WO2007100105A1 - マルチx線発生装置およびマルチx線撮影装置 - Google Patents
マルチx線発生装置およびマルチx線撮影装置 Download PDFInfo
- Publication number
- WO2007100105A1 WO2007100105A1 PCT/JP2007/054090 JP2007054090W WO2007100105A1 WO 2007100105 A1 WO2007100105 A1 WO 2007100105A1 JP 2007054090 W JP2007054090 W JP 2007054090W WO 2007100105 A1 WO2007100105 A1 WO 2007100105A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ray
- electron
- target unit
- generator
- shielding means
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/16—Vessels; Containers; Shields associated therewith
- H01J35/18—Windows
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/06—Cathodes
- H01J35/065—Field emission, photo emission or secondary emission cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/08—Anodes; Anti cathodes
- H01J35/112—Non-rotating anodes
- H01J35/116—Transmissive anodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/08—Anodes; Anti cathodes
- H01J35/12—Cooling non-rotary anodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/16—Vessels; Containers; Shields associated therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/06—Cathode assembly
- H01J2235/062—Cold cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/06—Cathode assembly
- H01J2235/068—Multi-cathode assembly
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/16—Vessels
- H01J2235/165—Shielding arrangements
- H01J2235/166—Shielding arrangements against electromagnetic radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/16—Vessels
- H01J2235/165—Shielding arrangements
- H01J2235/168—Shielding arrangements against charged particles
Definitions
- the present invention relates to a multi-X-ray generator used for non-destructive X-ray imaging, diagnostic application, etc. in the field of medical equipment and industrial equipment using an X-ray source.
- an X-ray tube uses a thermoelectron source as an electron source, and thermoelectrons emitted from a filament heated to a high temperature are subjected to Wehnelt electrode, extraction electrode, acceleration electrode, and lens electrode. Accelerate through and get a high-tech energy beam. Then, after forming an electron beam into a desired shape, X-rays are generated by irradiating an X-ray target portion made of a metal cover.
- a cold cathode type electron source has been developed as an electron source to replace the thermionic source, and has been widely studied as an application of flat panel displays (FPD).
- FPD flat panel displays
- a Spindt type electron source is known in which electrons are extracted by applying a high electric field to the tip of a needle of several lOnm.
- electron emission emitters made of carbon nanotubes (CNT) and surface conduction electron sources that emit electrons by forming a nanometer-order microstructure on the surface of a glass substrate.
- Patent Documents 1 and 2 propose that a single electron beam is formed using a Spindt-type electron source or a carbon nanotube-type electron source to extract X-rays. Yes. Further, it is also disclosed in Patent Document 3 and Non-Patent Document 1 that a plurality of cold cathode electron sources are used to irradiate a multi-electron source-powered electron beam onto an X-ray target unit to generate X-rays. Has been.
- Patent Document 1 JP-A-9-180894
- Patent Document 2 Japanese Patent Application Laid-Open No. 2004-329784
- Patent Document 3 JP-A-8-264139
- Non-Patent Document 1 Applied Physics Letters 86, 184104 (2005), J. Zhang TStationaryscanning ngx-ray source based on carbon nanotube field emittersj Disclosure of the invention
- FIG. 14 is a configuration diagram of a conventional X-ray generation method using a multi-electron beam.
- a vacuum chamber 1 where an electron beam e is generated by a plurality of electron sources consisting of multi-electron-emitting device forces, the target part 2 is irradiated with the electron beam e to generate X-rays, and the generated X-rays are exhausted as they are. Take out inside.
- X-rays generated from the target part 2 diverge in all directions in a vacuum.
- An object of the present invention is to solve the above-mentioned problems, and to produce a multi-X-ray generator capable of forming a multi-X-ray beam that is compact, has few scattered X-rays and has excellent uniformity, and an X-ray using the same It is to provide a photographing apparatus.
- the technical feature of the multi-X-ray generator according to the present invention for achieving the above object is that a plurality of electron-emitting devices and acceleration means for accelerating the electron beams emitted by the plurality of electron-emitting device forces are provided. And an X-ray generator having a target unit for irradiating the electron beam, wherein the target unit is provided opposite to the electron beam, and the target unit includes X-ray shielding means and is generated from the target unit. X-rays can be extracted into the atmosphere as multiple X-ray beams.
- the X-ray source using a plurality of electron-emitting devices is used to control the X-ray divergence angle. Forming can do. Using this multi X-ray beam, a miniaturized X-ray imaging apparatus with excellent beam uniformity can be realized.
- FIG. 1 is a configuration diagram of a multi X-ray source main body according to Embodiment 1.
- FIG. 1 is a configuration diagram of a multi X-ray source main body according to Embodiment 1.
- FIG. 2 is a plan view of an element substrate.
- FIG. 3 is a configuration diagram of a Spindt-type element.
- FIG. 4 is a configuration diagram of a carbon nanotube type device.
- FIG. 5 is a configuration diagram of a surface conduction element.
- FIG. 6 is a graph of voltage-current characteristics of a multi-electron emitter.
- FIG. 7 is a configuration diagram of a multi-type transmission target unit including an X-ray shielding plate.
- FIG. 8 is a configuration diagram of a transmissive target unit.
- FIG. 9 is a configuration diagram of a multi-type transmission target unit including an X-ray shielding plate.
- FIG. 10 is a configuration diagram of a transmissive target unit including an X-ray reflection electron beam shielding plate.
- FIG. 11 is a configuration diagram in which a tapered X-ray extraction part is provided on the X-ray shielding plate.
- FIG. 12 is a perspective view of a multi X-ray source body using a reflective target unit according to a second embodiment.
- FIG. 13 is a configuration diagram of a multi X-ray imaging apparatus according to Embodiment 3.
- FIG. 14 is a configuration diagram of a conventional multi X-ray source.
- FIG. 15 is a configuration diagram of a conventional multi X-ray source.
- Fig. 1 is a block diagram of the multi-X-ray source body 10, and the electron beam generator 1 is located in the vacuum chamber 11.
- the electron beam generator 12 includes an element substrate 14 and its A plurality of electron-emitting devices 15 are arranged on the device array 16, and the driving of the electron-emitting devices 15 is controlled by a drive signal unit 17.
- a lens electrode 19 fixed to the insulator 18 is provided, and a high voltage is applied to these electrodes 19, 20 via high voltage introduction parts 21, 22. Supplied.
- a transmission type target portion 13 with which the generated electron beam e collides is discretely configured so as to face the electron beam e. Further, an X-ray shielding plate 23 made of heavy metal is provided on the transmission type target portion 13, and an X-ray extraction portion 24 is provided on the X-ray shielding plate 23 in the vacuum chamber, and the wall portion of the vacuum chamber 11 in front of the X-ray shielding plate 23. 25 is provided with an X-ray extraction window 27 provided with an X-ray transmission film 26.
- the electron beam e generated from the electron-emitting device 15 is subjected to a lens action by the lens electrode 19 and accelerated to the final potential at the transmission target portion 13 of the anode electrode 20.
- the X-ray beam X generated in the transmission target unit 13 passes through the X-ray extraction unit 24 and is further extracted from the X-ray extraction window 27 into the atmosphere.
- a plurality of X-ray beams X are generated in response to a plurality of electron beams e from a plurality of electron-emitting devices 15, and a plurality of X-ray beams X are extracted from the X war take-out unit 24 to form a multi-X-ray beam. Will be.
