WO2008072664A1 - ガラス成形用金型の製造方法 - Google Patents

ガラス成形用金型の製造方法 Download PDF

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Publication number
WO2008072664A1
WO2008072664A1 PCT/JP2007/073955 JP2007073955W WO2008072664A1 WO 2008072664 A1 WO2008072664 A1 WO 2008072664A1 JP 2007073955 W JP2007073955 W JP 2007073955W WO 2008072664 A1 WO2008072664 A1 WO 2008072664A1
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Prior art keywords
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coating layer
surface coating
base material
mold
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PCT/JP2007/073955
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English (en)
French (fr)
Inventor
Jun Masuda
Takaharu Tashiro
Original Assignee
Toshiba Kikai Kabushiki Kaisha
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Application filed by Toshiba Kikai Kabushiki Kaisha filed Critical Toshiba Kikai Kabushiki Kaisha
Priority to KR1020097012031A priority Critical patent/KR101053701B1/ko
Priority to DE112007003026T priority patent/DE112007003026B4/de
Publication of WO2008072664A1 publication Critical patent/WO2008072664A1/ja
Priority to US12/473,360 priority patent/US20090236016A1/en

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/06—Construction of plunger or mould
    • C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
    • C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
    • C03B11/086—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D6/00—Heat treatment of ferrous alloys
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D6/00—Heat treatment of ferrous alloys
    • C21D6/04—Hardening by cooling below 0 degrees Celsius
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/12—Ferrous alloys, e.g. steel alloys containing tungsten, tantalum, molybdenum, vanadium, or niobium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
    • C22C38/22—Ferrous alloys, e.g. steel alloys containing chromium with molybdenum or tungsten
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
    • C22C38/24—Ferrous alloys, e.g. steel alloys containing chromium with vanadium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
    • C22C38/36—Ferrous alloys, e.g. steel alloys containing chromium with more than 1.7% by weight of carbon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1657—Electroless forming, i.e. substrate removed or destroyed at the end of the process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C23C18/1692—Heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1865—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00—Press-moulding glass
    • C03B2215/02—Press-mould materials
    • C03B2215/08—Coated press-mould dies
    • C03B2215/10—Die base materials
    • C03B2215/11—Metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00—Press-moulding glass
    • C03B2215/02—Press-mould materials
    • C03B2215/08—Coated press-mould dies
    • C03B2215/14—Die top coat materials, e.g. materials for the glass-contacting layers
    • C03B2215/16—Metals or alloys, e.g. Ni-P, Ni-B, amorphous metals

