WO2007116625A1 - 硬化性樹脂組成物 - Google Patents
硬化性樹脂組成物 Download PDFInfo
- Publication number
- WO2007116625A1 WO2007116625A1 PCT/JP2007/055063 JP2007055063W WO2007116625A1 WO 2007116625 A1 WO2007116625 A1 WO 2007116625A1 JP 2007055063 W JP2007055063 W JP 2007055063W WO 2007116625 A1 WO2007116625 A1 WO 2007116625A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- refractive index
- resin composition
- curable resin
- rubazole
- polymerizable
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 57
- 239000000178 monomer Substances 0.000 claims abstract description 53
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 37
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 29
- 238000007789 sealing Methods 0.000 claims abstract description 20
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 18
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims abstract description 16
- 239000004305 biphenyl Chemical group 0.000 claims abstract description 9
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 9
- 125000005577 anthracene group Chemical group 0.000 claims abstract description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 3
- 125000001624 naphthyl group Chemical group 0.000 claims abstract description 3
- 239000000126 substance Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 14
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 239000011882 ultra-fine particle Substances 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 4
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 4
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 claims description 3
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 abstract description 23
- 239000003822 epoxy resin Substances 0.000 abstract description 13
- 229920000647 polyepoxide Polymers 0.000 abstract description 13
- 230000008646 thermal stress Effects 0.000 abstract description 6
- 230000001747 exhibiting effect Effects 0.000 abstract 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 abstract 1
- 239000000047 product Substances 0.000 description 41
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 239000000843 powder Substances 0.000 description 14
- 238000001723 curing Methods 0.000 description 11
- -1 methylmethyl Chemical group 0.000 description 11
- 229920002050 silicone resin Polymers 0.000 description 11
- 238000002156 mixing Methods 0.000 description 9
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 6
- 229910052594 sapphire Inorganic materials 0.000 description 6
- 239000010980 sapphire Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 239000003925 fat Substances 0.000 description 3
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- FDYDISGSYGFRJM-UHFFFAOYSA-N (2-methyl-2-adamantyl) 2-methylprop-2-enoate Chemical compound C1C(C2)CC3CC1C(OC(=O)C(=C)C)(C)C2C3 FDYDISGSYGFRJM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- SBMYBOVJMOVVQW-UHFFFAOYSA-N 2-[3-[[4-(2,2-difluoroethyl)piperazin-1-yl]methyl]-4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]pyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound FC(CN1CCN(CC1)CC1=NN(C=C1C=1C=NC(=NC=1)NC1CC2=CC=CC=C2C1)CC(=O)N1CC2=C(CC1)NN=N2)F SBMYBOVJMOVVQW-UHFFFAOYSA-N 0.000 description 1
- YCPMSWJCWKUXRH-UHFFFAOYSA-N 2-[4-[9-[4-(2-prop-2-enoyloxyethoxy)phenyl]fluoren-9-yl]phenoxy]ethyl prop-2-enoate Chemical compound C1=CC(OCCOC(=O)C=C)=CC=C1C1(C=2C=CC(OCCOC(=O)C=C)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YCPMSWJCWKUXRH-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 1
- VIJYEGDOKCKUOL-UHFFFAOYSA-N 9-phenylcarbazole Chemical compound C1=CC=CC=C1N1C2=CC=CC=C2C2=CC=CC=C21 VIJYEGDOKCKUOL-UHFFFAOYSA-N 0.000 description 1
- CEXZNMHCRJIPFP-UHFFFAOYSA-N CCC.C(C(=C)C)(=O)OCCCOC1=CC=C(C=C1)O Chemical compound CCC.C(C(=C)C)(=O)OCCCOC1=CC=C(C=C1)O CEXZNMHCRJIPFP-UHFFFAOYSA-N 0.000 description 1
- BEKUSRVKICKJNQ-UHFFFAOYSA-N CCC.C(C(=C)C)(=O)OCCOC1=CC=C(C=C1)O Chemical compound CCC.C(C(=C)C)(=O)OCCOC1=CC=C(C=C1)O BEKUSRVKICKJNQ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- LFYJSSARVMHQJB-QIXNEVBVSA-N bakuchiol Chemical compound CC(C)=CCC[C@@](C)(C=C)\C=C\C1=CC=C(O)C=C1 LFYJSSARVMHQJB-QIXNEVBVSA-N 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- MAWOHFOSAIXURX-UHFFFAOYSA-N cyclopentylcyclopentane Chemical group C1CCCC1C1CCCC1 MAWOHFOSAIXURX-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 231100001231 less toxic Toxicity 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- HYIMSNHJOBLJNT-UHFFFAOYSA-N nifedipine Chemical compound COC(=O)C1=C(C)NC(C)=C(C(=O)OC)C1C1=CC=CC=C1[N+]([O-])=O HYIMSNHJOBLJNT-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000000411 transmission spectrum Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
- C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
- C08K5/3417—Five-membered rings condensed with carbocyclic rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Definitions
- the present invention relates to a curable resin composition useful for sealing an optical element.
