WO2006134709A1 - Substrate transfer apparatus - Google Patents
Substrate transfer apparatus Download PDFInfo
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- WO2006134709A1 WO2006134709A1 PCT/JP2006/307186 JP2006307186W WO2006134709A1 WO 2006134709 A1 WO2006134709 A1 WO 2006134709A1 JP 2006307186 W JP2006307186 W JP 2006307186W WO 2006134709 A1 WO2006134709 A1 WO 2006134709A1
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- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- handling device
- glass substrate
- buffer
- taking
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
- B65G49/069—Means for avoiding damage to stacked plate glass, e.g. by interposing paper or powder spacers in the stack
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0294—Vehicle bodies
Definitions
- FIG. 5 a glass substrate transport device 20 as shown in FIG. 5 is used as a device for taking out each glass substrate 3 from the pallet 2 and transporting the glass substrates 3 to a carriage line or the like.
- the substrate packaging box is a pallet on which a plurality of substrates and a buffer material sandwiched between the substrates are stacked, and further includes a buffer material removing device that removes the buffer material.
- the cushioning material removing device may be arranged in the vicinity between the first handling device and the second handling device.
- the buffer removal device starts the operation of taking the buffer, and the buffer removal device finishes the operation of carrying the buffer. Then, the second handling device starts the operation of taking the next substrate, and when the second handling device 7 finishes the operation of taking the substrate, the buffer removal device takes the operation of taking the next buffer agent.
- the buffer removal device is configured to repeatedly perform the procedure of starting the operation of taking the next substrate when the buffer removal device finishes the operation of carrying the buffer, the buffer removal The mobility of the apparatus can be improved.
- FIG. 1 is a view showing a schematic configuration of a glass substrate transfer device according to an embodiment of the present invention.
- the illustrated glass substrate transport device 1 includes one turntable 5 on which a pallet 2 is placed, two first handling devices 6 and a second handling device 7 that take out the glass substrate 3.
- one slip sheet removing device 8 that removes the slip sheet 4 and two first conveyors 9 and second conveyors 10 that transport the taken glass substrate 3 to the next process are provided.
- the first handling device 6 and the second handling device 7 shown in FIG. 1 are composed of, for example, an articulated industrial robot, and a plurality of suction pads (not shown) are provided on the surfaces of the three arms 15, respectively. ing.
- the glass substrate 3 is taken out from the pallet 2 by pressing the suction pad against the glass substrate 3 by the arm 15 to support the glass substrates 3 one by one and rotating the arm 15.
- the taken-out glass substrate 3 is placed on conveyors 9 and 10 provided downstream, and is conveyed by the conveyors 9 and 10 to, for example, a cleaning device.
- the first handling device 6 starts an operation 6a for taking the next glass substrate 3 (arrow D). Similarly, the first handling device 6 and the second handling device 7 take out the glass substrates 3 alternately.
- the first handling device and the second handling device are respectively arranged in the vicinity of both sides of the one glass substrate packaging box, and the glass. Since the substrate is taken out alternately, the installation area of the pallet transfer device such as a turntable can be reduced compared to the simple addition as in the conventional technology, and the installation area of the glass substrate transfer device can be increased by the addition. Can be suppressed.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
- Specific Conveyance Elements (AREA)
- Wrapping Of Specific Fragile Articles (AREA)
Abstract
A substrate transfer apparatus by which installation area can be suppressed. A substrate transfer apparatus is provided with a first handling apparatus (6) and a second handling apparatus (7) for taking out glass substrates (3) from one glass substrate packing box (2) wherein a plurality of glass substrates (3) are stored; a first conveyer (9) for transferring the glass substrate (3) taken out by the first handling apparatus (6); and a second conveyer (10) for transferring the glass substrate (3) taken out by the second handling apparatus (7). The first handling apparatus (6) and the second handling apparatus (7) are arranged close to the both sides of the one glass substrate packing box (2) and alternately take out the glass substrates (3).
Description
明 細 書 Specification
基板搬送装置 Substrate transfer device
技術分野 Technical field
[0001] 本発明は、液晶パネル用のガラス基板などが複数枚収納された基板梱包箱から基 板を搬送する装置に関する。 The present invention relates to an apparatus for transporting a substrate from a substrate packaging box in which a plurality of glass substrates for liquid crystal panels and the like are stored.