- the electron-emitting devices 15 are two-dimensionally arranged on the device array 16 as shown in FIG. With recent advances in nanotechnology, it is possible to form fine structures of nm size at a predetermined position by a device process, and the electron emitter 15 is fabricated using this nanotechnology. Yes.
- the electron emission amount of each of these electron-emitting devices 15 is individually controlled by drive signals Sl and S2, which will be described later, via a drive signal unit 17. That is, by individually controlling the electron emission amount of the electron emitter 15 on the element array 16 by the matrix signals of the drive signals Sl and S2, the X-ray beam can be individually controlled to be turned on and off.
- FIG. 3 is a configuration diagram of the Spindt type electron-emitting device 15.
- An insulator 32 and an extraction electrode 33 are provided on an element substrate 31 made of Si, and a conical emitter having a tip diameter of several lOnm made of metal or a semiconductor material in a groove of / zm size in the center. 34 is formed using the device fabrication process.
- FIG. 4 is a configuration diagram of the carbon nanotube type electron-emitting device 15. As the material of the emitter 35, a carbon nanotube having a fine structural force of several lOnm is used, and the emitter 35 is formed at the center of the extraction electrode 36.
- FIG. 5 is a block diagram of the surface conduction electron-emitting device 15, and a fine structure having nanoparticle force is formed in the gap between the thin film electrodes 37 formed on the glass device substrate 31.
- a surface conduction type device by applying a voltage of several tens of volts between electrodes, a high electric field is applied to a fine gap formed by fine particles between electrodes, thereby generating conduction electrons.
- the electron beam e is emitted into the vacuum, and the electron emission can be controlled at a relatively low voltage.
- FIG. 6 shows voltage-current characteristics of these Spindt-type devices, carbon nanotube-type devices, and surface conduction devices.
- a voltage corrected by a correction voltage ⁇ with respect to the average driving voltage Vo is supplied to the electron-emitting device 15 as a driving voltage, whereby the emission current of the electron-emitting device 15 varies. Can be corrected.
- an electron source for generating a multi-X-ray beam other than the above-described electron-emitting device a MIM (Metallnsulator Metal) type device or an MIS (Metal Insulator Semiconductor) type device can be applied. Furthermore, a cold cathode type electron source such as a semiconductor PN junction or Schottky junction type can be applied.
- An X-ray generator using such a cold cathode electron-emitting device as an electron source emits electrons by heating a force sword at room temperature and supplying a low voltage to the electron-emitting device. No waiting time for X-ray generation is necessary. In addition, since no power is required for power sword heating, a low power consumption X-ray source can be created even if a multi-X-ray source is configured. Since these electron-emitting devices can control the current on and off with high-speed driving of the driving voltage, select the electron-emitting device to be driven and manufacture a multi-array X-ray source that responds quickly. can do.
- FIG. Figure 7 shows the multi-type transmission type
- An example of one get portion 13 is shown, and transmissive target portions 13 corresponding to the electron-emitting devices 15 are arranged in the vacuum chamber 11.
- an X-ray beam generated by irradiating the transmission target 13 with one electron beam e and an X-ray beam generated by an adjacent electron beam e is used. It is necessary to distinguish it from the vacuum chamber 11 without mixing with X.
- the X-ray shielding plate 23 in the vacuum chamber and the multi-type transmissive target portion 13 have a single structure.
- the X-ray extraction unit 24 provided on the X-ray shielding plate 23 is arranged at a position corresponding to the electron beam e so that the X-ray beam X having a necessary opening angle can be extracted from the transmission target unit 13. .
- the transmissive target portion 13 formed of a metal thin film generally has low heat dissipation, it is difficult to input a large amount of power.
- the transmissive target portion 13 of this embodiment is covered with the thick X-ray shielding plate 23 except for the region where the electron beam e is irradiated and the X-ray beam X is extracted, and the transmissive target portion 13 and the X-ray shielding plate are covered. 23 is in mechanical and thermal contact. Therefore, the X-ray shielding plate 23 has a function of radiating the heat of the transmission target 13 by heat conduction.
- transmissive target unit 13 in which a much larger electric power is applied than in the conventional transmissive target unit and a plurality of transmissive target units 13 are arranged. Since the surface accuracy is improved by using the thick X-ray shielding plate 23, a multi-X-ray source with uniform X-ray radiation characteristics can be manufactured.
- the transmissive target unit 13 is composed of an X-ray generation layer 131 and an X-ray generation support layer 132, and has excellent functionality with high X-ray generation efficiency.
- An X-ray shielding plate 23 is provided on the X-ray generation support layer 132.
- the X-ray generation layer 131 is formed of heavy metal having a thickness of about several lOnm to several / zm in order to reduce absorption generated when the X-ray beam X passes through the transmission target unit 13.
- the X-ray generation support layer 132 supports the thin film layer of the X-ray generation layer 131 and at the same time increases the cooling efficiency of the X-ray generation layer 131 heated by irradiation of the electron beam e, thereby absorbing the X-ray beam X.
- a substrate made of light elements is used.
- the conventional X-ray generating support layer 132 is generally made of metal beryllium as a substrate material.
- Al, A1N, and SiC having a film thickness of about 0.1 mm to several mm are used alone or in combination.
- This material has high thermal conductivity and excellent X-ray transmission, and absorbs less than 50% of the X-ray beam in the low-energy region of the X-ray beam X. This is because it has a filter function that changes the quality of the X-ray beam X.
- the divergence angle of the X-ray beam X is determined by the opening condition of the X-ray extraction part 24 arranged in the vacuum chamber 11, but it is necessary to adjust the divergence angle of the X-ray beam X according to the imaging conditions. There is a match.
- FIG. 9 has two shielding means corresponding to this demand, and an X-ray shielding plate 41 provided outside the vacuum chamber 11 is combined with the X-ray shielding plate 23 in the vacuum chamber. Since the X-ray shielding plate 41 provided in the atmosphere can be easily replaced, the divergence angle of the X-ray beam X can be freely selected according to the irradiation condition of the subject.
- FIG. 10 shows a countermeasure against this problem.
- An X-ray reflecting electron beam shielding plate 43 provided with an electron beam incident hole 42 is provided on the electron emission element 15 side of the transmission type target unit 13. It has been.
- the electron beam e emitted from the electron-emitting device 15 passes through the electron beam incident hole 42 of the X-ray / reflected electron beam shielding plate 43 and irradiates the transmissive target unit 13. Thereby, the X-rays, reflected electrons, and secondary electrons generated on the surface force electron source side of the transmission type target unit 13 can be shielded by the X-ray / reflected electron beam shielding plate 43.
- the arrangement density of the X-ray beam X is limited by the arrangement density of the electron-emitting devices 15. It ’s not something that ’s done.
- This arrangement density is determined by the multi X-rays generated at the transmission target 13 It is determined by the X-ray shielding plates 23 and 41 that are extracted as X-ray beams x separated from each other in the source.
- Table 1 shows the X-ray beam X for 50KeV, 62KeV, and 82KeV energy, assuming the energy of the X-ray beam X generated by irradiating the transmission target 13 with the lOOKeV electron beam e.
- the shielding effect of heavy gold d genus (Ta, W, Pb) is shown.
- an attenuation factor of 1Z100 is appropriate as an amount that does not affect the X-ray image.
- the thickness of the shielding plate to achieve this attenuation factor As can be seen, heavy metal with a thickness of about 5 to: LOmm is required.
- the X-ray reflection electron beam shielding plate 43, X-ray shielding plate 23 shown in FIG. It is appropriate to set the thicknesses D1 and D2 to 5 to LOmm. Further, the shielding efficiency can be increased by forming the X-ray extraction portion 24 of the in-vacuum X-ray shielding plate 23 into a tapered window.