- LEDs light emitting diodes
- LEDs have features such as low power consumption, small size, and light weight, and those sealed with grease are used for various display lamps, etc.
- blue LEDs and white LEDs have been developed and their brightness has increased, so the application to backlight light sources, illumination light sources, signal lights, etc. for liquid crystal display panels has been rapidly progressing, and application to automotive headlights. Has also been developed.
- gel-type silicone resins are used in high-brightness LEDs because they have better heat resistance and light resistance than epoxy resins.
- gel type silicone resin has the following problems.
- silicone resin is currently used as a resin to fill these gaps after bonding the dome part with the lens function and the LED chip base, or as a sealing resin for LED surface mounting. Limited to use.
- the silicone resin has a refractive index smaller than that of the epoxy resin 1.41-: L51, so that the light extraction efficiency from the LED is inferior.
- a sapphire substrate side force that often uses a sapphire substrate as its chip substrate also extracts light.
- the refractive index of the sapphire is 1.76
- the refractive index of the sealing resin should be close to the refractive index of the sapphire in order to efficiently extract light into the sapphire substrate.
- the refractive index of silicone resin is 1.41 for general dimethyl silicone resin. Diphenyldimethyl-based or methylmethyl having a refractive index increased by introducing a phenyl group.
- silicone resin is about 1.51, both of which are lower than the refractive index of epoxy resin 1.53 ⁇ : L57. For this reason, when silicone resin is used as the sealing resin for high-brightness LEDs, the light extraction efficiency is inevitably inferior to that when epoxy resin is used.
- the silicone resin used in electronic materials is an addition reaction type and is two-component, there is a restriction that the two components must be mixed immediately before use.
- the power of using a static mixer is usually used for mixing two liquids. This mixer can only be mixed with a relatively low viscosity! Therefore, the mixture of the two liquids should have a sufficiently high viscosity. It is difficult to get. Therefore, it cannot be molded into a predetermined lens shape, and the lens function cannot be imparted to the sealing resin.
- Patent Document 2 it has been proposed to use a fluorene group-containing mono acrylate as a high refractive index resin used in the production of an optical antireflection film. It can be considered to be used as a rosin.
- the fluorene group-containing monoattalylate is sealed due to its very high viscosity.
- the handling property as an agent is not sufficient.
- a low-viscosity diluting monomer such as 2-hydroxyethyl acrylate
- the viscosity of the composition can be reduced, but the refractive index is reduced by using the diluting monomer.
- this composition is used as an LED sealing resin that is very hard after curing, thermal stress causes separation between the chip and the resin, damages the chip, and breaks the wiring. Such problems arise.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2004-15063
- Patent Document 2 Japanese Patent Laid-Open No. 2002-293762
- the present invention provides a curable resin composition having a viscosity suitable for forming an LED sealing resin, and the cured product is at least an epoxy resin. It has an index of refraction equal to or higher than that of resin, has excellent heat resistance and light resistance, has an appropriate viscosity, and seals resin, peels off chips, breaks, etc. It is an object of the present invention to provide a resin composition that does not cause an obstacle, and to provide a cured product of such a resin composition and a light-emitting element sealed with the cured product.
- a rosin composition in which a non-polymerizable power rubazole is blended with a high refractive index acrylic monomer such as a fluorene group-containing acrylate is a one-component curable resin having an appropriate viscosity.
- the refractive index of the cured product is equal to or higher than that of epoxy resin, and is found to be excellent in heat resistance and light resistance, and also has suitable hardness as a sealing resin.
- the present invention provides a curable resin composition
- a curable resin composition comprising a high refractive index acrylic monomer having a refractive index of 1.52 or more and a non-polymerizable carbazole.
- the present invention also provides a cured product obtained by curing the curable resin composition, particularly a light-emitting device encapsulated using the curable resin composition.
- the resin composition of the present invention is a one-component that can be easily cured by heat or UV irradiation, there is no limitation on the usable time.