背景技術 Background art
[0002] 近年、液晶パネルなどの平面型の表示装置に用いられるガラス基板は大型化して きていることから、トラック輸送等する際のガラス基板梱包箱として、図 4に示すような、 複数のガラス基板 3及び該ガラス基板 3に挟んだ緩衝材としての合紙 4とを傾斜させ て積み重ねた状態で積載する斜め積みパレット 2を使用して、運搬コストを下げるよう にしている。そして、このパレット 2から、ガラス基板 3を 1枚 1枚取り出してカ卩エライン 等に搬送する装置として、一般的には、図 5に示すようなガラス基板搬送装置 20が用 いられている。 [0002] In recent years, since glass substrates used in flat display devices such as liquid crystal panels have become larger, a plurality of glass substrate packaging boxes for truck transportation or the like as shown in FIG. The slant stacking pallet 2 loaded in a state where the glass substrate 3 and the interleaving paper 4 sandwiched between the glass substrates 3 are inclined and stacked is used to reduce the transportation cost. In general, a glass substrate transport device 20 as shown in FIG. 5 is used as a device for taking out each glass substrate 3 from the pallet 2 and transporting the glass substrates 3 to a carriage line or the like.
[0003] 図示されるようにガラス基板搬送装置 20には、パレット 2が載置されるターンテープ ル 21と、ガラス基板 3を取り出すノヽンドリング装置 22と、合紙 4を除去する合紙除去 装置 23と、取り出したガラス基板 3を洗浄装置などへ搬送するコンベア 24が備えられ ている。 [0003] As shown in the figure, the glass substrate transport device 20 includes a turntable 21 on which the pallet 2 is placed, a nodling device 22 for taking out the glass substrate 3, and a slip sheet removing device for removing the slip sheet 4. 23 and a conveyor 24 for transporting the taken glass substrate 3 to a cleaning device or the like.
[0004] 図 6は、このようなガラス基板搬送装置 20を用いて、ガラス基板 3を取り出してコン ベア 24に載せる手順とそれに要する時間を示したタイミングチャートである。先ず、ハ ンドリング装置 22の動作について説明する。ハンドリング装置 22の取る動作 22aとは 、ガラス基板 3を取りに行く動作を開始してカゝらガラス基板 3をアーム 25に保持するま でをいい、この動作に 14秒かかる。ハンドリング装置 22の運ぶ動作 22bとは、保持し たガラス基板 3を取り出してコンベア 24にまで運ぶ動作をいい、この動作に 8秒かか る。ハンドリング装置 22の置く動作 22cとは、ガラス基板 3を放してコンベア 24に載置 するまでをいい、この動作に 10秒かかる。ハンドリング装置 22の戻る動作 22dとは、 コンベア 24にガラス基板 3を載置して力もアーム 25を取る動作 22aの開始位置に戻 すまでをいい、この動作に 8秒かかる。従って、ハンドリング装置 22のガラス基板 3を
取りに行く動作を開始して力も戻ってくるまでに力かる時間は 40秒である。 FIG. 6 is a timing chart showing a procedure for taking out the glass substrate 3 and placing it on the conveyor 24 using such a glass substrate transfer device 20 and the time required for it. First, the operation of the handling device 22 will be described. The operation 22a taken by the handling device 22 refers to the operation until the glass substrate 3 is held by the arm 25 after starting the operation of taking the glass substrate 3, and this operation takes 14 seconds. The carrying operation 22b of the handling device 22 is an operation of taking out the held glass substrate 3 and carrying it to the conveyor 24, and this operation takes 8 seconds. The operation 22c of placing the handling device 22 refers to releasing the glass substrate 3 and placing it on the conveyor 24. This operation takes 10 seconds. The return operation 22d of the handling device 22 refers to the operation until the glass substrate 3 is placed on the conveyor 24 and the arm 25 is moved to return to the starting position of the operation 22a. This operation takes 8 seconds. Therefore, the glass substrate 3 of the handling device 22 It takes 40 seconds to start taking a move and to return the power.