- FIG. 12 is a configuration diagram of the second embodiment and shows a structure of a multi-X-ray source body 10 ′ having a reflective target portion 13 ′.
- An X-ray / reflected electron beam shielding plate 43 equipped with an electron beam generator 12 ', a reflective target 13', an electron beam entrance hole 42 'and an X-ray extraction part 24' in the vacuum chamber 11 '. It is composed of the anode electrode 20, which also has power! RU
- the electron beam generator 12 ' the electron beam e generated by the electron emitter 15 passes through the lens electrode and is accelerated to high energy. Then, the accelerated electron beam e is applied to the reflective target portion 13 ′ through the electron beam incident hole 42 ′ of the X-ray “reflection electron beam shielding plate 43”.
- X-rays generated at the reflective target unit 13 ' are extracted as an X-ray beam X from the X-ray extraction unit 24 of the X-ray' reflected electron beam shielding plate 43 ', and a plurality of X-ray beams X are used as a multi-X-ray beam. Is formed.
- scattering of reflected electrons that cause high voltage discharge is It can be greatly suppressed by the electron beam shielding plate 43 ′.
- the X-ray shielding plate 23 in the vacuum chamber 11 and the X-ray shielding plate 41 outside the vacuum chamber 11 are used to adjust the radiation angle of the X-ray beam X. ⁇
- the X-ray beam X radiation angle can be adjusted using the X-ray shielding plate 41 outside the vacuum chamber 11.
- Example 2 the force electron beam generation unit 12, the anode electrode 20, and the reflection type target unit 13 described in the application example to the reflection type target unit 13 'having a planar structure are arranged in an arc shape. It can also be applied to multi X-ray source bodies. For example, by arranging X-ray shielding plates 23 and 41 in a circular arc centered on the subject as the position where the reflective target portion 13 ′ is placed, the leakage X-ray shown in the conventional example of FIG. The x2 area can be extremely reduced. This arrangement can be applied to the transmissive target unit 13 in the same manner.
- Example 2 the electron beam e irradiates the reflective target unit 13 ', and the X-ray generated by the medium force scattering X-rays and the leakage X-rays are extremely small, the SZN is high and independent. X-ray beam X can be taken out. Therefore, high-quality X-ray imaging with high contrast can be performed using this X-ray beam X.
- FIG. 13 shows a configuration diagram of a multi X-ray imaging apparatus.
- a multi X-ray intensity measuring unit 52 having a transmission X-ray detector 51 is arranged in front of the multi X-ray source body 10 shown in FIG. 1, and further, an X-ray is passed through a subject not shown.
- a detector 53 is arranged.
- the multi X-ray intensity measuring unit 52 and the X-ray detector 53 are connected to the control unit 56 via X-ray detection signal processing units 54 and 55, respectively.
- the output of the control unit 56 is connected to the drive signal unit 17 via the electron-emitting device drive circuit 57. Further, the output of the control unit 56 is connected to the high voltage introduction units 21 and 22 of the lens electrode 19 and the anode electrode 20 via high voltage control units 58 and 59, respectively.
- the multiple X-ray source main body 10 is configured to irradiate the transmission target unit 13 with a plurality of electron beams e extracted from the electron beam generation unit 12, and generate a plurality of X-ray beams X. As described in Example 1.
- the generated X-ray beams X are extracted as multi-X-ray beams through an X-ray extraction window 27 provided on the wall 25 toward the multi-X-ray intensity measuring unit 52 in the atmosphere.
- Multiple X-ray beams (multiple X-ray beams X) After passing through the transmission type X-ray detector 51 of the fixed part 52, the subject is irradiated.
- the multi X-ray beam that has passed through the subject is detected by the X-ray detector 53, and an X-ray transmission image of the subject is obtained.
- the transmission X-ray detector 51 of the multi-X-ray intensity measuring unit 52 is a detector using a semiconductor.
- the transmissive X-ray detector 51 absorbs a part of the multi-X-ray beam and converts it into an electrical signal.
- the obtained electrical signal is then converted into digital data by the X-ray detection signal processing unit 54 and a plurality of The X-ray beam X is stored in the control unit 56 as intensity data.
- control unit 56 stores correction data of the electron-emitting devices 15 corresponding to the voltage-current characteristics of the electron-emitting devices 15 of FIG. 6, and compares them with the detection intensity data of the multi-X-ray beam.
- the set value of the correction voltage for each electron-emitting device 15 is determined.
- the drive voltages of the drive signals Sl and S2 by the emission element drive signal unit 17 controlled by the electron emission element drive circuit 57 are corrected.
- the emission current of the electron-emitting device 15 can be made uniform, and at the same time, the intensity of the X-ray beam X in the multi-X-ray beam can be made uniform.
- the X-ray intensity correction method using the transmission X-ray detector 51 can measure the X-ray intensity regardless of the subject, the X-ray beam X intensity correction is performed in real time during X-ray imaging. It is possible to perform.
- the intensity of the multi-X-ray beam can be corrected using the X-ray detector 53 for imaging.
- the X-ray detector 53 uses a two-dimensional X-ray detector such as a CCD solid-state imaging device or an imaging device using amorphous silicon, and can measure the intensity distribution of each X-ray beam X.
- X-ray detector 53 may detect the synchronization. In this case, the X-ray beam generation signal and imaging of the multiple X-ray beams are used. If the detection signals from the shadow X-ray detector 53 are measured in synchronism, the intensity distribution of multi-X-ray beams can be measured efficiently. This detection signal is digitally converted by the X-ray detection signal processing unit 55 and then stored in the control unit 56.
- This operation is performed for all the electron-emitting devices 15, and is stored in the control unit 56 as intensity distribution data of all multi-X-ray beams. At the same time, a part of the intensity distribution of the multi-X-ray beams or an integrated value is obtained. The correction value of the driving voltage for each electron-emitting device 15 is determined by using this.
- the multi-electron emission element drive circuit 57 drives the electron emission element 15 according to the correction value of the drive voltage.
- a series of these operations is usually performed as a periodic calibration of the apparatus, so that the intensity of the X-ray beam X can be made uniform.
- the present correction method since the present correction method has the intensity distribution of each X-ray beam X as data, it can be used for correcting unevenness in the X-ray beam X.
- the X-ray imaging apparatus using the multi-X-ray source body 10 of the present embodiment can realize a subject-size planar X-ray source by arranging X-ray beams X as described above.
- the apparatus can be miniaturized by bringing the source body 10 and the X-ray detector 53 close to each other. Further, as described above, the X-ray beam X can arbitrarily select the X-ray irradiation intensity and the irradiation region by designating the driving condition of the electron-emitting device driving circuit 57 and the element region to be driven.
- the multi X-ray imaging apparatus can select the radiation angle of the X-ray beam X by changing the X-ray shielding plate 41 provided outside the vacuum chamber 11 shown in FIG.
- the optimal X-ray beam X can be obtained according to the imaging conditions such as the distance and resolution between the subject and the subject.