- the viscosity can be adjusted, and the viscosity can be adjusted according to the application. Therefore, the resin composition of the present invention is excellent in handleability.
- the cured product of the resin composition is a dry touch with no stickiness on the surface and has a self-shape-retaining property. For this reason, this cured product exhibits a lens function in addition to a sealing function.
- this cured product has thermal stress relaxation properties that make it harder like a cured product of a fluorene group-containing monoatarylate. Therefore, it is possible to solve the problem of chip deterioration due to sealing failure that does not give thermal stress to the LED chip and disconnection due to thermal stress.
- the refractive index of the cured product is equal to or higher than 1.55, which is equal to or higher than that of epoxy resin, and the light extraction efficiency from the sapphire substrate of the LED can be improved.
- the cured product has excellent heat resistance and light resistance, and can maintain transparency. Therefore, according to this cured product, it is possible to reduce the change over time in the light emission amount when the high-brightness LED is sealed.
- the curable resin composition of the present invention contains a high refractive index acrylic monomer having a refractive index of 1.52 or more and a non-polymerizable rubazole.
- the refractive index is a value at a sodium D line (589 nm) at 25 ° C. Since the refractive index of the acrylic monomer is strongly reflected in the refractive index of the cured product, a high refractive index acrylic monomer having a refractive index of 1.52 or more is used in the present invention.
- Such a high refractive index acrylic monomer has two or more phenol groups in the molecule, such as a fluorene skeleton, a bisphenol A skeleton, a biphenyl skeleton, a naphthalene skeleton, or an anthracene skeleton. Meta) Atallate can be raised. These also have good solubility with non-polymerizable carbazole.
- examples of the acrylic monomers having a fluorene group include compounds represented by the following formula (1).
- the fluorene group-containing (meth) acrylate having formula (1) is preferable because it has a refractive index equivalent to or higher than that of epoxy resin and is excellent in heat resistance and light resistance. In the formula (1), if ⁇ force is exceeded, the refractive index becomes too small, which is not preferable.
- fluorene group-containing (meth) acrylates of formula (1) can be used.
- Fluorene (Osaka Gas Chemical Company) (refractive index 1.574)
- the fluorene group-containing (meth) atrelate of formula (1) may contain one or more kinds.
- Examples of the high refractive index acrylic monomer having no fluorene group include monofunctional (meth) acrylates represented by the following formula (2).
- X phenyl, tamilphenyl, biphenyl, terphenyl or
- examples of the polycyclic aromatic hydrocarbon group represented by X include naphthalene, dinaphthalene, anthracene, and pyrene.
- the monofunctional (meth) atalylate of the formula (2) may be used alone or in combination as appropriate.
- Examples of the high refractive index acrylic monomer having a fluorene group may include a bifunctional (meth) acrylate.
- a bifunctional (meth) acrylate For example, 2,2-bis [4- (attalylooxyethoxy) [Fuel] Bread, 2,2-bis [4- (Atalyloxydiethoxy) phenol] propane, 2,2-bis [4- (methacryloxyethoxy) phenol] Propane, 2,2-bis [4- (methacryloxydiethoxy) phenol] propane, 2,2-bis [4- (talyloxypropoxy) phenol] propane, 2,2-bis [ 4- (methacryloxypropoxy) phenol] propane and the like can be used in appropriate combination.
- fluorene group-containing (meth) acrylate of formula (1) the monofunctional (meth) acrylate, and bifunctional (meth) acrylate of formula (2) may be used in combination! /.
- non-polymerizable rubazole means polymerizability under the curing conditions of the curable resin composition of the present invention, that is, UV irradiation or heat treatment at 80 to 150 ° C. Demonstrate V, power rubazole.
- Non-polymerizable rubazole and high refractive index acrylic monomer The combined composition has a viscosity suitable as a sealing resin, and the refractive index of the cured product is 1.
- the polymerizable power rubazole is generally toxic, whereas the non-polymerizable carbazole is less toxic. Also, the power rubazole is not copolymerized when the resin composition is cured. Therefore, the hardness of the cured product can be lowered. Therefore, in the present invention, non-polymerizable rubazole is used as an essential component.
- non-polymerizable power rubazole examples include N-substituted power rubazole represented by the following formula (3).
- a cured product which is a polymer of a polymerizable strength rubazole monomer can also be used.
- This cured product is preferred because it has a higher refractive index than the polymerizable carbazole monomer.
- the viscosity of the resin composition can be adjusted to a high level by using this polymerizable power rubazole cured product, the lens and the like are simultaneously molded when the optical element is sealed. In this case, it can be suitably used.
