JP4291164B2 - 弾性表面波装置 - Google Patents
弾性表面波装置 Download PDFInfo
- Publication number
- JP4291164B2 JP4291164B2 JP2004002927A JP2004002927A JP4291164B2 JP 4291164 B2 JP4291164 B2 JP 4291164B2 JP 2004002927 A JP2004002927 A JP 2004002927A JP 2004002927 A JP2004002927 A JP 2004002927A JP 4291164 B2 JP4291164 B2 JP 4291164B2
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- spiral inductor
- chip
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims description 64
- 230000005540 biological transmission Effects 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 24
- 230000010363 phase shift Effects 0.000 claims description 20
- 239000003990 capacitor Substances 0.000 claims description 13
- 239000012212 insulator Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 description 39
- 229910052751 metal Inorganic materials 0.000 description 39
- 238000003780 insertion Methods 0.000 description 18
- 230000037431 insertion Effects 0.000 description 18
- 238000010586 diagram Methods 0.000 description 15
- 239000000758 substrate Substances 0.000 description 14
- 238000000605 extraction Methods 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000005672 electromagnetic field Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 241000239290 Araneae Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/60—Substation equipment, e.g. for use by subscribers including speech amplifiers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1016—Earpieces of the intra-aural type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0046—Printed inductances with a conductive path having a bridge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0078—Constructional details comprising spiral inductor on a substrate
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
図10は、簡単化のために移相回路23を構成するチップ8のみについてパッケージ9へのフリップチップによる実装を説明する図である。
2 スパイラルインダクタ
3 信号取り出し部
4 絶縁体
5 被覆
6 電極パッド
7 バンプ
8 チップ
9 セラミックパッケージ
91 パッケージ蓋
92 シール材
9a 金属パターン
10 ダイアタッチ面
11 スパイラルインダクタとダイアタッチ面との間隔
Claims (3)
- スパイラルインダクタが形成されたチップを備える弾性表面波装置であって、
前記スパイラルインダクタが形成されたチップが、他の弾性表面波デバイスとともにパッケージにフリップチップ実装され、
前記パッケージにハーメチック封止された蓋部を有し、
さらに、前記パッケージの前記スパイラルインダクタに対向する面に導電体パターンが形成され、
前記スパイラルインダクタと前記導電体パターンとが間隔を有し、更に
前記弾性表面波デバイスは、2つの弾性表面波素子を有し、一方は共用アンテナから受信される受信信号を通過する受信用弾性表面波フィルタと他方は前記共用アンテナに供給される送信信号を通過する送信用弾性表面波フィルタであって、
さらに、前記スパイラルインダクタが形成されたチップは、前記スパイラルインダクタと並列にキャパシタが形成され、前記受信用弾性表面波フィルタの入力側に接続されて移相回路またはインピーダンス整合回路の機能を有し、
前記スパイラルインダクタに対向する面の導電体パターンは、前記受信用弾性表面波フィルタと接続するための導電体及び、接地導体である、
ことを特徴とする弾性表面波装置。 - スパイラルインダクタが形成されたチップを備える弾性表面波装置であって、
絶縁体板上に前記スパイラルインダクタが形成された第一のチップと、
弾性表面波デバイスが形成された第二のチップを有し、
前記第二のチップが、前記スパイラルインダクタと前記弾性表面波デバイスが対向する様に前記第一のチップ上にフリップチップ実装され、
前記第一のチップと第二のチップの側端部がハーメチック構造により封止されており、
前記スパイラルインダクタの領域と前記弾性表面波デバイスが対向する領域が重ならないように形成されていることを特徴とする弾性表面波装置。 - 請求項2において、
前記弾性表面波デバイスは、2つの弾性表面波素子を有し、一方は共用アンテナから受信される受信信号を通過する受信用弾性表面波フィルタと他方は前記共用アンテナに供給される送信信号を通過する送信用弾性表面波フィルタであって、