Landscapes
- X-Ray Techniques (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Description
Claims
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BRPI0708509A BRPI0708509B8 (pt) | 2006-03-03 | 2007-03-02 | gerador de raios-x múltiplos, e, aparelho de formação de imagem de raios-x múltiplos |
KR1020107026906A KR101113093B1 (ko) | 2006-03-03 | 2007-03-02 | 멀티 x선 발생장치 및 멀티 x선 촬영장치 |
CN2007800070290A CN101395691B (zh) | 2006-03-03 | 2007-03-02 | 多x射线发生器以及多x射线摄影设备 |
US12/281,453 US7873146B2 (en) | 2006-03-03 | 2007-03-02 | Multi X-ray generator and multi X-ray imaging apparatus |
KR1020087022668A KR101113092B1 (ko) | 2006-03-03 | 2007-03-02 | 멀티 x선 발생장치 및 멀티 x선 촬영장치 |
EP07715172.8A EP1995757B1 (en) | 2006-03-03 | 2007-03-02 | Multi x-ray generator and multi-radiography system |
US12/875,745 US7889844B2 (en) | 2006-03-03 | 2010-09-03 | Multi X-ray generator and multi X-ray imaging apparatus |
US12/971,849 US8139716B2 (en) | 2006-03-03 | 2010-12-17 | Multi X-ray generator and multi X-ray imaging apparatus |
US13/370,478 US8861682B2 (en) | 2006-03-03 | 2012-02-10 | Multi X-ray generator and multi X-ray imaging apparatus |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006057846 | 2006-03-03 | ||
JP2006-057846 | 2006-03-03 | ||
JP2007-050942 | 2007-03-01 | ||
JP2007050942A JP4878311B2 (ja) | 2006-03-03 | 2007-03-01 | マルチx線発生装置 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/281,453 A-371-Of-International US7873146B2 (en) | 2006-03-03 | 2007-03-02 | Multi X-ray generator and multi X-ray imaging apparatus |
US12/875,745 Continuation US7889844B2 (en) | 2006-03-03 | 2010-09-03 | Multi X-ray generator and multi X-ray imaging apparatus |
US12/971,849 Continuation US8139716B2 (en) | 2006-03-03 | 2010-12-17 | Multi X-ray generator and multi X-ray imaging apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007100105A1 true WO2007100105A1 (ja) | 2007-09-07 |
Family
ID=38459200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/054090 WO2007100105A1 (ja) | 2006-03-03 | 2007-03-02 | マルチx線発生装置およびマルチx線撮影装置 |
Country Status (8)
Country | Link |
---|---|
US (4) | US7873146B2 (ja) |
EP (2) | EP2573791B1 (ja) |
JP (1) | JP4878311B2 (ja) |
KR (2) | KR101113093B1 (ja) |
CN (2) | CN101395691B (ja) |
BR (1) | BRPI0708509B8 (ja) |
RU (1) | RU2388103C1 (ja) |
WO (1) | WO2007100105A1 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009136518A (ja) * | 2007-12-07 | 2009-06-25 | Canon Inc | X線撮影装置及びx線撮影方法 |
WO2009101882A1 (ja) * | 2008-02-13 | 2009-08-20 | Canon Kabushiki Kaisha | X線発生装置、x線撮影装置及びそれらの制御方法 |
WO2010055930A1 (en) | 2008-11-11 | 2010-05-20 | Canon Kabushiki Kaisha | X-ray imaging apparatus |
US7940888B2 (en) | 2009-04-03 | 2011-05-10 | Canon Kabushiki Kaisha | X-ray imaging apparatus, method of controlling the same, and computer program |
US7991120B2 (en) | 2008-02-28 | 2011-08-02 | Canon Kabushiki Kaisha | Multi X-ray generating apparatus and X-ray imaging apparatus |
US20120027173A1 (en) * | 2009-03-27 | 2012-02-02 | Koninklijke Philips Electronics N.V. | Structured electron emitter for coded source imaging with an x-ray tube |
JP2013051165A (ja) * | 2011-08-31 | 2013-03-14 | Canon Inc | 透過型x線発生装置 |
JP2013051164A (ja) * | 2011-08-31 | 2013-03-14 | Canon Inc | 透過型x線発生装置 |
WO2015039604A1 (zh) * | 2013-09-23 | 2015-03-26 | 清华大学 | 一种产生均整x射线辐射场的装置以及方法 |
RU2578675C1 (ru) * | 2013-06-28 | 2016-03-27 | Демидова Елена Викторовна | Многолучевая рентгеновская трубка |
US9570264B2 (en) | 2011-08-31 | 2017-02-14 | Canon Kabushiki Kaisha | X-ray generator and X-ray imaging apparatus |
US9595415B2 (en) | 2011-08-31 | 2017-03-14 | Canon Kabushiki Kaisha | X-ray generator and X-ray imaging apparatus |
Families Citing this family (112)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10483077B2 (en) | 2003-04-25 | 2019-11-19 | Rapiscan Systems, Inc. | X-ray sources having reduced electron scattering |
GB0525593D0 (en) | 2005-12-16 | 2006-01-25 | Cxr Ltd | X-ray tomography inspection systems |
GB0812864D0 (en) | 2008-07-15 | 2008-08-20 | Cxr Ltd | Coolign anode |
US9208988B2 (en) | 2005-10-25 | 2015-12-08 | Rapiscan Systems, Inc. | Graphite backscattered electron shield for use in an X-ray tube |
US8094784B2 (en) | 2003-04-25 | 2012-01-10 | Rapiscan Systems, Inc. | X-ray sources |
US8243876B2 (en) | 2003-04-25 | 2012-08-14 | Rapiscan Systems, Inc. | X-ray scanners |
US9046465B2 (en) | 2011-02-24 | 2015-06-02 | Rapiscan Systems, Inc. | Optimization of the source firing pattern for X-ray scanning systems |
KR100895067B1 (ko) * | 2007-12-17 | 2009-05-04 | 한국전자통신연구원 | 개별 어드레싱이 가능한 대면적 x 선 시스템 |
JP5550209B2 (ja) * | 2007-12-25 | 2014-07-16 | キヤノン株式会社 | X線撮影装置 |
JP5367275B2 (ja) * | 2008-02-18 | 2013-12-11 | 株式会社アールエフ | 放射線撮像システム |
JP5398157B2 (ja) * | 2008-03-17 | 2014-01-29 | キヤノン株式会社 | X線撮影装置及びその制御方法 |
JP2010015711A (ja) * | 2008-07-01 | 2010-01-21 | Kyoto Univ | 異極像結晶を用いたx線発生装置 |
JP4693884B2 (ja) | 2008-09-18 | 2011-06-01 | キヤノン株式会社 | マルチx線撮影装置及びその制御方法 |
GB0901338D0 (en) | 2009-01-28 | 2009-03-11 | Cxr Ltd | X-Ray tube electron sources |
JP5416426B2 (ja) * | 2009-02-03 | 2014-02-12 | 富士フイルム株式会社 | 放射線画像撮影装置 |
US8724872B1 (en) * | 2009-02-25 | 2014-05-13 | L-3 Communications Security And Detection Systems, Inc. | Single radiation data from multiple radiation sources |