- N- (2-methacryloxychetyl) strength rubazole cured powder N-arylcarbazole cured product Powder
- N- (p-vinylbenzyl) strength rubazole hardened powder etc.
- N-bicarbcarbazole hardened powder N- (2-Ataloyloxyethyl)
- Strength rubazole cured powder and the like are preferable.
- the curable resin composition of the present invention comprises the viscosity of the composition, the curing rate, the refractive index of the cured product, transparency, light resistance, In order to adjust physical properties such as heat resistance, other monomers can be contained as necessary.
- N-butcarbazole N 2-(2-atalyloyloxetyl) carbazole, N- (2-methacryloyloxychetyl) force rubazole
- Polymerizable force rubazole such as sol, N-arylcarbazole, N- (p-butylbenzyl) force rubazole
- Polymerizable force rubazole can be copolymerized with an acrylic monomer, and the copolymer has good compatibility with non-polymerizable force rubazole. Therefore, high refractive index acrylic monomer and non-polymerizable force rubazole are mixed.
- the strain stress generated when the curable resin composition is cured and contracted and the thermal stress due to the thermal expansion of the cured product are alleviated, thereby being sealed with the cured product.
- these monomers generally have a refractive index of less than 1.52, and The refractive index of the cured product of the curable resin composition of the present invention cannot be made 1.55 or more. Therefore, the blending amount of these monomers is usually preferably 50% by weight or less in the curable resin composition.
- a monomer that improves the transparency of the cured product is preferably blended.
- Transparency includes transparency in the visible light region and transparency in the ultraviolet region. Conventionally, transparency in the visible light region has been naturally required for LED sealing materials. On the other hand, in the present invention, in addition to transparency in the visible light region, it is also preferable to enhance transparency in the ultraviolet region so that UV light and blue light are absorbed by the cured product.
- Transparency in the ultraviolet region can be evaluated by measuring the cut-off wavelength of the cured product.
- the cut-off wavelength refers to a wavelength at which the transmittance of light whose visible region force also decreases toward the ultraviolet region becomes zero in the cured product.
- LED power with a cut-off wavelength is short UV light or blue light that is emitted is hard to be absorbed by the cured product, and it is not a force that can prevent loss of brightness. It becomes possible to maintain the transparency for a long time without deterioration. Therefore, in the present invention, it is preferable to add a monomer that increases the transparency of the cured product in both the visible region and the ultraviolet region.
- a monomer having no benzene ring in its structure and having an alicyclic structure is preferred from the viewpoint of transparency and refractive index.
- examples thereof include hexyl (meth) acrylate, dicyclopentyl (meth) acrylate, tricyclodehydryl (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, and the like.
- the total amount of the high refractive index acrylic monomer and the non-polymerizable power rubazole was included, and when the polymerizable power rubazole was included, it was also included. It is preferable that the total amount be 50% by weight or more.
- the refractive index after curing of the curable resin composition of the present invention is 1.55 or more. It becomes difficult to make it.
- a high refractive index acrylic monomer and 5% by weight in the case of containing polymerizable power rubazole the content of which is preferably 5% by weight or more and 55% by weight or less, based on the total amount of non-polymerizable power rubazole. It is preferable that the amount is not less than 65% by weight. If the amount of non-polymerizable power rubazole is too large, non-polymerizable power rubazole will be difficult to dissolve with the acrylic monomer, and even when dissolved, non-polymerizable power rubazole will precipitate after curing and the cured product will be white. It may become. Conversely, if the amount of non-polymerizable rubazole is too small, the refractive index cannot be increased.
- radical curing agents such as peroxides and azo compounds, UV curing agents and the like can be used.
- the blending amount is preferably 0.1 to 5 parts by weight, more preferably 0.3 to 1 part by weight based on 100 parts by weight of the total amount of the high refractive index acrylic monomer and the non-polymerizable power rubazole.
- the curable resin composition of the present invention can be blended with ultrafine particles of high refractive index in order to further increase the refractive index of the cured product.
- the high refractive index ultrafine particles are composed of metal oxides such as titanium oxide, zirconium oxide, zinc oxide, aluminum oxide, magnesium oxide, and the like, and have a diameter of 20 nm or less, more preferably 9 nm or less. It is a transparent fine particle with a particle size called size and a refractive index of 1.6 or more.
- the high-refractive-index ultrafine particles it is preferable that the surface is subjected to a hydrophobic treatment to improve the dispersibility.
