WO2006134709A1 - 基板搬送装置 - Google Patents
基板搬送装置 Download PDFInfo
- Publication number
- WO2006134709A1 WO2006134709A1 PCT/JP2006/307186 JP2006307186W WO2006134709A1 WO 2006134709 A1 WO2006134709 A1 WO 2006134709A1 JP 2006307186 W JP2006307186 W JP 2006307186W WO 2006134709 A1 WO2006134709 A1 WO 2006134709A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- handling device
- glass substrate
- buffer
- taking
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
- B65G49/069—Means for avoiding damage to stacked plate glass, e.g. by interposing paper or powder spacers in the stack
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0294—Vehicle bodies
Definitions
- FIG. 5 a glass substrate transport device 20 as shown in FIG. 5 is used as a device for taking out each glass substrate 3 from the pallet 2 and transporting the glass substrates 3 to a carriage line or the like.
- the substrate packaging box is a pallet on which a plurality of substrates and a buffer material sandwiched between the substrates are stacked, and further includes a buffer material removing device that removes the buffer material.
- the cushioning material removing device may be arranged in the vicinity between the first handling device and the second handling device.
- the buffer removal device starts the operation of taking the buffer, and the buffer removal device finishes the operation of carrying the buffer. Then, the second handling device starts the operation of taking the next substrate, and when the second handling device 7 finishes the operation of taking the substrate, the buffer removal device takes the operation of taking the next buffer agent.
- the buffer removal device is configured to repeatedly perform the procedure of starting the operation of taking the next substrate when the buffer removal device finishes the operation of carrying the buffer, the buffer removal The mobility of the apparatus can be improved.
- FIG. 1 is a view showing a schematic configuration of a glass substrate transfer device according to an embodiment of the present invention.
- the illustrated glass substrate transport device 1 includes one turntable 5 on which a pallet 2 is placed, two first handling devices 6 and a second handling device 7 that take out the glass substrate 3.
- one slip sheet removing device 8 that removes the slip sheet 4 and two first conveyors 9 and second conveyors 10 that transport the taken glass substrate 3 to the next process are provided.
- the first handling device 6 and the second handling device 7 shown in FIG. 1 are composed of, for example, an articulated industrial robot, and a plurality of suction pads (not shown) are provided on the surfaces of the three arms 15, respectively. ing.
- the glass substrate 3 is taken out from the pallet 2 by pressing the suction pad against the glass substrate 3 by the arm 15 to support the glass substrates 3 one by one and rotating the arm 15.
- the taken-out glass substrate 3 is placed on conveyors 9 and 10 provided downstream, and is conveyed by the conveyors 9 and 10 to, for example, a cleaning device.
- the first handling device 6 starts an operation 6a for taking the next glass substrate 3 (arrow D). Similarly, the first handling device 6 and the second handling device 7 take out the glass substrates 3 alternately.
- the first handling device and the second handling device are respectively arranged in the vicinity of both sides of the one glass substrate packaging box, and the glass. Since the substrate is taken out alternately, the installation area of the pallet transfer device such as a turntable can be reduced compared to the simple addition as in the conventional technology, and the installation area of the glass substrate transfer device can be increased by the addition. Can be suppressed.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
