JP7183699B2 - 発振器、電子機器及び移動体 - Google Patents
発振器、電子機器及び移動体 Download PDFInfo
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- JP7183699B2 JP7183699B2 JP2018202459A JP2018202459A JP7183699B2 JP 7183699 B2 JP7183699 B2 JP 7183699B2 JP 2018202459 A JP2018202459 A JP 2018202459A JP 2018202459 A JP2018202459 A JP 2018202459A JP 7183699 B2 JP7183699 B2 JP 7183699B2
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- oscillator
- integrated circuit
- vibrator
- circuit element
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Description
振動片及び前記振動片を収容する振動片用容器を含む振動子と、
インダクターを含む集積回路素子と、
不導体のスペーサー部材と、を備え、
前記振動子と前記集積回路素子とは積層されており、
前記振動子は金属部材を有し、
前記スペーサー部材は、前記振動子と前記集積回路素子との間に設けられている。
前記スペーサー部材の厚さは、前記インダクターの外径の1/2以上であってもよい。
前記振動片用容器は、
前記振動片が収容される凹部が設けられた基体と、
前記金属部材である蓋体と、を含み、
前記振動子は、前記蓋体が前記集積回路素子に向かい合うように、前記スペーサー部材に搭載されていてもよい。
振動片及び前記振動片を収容する振動片用容器を含む振動子と、
インダクターを含む集積回路素子と、
導体のスペーサー部材と、を備え、
前記振動子と前記集積回路素子とは積層されており、
前記振動子は金属部材を有し、
前記スペーサー部材は、前記振動子と前記集積回路素子との間に設けられ、前記振動子と前記集積回路素子とを電気的に接続し、
平面視で、前記スペーサー部材と前記インダクターとが重なっていない。
前記集積回路素子は、前記インダクターの周囲に設けられたガードリングを含み、
平面視で、前記スペーサー部材は前記ガードリングと重なっていなくてもよい。
前記振動片用容器は、
前記振動片が収容される凹部が設けられた基体と、
前記金属部材である蓋体と、を含み、
前記振動子は、前記基体が前記集積回路素子に向かい合うように、前記スペーサー部材を介して前記集積回路素子に搭載されていてもよい。
平面視で、前記インダクターと前記金属部材とが重なっていてもよい。
前記スペーサー部材の厚さは、1ミリメートル以下であってもよい。
前記発振器の一態様を備えている。
前記発振器の一態様を備えている。
1-1.第1実施形態
[発振器の機能構成]
図1は本実施形態の発振器1の機能ブロック図である。図1に示すように、本実施形態の発振器1は、集積回路素子10と振動子20とを含む。
発振信号の周波数fOSCとは式(1)の関係を満たす。
34,35及びNチャネル型MOSトランジスター36,37を含む。そして、電圧制御発振器144は、Nチャネル型MOSトランジスター36,37によって構成される発振段により生成される発振信号を、例えば差動信号OUT+,OUT-として出力する。可変容量ダイオード34のアノードと可変容量ダイオード35のアノードとが接続されているノードN1にローパスフィルター143の出力電圧が印加され、ノードN1の電圧に応じて可変容量ダイオード34,35の容量値が変化する。電圧制御発振器144から出力される発振信号の周波数は、インダクター32,33のインダクタンス値と可変容量ダイオード34,35の容量値によって決まる。
図3及び図4は、第1実施形態の発振器1の構造の一例を示す図である。図3は発振器1の斜視図であり、図4は発振器1の側面図である。図4では、便宜上、モールド樹脂4や振動子20の容器等を透視した状態で図示されている。
図5は、第1実施形態の発振器1における集積回路素子10の内部配置の一例を示す図であり、発振器1を上面から視たときの集積回路素子10の平面図である。図5には、集積回路素子10が有する各回路及び一部の端子として機能するパッドの配置が図示されている。また、図5において、振動子20が破線で図示されている。なお、図5において、「OSC」は発振用回路11であり、「Control Logic」は制御回路12であり、「VREG」は電圧レギュレーター13である。また、「PFD」は位相比較器141であり、「CP」はチャージポンプ142であり、「LPF」はローパスフィルター143であり、「VCO」は電圧制御発振器144であり、「ODIV1」は分周回路146である。また、「ODIV2」は分周回路161であり、「OBUF」は出力バッファー162である。
1とPLL回路14との間に配置されている。
様のことが言える。なお、インダクター32,33の外径L1は、例えば、インダクター32,33の輪郭が矩形である場合は当該矩形の最長の辺の長さであり、インダクター32,33の輪郭が楕円である場合は当該楕円の長軸の長さである。