- the blending amount of the high refractive index ultrafine particles is usually 1 to 40 parts by weight with respect to 100 parts by weight in total of the high refractive index acrylic monomer and force rubazole (non-polymerizable force rubazole and polymerizable carbazole). It is preferable.
- a polymerization inhibitor and other various additives can be combined with the curable resin composition of the present invention.
- 25-1000 ppm of hydroquinone, methoquinone, BHT, etc. can be blended as a polymerization inhibitor.
- acid fine particles such as aerosol can be blended.
- coloring dyes, YAG phosphors, etc. may be added.
- the curable resin composition of the present invention is prepared by mixing a high refractive index acrylic monomer and a non-polymerizable power rubazole, a polymerizable carbazole to be added as necessary, and other components by a conventional method. It can be obtained as a liquid composition.
- This curable resin composition can be cured by heat treatment at a temperature of 80 to 150 ° C or UV irradiation. Further, it can be suitably used as a curable resin composition for optical sealing of light emitting elements such as LEDs, optical disks, and lasers. Accordingly, the present invention includes a light emitting device encapsulated with the resin composition of the present invention.
- the curable resin composition of (1) was sandwiched between two PET release films and irradiated with ultraviolet rays with a mercury lamp (1J) to obtain a cured sheet having a thickness of 0.5 mm.
- the viscosity of the curable resin composition was measured with an E-type viscometer (25 ° C).
- the refractive indexes of the curable resin composition and the cured sheet were measured using Abbe refractometers (Natrium D line (589 nm), 25 ° C.), respectively. In this case, the cured material sheet was measured using matching oil.
- the transmission spectrum of the curable rosin composition was measured and the cut-off wavelength was determined. It should be noted that the cut-off wavelength is practically lower than the blue LED emission wavelength of 440 ⁇ 20 nm. Needed.
- the cured product sheet was used as a sample piece, and a light resistance test for 96 hours was performed using an ultraviolet carbon arc lamp in accordance with JIS A 1415.
- the cured sheet was used as a sample piece, and a heat resistance test was performed for 96 hours in an air atmosphere at 150 ° C. The presence or absence of a change in transparency before and after the test was visually examined.
- the Shore A hardness (room temperature) of the cured sheet was measured using a type A durometer.
- a curable resin composition and a cured product sheet were produced in the same manner as in Example 1 except that the composition was changed as shown in Table 1.
- the composition was cured by heat treatment at 80 ° C. for 1 hour.
- the N- (2-attalylooxychetyl) strength rubazole-cured powder has good compatibility with the high refractive index acrylate monomer, and polymerizes the high refractive index acrylic monomer. It was confirmed that a uniform and transparent cured product without phase separation could be obtained.
- BPEF—A (refractive index 1.614)
- paracumyl phenoxytyl acrylate (Toagosei Co., Ltd., Alonix Ml 10)
- Refractive index 1.564 is used in combination as N-Bule as non-polymerizable force rubazole
- hard rubazole cured powder (refractive index 1.68) or N-phenolcarbazole (refractive index 1.68)
- the viscosity of the curable resin composition can be adjusted to be low by using butyl acrylate or phenoxy acetyl acrylate together, and the cured sheet has a low Shore A hardness.
- Example 20 From Example 20, it is possible to adjust the viscosity of the curable resin composition to be high by using the polymerizable power rubazole in combination, and to add more carbazole compound without impairing transparency. Thus, it can be seen that the refractive index can be increased.
- Example 2 is between the Shore A hardness of Example 1 and Example 5
- Shore A hardness of Examples 7 to 9 is Example 6 and Example 10.
- the Shore A hardness is between The Shore A hardness of Example 12 13 is between the Shore A hardness of Example 11 and Example 14 [Table 1]
- the curable resin composition of the present invention is useful as a resin composition for optical sealing of light emitting devices such as LEDs, optical disks, and lasers, and is particularly useful as a sealing resin composition for high-brightness LEDs. It is for.