[0005] 次に、合紙除去装置 23の動作について説明する。合紙除去装置 23の取る動作 23 aとは、合紙 4を取りに行く動作を開始して力ゝら合紙 4をアーム 26に保持するまでをい い、この動作に 3秒かかる。具体的には、この合紙除去装置 23の取る動作 23aは、ハ ンドリング装置 22の取る動作 22aが終了してから開始されるようになっている(矢印 E )。合紙除去装置 23の運ぶ動作 23bとは、取り出した合紙 4を合紙投入ケース 27ま で運ぶ動作をいい、この動作に 5秒かかる。合紙除去装置 23の置く動作 23cとは、合 紙投入ケース 27に合紙 4を放して合紙投入ケース 27に投入するまでを ヽ、この動 作に 7秒かかる。合紙除去装置 23の戻る動作 23dとは、合紙 4を合紙投入ケース 27 に投入して力もアーム 26を取る動作 23aの開始位置に戻すまでをいい、この動作に 5秒かかる。従って、合紙除去装置 23の合紙 4を取りに行く動作を開始して力も戻つ てくるまでに力かる時間は 20秒である。 Next, the operation of the slip sheet removing device 23 will be described. The operation 23 a taken by the slip sheet removing device 23 is the time from the start of taking the slip sheet 4 until the slip sheet 4 is held by the arm 26, and this operation takes 3 seconds. Specifically, the operation 23a taken by the slip sheet removing device 23 is started after the operation 22a taken by the handling device 22 is completed (arrow E). The operation 23b of the interleaf removal device 23 refers to the operation of transporting the taken interleaving paper 4 to the interleaf insertion case 27, which takes 5 seconds. The operation 23c of the slip-sheet removing device 23 means that it takes 7 seconds to release the slip-sheet 4 into the slip-sheet feeding case 27 and put it into the slip-sheet feeding case 27. The return action 23d of the slip sheet removing device 23 refers to the period from the insertion of the slip sheet 4 into the slip sheet feeding case 27 to the return to the starting position of the action 23a in which the force is also taken by the arm 26, and this operation takes 5 seconds. Therefore, it takes 20 seconds to start the operation of taking the interleaf 4 of the interleaf removal device 23 and to return the force.
[0006] なお、本発明に関連する先行技術文献として、特開 2000— 351449号公報が挙 げられる。 [0006] Incidentally, as a prior art document related to the present invention, JP-A-2000-351449 is cited.
発明の開示 Disclosure of the invention
発明が解決しょうとする課題 Problems to be solved by the invention
[0007] このガラス基板搬送装置 20を用いてガラス基板 3を取り出す枚数を増加させるには 、通常、図 7に示すようにガラス基板搬送装置 20をもう 1台増設した、ガラス基板搬送 装置 28として構成することが行われている。図 8は、このようなガラス基板搬送装置 2 0の 2台分のガラス基板搬送装置 28を用いて、ガラス基板 3を取り出してコンベア 24 , 24に載せる手順とそれに要する時間を示したタイミングチャートである。 [0007] In order to increase the number of glass substrates 3 to be taken out using this glass substrate transport device 20, normally, as shown in FIG. 7, another glass substrate transport device 20 is added as a glass substrate transport device 28. It has been made up. FIG. 8 is a timing chart showing a procedure for taking out the glass substrate 3 and placing it on the conveyors 24 and 24 using the glass substrate transfer devices 28 of the two glass substrate transfer devices 20 and the time required for the glass substrate transfer device 28. is there.
[0008] し力しながら、ガラス基板の大型化が進むに中、このようなガラス基板搬送装置を構 成するハンドリング装置、合紙除去装置、コンベア等も大型化しており、増設による設 置面積の増大を抑えることが望まれて 、る。 [0008] However, as the size of glass substrates increases, handling devices, slip sheet removal devices, conveyors, etc. that constitute such glass substrate transfer devices are also increasing in size. It is hoped that this increase will be suppressed.
[0009] そこで、本発明が解決しょうとする課題は、設置面積の増大を抑えることができる基 板搬送装置を提供することである。 Therefore, a problem to be solved by the present invention is to provide a substrate transport device that can suppress an increase in installation area.
課題を解決するための手段 Means for solving the problem
[0010] 上記課題を解決するため、本発明に係る基板搬送装置は、複数の基板が収納され
た一の基板梱包箱カも該基板を取り出す第 1のハンドリング装置及び第 2のハンドリ ング装置と、前記第 1のハンドリング装置により取り出された基板を搬送する第 1のコ ンベア及び前記第 2のハンドリング装置により取り出された基板を搬送する第 2のコン ベアとを備えると共に、前記第 1のハンドリング装置と前記第 2のハンドリング装置が 前記一の基板梱包箱の両側近傍に各々配置されて前記基板を交互に取り出すこと を要旨とするものである。 In order to solve the above problems, a substrate transfer apparatus according to the present invention stores a plurality of substrates. The first substrate packing box also has a first handling device and a second handling device for taking out the substrate, a first conveyor for transporting the substrate taken out by the first handling device, and the second handling device. A second conveyor for transporting the substrate taken out by the handling device, and the first handling device and the second handling device are respectively disposed in the vicinity of both sides of the one substrate packaging box. The gist of this is to alternately take out.
