Classifications

• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
  • C03B11/06—Construction of plunger or mould
  • C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
  • C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
  • C03B11/086—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/1601—Process or apparatus
  • C23C18/1633—Process of electroless plating
  • C23C18/1689—After-treatment
  • C23C18/1692—Heat-treatment
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/31—Coating with metals
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/31—Coating with metals
  • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B2215/00—Press-moulding glass
  • C03B2215/02—Press-mould materials
  • C03B2215/08—Coated press-mould dies
  • C03B2215/10—Die base materials
  • C03B2215/11—Metals
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B2215/00—Press-moulding glass
  • C03B2215/02—Press-mould materials
  • C03B2215/08—Coated press-mould dies
  • C03B2215/14—Die top coat materials, e.g. materials for the glass-contacting layers
  • C03B2215/16—Metals or alloys, e.g. Ni-P, Ni-B, amorphous metals

Definitions

• the present invention relates to a mold for glass molding, which requires precise processing, and a method of manufacturing the same.
• the mold is manufactured by applying electroless Ni-P plating on the surface of a stainless steel substrate and then precision processing this plating layer with a diamond bit.
• the thermal expansion coefficient is selected substrate 10 X 10- 6 ⁇ 16 X 10 _6 ( K _1), after plating, 400 to 500 ° Heat treatment is performed with C.
• the thermal expansion coefficient of the substrate is matched to that of the Ni-P plating layer, during heat treatment, volume contraction due to crystallization occurs only in the plating layer, so a large tensile stress occurs in the plating layer and cracks occur. There was a case to do.
• the present invention has been made in view of the problems with the surface coating layer of the conventional glass molding die as described above, and the object of the present invention is to provide a surface coating layer at a glass forming temperature. Crack is hard to occur! /, To provide a method of manufacturing mold.
• the method for producing a glass-forming mold of the present invention is
• the substrate is shrunk and the surface coating layer is subjected to heat treatment to crystallize the surface coating layer. Since the shrinkage occurs almost at the same time, no large tensile stress is generated in the surface coating layer. For this reason, a crack is hard to generate
• carbon contained in the base is 0.3 wt% or more, 2.7 wt% or less, and chromium 13 wt% or less.
• the tempering temperature of the substrate is, for example, 350 ° C. or less.
• the surface coating layer which also has the amorphous Ni-P alloy strength is formed by electroless plating containing Ni and P, or Ni and P and B, and the heat treatment is performed using the base material.
• Temperature above the tempering temperature of the mold and above the working temperature of the mold eg 400.degree. C.
• the temperature of the heat treatment is 270 ° C. or higher.
• the base material has a martensitic structure.
• the residual stress of the surface coating layer may be within the range of +150 MPa to ⁇ 760 MPa (wherein, + represents a tensile stress and ⁇ represents a compressive stress). It can.
• the residual stress can be measured, for example, using an X-ray stress measurement method.
• the method for producing a glass molding die of the present invention since cracks are not easily generated in the surface coating layer of the die, the shape of the die is maintained with high accuracy, and the life thereof is increased. It can be done.
• FIG. 1 is a view showing an outline of a manufacturing process of a glass forming mold according to the present invention.
• FIG. 1 shows an outline of a manufacturing process of a glass forming mold according to the present invention.
• a base made of carbon steel or low alloy steel quenching and tempering are performed.
• electroless plating is performed to form a surface coating layer that also has a Ni—P alloy strength.
• the substrate and the surface coating layer are subjected to heat treatment to crystallize the surface coating layer and to change the substrate into a tempered structure.
• the surface covering layer is coated with a release film.
• the surface coating is made by bringing the dimensional change of the substrate of the mold close to the dimensional change of the surface coating layer in the process of the heat treatment for crystallizing the surface coating layer. Reduce the tensile stress generated in the layer.
• the amorphous Ni-P alloy layer formed on the surface of the mold by electroless plating changes to a eutectic structure of Ni and Ni P when the mold is heated to the forming temperature of the glass. Volume shrinks. Such contraction is about 270 ° C.
• the tempering temperature of the substrate of the mold before plating is determined by the temperature of the heat treatment of the mold after plating. It should be set much lower than that.
• heat treatment after plating The temperature needs to be 270.degree. C. or more at which the transformation of the amorphous Ni-P alloy layer to the eutectic structure starts.
• the temperature of the heat treatment needs to be equal to or higher than the working temperature of the mold (that is, the molding temperature of the glass). If the temperature is lower than the working temperature of the mold, dimensional change occurs during use and the dimensional accuracy of the molded article is lowered.
• the upper limit of the heat treatment temperature is preferably about + 30 ° C. at the operating temperature. If the heat treatment temperature is raised higher than necessary, it is a force that causes adverse effects such as softening of the substrate.
• the tempering temperature of the substrate of the mold before plating needs to be 350 ° C. or less.
• the structure change of the third process (Table 1) occurs in the mold base, and the volume contraction occurs at almost the same timing as the Ni-P alloy layer.
• the tempering temperature of the substrate is higher than 350 ° C.
• the base at a temperature of 270 ° C. to 430 ° C. (third step in Table 1) during heat treatment after plating. Cracks may occur in the Ni-P alloy layer where the volume shrinkage of the material is not sufficient.
• tempering can be omitted by applying only quenching to the mold before plating.
• the C content is preferably 0.3 wt% or more and 2.7 wt% or less. If the C content is lower than 0.3 wt%, the volume shrinkage of the substrate in the third tempering process (Table 1) will be too small. On the other hand, if the C content exceeds 3 wt%, the volume shrinkage of the base material is sufficient, which causes negative effects such as a decrease in strength and toughness.
• the Cr content is preferably 13 wt% or less.
• decomposition of retained austenite in the second tempering process occurs at 500 ° C. or more, and the difference between the volume shrinkage history of the Ni—P plating layer becomes large.
• the lower limit of the Cr content is not particularly limited.
• the structure of the base material before heat treatment is a martensitic structure (or low carbon martensite)
• the structure of the base material after the heat treatment is a trothite structure (structure in which ferrite and cementite are very finely mixed) and a sorbite structure (mixture of ferrite and cementite in which cementite is precipitated by precipitation).
• the yarn and weave of the Ni—P or ⁇ i P—B plated layer are amorphous or partially amorphous in the plated state, and Ni and Ni completely crystallized by heating at about 270 ° C. or higher. Transform to mixed structure of P. Table 2 The above metallographic features are summarized.
• a die was prepared in which electroless Ni-P plating was coated to a thickness of 100 ⁇ m on a substrate of various compositions.
• Table 3 shows the relationship between the composition of the base material, the tempering temperature and the heat treatment temperature, and the crack generation rate.
• the forming temperature of the glass was all 430.degree.
• the test pieces 13 to 15 are molds for plastic molding used for comparison. As can be seen from Table 3, in the mold manufactured based on the manufacturing method of the present invention, the occurrence of cracks was not observed o