- the light-emitting element encapsulated with the curable resin composition of the present invention is used in various fields such as flat panel knocklights, traffic lights, advertisement signboard lighting, and automobile headlights.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800121216A CN101415736B (zh) | 2006-04-10 | 2007-03-14 | 硬化性树脂组合物 |
US12/084,707 US7868109B2 (en) | 2006-04-10 | 2007-03-14 | Curable resin composition |
HK09106173.7A HK1128483A1 (en) | 2006-04-10 | 2009-07-09 | Hardening resin composition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006108111A JP2007277467A (ja) | 2006-04-10 | 2006-04-10 | 硬化性樹脂組成物 |
JP2006-108111 | 2006-04-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007116625A1 true WO2007116625A1 (ja) | 2007-10-18 |
Family
ID=38580927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/055063 WO2007116625A1 (ja) | 2006-04-10 | 2007-03-14 | 硬化性樹脂組成物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7868109B2 (ja) |
JP (1) | JP2007277467A (ja) |
CN (1) | CN101415736B (ja) |
HK (1) | HK1128483A1 (ja) |
WO (1) | WO2007116625A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010525111A (ja) * | 2007-04-17 | 2010-07-22 | ゼネラル・エレクトリック・カンパニイ | ポリカルバゾリル(メタ)アクリレート発光組成物 |
CN101367893B (zh) * | 2008-09-01 | 2011-11-23 | 长兴化学工业股份有限公司 | 一种可聚合组合物及其用途 |
CN102369225A (zh) * | 2009-03-30 | 2012-03-07 | 昭和电工株式会社 | 固化性组合物和其固化物 |
JP2017057401A (ja) * | 2013-09-05 | 2017-03-23 | 株式会社ダイセル | 接着剤及び封止材 |
WO2017154589A1 (ja) * | 2016-03-10 | 2017-09-14 | Dic株式会社 | 硬化性組成物及び光学部材 |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4853630B2 (ja) * | 2006-04-10 | 2012-01-11 | ソニーケミカル&インフォメーションデバイス株式会社 | 硬化性樹脂組成物 |
JP2008094987A (ja) * | 2006-10-13 | 2008-04-24 | Nippon Kayaku Co Ltd | 光学材料用高屈折率樹脂組成物およびその硬化物 |
TWI379840B (en) * | 2008-08-01 | 2012-12-21 | Eternal Chemical Co Ltd | Polymerizable composition and its uses |
US8829070B2 (en) | 2009-08-31 | 2014-09-09 | Kabushiki Kaisha Toshiba | Ultraviolet-curable resin material for pattern transfer and magnetic recording medium manufacturing method using the same |
WO2011102272A1 (ja) | 2010-02-19 | 2011-08-25 | 東レ株式会社 | 蛍光体含有シリコーン硬化物、その製造方法、蛍光体含有シリコーン組成物、その組成物前駆体、シート状成型物、ledパッケージ、発光装置およびled実装基板の製造方法 |
JP5744847B2 (ja) * | 2010-04-09 | 2015-07-08 | 日本化薬株式会社 | 光学レンズシート用エネルギー線硬化型樹脂組成物及びその硬化物 |
JP5812993B2 (ja) * | 2010-08-12 | 2015-11-17 | 株式会社ダイセル | 低透湿性樹脂組成物及びその硬化物 |
JP5626630B2 (ja) * | 2010-09-01 | 2014-11-19 | Dic株式会社 | 材料組成物およびそれを用いた光学素子 |
WO2012053377A1 (ja) * | 2010-10-18 | 2012-04-26 | 株式会社ダイセル | 高屈折率樹脂組成物および樹脂硬化物 |
JP4988032B2 (ja) * | 2010-12-08 | 2012-08-01 | 株式会社東芝 | 磁気記録媒体の製造方法 |
JP5039199B2 (ja) * | 2010-12-08 | 2012-10-03 | 株式会社東芝 | パターン転写に用いられる紫外線硬化性樹脂材料 |
WO2012081411A1 (ja) * | 2010-12-13 | 2012-06-21 | 東レ株式会社 | 蛍光体シート、これを用いたledおよび発光装置ならびにledの製造方法 |
US9574106B2 (en) * | 2011-09-27 | 2017-02-21 | Maruzen Petrochemical Co., Ltd. | Optical element material and method for producing same |
KR101525286B1 (ko) * | 2012-09-03 | 2015-06-02 | (주)엘지하우시스 | 고굴절층 코팅용 조성물 및 이를 포함하는 투명 도전성 필름 |