[0011] この場合、前記基板梱包箱は、複数の基板及び該基板に挟んだ緩衝材とを積み 重ねた状態で積載するパレットであり、更に、前記緩衝材を取り去る一の緩衝材除去 装置を備えると共に、この緩衝材除去装置が前記第 1のハンドリング装置と前記第 2 のハンドリング装置の間の近傍に配置されて 、る構成にすると良い。 [0011] In this case, the substrate packaging box is a pallet on which a plurality of substrates and a buffer material sandwiched between the substrates are stacked, and further includes a buffer material removing device that removes the buffer material. In addition, the cushioning material removing device may be arranged in the vicinity between the first handling device and the second handling device.
[0012] 更に、前記第 1のハンドリング装置が基板を取る動作を終了すると、前記緩衝剤除 去装置が緩衝剤を取る動作を開始し、該緩衝剤除去装置が該緩衝剤を運ぶ動作を 終了すると、前記第 2のハンドリング装置が次の基板を取る動作を開始し、該第 2の ハンドリング装置 7が該基板を取る動作を終了すると、前記緩衝剤除去装置が次の 緩衝剤を取る動作を開始し、該緩衝剤除去装置が該緩衝剤を運ぶ動作を終了する と、前記第 1のハンドリング装置が更に次の基板を取る動作を開始するという手順を 繰り返し行う構成にすると良い。 [0012] Furthermore, when the first handling device finishes the operation of taking the substrate, the buffer removal device starts the operation of taking the buffer, and the buffer removal device finishes the operation of carrying the buffer. Then, the second handling device starts the operation of taking the next substrate, and when the second handling device 7 finishes the operation of taking the substrate, the buffer removal device takes the operation of taking the next buffer agent. When the buffering agent removing apparatus finishes the operation of transporting the buffering agent, the first handling device may repeat the procedure of starting the operation of taking the next substrate.
発明の効果 The invention's effect
[0013] 上記構成を有する基板搬送装置によれば、一の基板梱包箱から該基板を取り出す 第 1のハンドリング装置及び第 2のハンドリング装置と、第 1のハンドリング装置により 取り出された基板を搬送する第 1のコンベア及び第 2のハンドリング装置により取り出 された基板を搬送する第 2のコンベアとを備えると共に、第 1のハンドリング装置と第 2 のハンドリング装置が一の基板梱包箱の両側近傍に各々配置されて基板を交互に 取り出すという構成なので、従来技術の増設と比べて基板梱包箱 1つ分の設置面積 が縮小され、増設による基板搬送装置の設置面積の増大を抑えることができる。 [0013] According to the substrate transport apparatus having the above-described configuration, the first handling device and the second handling device that take out the substrate from one substrate packaging box, and the substrate taken out by the first handling device are transported. A first conveyor and a second conveyor for transporting the substrate taken out by the second handling device, and the first handling device and the second handling device are respectively located near both sides of one substrate packaging box. Since the arrangement is such that the boards are taken out alternately, the installation area for one board packaging box is reduced compared to the expansion of the conventional technology, and the increase in the installation area of the board transfer device due to the expansion can be suppressed.
[0014] この場合、基板梱包箱は、複数の基板及び該基板に挟んだ緩衝材とを積み重ねた 状態で積載するパレットであり、更に、緩衝材を取り去る一の緩衝材除去装置を備え ると共に、この緩衝材除去装置が第 1のハンドリング装置と第 2のハンドリング装置の
間の近傍に配置されて ヽる構成にすれば、従来技術の増設と比べて緩衝材である 合紙を除去する装置 1台分の設置面積も縮小でき、増設による基板搬送装置の設置 面積の増大を抑えることができる。 [0014] In this case, the substrate packaging box is a pallet on which a plurality of substrates and a buffer material sandwiched between the substrates are stacked, and further includes one buffer material removing device that removes the buffer material. This cushioning material removal device is used for the first handling device and the second handling device. If installed in the vicinity, the installation area of one device that removes the interleaving paper, which is a buffer material, can be reduced compared to the expansion of the conventional technology, and the installation area of the board transfer device by the expansion can be reduced. The increase can be suppressed.