JP5346654B2 (ja) | 2009-03-31 | 2013-11-20 | キヤノン株式会社 | 放射線撮影装置及びその制御方法 |
WO2010141659A1 (en) * | 2009-06-03 | 2010-12-09 | Rapiscan Security Products, Inc. | A graphite backscattered electron shield for use in an x-ray tube |
KR101023713B1 (ko) | 2009-06-16 | 2011-03-25 | 한국전기연구원 | 투과형 또는 반사형 모드의 선택이 가능한 듀얼 x-선 발생장치 |
US8229074B2 (en) * | 2009-08-17 | 2012-07-24 | Indian Institute Of Science | Carbon nanotube array for focused field emission |
JP5641916B2 (ja) | 2010-02-23 | 2014-12-17 | キヤノン株式会社 | 放射線発生装置および放射線撮像システム |
JP5416006B2 (ja) | 2010-03-23 | 2014-02-12 | キヤノン株式会社 | X線発生装置及びその制御方法 |
JP5661368B2 (ja) * | 2010-08-04 | 2015-01-28 | キヤノン株式会社 | X線発生装置 |
JP2012066062A (ja) * | 2010-08-24 | 2012-04-05 | Fujifilm Corp | 放射線撮影システム及び放射線撮影方法 |
US8320521B2 (en) * | 2010-09-30 | 2012-11-27 | General Electric Company | Method and system for operating an electron beam system |
US9373478B2 (en) | 2010-12-10 | 2016-06-21 | Canon Kabushiki Kaisha | Radiation generating apparatus and radiation imaging apparatus |
JP5455880B2 (ja) | 2010-12-10 | 2014-03-26 | キヤノン株式会社 | 放射線発生管、放射線発生装置ならびに放射線撮影装置 |
JP2012138203A (ja) * | 2010-12-24 | 2012-07-19 | Aet Inc | X線発生装置とx線発生装置群を用いたx線照射装置 |
EP2533267B1 (en) * | 2011-06-10 | 2014-04-23 | Outotec Oyj | X-ray tube and X-ray fluorescence analyser utilizing selective excitation radiation |
WO2013002124A1 (ja) * | 2011-06-28 | 2013-01-03 | 株式会社 東芝 | X線管球及びx線ct装置 |
KR101773960B1 (ko) * | 2011-06-30 | 2017-09-12 | 한국전자통신연구원 | 단층합성영상 시스템 |
JP2013020792A (ja) | 2011-07-11 | 2013-01-31 | Canon Inc | 放射線発生装置及びそれを用いた放射線撮影装置 |
JP5791401B2 (ja) | 2011-07-11 | 2015-10-07 | キヤノン株式会社 | 放射線発生装置及びそれを用いた放射線撮影装置 |
JP6039282B2 (ja) | 2011-08-05 | 2016-12-07 | キヤノン株式会社 | 放射線発生装置及び放射線撮影装置 |
CN103733734B (zh) | 2011-08-05 | 2016-04-27 | 佳能株式会社 | 放射线发生装置和放射线成像装置 |
JP5871528B2 (ja) | 2011-08-31 | 2016-03-01 | キヤノン株式会社 | 透過型x線発生装置及びそれを用いたx線撮影装置 |
JP5875297B2 (ja) | 2011-08-31 | 2016-03-02 | キヤノン株式会社 | 放射線発生管及びそれを用いた放射線発生装置、放射線撮影システム |
JP5902186B2 (ja) * | 2011-09-29 | 2016-04-13 | 富士フイルム株式会社 | 放射線撮影システム及び放射線撮影方法 |
CN103907402A (zh) | 2011-11-02 | 2014-07-02 | 富士胶片株式会社 | 放射线照射装置、放射线照射方法及程序存储介质 |
US20150117599A1 (en) | 2013-10-31 | 2015-04-30 | Sigray, Inc. | X-ray interferometric imaging system |
JP2013128661A (ja) | 2011-12-21 | 2013-07-04 | Canon Inc | ステレオx線撮影装置、ステレオx線撮影方法 |
US9058954B2 (en) | 2012-02-20 | 2015-06-16 | Georgia Tech Research Corporation | Carbon nanotube field emission devices and methods of making same |
JP5580843B2 (ja) * | 2012-03-05 | 2014-08-27 | 双葉電子工業株式会社 | X線管 |
JP6108671B2 (ja) | 2012-03-13 | 2017-04-05 | キヤノン株式会社 | 放射線撮影装置 |
KR102076380B1 (ko) * | 2012-03-16 | 2020-02-11 | 나녹스 이미징 피엘씨 | 전자 방출 구조체를 갖는 장치 |
JP2013218933A (ja) * | 2012-04-10 | 2013-10-24 | Canon Inc | 微小焦点x線発生装置及びx線撮影装置 |
WO2013184213A2 (en) * | 2012-05-14 | 2013-12-12 | The General Hospital Corporation | A distributed, field emission-based x-ray source for phase contrast imaging |
KR101917742B1 (ko) * | 2012-07-06 | 2018-11-12 | 삼성전자주식회사 | 메쉬 전극 접합 구조체, 전자 방출 소자, 및 전자 방출 소자를 포함하는 전자 장치 |
CN104584179B (zh) | 2012-08-16 | 2017-10-13 | 纳欧克斯影像有限公司 | 图像捕捉装置 |
JP5662393B2 (ja) * | 2012-08-30 | 2015-01-28 | 株式会社アドバンテスト | 電子ビーム検出器、電子ビーム処理装置及び電子ビーム検出器の製造方法 |
JP6099938B2 (ja) | 2012-11-13 | 2017-03-22 | キヤノン株式会社 | マルチx線発生管及びそれを用いたx線撮影システム |
US9008278B2 (en) * | 2012-12-28 | 2015-04-14 | General Electric Company | Multilayer X-ray source target with high thermal conductivity |
CN203165848U (zh) * | 2012-12-29 | 2013-08-28 | 清华大学 | X光管 |
JP6116274B2 (ja) * | 2013-02-13 | 2017-04-19 | キヤノン株式会社 | 放射線発生装置および該放射線発生装置を備える放射線撮影装置 |
JP6080610B2 (ja) * | 2013-02-26 | 2017-02-15 | キヤノン株式会社 | マルチ放射線発生装置および放射線撮影システム |
JP5693650B2 (ja) * | 2013-05-09 | 2015-04-01 | キヤノン株式会社 | X線撮影装置及びx線撮影方法 |
JP2013154254A (ja) * | 2013-05-24 | 2013-08-15 | Canon Inc | X線断層撮影装置 |
JP2015019987A (ja) * | 2013-07-23 | 2015-02-02 | キヤノン株式会社 | マルチ放射線発生装置及び放射線撮影システム |
JP6188470B2 (ja) * | 2013-07-24 | 2017-08-30 | キヤノン株式会社 | 放射線発生装置及びそれを用いた放射線撮影システム |
KR20150024720A (ko) | 2013-08-27 | 2015-03-09 | 삼성전자주식회사 | 평판형 엑스선 발생기 및 이를 구비하는 엑스선 영상 시스템 |
US9368316B2 (en) * | 2013-09-03 | 2016-06-14 | Electronics And Telecommunications Research Institute | X-ray tube having anode electrode |
US10295485B2 (en) | 2013-12-05 | 2019-05-21 | Sigray, Inc. | X-ray transmission spectrometer system |
US9570265B1 (en) | 2013-12-05 | 2017-02-14 | Sigray, Inc. | X-ray fluorescence system with high flux and high flux density |
US9448190B2 (en) | 2014-06-06 | 2016-09-20 | Sigray, Inc. | High brightness X-ray absorption spectroscopy system |
US10269528B2 (en) | 2013-09-19 | 2019-04-23 | Sigray, Inc. | Diverging X-ray sources using linear accumulation |
CN105556637B (zh) * | 2013-09-19 | 2019-12-10 | 斯格瑞公司 | 使用线性累加的x射线源 |
US9449781B2 (en) | 2013-12-05 | 2016-09-20 | Sigray, Inc. | X-ray illuminators with high flux and high flux density |
US10297359B2 (en) | 2013-09-19 | 2019-05-21 | Sigray, Inc. | X-ray illumination system with multiple target microstructures |
US9390881B2 (en) | 2013-09-19 | 2016-07-12 | Sigray, Inc. | X-ray sources using linear accumulation |
JP5723432B2 (ja) * | 2013-10-24 | 2015-05-27 | キヤノン株式会社 | X線撮影装置及びその制御方法 |
USRE48612E1 (en) | 2013-10-31 | 2021-06-29 | Sigray, Inc. | X-ray interferometric imaging system |
