JPS574128A - Device for feeding of electronic parts - Google Patents
Device for feeding of electronic partsInfo
- Publication number
- JPS574128A JPS574128A JP7773480A JP7773480A JPS574128A JP S574128 A JPS574128 A JP S574128A JP 7773480 A JP7773480 A JP 7773480A JP 7773480 A JP7773480 A JP 7773480A JP S574128 A JPS574128 A JP S574128A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- frame
- cut
- feeding
- shifted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Abstract
PURPOSE:To unnecessitate the discrimination and the like of parts as well as to improve workability by a method wherein an electronic part is feeded in a resin sealed state by hand working without detaching it from a lead frame, the part is supported with a shifting device at the feeding position and then it is separated from the frame and placed on the substrate. CONSTITUTION:The feeding device of electron parts is constituted by the device A which feeds an oblong-shaped lead frame 2 whereon a plurality of electron parts are coupled leaving a prescribed space between them, the shifting device B with which the frame 2 is shifted to the feeding point, the cutting device C with which the parts are cut off from the frame 2 and the transferring device D with which the cut parts are transferred and placed on the substrate. On the feeding device A, a driving section A3 with which the frame 2 holding a plurality of electron parts are held in one body is supported and driven, is provided, and the parts are sent to the shifting device B and then shifted to the cutting device C and then they are cut off from the frame 2 by the moving blade. Then, the cut off parts are attracted to the vacuum chuck located on the transferring device D and are shifted to the prescribed location.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7773480A JPS574128A (en) | 1980-06-11 | 1980-06-11 | Device for feeding of electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7773480A JPS574128A (en) | 1980-06-11 | 1980-06-11 | Device for feeding of electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS574128A true JPS574128A (en) | 1982-01-09 |
JPS6230518B2 JPS6230518B2 (en) | 1987-07-02 |
Family
ID=13642128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7773480A Granted JPS574128A (en) | 1980-06-11 | 1980-06-11 | Device for feeding of electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS574128A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60153198A (en) * | 1984-01-21 | 1985-08-12 | 池上通信機株式会社 | Electronic part conveying device |
JPS6333133A (en) * | 1986-07-29 | 1988-02-12 | Matsushita Electric Ind Co Ltd | Cutting device |
JPH04109546U (en) * | 1991-03-11 | 1992-09-22 | 上野精機株式会社 | Semiconductor device lead cutting and taping equipment |
JPH0653385A (en) * | 1991-07-04 | 1994-02-25 | Apic Yamada Kk | Forming apparatus |
US6103979A (en) * | 1993-08-26 | 2000-08-15 | Fujitsu Limited | Keyboard having plurality of keys therein, each key establishing different electric contacts |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52143767A (en) * | 1976-05-26 | 1977-11-30 | Hitachi Ltd | Production of semiconductor device |
JPS5361060A (en) * | 1976-11-11 | 1978-06-01 | Matsushita Electric Ind Co Ltd | Method of and device for inserting electronic part |
-
1980
- 1980-06-11 JP JP7773480A patent/JPS574128A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52143767A (en) * | 1976-05-26 | 1977-11-30 | Hitachi Ltd | Production of semiconductor device |
JPS5361060A (en) * | 1976-11-11 | 1978-06-01 | Matsushita Electric Ind Co Ltd | Method of and device for inserting electronic part |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60153198A (en) * | 1984-01-21 | 1985-08-12 | 池上通信機株式会社 | Electronic part conveying device |
JPS6333133A (en) * | 1986-07-29 | 1988-02-12 | Matsushita Electric Ind Co Ltd | Cutting device |
JPH04109546U (en) * | 1991-03-11 | 1992-09-22 | 上野精機株式会社 | Semiconductor device lead cutting and taping equipment |
JPH0653385A (en) * | 1991-07-04 | 1994-02-25 | Apic Yamada Kk | Forming apparatus |
US6103979A (en) * | 1993-08-26 | 2000-08-15 | Fujitsu Limited | Keyboard having plurality of keys therein, each key establishing different electric contacts |
Also Published As
Publication number | Publication date |
---|---|
JPS6230518B2 (en) | 1987-07-02 |
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