JP2014077117A (ja) * | 2012-09-21 | 2014-05-01 | Dow Corning Toray Co Ltd | 高屈折性表面処理剤、それを用いて表面処理された微細部材および光学材料 |
CN103804560A (zh) * | 2014-02-26 | 2014-05-21 | 江苏华天通纳米科技有限公司 | 一种高折射率光学树脂及其制备方法 |
EP3186319A4 (en) | 2014-07-25 | 2018-04-18 | Kateeva, Inc. | Organic thin film ink compositions and methods |
KR101788366B1 (ko) | 2014-11-24 | 2017-10-20 | 삼성디스플레이 주식회사 | 고굴절률 캡핑층을 포함하는 유기발광 표시장치 |
JP6507683B2 (ja) * | 2015-02-02 | 2019-05-08 | 日立化成株式会社 | 樹脂組成物及び光学部材 |
KR101943688B1 (ko) * | 2015-06-19 | 2019-01-30 | 삼성에스디아이 주식회사 | 유기발광표시장치 |
KR101943689B1 (ko) * | 2015-06-19 | 2019-01-30 | 삼성에스디아이 주식회사 | 유기발광표시장치 |
JP2018532823A (ja) | 2015-08-31 | 2018-11-08 | カティーバ, インコーポレイテッド | Di−およびモノ(メタ)アクリレートベースの有機薄膜インク組成物 |
CN106356440A (zh) * | 2016-08-31 | 2017-01-25 | 肥城芯联新材料科技有限公司 | 固晶胶及光电元件封装结构 |
WO2018070256A1 (ja) * | 2016-10-11 | 2018-04-19 | Dic株式会社 | 光学物品用活性エネルギー線硬化型樹脂組成物、硬化物及び光学シート |
KR20230167139A (ko) | 2017-04-21 | 2023-12-07 | 카티바, 인크. | 유기 박막을 형성하기 위한 조성물 및 기술 |
US11554539B2 (en) | 2017-07-28 | 2023-01-17 | Nikon Corporation | Photocurable composition for three-dimensional stereolithography and three-dimensional object |
WO2021006011A1 (ja) * | 2019-07-08 | 2021-01-14 | ソニー株式会社 | 化合物、ポリマー及び有機材料、並びにこれを用いた光学装置、光学部品及び画像表示装置 |
CN117940517A (zh) * | 2021-10-19 | 2024-04-26 | 积水化学工业株式会社 | 密封用树脂组合物 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58186976A (ja) * | 1982-04-26 | 1983-11-01 | Tokuyama Soda Co Ltd | 発光ダイオ−ド |
JPH0371680A (ja) * | 1989-08-11 | 1991-03-27 | Tokuyama Soda Co Ltd | 発光ダイオード |
JPH0580308A (ja) * | 1991-09-19 | 1993-04-02 | Dainippon Printing Co Ltd | 光学素子 |
JP2003040940A (ja) * | 2001-07-31 | 2003-02-13 | Dainippon Ink & Chem Inc | 光学素子用重合性組成物及びこれを用いた光学素子 |
JP2004126499A (ja) * | 2002-02-27 | 2004-04-22 | Canon Inc | 光学素子及び光学素子の製造方法、積層型光学素子及び積層型光学素子の製造方法、または光学材料 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61171771A (ja) * | 1985-01-25 | 1986-08-02 | Mitsubishi Chem Ind Ltd | 電子写真用感光体の製造方法 |
ATE87752T1 (de) * | 1988-01-15 | 1993-04-15 | Du Pont | Verfahren zur herstellung von reflexionshologrammen in photopolymerisierbaren schichten. |
US5175248A (en) * | 1990-06-04 | 1992-12-29 | Sartomer Company, Inc. | Process for the removal of n-vinylcarbazole from poly(n-vinylcarbazole) |
JP4530565B2 (ja) | 2001-03-29 | 2010-08-25 | 大阪瓦斯株式会社 | モノアクリレートフルオレン化合物、該化合物を含有する組成物、及びその硬化物 |
CN101336021A (zh) * | 2002-02-12 | 2008-12-31 | 出光兴产株式会社 | 有机el显示装置及其制造方法 |
US20030180563A1 (en) * | 2002-02-27 | 2003-09-25 | Canon Kabushiki Kaisha | Optical element and method of manufacturing the same, or laminated optical element and method of manufacturing the same |
US6756449B2 (en) * | 2002-02-27 | 2004-06-29 | Medtronic, Inc. | AnB block copolymers containing poly (vinyl pyrrolidone) units, medical devices, and methods |
US6870311B2 (en) | 2002-06-07 | 2005-03-22 | Lumileds Lighting U.S., Llc | Light-emitting devices utilizing nanoparticles |
-
2006
- 2006-04-10 JP JP2006108111A patent/JP2007277467A/ja active Pending
-
2007
- 2007-03-14 CN CN2007800121216A patent/CN101415736B/zh active Active