US10304580B2 (en) | 2013-10-31 | 2019-05-28 | Sigray, Inc. | Talbot X-ray microscope |
KR20150051820A (ko) * | 2013-11-05 | 2015-05-13 | 삼성전자주식회사 | 투과형 평판 엑스레이 발생 장치 및 엑스레이 영상 시스템 |
KR102259859B1 (ko) | 2013-11-27 | 2021-06-03 | 나녹스 이미징 피엘씨 | 이온 내충격성을 가진 전자 방출 구조물 |
JP6395373B2 (ja) | 2013-11-29 | 2018-09-26 | キヤノン株式会社 | 放射線発生ユニットおよび放射線撮影装置 |
JP6272043B2 (ja) * | 2014-01-16 | 2018-01-31 | キヤノン株式会社 | X線発生管及びこれを用いたx線発生装置、x線撮影システム |
US9594036B2 (en) | 2014-02-28 | 2017-03-14 | Sigray, Inc. | X-ray surface analysis and measurement apparatus |
US9823203B2 (en) | 2014-02-28 | 2017-11-21 | Sigray, Inc. | X-ray surface analysis and measurement apparatus |
JP2015170424A (ja) * | 2014-03-05 | 2015-09-28 | 株式会社日立メディコ | X線発生装置 |
US9976971B2 (en) * | 2014-03-06 | 2018-05-22 | United Technologies Corporation | Systems and methods for X-ray diffraction |
US10401309B2 (en) | 2014-05-15 | 2019-09-03 | Sigray, Inc. | X-ray techniques using structured illumination |
CN105374654B (zh) | 2014-08-25 | 2018-11-06 | 同方威视技术股份有限公司 | 电子源、x射线源、使用了该x射线源的设备 |
GB2531326B (en) * | 2014-10-16 | 2020-08-05 | Adaptix Ltd | An X-Ray emitter panel and a method of designing such an X-Ray emitter panel |
TWI552187B (zh) * | 2014-11-20 | 2016-10-01 | 能資國際股份有限公司 | 冷陰極x射線產生器的封裝結構及其抽真空的方法 |
US10352880B2 (en) | 2015-04-29 | 2019-07-16 | Sigray, Inc. | Method and apparatus for x-ray microscopy |
US10295486B2 (en) | 2015-08-18 | 2019-05-21 | Sigray, Inc. | Detector for X-rays with high spatial and high spectral resolution |
EP3171163B1 (en) * | 2015-11-18 | 2022-05-04 | FEI Company | X-ray imaging technique |
US11282668B2 (en) * | 2016-03-31 | 2022-03-22 | Nano-X Imaging Ltd. | X-ray tube and a controller thereof |
US10991539B2 (en) * | 2016-03-31 | 2021-04-27 | Nano-X Imaging Ltd. | X-ray tube and a conditioning method thereof |
US11145431B2 (en) * | 2016-08-16 | 2021-10-12 | Massachusetts Institute Of Technology | System and method for nanoscale X-ray imaging of biological specimen |
EP3500845A1 (en) * | 2016-08-16 | 2019-06-26 | Massachusetts Institute of Technology | Nanoscale x-ray tomosynthesis for rapid analysis of integrated circuit (ic) dies |
US10247683B2 (en) | 2016-12-03 | 2019-04-02 | Sigray, Inc. | Material measurement techniques using multiple X-ray micro-beams |
JP6937380B2 (ja) | 2017-03-22 | 2021-09-22 | シグレイ、インコーポレイテッド | X線分光を実施するための方法およびx線吸収分光システム |
CN109216139A (zh) * | 2017-06-30 | 2019-01-15 | 同方威视技术股份有限公司 | 用于多焦点x射线管的壳体和多焦点x射线管 |
CN109216140A (zh) * | 2017-06-30 | 2019-01-15 | 同方威视技术股份有限公司 | 多焦点x射线管和壳体 |
KR101966794B1 (ko) * | 2017-07-12 | 2019-08-27 | (주)선재하이테크 | 전자 집속 개선용 엑스선관 |
US10578566B2 (en) | 2018-04-03 | 2020-03-03 | Sigray, Inc. | X-ray emission spectrometer system |
EP3804472A4 (en) * | 2018-05-25 | 2022-03-23 | Micro-X Limited | DEVICE FOR APPLYING BEAM-FORMING SIGNAL PROCESSING TO RF MODULATED X-RAYS |
US10845491B2 (en) | 2018-06-04 | 2020-11-24 | Sigray, Inc. | Energy-resolving x-ray detection system |
GB2591630B (en) | 2018-07-26 | 2023-05-24 | Sigray Inc | High brightness x-ray reflection source |
US10656105B2 (en) | 2018-08-06 | 2020-05-19 | Sigray, Inc. | Talbot-lau x-ray source and interferometric system |
US10962491B2 (en) | 2018-09-04 | 2021-03-30 | Sigray, Inc. | System and method for x-ray fluorescence with filtering |
DE112019004478T5 (de) | 2018-09-07 | 2021-07-08 | Sigray, Inc. | System und verfahren zur röntgenanalyse mit wählbarer tiefe |
JP7043381B2 (ja) * | 2018-09-27 | 2022-03-29 | 富士フイルム株式会社 | トモシンセシス撮影装置及びその作動方法 |
WO2021011209A1 (en) | 2019-07-15 | 2021-01-21 | Sigray, Inc. | X-ray source with rotating anode at atmospheric pressure |
WO2021079307A1 (en) * | 2019-10-24 | 2021-04-29 | Nova Measuring Instruments, Inc. | Patterned x-ray emitting target |
US11437218B2 (en) | 2019-11-14 | 2022-09-06 | Massachusetts Institute Of Technology | Apparatus and method for nanoscale X-ray imaging |
US11404235B2 (en) | 2020-02-05 | 2022-08-02 | John Thomas Canazon | X-ray tube with distributed filaments |
EP3933881A1 (en) | 2020-06-30 | 2022-01-05 | VEC Imaging GmbH & Co. KG | X-ray source with multiple grids |
CN114415225A (zh) * | 2021-12-20 | 2022-04-29 | 核工业西南物理研究院 | 一种核聚变α粒子损失探测器 |
WO2023177981A1 (en) | 2022-03-15 | 2023-09-21 | Sigray, Inc. | System and method for compact laminography utilizing microfocus transmission x-ray source and variable magnification x-ray detector |
US11885755B2 (en) | 2022-05-02 | 2024-01-30 | Sigray, Inc. | X-ray sequential array wavelength dispersive spectrometer |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08264139A (ja) | 1995-03-22 | 1996-10-11 | Hamamatsu Photonics Kk | X線発生装置 |
JPH09180894A (ja) | 1995-12-22 | 1997-07-11 | Ebara Corp | X線源 |
JP2002214353A (ja) * | 2001-01-18 | 2002-07-31 | Aloka Co Ltd | 放射線検出器 |
JP2004111336A (ja) * | 2002-09-20 | 2004-04-08 | Hamamatsu Photonics Kk | X線管 |
JP2004333131A (ja) * | 2003-04-30 | 2004-11-25 | Rigaku Corp | 全反射蛍光xafs測定装置 |
JP2004329784A (ja) | 2003-05-12 | 2004-11-25 | Aet Japan:Kk | X線ct装置および使用方法 |
JP2004357724A (ja) * | 2003-05-30 | 2004-12-24 | Toshiba Corp | X線ct装置、x線発生装置及びx線ct装置のデータ収集方法 |
WO2006009053A1 (ja) * | 2004-07-15 | 2006-01-26 | Hitachi Medical Corporation | 固定陽極x線管とそれを用いたx線検査装置及びx線照射装置 |
JP2006057846A (ja) | 2004-08-16 | 2006-03-02 | Guzik Technical Enterp Inc | 拘束層減衰組立体 |