以上に説明した第1実施形態の発振器1では、振動子20と集積回路素子10とが積層されており、振動子20と集積回路素子10との間に不導体のスペーサー部材70が設けられている。具体的には、振動子20は、蓋体24が集積回路素子10に向かい合うように、スペーサー部材70に搭載されている。そのため、スペーサー部材70の厚さの分、振動子20が有する金属部材である蓋体24と集積回路素子10が有するインダクター32,33との距離が大きくなる。その結果、発振器1の平面視で蓋体24とインダクター32,33とが重なっていても、インダクター32,33に流れる電流によって発生する磁界が、蓋体24によって遮られにくく、蓋体24に渦電流が発生しにくい。したがって、第1実施形態の発振器1によれば、インダクター32,33のQ値の悪化が低減され、回路要素としての機能が劣化してしまうおそれが低減される。特に、スペーサー部材70の厚さをインダクター32,33の外径の1/2以上とすることで、インダクター32,33のQ値の悪化が大きく低減される。
10に入力された信号は、辺10aから辺10cに向かって伝播し、OUT端子あるいはOUTB端子として機能する各パッドを介して出力される。そして、集積回路素子10において、このような各種の信号の流れに整合させるように、PLL回路14が発振用回路11と出力回路16との間に配置されており、各種の信号が伝播する各配線が短くなる。したがって、第1実施形態の発振器1によれば、各配線の寄生容量が低減され、他の信号とのクロストーク等により各信号に重畳されるノイズが低減される。さらに、各配線が短くなるため、配線領域が全体として小さくなるので、集積回路素子10の面積が低減される。
以下、第2実施形態の発振器1について、第1実施形態と装用の構成要素には同じ符号を付し、第1実施形態と重複する説明は省略又は簡略し、主に第1実施形態と異なる内容について説明する。
ーサー部材80とインダクター32,33との距離が大きい。したがって、インダクター32,33に流れる電流によって発生する磁界が、導体のスペーサー部材80によって遮られにくく、スペーサー部材80に渦電流が発生しにくい。その結果、インダクター32,33のQ値の悪化が低減され、回路要素としての機能が劣化してしまうおそれが低減される。
例えば、上記の第1実施形態の発振器1では、集積回路素子10は、インダクターを含むPLL回路を1つ有しているが、PLL回路を2つ以上有していて、発振器1の平面視で、少なくとも1つのインダクターが、振動子20が有する金属部材と重なっているものであってもよい。また、上記の第2実施形態の発振器1では、集積回路素子10は、インダクターを含むPLL回路を1つ有しているが、PLL回路を2つ以上有していて、発振器1の平面視で、少なくとも1つのインダクターが、振動子20が有する金属部材と重なっており、かつ、すべてのインダクターがスペーサー部材80と重なっていないものであってもよい。
図11は、本実施形態の電子機器の構成の一例を示す機能ブロック図である。また、図12は、本実施形態の電子機器の一例であるスマートフォンの外観の一例を示す図である。
部装置とデータ通信を行うために通信部360を制御する処理、表示部370に各種の情報を表示させるための表示信号を送信する処理等を行う。
図13は、本実施形態の移動体の一例を示す図である。図13に示す移動体400は、発振器410、エンジンシステム、ブレーキシステム、キーレスエントリーシステム等の各種の制御を行うコントローラー420,430,440、バッテリー450、バックアップ用バッテリー460を含んで構成されている。なお、本実施形態の移動体は、図13の構成要素の一部を省略し、あるいは、他の構成要素を付加した構成としてもよい。
、70…スペーサー部材、80…スペーサー部材、141…位相比較器、142…チャージポンプ、143…ローパスフィルター、144…電圧制御発振器、145…分周回路、146…分周回路、161…分周回路、162…出力バッファー、300…電子機器、310…発振器、312…集積回路素子、313…振動子、320…CPU、330…操作部、340…ROM、350…RAM、360…通信部、370…表示部、400…移動体、410…発振器、420,430,440…コントローラー、450…バッテリー、460…バックアップ用バッテリー
Claims (6)
- 振動片及び前記振動片を収容する振動片用容器を含む振動子と、
インダクターを含む集積回路素子と、
不導体のスペーサー部材と、を備え、
前記振動子と前記集積回路素子とは積層されており、
前記振動子は金属部材を有し、
前記スペーサー部材は、前記振動子と前記集積回路素子との間に設けられており、
前記振動片用容器は、
前記振動片が収容される凹部が設けられた基体と、
前記金属部材である蓋体と、を含み、
前記振動子は、前記蓋体が前記集積回路素子に向かい合うように、前記スペーサー部材に搭載されている、発振器。 - 前記スペーサー部材の厚さは、前記インダクターの外径の1/2以上である、請求項1に記載の発振器。
- 平面視で、前記インダクターと前記金属部材とが重なっている、請求項1又は2に記載の発振器。
- 前記スペーサー部材の厚さは、1ミリメートル以下である、請求項1乃至3のいずれか一項に記載の発振器。
- 請求項1乃至4のいずれか1項に記載の発振器を備えた、電子機器。
- 請求項1乃至4のいずれか1項に記載の発振器を備えた、移動体。
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