Definitions

  • the present invention relates to a method for manufacturing a glass molding die that requires precise processing, and particularly relates to a method capable of maintaining the shape of the die with high accuracy.
  • the mold is manufactured by applying electroless Ni—P plating to the surface of a base material made of stainless steel, and then precisely processing this plating layer with a diamond bite.
  • a base material having a thermal expansion coefficient of ⁇ ⁇ _ 6 ⁇ ; ⁇ ⁇ ⁇ ⁇ ⁇ 1 ) is selected, and heat treatment is performed at 400 to 500 ° C after plating. Even if the thermal expansion coefficient of the base material is matched to that of the Ni-P plating layer, volume contraction due to crystallization occurs only in the plating layer during heat treatment, so that a large tensile stress acts on the plating layer. In some cases, cracks occur (see, for example, JP-A-11 157852).
  • the present invention prevents the occurrence of cracks in the surface coating layer at the molding temperature, and also prevents the plastic deformation of the mold, thereby maintaining the shape of the mold with high accuracy. It is an object of the present invention to provide a method for manufacturing a glass mold that can increase the service life. [0007] In order to solve the above problems and achieve the object, the method for producing a glass molding die of the present invention is configured as follows!
  • Carbon is 0.3 wt% or more 2.7 wt% or less, chromium is 13 wt% or less, molybdenum is 0.5 wt% or more and 3 wt% or less, vanadium is 0.1 wt% or more and 5 wt% or less, tungsten is lwt
  • a base material is formed by quenching a steel material to which an additive satisfying at least one of at least 1% and not more than 7wt% is added and tempering at 400 ° C or higher and 650 ° C or lower.
  • a surface coating layer made of an amorphous Ni—P alloy is formed on the surface, and the surface coating layer is changed to a eutectic structure of Ni and Ni P by subjecting it to a heat treatment.
  • Carbon is 0.3 wt% or more 2.7 wt% or less, chromium is 13 wt% or less, molybdenum is 0.5 wt% or more and 3 wt% or less, vanadium is 0.1 wt% or more and 5 wt% or less, tungsten is lwt
  • a base material is formed by quenching a steel material to which an additive satisfying at least one of at least 1% and not more than 7wt% is added, and by sub-zero treatment.
  • Amorphous Ni is formed on the surface of the base material. —
  • a surface coating layer made of a P alloy is formed, and the surface coating layer is changed to a eutectic structure of Ni and Ni P by heat treatment.
  • Fig. 1 is a block diagram showing an outline of a method for manufacturing a glass molding die according to an embodiment of the present invention.
  • FIG. 1 is a block diagram showing an outline of a manufacturing process of a glass molding die according to an embodiment of the present invention. Manufacture of a glass mold is performed by the following process.
  • carbon is 0.3 wt% or more and 2.7 wt% or less
  • chromium is 13 wt% or less
  • molybdenum is 0.5 wt% or more and 3 wt% or less
  • vanadium is 0.1 wt% or more and 5 wt% or less. Less than%, use a steel material to which an additive satisfying at least one of tungsten and lwt% or more and 7wt% or less is added.
  • the surface coating layer is prevented from cracking even when high-temperature tempering is performed by using steel having Mo, V, and W added to improve the high-temperature hardness. I have to. This is because a high-temperature tempering force that contains a large amount of retained austenite immediately after quenching changes to a low-carbon martensite and martensite structure.
  • the temperature in the high temperature tempering needs to be 400 to 650 ° C or less. It is not very effective in reducing retained austenite at temperatures lower than 400 ° C. Above 650 ° C, the base material is significantly softened. In addition, it may be possible to perform sub-zero treatment more than high temperature tempering! /. This is because subzero treatment also has the effect of transforming retained austenite to martensite.
  • the surface coating layer is formed using a Ni—P alloy such as Ni—P, Ni—P—B or Ni—P—W. These structures are amorphous or partially amorphous in the plated state, and transform to a fully crystallized mixed structure of Ni and NiP when heated to about 270 ° C or higher.
  • the temperature of the heat treatment needs to be equal to or higher than the use temperature of the mold (that is, the glass forming temperature). This is because, if the temperature is lower than the mold use temperature, dimensional changes occur during use, and the dimensional accuracy of the molded product decreases. If the heat treatment temperature is raised too much, it affects the mating surface, so the upper limit of the heat treatment temperature is about 700 ° C.
  • the C content was set to 0.3 wt% or more and 2.7 wt% or less.
  • the C content is lower than 0.3 wt%, the volume shrinkage of the base material during tempering becomes too small.
  • the C content exceeds 2.7 wt%, adverse effects such as a decrease in toughness that the volume shrinkage of the base material is sufficient will occur.
  • the Cr content was set to 13 wt% or less. This is because when the Cr content exceeds 13 wt%, the retained austenite is decomposed. There are no particular restrictions on the lower limit of the Cr content.
  • Mo was 0.5 wt% or more and 3 wt% or less
  • V was 0.1 wt% or more and 5 wt% or less
  • W force was wt% or more and 7 wt% or less.
  • the amount of these additives is low If it is too high, the high-temperature hardness of the substrate is not sufficient, and plastic deformation may occur due to press pressure. Note that the upper limit is set because the cost increases if the number is increased more than necessary.
  • a mold having electroless Ni-P plating coated at 100 ⁇ m on a base material of various components was manufactured, and the number of cracks generated during heat treatment and molding and the basis when glass was molded. The presence or absence of plastic deformation of the material was examined. Table 1 shows the relationship between the base material components, tempering temperature, crack generation rate, and the presence or absence of plastic deformation.
  • the specimen 7 uses a plastic molding die subjected to conventional heat treatment. All molding temperatures were 550 ° C.
  • the surface coating layer is prevented from being cracked at the molding temperature, and the mold It is possible to prevent plastic deformation of the mold, maintain the shape of the mold with high accuracy, and increase its life.
  • the present invention is not limited to the embodiment described above. For example, you may make it heat-process a base material and a surface coating layer after the finishing process of a base material, and the finishing process of a surface coating layer.
  • various modifications can be made without departing from the scope of the present invention. Of course.
  • cracks are prevented from occurring in the surface coating layer at the molding temperature, and by preventing plastic deformation of the mold, the shape of the mold can be maintained with high accuracy and the service life thereof can be increased. It can be increased.

