JPS5710940A - Supplying method for lead frame - Google Patents

Supplying method for lead frame

Info

Publication number
JPS5710940A
JPS5710940A JP8507280A JP8507280A JPS5710940A JP S5710940 A JPS5710940 A JP S5710940A JP 8507280 A JP8507280 A JP 8507280A JP 8507280 A JP8507280 A JP 8507280A JP S5710940 A JPS5710940 A JP S5710940A
Authority
JP
Japan
Prior art keywords
lead frame
suckers
stocker
transfer mechanism
feeder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8507280A
Other languages
Japanese (ja)
Inventor
Fumio Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8507280A priority Critical patent/JPS5710940A/en
Publication of JPS5710940A publication Critical patent/JPS5710940A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Abstract

PURPOSE:To improve operation efficiency by mounting a transfer mechanism which alternately supplies the lead frame to frame feeders juxtaposed at regular intervals from a stocker positioned at the middle of the lead frame feeders. CONSTITUTION:Suckers 9a, 9b are positioned on the feeder 1a and suckers 9c, 9d on the stocker 2, the transfer mechanism 5 falls and the suckers 9c, 9d adsorb the lead frame 3, the suckers 9a, 9b move on the stocker 2 and the suckers 9c, 9d on the feeder 1b by the sliding of the transfer mechanism 5, and the lead frame 3 is located on the feeder 1b through the falling of the transfer mechanism 5 and the release of attraction while the other suckers 9a, 9b suck the lead frame 3. The operation is repeated, and the lead frame is supplied alternately to the feeders 1a, 1b. Productivity is improved because the lead frame is attracted and released simultaneously from the stocker.
JP8507280A 1980-06-25 1980-06-25 Supplying method for lead frame Pending JPS5710940A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8507280A JPS5710940A (en) 1980-06-25 1980-06-25 Supplying method for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8507280A JPS5710940A (en) 1980-06-25 1980-06-25 Supplying method for lead frame

Publications (1)

Publication Number Publication Date
JPS5710940A true JPS5710940A (en) 1982-01-20

Family

ID=13848410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8507280A Pending JPS5710940A (en) 1980-06-25 1980-06-25 Supplying method for lead frame

Country Status (1)

Country Link
JP (1) JPS5710940A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6072727A (en) * 1983-09-30 1985-04-24 Pilot Pen Co Ltd:The Conveying apparatus of stacked thin plate materials in screen printing step
NL1003342C2 (en) * 1996-06-14 1997-12-17 Fico Bv Apparatus for simultaneously moving and changing the orientation of at least one carrier for electronic components.
WO1998002903A1 (en) * 1996-07-12 1998-01-22 Fico B.V. Device for separate removal from a holder or placing into a holder of stackable carriers of electronic components
JPWO2006134709A1 (en) * 2005-06-17 2009-01-08 シャープ株式会社 Substrate transfer device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6072727A (en) * 1983-09-30 1985-04-24 Pilot Pen Co Ltd:The Conveying apparatus of stacked thin plate materials in screen printing step
NL1003342C2 (en) * 1996-06-14 1997-12-17 Fico Bv Apparatus for simultaneously moving and changing the orientation of at least one carrier for electronic components.
WO1997048125A1 (en) * 1996-06-14 1997-12-18 Fico B.V. Device for simultaneous transport and change of orientation of at least one carrier for electronic components
WO1998002903A1 (en) * 1996-07-12 1998-01-22 Fico B.V. Device for separate removal from a holder or placing into a holder of stackable carriers of electronic components
JPWO2006134709A1 (en) * 2005-06-17 2009-01-08 シャープ株式会社 Substrate transfer device

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