Landscapes

• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• Metallurgy (AREA)
• Mechanical Engineering (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)
• Manufacturing & Machinery (AREA)
• Chemically Coating (AREA)
• Mounting, Exchange, And Manufacturing Of Dies (AREA)
• Heat Treatment Of Articles (AREA)
• Moulds For Moulding Plastics Or The Like (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

Family

ID=37570261

Family Applications (1)

Country Status (7)

Cited By (4)

Families Citing this family (6)

Citations (5)

Family Cites Families (39)

• 2005
  • 2005-06-24 JP JP2005185052A patent/JP4778735B2/ja not_active Expired - Lifetime
• 2006
  • 2006-05-11 EP EP06746287A patent/EP1894895A4/en not_active Withdrawn
  • 2006-05-11 WO PCT/JP2006/309478 patent/WO2006137225A1/ja not_active Ceased
  • 2006-05-11 US US11/573,501 patent/US8206518B2/en not_active Expired - Fee Related
  • 2006-05-11 CN CN2006800006891A patent/CN101018743B/zh not_active Expired - Fee Related
  • 2006-05-11 KR KR1020077004262A patent/KR100849270B1/ko not_active Expired - Fee Related
  • 2006-06-05 TW TW095119904A patent/TWI316925B/zh not_active IP Right Cessation

Patent Citations (5)

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events