Abstract

　炭素が０．３ｗｔ％以上２．７ｗｔ％以下、クロムが１３ｗｔ％以下であって、モリブデンが０．５ｗｔ％以上３ｗｔ％以下、バナジウムが０．１ｗｔ％以上５ｗｔ％以下、タングステンが１ｗｔ％以上７ｗｔ％以下のうち少なくとも１つを満たす添加物が加えられた鋼製の素材を焼入れするとともに、４００°C以上６５０°C以下で焼戻しすることで基材を製作し、上記基材の表面に、非晶質のＮｉ－Ｐ合金からなる表面被覆層を形成し、これに加熱処理を施すことによって、前記表面被覆層をＮｉとＮｉ３Ｐの共晶組織に変える。これにより成形温度において表面被覆層にクラックが発生することを防止するとともに、金型の塑性変形を防止することで、金型の形状を高い精度で維持する。

Description

明 細 書
ガラス成形用金型の製造方法
技術分野
[0001] 本発明は、精密な加工を必要とするガラス成形用金型の製造方法に関し、特に金 型の形状を高い精度で維持することができるものに関する。
背景技術
[0002] プラスチック成形の分野では、成形金型の精密加工技術が確立されており、回折 格子など、微細形状を有する光学素子の量産が実現している。この場合、金型の製 作は、ステンレス鋼からなる基材の表面に無電解 Ni— Pめっきを施し、次いで、この めっき層をダイヤモンドバイトで精密加工することにより行われている。
発明の開示
[0003] しかし、これと同様の金型をガラス成形に適用すると、無電解 Ni— Pめっき層にクラ ックが発生する問題が生ずる。この現象は、成形温度に起因している。即ち、 Ni— P めっき層は、めっき状態ではアモルファス（非晶質）構造をとっている力 約 270°C以 上に加熱すると結晶化が始まり、そのとき、めっき層に体積収縮が起こり、引張応力 が作用してめっき層にクラックが発生する。
[0004] この問題の対策として、熱膨張係数が ιοχ ιο_6〜； ΐδ χ ιο^ τ1)の基材を選定 し、めっき後、 400〜500°Cで熱処理を行っている。し力、し、基材の熱膨張係数を Ni —Pめっき層に合わせても、熱処理の際、結晶化に伴う体積収縮がめっき層だけに 生ずるので、めっき層に大きな引張応力が作用して、クラックが発生する場合があつ た（例えば特開平 11 157852号公報参照）。
[0005] また、金型使用中に高温になると、金型に塑性変形が生じ、金型の形状を高い精 度で維持することができな!/、と!/、う問題もあった。
[0006] 本発明は、成形温度において表面被覆層にクラックが発生することを防止するとと もに、金型の塑性変形を防止することで、金型の形状を高い精度で維持するとともに 、その寿命を増大させることができるガラス成形用金型の製造方法を提供することを 目的としている。 [0007] 前記課題を解決し目的を達成するために、本発明のガラス成形用金型の製造方法 は次のように構成されて!/、る。
[0008] 炭素が 0. 3wt%以上 2. 7wt%以下、クロムが 13wt%以下であって、モリブデンが 0. 5wt%以上 3wt%以下、バナジウムが 0. lwt%以上 5wt%以下、タングステンが lwt%以上 7wt%以下のうち少なくとも 1つを満たす添加物が加えられた鋼製の素材 を焼入れするとともに、 400°C以上 650°C以下で焼戻しすることで基材を形成し、上 記基材の表面に、非晶質の Ni— P合金からなる表面被覆層を形成し、これに加熱処 理を施すことによって、前記表面被覆層を Niと Ni Pの共晶組織に変える。
3
[0009] 炭素が 0. 3wt%以上 2. 7wt%以下、クロムが 13wt%以下であって、モリブデンが 0. 5wt%以上 3wt%以下、バナジウムが 0. lwt%以上 5wt%以下、タングステンが lwt%以上 7wt%以下のうち少なくとも 1つを満たす添加物が加えられた鋼製の素材 を焼入れするとともに、サブゼロ処理することで基材を形成し、上記基材の表面に、 非晶質の Ni— P合金からなる表面被覆層を形成し、これに加熱処理を施すことによ つて、前記表面被覆層を Niと Ni Pの共晶組織に変える。
3
図面の簡単な説明
[0010] 園 1]図 1は、本発明の一実施の形態に係るガラス成形用金型の製造方法の概要を 示すブロック図である。
発明を実施するための最良の形態
[0011] 図 1は、本発明の一実施の形態に係るガラス成形用金型の製造工程の概要を示す ブロック図である。ガラス成形用金型の製造は次のような工程で行う。
[0012] なお、基材として、炭素が 0. 3wt%以上 2. 7wt%以下、クロムが 13wt%以下であ つて、モリブデンが 0. 5wt%以上 3wt%以下、バナジウムが 0. lwt%以上 5wt%以 下、タングステンが lwt%以上 7wt%以下のうち少なくとも 1つを満たす添加物が加 えられた鋼製の素材を用いる。
