HK1128483A1 - Hardening resin composition - Google Patents

Hardening resin composition

Info

Publication number
HK1128483A1
HK1128483A1 HK09106173.7A HK09106173A HK1128483A1 HK 1128483 A1 HK1128483 A1 HK 1128483A1 HK 09106173 A HK09106173 A HK 09106173A HK 1128483 A1 HK1128483 A1 HK 1128483A1
Authority
HK
Hong Kong
Prior art keywords
resin composition
hardening resin
hardening
composition
resin
Prior art date
Application number
HK09106173.7A
Other languages
English (en)
Inventor
Hiroshi Samukawa
Kouki Hatsuda
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1128483A1 publication Critical patent/HK1128483A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
HK09106173.7A 2006-04-10 2009-07-09 Hardening resin composition HK1128483A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006108111A JP2007277467A (ja) 2006-04-10 2006-04-10 硬化性樹脂組成物
PCT/JP2007/055063 WO2007116625A1 (ja) 2006-04-10 2007-03-14 硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
HK1128483A1 true HK1128483A1 (en) 2009-10-30

Family

ID=38580927

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09106173.7A HK1128483A1 (en) 2006-04-10 2009-07-09 Hardening resin composition

Country Status (5)

Country Link
US (1) US7868109B2 (xx)
JP (1) JP2007277467A (xx)
CN (1) CN101415736B (xx)
HK (1) HK1128483A1 (xx)
WO (1) WO2007116625A1 (xx)

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US20080258111A1 (en) * 2007-04-17 2008-10-23 General Electric Company Polycarbazolyl(meth)acrylate light emissive compositions
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JP5587869B2 (ja) * 2009-03-30 2014-09-10 昭和電工株式会社 硬化性組成物及びその硬化物
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WO2011126066A1 (ja) * 2010-04-09 2011-10-13 日本化薬株式会社 光学レンズシート用エネルギー線硬化型樹脂組成物及びその硬化物
JP5812993B2 (ja) * 2010-08-12 2015-11-17 株式会社ダイセル 低透湿性樹脂組成物及びその硬化物
JP5626630B2 (ja) * 2010-09-01 2014-11-19 Dic株式会社 材料組成物およびそれを用いた光学素子
WO2012053377A1 (ja) * 2010-10-18 2012-04-26 株式会社ダイセル 高屈折率樹脂組成物および樹脂硬化物
JP4988032B2 (ja) * 2010-12-08 2012-08-01 株式会社東芝 磁気記録媒体の製造方法
JP5039199B2 (ja) * 2010-12-08 2012-10-03 株式会社東芝 パターン転写に用いられる紫外線硬化性樹脂材料
MY175544A (en) * 2010-12-13 2020-07-01 Toray Industries Phosphor sheet, led and light emitting device using the same and method for manufacturing led
WO2013047524A1 (ja) * 2011-09-27 2013-04-04 丸善石油化学株式会社 光学素子材料、及びその製造方法
KR101525286B1 (ko) * 2012-09-03 2015-06-02 (주)엘지하우시스 고굴절층 코팅용 조성물 및 이를 포함하는 투명 도전성 필름
JP2014077117A (ja) * 2012-09-21 2014-05-01 Dow Corning Toray Co Ltd 高屈折性表面処理剤、それを用いて表面処理された微細部材および光学材料
KR101838830B1 (ko) * 2013-09-05 2018-03-14 주식회사 다이셀 수지 조성물 및 전자 디바이스
CN103804560A (zh) * 2014-02-26 2014-05-21 江苏华天通纳米科技有限公司 一种高折射率光学树脂及其制备方法
US9909022B2 (en) 2014-07-25 2018-03-06 Kateeva, Inc. Organic thin film ink compositions and methods
KR101788366B1 (ko) 2014-11-24 2017-10-20 삼성디스플레이 주식회사 고굴절률 캡핑층을 포함하는 유기발광 표시장치
JP6507683B2 (ja) * 2015-02-02 2019-05-08 日立化成株式会社 樹脂組成物及び光学部材
KR101943689B1 (ko) * 2015-06-19 2019-01-30 삼성에스디아이 주식회사 유기발광표시장치
KR101943688B1 (ko) 2015-06-19 2019-01-30 삼성에스디아이 주식회사 유기발광표시장치
EP3344712A4 (en) 2015-08-31 2019-05-15 Kateeva, Inc. INK COMPOSITIONS FOR ORGANIC THIN FILM BASED ON DI AND MONO (METH) ACRYLATE
TWI708803B (zh) * 2016-03-10 2020-11-01 日商迪愛生股份有限公司 硬化性組成物及光學構件
CN106356440A (zh) * 2016-08-31 2017-01-25 肥城芯联新材料科技有限公司 固晶胶及光电元件封装结构
CN109890860B (zh) * 2016-10-11 2022-07-12 Dic株式会社 光学物品用活性能量射线固化型树脂组合物、固化物及光学片
KR102607711B1 (ko) 2017-04-21 2023-11-28 카티바, 인크. 유기 박막을 형성하기 위한 조성물 및 기술
CN110959018B (zh) 2017-07-28 2022-03-08 株式会社尼康 三维立体光刻用光固化性组合物及三维物体
KR20220029590A (ko) * 2019-07-08 2022-03-08 소니그룹주식회사 화합물, 폴리머 및 유기 재료, 및 이를 사용한 광학 장치, 광학 부품 및 화상 표시 장치
WO2023068239A1 (ja) * 2021-10-19 2023-04-27 積水化学工業株式会社 封止用樹脂組成物

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Also Published As

Publication number Publication date
WO2007116625A1 (ja) 2007-10-18
JP2007277467A (ja) 2007-10-25
US7868109B2 (en) 2011-01-11
US20090143505A1 (en) 2009-06-04
CN101415736A (zh) 2009-04-22
CN101415736B (zh) 2012-01-04

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