JP2007050942A (ja) | 2005-08-15 | 2007-03-01 | Ntt Docomo Inc | 輸送管理方法、輸送管理サーバ、格納箱、輸送車両、及び、輸送管理システム |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE407436C (de) * | 1921-02-19 | 1924-12-23 | Julius Edgar Lilienfeld Dr | Roentgenroehre |
GB268012A (en) * | 1925-12-18 | 1927-03-18 | Warnford Moppett | Improvements in x-ray apparatus |
FR984432A (fr) * | 1943-09-23 | 1951-07-05 | Tubix Sa | Tube pour rayons x de grande longueur d'onde |
US2919362A (en) * | 1958-04-21 | 1959-12-29 | Dunlee Corp | Stabilized x-ray generator |
DE2203403A1 (de) * | 1972-01-25 | 1973-08-09 | Siemens Ag | Roentgen-strahlenquelle |
JPS59144129A (ja) * | 1983-02-08 | 1984-08-18 | Seiko Epson Corp | X線源装置 |
US4870671A (en) * | 1988-10-25 | 1989-09-26 | X-Ray Technologies, Inc. | Multitarget x-ray tube |
JPH06196114A (ja) * | 1992-12-25 | 1994-07-15 | Toshiba Corp | ベリリウム箔を用いた真空容器 |
FR2764731A1 (fr) * | 1997-06-13 | 1998-12-18 | Commissariat Energie Atomique | Tube a rayons x comportant une source d'electrons a micropointes et des moyens de focalisations magnetique |
DE19802668B4 (de) * | 1998-01-24 | 2013-10-17 | Smiths Heimann Gmbh | Röntgenstrahlungserzeuger |
FR2778757B1 (fr) * | 1998-05-12 | 2001-10-05 | Commissariat Energie Atomique | Systeme d'inscription d'informations sur un support sensible aux rayons x |
US6333968B1 (en) * | 2000-05-05 | 2001-12-25 | The United States Of America As Represented By The Secretary Of The Navy | Transmission cathode for X-ray production |
US20040213378A1 (en) * | 2003-04-24 | 2004-10-28 | The University Of North Carolina At Chapel Hill | Computed tomography system for imaging of human and small animal |
US7082182B2 (en) * | 2000-10-06 | 2006-07-25 | The University Of North Carolina At Chapel Hill | Computed tomography system for imaging of human and small animal |
US6876724B2 (en) * | 2000-10-06 | 2005-04-05 | The University Of North Carolina - Chapel Hill | Large-area individually addressable multi-beam x-ray system and method of forming same |
JP2002298772A (ja) * | 2001-03-30 | 2002-10-11 | Toshiba Corp | 透過放射型x線管およびその製造方法 |
JP2002352754A (ja) * | 2001-05-29 | 2002-12-06 | Shimadzu Corp | 透過型x線ターゲット |
US7104686B2 (en) | 2001-05-30 | 2006-09-12 | Canon Kabushiki Kaisha | Radiographic apparatus |
US6760403B2 (en) * | 2001-10-25 | 2004-07-06 | Seh America, Inc. | Method and apparatus for orienting a crystalline body during radiation diffractometry |
JP3639826B2 (ja) | 2002-04-03 | 2005-04-20 | キヤノン株式会社 | 放射線撮影装置、プログラム、コンピュータ可読記憶媒体、及び放射線撮影システム |
US6947522B2 (en) | 2002-12-20 | 2005-09-20 | General Electric Company | Rotating notched transmission x-ray for multiple focal spots |
US7466799B2 (en) * | 2003-04-09 | 2008-12-16 | Varian Medical Systems, Inc. | X-ray tube having an internal radiation shield |
GB0309374D0 (en) | 2003-04-25 | 2003-06-04 | Cxr Ltd | X-ray sources |
JP4439882B2 (ja) | 2003-11-14 | 2010-03-24 | キヤノン株式会社 | 放射線画像処理装置及び処理方法 |
US7042982B2 (en) * | 2003-11-19 | 2006-05-09 | Lucent Technologies Inc. | Focusable and steerable micro-miniature x-ray apparatus |
CN1674204B (zh) * | 2004-03-24 | 2010-10-13 | 徐文廷 | 一种x射线管 |
JP4549093B2 (ja) | 2004-04-12 | 2010-09-22 | キヤノン株式会社 | 画像処理装置及びその方法、プログラム |
JP4497997B2 (ja) | 2004-04-21 | 2010-07-07 | キヤノン株式会社 | 放射線画像撮影装置及びその制御方法 |
US7809114B2 (en) * | 2008-01-21 | 2010-10-05 | General Electric Company | Field emitter based electron source for multiple spot X-ray |
-
2007
- 2007-03-01 JP JP2007050942A patent/JP4878311B2/ja active Active
- 2007-03-02 BR BRPI0708509A patent/BRPI0708509B8/pt not_active IP Right Cessation
- 2007-03-02 EP EP12005367.3A patent/EP2573791B1/en not_active Not-in-force
- 2007-03-02 EP EP07715172.8A patent/EP1995757B1/en not_active Not-in-force
- 2007-03-02 WO PCT/JP2007/054090 patent/WO2007100105A1/ja active Search and Examination
- 2007-03-02 CN CN2007800070290A patent/CN101395691B/zh not_active Expired - Fee Related
- 2007-03-02 KR KR1020107026906A patent/KR101113093B1/ko active IP Right Grant
- 2007-03-02 CN CN2011100280278A patent/CN102129948B/zh not_active Expired - Fee Related
- 2007-03-02 KR KR1020087022668A patent/KR101113092B1/ko not_active IP Right Cessation
- 2007-03-02 RU RU2008139289/28A patent/RU2388103C1/ru active
- 2007-03-02 US US12/281,453 patent/US7873146B2/en not_active Expired - Fee Related
-
2010
- 2010-09-03 US US12/875,745 patent/US7889844B2/en not_active Expired - Fee Related
- 2010-12-17 US US12/971,849 patent/US8139716B2/en not_active Expired - Fee Related
-
2012
- 2012-02-10 US US13/370,478 patent/US8861682B2/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08264139A (ja) | 1995-03-22 | 1996-10-11 | Hamamatsu Photonics Kk | X線発生装置 |
JPH09180894A (ja) | 1995-12-22 | 1997-07-11 | Ebara Corp | X線源 |
JP2002214353A (ja) * | 2001-01-18 | 2002-07-31 | Aloka Co Ltd | 放射線検出器 |
JP2004111336A (ja) * | 2002-09-20 | 2004-04-08 | Hamamatsu Photonics Kk | X線管 |
JP2004333131A (ja) * | 2003-04-30 | 2004-11-25 | Rigaku Corp | 全反射蛍光xafs測定装置 |
JP2004329784A (ja) | 2003-05-12 | 2004-11-25 | Aet Japan:Kk | X線ct装置および使用方法 |
JP2004357724A (ja) * | 2003-05-30 | 2004-12-24 | Toshiba Corp | X線ct装置、x線発生装置及びx線ct装置のデータ収集方法 |
WO2006009053A1 (ja) * | 2004-07-15 | 2006-01-26 | Hitachi Medical Corporation | 固定陽極x線管とそれを用いたx線検査装置及びx線照射装置 |