- Specific Conveyance Elements (AREA)
- Wrapping Of Specific Fragile Articles (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006800202346A CN101193811B (zh) | 2005-06-17 | 2006-04-05 | 基板搬运装置 |
JP2007521175A JPWO2006134709A1 (ja) | 2005-06-17 | 2006-04-05 | 基板搬送装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-177153 | 2005-06-17 | ||
JP2005177153 | 2005-06-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006134709A1 true WO2006134709A1 (ja) | 2006-12-21 |
Family
ID=37532077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/307186 WO2006134709A1 (ja) | 2005-06-17 | 2006-04-05 | 基板搬送装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2006134709A1 (zh) |
KR (1) | KR100956807B1 (zh) |
CN (1) | CN101193811B (zh) |
TW (1) | TW200740678A (zh) |
WO (1) | WO2006134709A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020028952A (ja) * | 2018-08-23 | 2020-02-27 | 川崎重工業株式会社 | ロボット及びそれを備えるロボットシステム |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102502260B (zh) * | 2011-10-18 | 2013-11-06 | 深圳市华星光电技术有限公司 | 玻璃基板存储搬运系统以及玻璃基板存储平台 |
US9004839B2 (en) | 2011-10-18 | 2015-04-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Glass substrate storage and transportation system and a glass substrate storage platform |
CN106315210B (zh) * | 2015-07-10 | 2019-07-23 | 上海微电子装备(集团)股份有限公司 | 一种片盒存取设备及方法 |
CN105668206B (zh) | 2016-03-23 | 2019-02-12 | 深圳市华星光电技术有限公司 | 玻璃基板的分流方法、分流装置及加工系统 |
CN106335791B (zh) * | 2016-08-24 | 2019-01-22 | 京东方科技集团股份有限公司 | 叠片装置、叠片方法和基板强化设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01147333U (zh) * | 1988-03-31 | 1989-10-12 | ||
JPH04105029U (ja) * | 1991-02-13 | 1992-09-10 | ナシヨナル住宅産業株式会社 | ワーク搬出装置 |
JPH07137830A (ja) * | 1993-11-12 | 1995-05-30 | Daiwa Kogyo Kk | 製品整列機 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5710940A (en) * | 1980-06-25 | 1982-01-20 | Toshiba Corp | Supplying method for lead frame |
JPH0236368Y2 (zh) * | 1985-09-28 | 1990-10-03 | ||
DE19650689A1 (de) * | 1996-12-06 | 1998-06-10 | Focke & Co | Vorrichtung zum Handhaben von Zuschnittstapeln |
DE19815434A1 (de) * | 1998-04-07 | 1999-10-14 | Focke & Co | Hubvorrichtung (Palettierer) mit Schwenkarm |
DE19922873A1 (de) * | 1999-05-19 | 2000-11-23 | Krones Ag | Vorrichtung zum Einbringen und/oder Ausbringen von Behältern |
JP4282827B2 (ja) * | 1999-06-11 | 2009-06-24 | 三島光産株式会社 | ガラス基板搬送装置 |
JP2004284772A (ja) * | 2003-03-24 | 2004-10-14 | Toshiba Mitsubishi-Electric Industrial System Corp | 基板搬送システム |
-
2006
- 2006-04-05 CN CN2006800202346A patent/CN101193811B/zh not_active Expired - Fee Related
- 2006-04-05 KR KR1020077026701A patent/KR100956807B1/ko not_active IP Right Cessation
- 2006-04-05 WO PCT/JP2006/307186 patent/WO2006134709A1/ja active Application Filing
- 2006-04-05 JP JP2007521175A patent/JPWO2006134709A1/ja active Pending
- 2006-05-04 TW TW095115916A patent/TW200740678A/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01147333U (zh) * | 1988-03-31 | 1989-10-12 | ||
JPH04105029U (ja) * | 1991-02-13 | 1992-09-10 | ナシヨナル住宅産業株式会社 | ワーク搬出装置 |
JPH07137830A (ja) * | 1993-11-12 | 1995-05-30 | Daiwa Kogyo Kk | 製品整列機 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020028952A (ja) * | 2018-08-23 | 2020-02-27 | 川崎重工業株式会社 | ロボット及びそれを備えるロボットシステム |
WO2020040103A1 (ja) * | 2018-08-23 | 2020-02-27 | 川崎重工業株式会社 | ロボット及びそれを備えるロボットシステム |
JP7117193B2 (ja) | 2018-08-23 | 2022-08-12 | 川崎重工業株式会社 | ロボット及びそれを備えるロボットシステム |
US11845621B2 (en) | 2018-08-23 | 2023-12-19 | Kawasaki Jukogyo Kabushiki Kaisha | Robot and robot system having the same |
Also Published As
Publication number | Publication date |
---|---|
KR20080014779A (ko) | 2008-02-14 |
TW200740678A (en) | 2007-11-01 |
JPWO2006134709A1 (ja) | 2009-01-08 |
CN101193811A (zh) | 2008-06-04 |
CN101193811B (zh) | 2011-11-23 |
KR100956807B1 (ko) | 2010-05-11 |
TWI318959B (zh) | 2010-01-01 |
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