[0013] このような基材に粗加工を行った後（ST1)、焼入れ ·高温焼戻しを行う（ST2)。次 いで、めっき前加工を行った後（ST3)、無電解めつきにより Ni— P合金からなる表面 被覆層（めっき層）を形成する（ST4)。次いで、基材及び表面被覆層に加熱処理を 行い（ST5)、表面被覆層を結晶化するとともに、基材を焼き戻し組織に変える。次い で、基材に仕上げ加工（ST6)及び表面被覆層の仕上げ加工（ST7)を行った後、表 面被覆層に、離型膜をコーティングする（ST8)。
[0014] 本実施の形態における製造方法では、基材として Mo, V, Wを添加して高温硬さ を向上させた鋼材を用いることで、高温焼戻しを行っても表面被覆層が割れないよう にしている。これは焼入れ直後には残留オーステナイトが多く存在する力 高温焼戻 しを行うと低炭素マルテンサイト及びマルテンサイトの組織に変化するためである。
[0015] なお、高温焼戻しにおける温度は 400〜650°C以下とする必要がある。 400°Cより も低い温度では残留オーステナイトの低減にあまり効果がなぐ 650°Cを超えると基 材の軟化が著しいからである。なお、高温焼戻しではなぐサブゼロ処理を行うように してもよ!/、。サブゼロ処理も残留オーステナイトをマルテンサイトに変態させる効果が あるためである。
[0016] 表面被覆層の形成は、 Ni— P合金、例えば、 Ni— P、 Ni— P— B又は Ni— P— Wを 用いる。これらの組織は、めっき状態では非晶質もしくは部分的に非晶質であり、約 2 70°C以上の加熱で、完全に結晶化した Niと Ni Pの混合組織に変態する。
3
[0017] 加熱処理の温度は、金型の使用温度（すなわち、ガラスの成形温度）以上にする必 要がある。金型の使用温度よりも低い温度にすると、使用中に寸法変化が起こり、成 形品の寸法精度が低下するからである。加熱処理温度を上げすぎるとメツキ面に影 響を与えるため、加熱処理温度の上限は 700°C程度とする。
[0018] 次に、基材を上述した成分の鋼製の素材を用いる理由について説明する。すなわ ち、 C含有量は、 0. 3wt%以上 2. 7wt%以下とした。 C含有量が 0. 3wt%より低く なると、焼戻しにおける基材の体積収縮量が小さくなり過ぎてしまう。一方、 C含有量 が 2. 7wt%を超えると、基材の体積収縮量は十分ではある力 靭性低下などの弊害 が出てくる。
[0019] また、 Cr含有量は、 13wt%以下とした。 Cr含有量が 13wt%を超えると残留オース テナイトが分解しに《なるためである。なお、 Cr含有量の下限値については、特に 制約はない。
[0020] 添加物である Mo, V, Wについては、 Moが 0. 5wt%以上 3wt%以下、 Vが 0. lw t%以上 5wt%以下、 W力 wt%以上 7wt%以下とした。これらの添加物の量が少な すぎると基材の高温硬さが十分ではなくプレス圧力によって塑性変形する虞があるた めである。なお、必要以上に多くするとコストが高くなるため上限を定めている。
[0021] 種々の成分の基材に、無電解 Ni— Pめっきを 100 μ m被覆した金型を製作して、 加熱熱処理中及び成形中に発生したクラックの数及びガラスを成形したときの基材 の塑性変形の有無を調べた。表 1に、基材の成分、焼戻し温度、クラック発生率、塑 性変形の有無との関係を示す。供試体 7は、比較例として従来の熱処理を行ったプ ラスチック成形用金型を用いている。また、成形温度は全て 550°Cとした。
[表 1] 表 1 機材の成分及び焼戻し温度、
クラック発生率、 塑 1·生変形の有無の関係
Figure imgf000006_0001
[0022] 表 1から分かるように、本発明の製造方法に基づいて製作された金型 (供試体 5, 6 )では、クラックの発生及び塑性変形が認められなかった。
[0023] 上述したように本実施の形態に係るガラス成形用金型の製造方法及びガラス成形 用金型では、成形温度において表面被覆層にクラックが発生することを防止するとと もに、金型の塑性変形を防止し、金型の形状を高い精度で維持するとともに、その寿 命を増大させることが可能となる。
[0024] なお、本発明は前記実施の形態に限定されるものではない。例えば、基材及び表 面被覆層の加熱処理を、基材の仕上げ加工及び表面被覆層の仕上げ加工の後に 行うようにしてもよい。この他、本発明の要旨を逸脱しない範囲で種々変形実施可能 であるのは勿論である。
産業上の利用可能性
本発明によれば、成形温度において表面被覆層にクラックが発生することを防止す るとともに、金型の塑性変形を防止することで、金型の形状を高い精度で維持すると ともに、その寿命を増大させることが可能となる。