JP2006057846A (ja) | 2004-08-16 | 2006-03-02 | Guzik Technical Enterp Inc | 拘束層減衰組立体 |
JP2007050942A (ja) | 2005-08-15 | 2007-03-01 | Ntt Docomo Inc | 輸送管理方法、輸送管理サーバ、格納箱、輸送車両、及び、輸送管理システム |
Non-Patent Citations (2)
Title |
---|
J. ZHANG: "Stationary scanning x-ray source based on carbon nanotube field emitters", APPLIED PHYSICS LETTERS, vol. 86, 2005, pages 184104 |
See also references of EP1995757A4 * |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009136518A (ja) * | 2007-12-07 | 2009-06-25 | Canon Inc | X線撮影装置及びx線撮影方法 |
WO2009101882A1 (ja) * | 2008-02-13 | 2009-08-20 | Canon Kabushiki Kaisha | X線発生装置、x線撮影装置及びそれらの制御方法 |
JP2009189507A (ja) * | 2008-02-13 | 2009-08-27 | Canon Inc | X線発生装置、x線撮影装置及びそれらの制御方法 |
US8879687B2 (en) | 2008-02-13 | 2014-11-04 | Canon Kabushiki Kaisha | X-ray generator, X-ray imaging apparatus, and control methods therefor |
CN101940066A (zh) * | 2008-02-13 | 2011-01-05 | 佳能株式会社 | X射线发生器、x射线成像设备及其控制方法 |
US8488742B2 (en) | 2008-02-13 | 2013-07-16 | Canon Kabushiki Kaisha | X-ray generator, X-ray imaging apparatus, and control methods therefor |
US8422637B2 (en) | 2008-02-28 | 2013-04-16 | Canon Kabushiki Kaisha | Multi X-ray generating apparatus and X-ray imaging apparatus |
US7991120B2 (en) | 2008-02-28 | 2011-08-02 | Canon Kabushiki Kaisha | Multi X-ray generating apparatus and X-ray imaging apparatus |
US8666024B2 (en) | 2008-02-28 | 2014-03-04 | Canon Kabushiki Kaisha | Multi-X-ray generating apparatus and X-ray imaging apparatus |
WO2010055930A1 (en) | 2008-11-11 | 2010-05-20 | Canon Kabushiki Kaisha | X-ray imaging apparatus |
CN102209494A (zh) * | 2008-11-11 | 2011-10-05 | 佳能株式会社 | X射线成像设备 |
US9245659B2 (en) | 2008-11-11 | 2016-01-26 | Canon Kabushiki Kaisha | X-ray imaging apparatus |
EP2346406A1 (en) * | 2008-11-11 | 2011-07-27 | Canon Kabushiki Kaisha | X-ray imaging apparatus |
RU2480158C2 (ru) * | 2008-11-11 | 2013-04-27 | Кэнон Кабусики Кайся | Устройство получения рентгеновских изображений |
EP2346406A4 (en) * | 2008-11-11 | 2013-05-01 | Canon Kk | X-RAY IMAGING APPARATUS |
US8509387B2 (en) | 2008-11-11 | 2013-08-13 | Canon Kabushiki Kaisha | X-ray imaging apparatus |
US20120027173A1 (en) * | 2009-03-27 | 2012-02-02 | Koninklijke Philips Electronics N.V. | Structured electron emitter for coded source imaging with an x-ray tube |
US7940888B2 (en) | 2009-04-03 | 2011-05-10 | Canon Kabushiki Kaisha | X-ray imaging apparatus, method of controlling the same, and computer program |
JP2013051164A (ja) * | 2011-08-31 | 2013-03-14 | Canon Inc | 透過型x線発生装置 |
JP2013051165A (ja) * | 2011-08-31 | 2013-03-14 | Canon Inc | 透過型x線発生装置 |
US9570264B2 (en) | 2011-08-31 | 2017-02-14 | Canon Kabushiki Kaisha | X-ray generator and X-ray imaging apparatus |
US9595415B2 (en) | 2011-08-31 | 2017-03-14 | Canon Kabushiki Kaisha | X-ray generator and X-ray imaging apparatus |
RU2578675C1 (ru) * | 2013-06-28 | 2016-03-27 | Демидова Елена Викторовна | Многолучевая рентгеновская трубка |
WO2015039604A1 (zh) * | 2013-09-23 | 2015-03-26 | 清华大学 | 一种产生均整x射线辐射场的装置以及方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101113093B1 (ko) | 2012-03-13 |
EP2573791A3 (en) | 2013-07-31 |
RU2388103C1 (ru) | 2010-04-27 |
CN101395691A (zh) | 2009-03-25 |
EP1995757A1 (en) | 2008-11-26 |
US20120140895A1 (en) | 2012-06-07 |
EP2573791A2 (en) | 2013-03-27 |
JP2007265981A (ja) | 2007-10-11 |
BRPI0708509A2 (pt) | 2011-05-31 |
CN101395691B (zh) | 2011-03-16 |
US8139716B2 (en) | 2012-03-20 |
EP1995757A4 (en) | 2010-04-14 |
KR101113092B1 (ko) | 2012-03-14 |
US8861682B2 (en) | 2014-10-14 |
US7873146B2 (en) | 2011-01-18 |
KR20080095295A (ko) | 2008-10-28 |
EP2573791B1 (en) | 2016-03-02 |
BRPI0708509B1 (pt) | 2019-04-02 |
EP1995757B1 (en) | 2013-06-19 |
KR20110005726A (ko) | 2011-01-18 |
BRPI0708509B8 (pt) | 2021-07-27 |
US20110085641A1 (en) | 2011-04-14 |
US20100329429A1 (en) | 2010-12-30 |
US7889844B2 (en) | 2011-02-15 |
US20090316860A1 (en) | 2009-12-24 |
CN102129948B (zh) | 2013-02-13 |
CN102129948A (zh) | 2011-07-20 |
JP4878311B2 (ja) | 2012-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4878311B2 (ja) | マルチx線発生装置 | |
JP2007265981A5 (ja) | ||
US7991120B2 (en) | Multi X-ray generating apparatus and X-ray imaging apparatus | |
TWI307110B (en) | Method and apparatus for controlling electron beam current | |
US7197116B2 (en) | Wide scanning x-ray source | |
JP2007504636A (ja) | 複数位置から複数のx線ビームを生成するための装置及び方法 | |
US8488737B2 (en) | Medical X-ray imaging system | |
JP5726763B2 (ja) | 電界放出陰極を具えるx線源 | |
JP5312555B2 (ja) | マルチx線発生装置 | |
JP2013154254A (ja) | X線断層撮影装置 | |
KR20200062961A (ko) | 전계 방출형 토모신테시스 시스템 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2007715172 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200780007029.0 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020087022668 Country of ref document: KR |
|
ENP | Entry into the national phase |
Ref document number: 2008139289 Country of ref document: RU Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12281453 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020107026906 Country of ref document: KR |
|
ENP | Entry into the national phase |
Ref document number: PI0708509 Country of ref document: BR Kind code of ref document: A2 Effective date: 20080903 |
|
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) |