さらに、前記スパイラルインダクタが形成されたチップは、前記スパイラルインダクタと並列にキャパシタが形成され、前記受信用弾性表面波フィルタの入力側に接続されて移相回路またはインピーダンス整合回路の機能を有することを特徴とする弾性表面波装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004002927A JP4291164B2 (ja) | 2004-01-08 | 2004-01-08 | 弾性表面波装置 |
US11/024,769 US7102462B2 (en) | 2004-01-08 | 2004-12-30 | Surface acoustic wave device |
KR1020050001314A KR100614171B1 (ko) | 2004-01-08 | 2005-01-06 | 탄성 표면파 장치 |
EP05250051A EP1553700B1 (en) | 2004-01-08 | 2005-01-07 | Surface acoustic wave device |
CN2005100005631A CN1638274B (zh) | 2004-01-08 | 2005-01-07 | 表面声波器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004002927A JP4291164B2 (ja) | 2004-01-08 | 2004-01-08 | 弾性表面波装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005198073A JP2005198073A (ja) | 2005-07-21 |
JP4291164B2 true JP4291164B2 (ja) | 2009-07-08 |
Family
ID=34587700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004002927A Expired - Lifetime JP4291164B2 (ja) | 2004-01-08 | 2004-01-08 | 弾性表面波装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7102462B2 (ja) |
EP (1) | EP1553700B1 (ja) |
JP (1) | JP4291164B2 (ja) |
KR (1) | KR100614171B1 (ja) |
CN (1) | CN1638274B (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
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US7248035B2 (en) * | 2002-12-12 | 2007-07-24 | Analog Devices, Inc. | Automatic test equipment pin channel with T-coil compensation |
JP2006135447A (ja) * | 2004-11-02 | 2006-05-25 | Fujitsu Media Device Kk | 分波器 |
JP2007060411A (ja) * | 2005-08-25 | 2007-03-08 | Fujitsu Media Device Kk | 分波器 |
CN1921301B (zh) * | 2005-08-26 | 2010-09-29 | 鸿富锦精密工业(深圳)有限公司 | 表面声波元件 |
DE102007020288B4 (de) * | 2007-04-30 | 2013-12-12 | Epcos Ag | Elektrisches Bauelement |
DE102009004720B4 (de) * | 2009-01-15 | 2017-07-27 | Qualcomm Technologies, Inc. (N.D.Ges.D. Staates Delaware) | Multiband-Impedanzanpass-Schaltung zur Anpassung von Planarantennen |
US7919909B2 (en) * | 2009-04-24 | 2011-04-05 | Delaware Capital Formation, Inc. | Integrated coupling structures |
US8638114B2 (en) * | 2009-12-08 | 2014-01-28 | Qualcomm Incorporated | Transformer within wafer test probe |
US20120188133A1 (en) * | 2011-01-20 | 2012-07-26 | Delaware Capital Formation, Inc. | Spiralpole small antenna system |
JP2014135448A (ja) * | 2013-01-11 | 2014-07-24 | Taiyo Yuden Co Ltd | 電子部品 |
WO2017104070A1 (ja) * | 2015-12-18 | 2017-06-22 | 三菱電機株式会社 | モノリシックマイクロ波集積回路および高周波増幅器 |
WO2017154387A1 (ja) * | 2016-03-08 | 2017-09-14 | 株式会社村田製作所 | 弾性波装置 |
KR20180017939A (ko) * | 2016-08-11 | 2018-02-21 | 삼성전기주식회사 | 탄성파 필터 장치 |
DE102017130926A1 (de) * | 2017-12-21 | 2019-06-27 | RF360 Europe GmbH | Waferanordnung, Verfahren zur Fertigung von derselben und Hybridfilter |
CN108692824A (zh) * | 2018-03-21 | 2018-10-23 | 中电科技德清华莹电子有限公司 | 一种无源无线声表面波温度传感器 |
JP7183699B2 (ja) * | 2018-10-29 | 2022-12-06 | セイコーエプソン株式会社 | 発振器、電子機器及び移動体 |
US20210336402A1 (en) * | 2020-04-23 | 2021-10-28 | Analog Devices International Unlimited Company | Laser system |