- 2007-03-14 US US12/084,707 patent/US7868109B2/en active Active
- 2007-03-14 WO PCT/JP2007/055063 patent/WO2007116625A1/ja active Application Filing
-
2009
- 2009-07-09 HK HK09106173.7A patent/HK1128483A1/xx unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58186976A (ja) * | 1982-04-26 | 1983-11-01 | Tokuyama Soda Co Ltd | 発光ダイオ−ド |
JPH0371680A (ja) * | 1989-08-11 | 1991-03-27 | Tokuyama Soda Co Ltd | 発光ダイオード |
JPH0580308A (ja) * | 1991-09-19 | 1993-04-02 | Dainippon Printing Co Ltd | 光学素子 |
JP2003040940A (ja) * | 2001-07-31 | 2003-02-13 | Dainippon Ink & Chem Inc | 光学素子用重合性組成物及びこれを用いた光学素子 |
JP2004126499A (ja) * | 2002-02-27 | 2004-04-22 | Canon Inc | 光学素子及び光学素子の製造方法、積層型光学素子及び積層型光学素子の製造方法、または光学材料 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010525111A (ja) * | 2007-04-17 | 2010-07-22 | ゼネラル・エレクトリック・カンパニイ | ポリカルバゾリル(メタ)アクリレート発光組成物 |
CN101367893B (zh) * | 2008-09-01 | 2011-11-23 | 长兴化学工业股份有限公司 | 一种可聚合组合物及其用途 |
CN102369225A (zh) * | 2009-03-30 | 2012-03-07 | 昭和电工株式会社 | 固化性组合物和其固化物 |
JP2017057401A (ja) * | 2013-09-05 | 2017-03-23 | 株式会社ダイセル | 接着剤及び封止材 |
WO2017154589A1 (ja) * | 2016-03-10 | 2017-09-14 | Dic株式会社 | 硬化性組成物及び光学部材 |
Also Published As
Publication number | Publication date |
---|---|
US20090143505A1 (en) | 2009-06-04 |
JP2007277467A (ja) | 2007-10-25 |
CN101415736B (zh) | 2012-01-04 |
HK1128483A1 (en) | 2009-10-30 |
CN101415736A (zh) | 2009-04-22 |
US7868109B2 (en) | 2011-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2007116625A1 (ja) | 硬化性樹脂組成物 | |
JP4853630B2 (ja) | 硬化性樹脂組成物 | |
US7446159B1 (en) | Curable resin composition | |
JP4952906B2 (ja) | 封止樹脂組成物及び発光素子 | |
EP2042528B1 (en) | Curable resin composition | |
US20080152933A1 (en) | Curable resin material-fine particle composite material and method of producing the same, optical material, and light emitting device | |
JP5007222B2 (ja) | 活性エネルギー線硬化型組成物 | |
TWI625340B (zh) | Sclerosing composition | |
TW201229168A (en) | UV-curable optical resin adhesive composition | |
JP6063228B2 (ja) | 光硬化性樹脂組成物 | |
US10100236B2 (en) | Light curable resin composition | |
JP2009185272A (ja) | 光学組成物、該組成物を用いて製造された集光シート及び集光シートの製造方法 | |
KR101813432B1 (ko) | 반도체 나노 입자 함유 경화성 조성물, 경화물, 광학 재료 및 전자 재료 | |
JPWO2015181984A1 (ja) | 光硬化性樹脂組成物 | |
TWI502011B (zh) | 聚合性組合物及丙烯酸樹脂膜 | |
JPWO2011087008A1 (ja) | 硬化性樹脂組成物、その硬化物からなる光学部材 | |
JP6020895B2 (ja) | 硬化性樹脂組成物、硬化物及び光学部材 | |
JP2019019245A (ja) | 光硬化性高屈折率樹脂組成物 | |
WO2013027640A1 (ja) | アクリレート系組成物 | |
JP6582413B2 (ja) | 硬化性樹脂組成物、硬化物、光学部材及び光学デバイス | |
WO2018037516A1 (ja) | 硬化性樹脂組成物、画像表示装置及び画像表示装置の製造方法 | |
WO2018221279A1 (ja) | 導光体用光硬化性樹脂組成物、導光体用硬化物、導光体及び光インテグレータ | |
JP2010031109A (ja) | 熱硬化性樹脂組成物、その硬化物、光学部材および光半導体並びにそれらの製法 | |
JP2005206704A (ja) | 光半導体素子部品用樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07738534 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12084707 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200780012121.6 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 07738534 Country of ref document: EP Kind code of ref document: A1 |