Claims

請求の範囲
[1] 炭素が 0. 3wt%以上 2. 7wt%以下、クロムが 13wt%以下であって、モリブデンが 0. 5wt%以上 3wt%以下、バナジウムが 0. lwt%以上 5wt%以下、タングステンが lwt%以上 7wt%以下のうち少なくとも 1つを満たす添加物が加えられた鋼製の素材 を焼入れするとともに、 400°C以上 650°C以下で焼戻しすることで基材を形成し、 上記基材の表面に、非晶質の Ni— P合金からなる表面被覆層を形成し、 これに加熱処理を施すことによって、前記表面被覆層を Niと Ni Pの共晶組織に変
3
えることを特徴とするガラス成形用金型の製造方法。
[2] 上記表面被覆層は、 Niと P、 Niと Pと B又は Niと Pと Wを含む無電解めつきにより形 成され、
上記加熱処理は、ガラスの成形温度以上であることを特徴とする請求項 1に記載の ガラス成形用金型の製造方法。
[3] 炭素が 0. 3wt%以上 2. 7wt%以下、クロムが 13wt%以下であって、モリブデンが
0. 5wt%以上 3wt%以下、バナジウムが 0. lwt%以上 5wt%以下、タングステンが lwt%以上 7wt%以下のうち少なくとも 1つを満たす添加物が加えられた鋼製の素材 を焼入れするとともに、サブゼロ処理することで基材を形成し、
上記基材の表面に、非晶質の Ni— P合金からなる表面被覆層を形成し、 これに加熱処理を施すことによって、前記表面被覆層を Niと Ni Pの共晶組織に変
3
えることを特徴とするガラス成形用金型の製造方法。
[4] 上記表面被覆層は、 Niと P、 Niと Pと B又は Niと Pと Wを含む無電解めつきにより形 成され、
上記加熱処理は、ガラスの成形温度以上であることを特徴とする請求項 3に記載の ガラス成形用金型の製造方法。
PCT/JP2007/073955 2006-12-14 2007-12-12 ガラス成形用金型の製造方法 WO2008072664A1 (ja)

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KR101073717B1 (ko) 2007-04-10 2011-10-13 도시바 기카이 가부시키가이샤 글래스 성형용 금형 및 그 제조 방법
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