Family Cites Families (20)
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DE69424737T2 (de) * | 1993-10-08 | 2000-09-28 | Matsushita Electric Ind Co Ltd | Akustisches Oberflächenwellenfilter |
US5499002A (en) | 1994-04-28 | 1996-03-12 | Kinsman; Robert G. | Resonator filter utilizing cascaded impedance inverters |
JPH0832402A (ja) | 1994-07-12 | 1996-02-02 | Hitachi Ltd | 弾性表面波装置、移動無線機用分波器および移動無線装置 |
GB2292016B (en) * | 1994-07-29 | 1998-07-22 | Plessey Semiconductors Ltd | Inductor device |
US5825092A (en) * | 1996-05-20 | 1998-10-20 | Harris Corporation | Integrated circuit with an air bridge having a lid |
JP3222072B2 (ja) | 1996-10-15 | 2001-10-22 | 富士通株式会社 | 分波器パッケージ |
US6159817A (en) * | 1998-05-07 | 2000-12-12 | Electro-Films Incorporated | Multi-tap thin film inductor |
US6310386B1 (en) * | 1998-12-17 | 2001-10-30 | Philips Electronics North America Corp. | High performance chip/package inductor integration |
JP2001127588A (ja) | 1999-10-28 | 2001-05-11 | Tdk Corp | 弾性表面波分波器 |
CN1197259C (zh) * | 1999-12-24 | 2005-04-13 | 松下电器产业株式会社 | 天线共用器 |
US6180445B1 (en) * | 2000-04-24 | 2001-01-30 | Taiwan Semiconductor Manufacturing Company | Method to fabricate high Q inductor by redistribution layer when flip-chip package is employed |
JP3551899B2 (ja) * | 2000-06-26 | 2004-08-11 | 株式会社村田製作所 | 共振器、フィルタ、デュプレクサおよび通信装置 |
US6489656B1 (en) * | 2001-10-03 | 2002-12-03 | Megic Corporation | Resistor for high performance system-on-chip using post passivation process |
JP3818896B2 (ja) * | 2001-11-26 | 2006-09-06 | 富士通メディアデバイス株式会社 | 分波器及びこれを用いた電子装置 |
JP3747853B2 (ja) * | 2002-01-08 | 2006-02-22 | 株式会社村田製作所 | 弾性表面波装置を備えた分波器 |
JP3745316B2 (ja) | 2002-06-24 | 2006-02-15 | Necエレクトロニクス株式会社 | 半導体集積回路及びその製造方法 |
KR100550917B1 (ko) * | 2003-10-08 | 2006-02-13 | 삼성전기주식회사 | Pcb 기판을 이용한 saw 듀플렉서 |
JP2005167969A (ja) * | 2003-11-14 | 2005-06-23 | Fujitsu Media Device Kk | 弾性波素子および弾性波素子の製造方法 |
KR100760780B1 (ko) * | 2004-09-28 | 2007-09-21 | 후지쓰 메디아 데바이스 가부시키가이샤 | 분파기 |
JP2014009516A (ja) * | 2012-06-29 | 2014-01-20 | Yuhshin Co Ltd | ドアロック装置 |
-
2004
- 2004-01-08 JP JP2004002927A patent/JP4291164B2/ja not_active Expired - Lifetime
- 2004-12-30 US US11/024,769 patent/US7102462B2/en active Active
-
2005
- 2005-01-06 KR KR1020050001314A patent/KR100614171B1/ko active IP Right Grant
- 2005-01-07 CN CN2005100005631A patent/CN1638274B/zh active Active
- 2005-01-07 EP EP05250051A patent/EP1553700B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1553700B1 (en) | 2011-07-27 |
KR100614171B1 (ko) | 2006-08-25 |
KR20050073401A (ko) | 2005-07-13 |
US7102462B2 (en) | 2006-09-05 |
CN1638274A (zh) | 2005-07-13 |
EP1553700A3 (en) | 2007-03-28 |
US20060022767A1 (en) | 2006-02-02 |
EP1553700A2 (en) | 2005-07-13 |
JP2005198073A (ja) | 2005-07-21 |
CN1638274B (zh) | 2011-06-15 |
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