[0015] 更に、前記第 1のハンドリング装置が基板を取る動作を終了すると、前記緩衝剤除 去装置が緩衝剤を取る動作を開始し、該緩衝剤除去装置が該緩衝剤を運ぶ動作を 終了すると、前記第 2のハンドリング装置が次の基板を取る動作を開始し、該第 2の ハンドリング装置 7が該基板を取る動作を終了すると、前記緩衝剤除去装置が次の 緩衝剤を取る動作を開始し、該緩衝剤除去装置が該緩衝剤を運ぶ動作を終了する と、前記第 1のハンドリング装置が更に次の基板を取る動作を開始するという手順を 繰り返し行う構成にすれば、緩衝剤除去装置の可動率を向上させることができる。 図面の簡単な説明 [0015] Further, when the first handling device finishes the operation of taking the substrate, the buffer removal device starts the operation of taking the buffer, and the buffer removal device finishes the operation of carrying the buffer. Then, the second handling device starts the operation of taking the next substrate, and when the second handling device 7 finishes the operation of taking the substrate, the buffer removal device takes the operation of taking the next buffer agent. When the buffer removal device is configured to repeatedly perform the procedure of starting the operation of taking the next substrate when the buffer removal device finishes the operation of carrying the buffer, the buffer removal The mobility of the apparatus can be improved. Brief Description of Drawings
[0016] [図 1]本発明の一実施形態に係るガラス基板搬送装置の概略構成を示した図である FIG. 1 is a view showing a schematic configuration of a glass substrate transfer device according to an embodiment of the present invention.
[図 2]図 1のガラス基板搬送装置の動作の手順とそれに要する時間を示したタイミング チャートである。 2 is a timing chart showing the operation procedure of the glass substrate transfer apparatus of FIG. 1 and the time required for it.
[図 3]図 1に示したターンテーブルの変形例を示した図である。 FIG. 3 is a view showing a modification of the turntable shown in FIG. 1.
[図 4]従来用いられてきた複数のガラス基板及び該ガラス基板に挟んだ合紙とを傾斜 させて積み重ねた状態で積載する斜め積みパレットの概略構成を示した図である。 FIG. 4 is a diagram showing a schematic configuration of an oblique stacking pallet on which a plurality of conventionally used glass substrates and slip sheets sandwiched between the glass substrates are stacked in an inclined state.
[図 5]従来用いられてきたガラス基板搬送装置の概略構成を示した図である。 FIG. 5 is a diagram showing a schematic configuration of a conventionally used glass substrate transfer apparatus.
[図 6]図 5のガラス基板搬送装置の動作の手順とそれに要する時間を示したタイミング チャートである。 6 is a timing chart showing an operation procedure and time required for the glass substrate transfer apparatus of FIG.
[図 7]図 5のガラス基板搬送装置が 2台に増設されたガラス基板搬送装置を示した図 である。 FIG. 7 is a view showing a glass substrate transfer apparatus in which the glass substrate transfer apparatus in FIG. 5 is added to two units.
[図 8]図 7のガラス基板搬送装置の動作の手順とそれに要する時間を示したタイミング チャートである。 FIG. 8 is a timing chart showing the operation procedure of the glass substrate transfer apparatus of FIG. 7 and the time required for it.
発明を実施するための最良の形態 BEST MODE FOR CARRYING OUT THE INVENTION
[0017] 以下に、本発明に係る基板搬送装置の実施の形態ついて、図面を参照して詳細に 説明する。図 1は本発明の一実施形態に係るガラス基板搬送装置の概略構成、図 2
はガラス基板搬送装置の動作の手順とそれに要する時間を示したタイミングチャート を示している。尚、本実施例で用いられるガラス基板梱包箱は、従来技術で説明した 図 4の斜め積みパレット 2である。 Hereinafter, an embodiment of a substrate transfer apparatus according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic configuration of a glass substrate transfer apparatus according to an embodiment of the present invention. Shows a timing chart showing the operation procedure of the glass substrate transfer apparatus and the time required for it. The glass substrate packing box used in this example is the diagonally stacked pallet 2 shown in FIG. 4 described in the prior art.
[0018] 図示されるガラス基板搬送装置 1には、パレット 2が載置される 1台のターンテープ ル 5と、ガラス基板 3を取り出す 2台の第 1ハンドリング装置 6及び第 2ハンドリング装置 7と、合紙 4を除去する 1台の合紙除去装置 8と、取り出したガラス基板 3を次工程へ 搬送する 2台の第 1コンベア 9及び第 2コンベア 10とが備えられている。 [0018] The illustrated glass substrate transport device 1 includes one turntable 5 on which a pallet 2 is placed, two first handling devices 6 and a second handling device 7 that take out the glass substrate 3. In addition, one slip sheet removing device 8 that removes the slip sheet 4 and two first conveyors 9 and second conveyors 10 that transport the taken glass substrate 3 to the next process are provided.
[0019] ターンテーブル 5は、上側に次にガラス基板 3を取り出すパレット 2を載置しておき、 下側のパレット 2が空になったら、ターンテーブル 5を回転させて上側と下側のパレツ ト 2を切り替える装置である。尚、ターンテーブル 5の代わりに、図 3に示すような、パレ ット搬送装置 11を用いても良い。このパレット搬送装置 11には、コの字状のコンベア 力もなる第 1パレット搬送コンベア 12と、この第 1パレット搬送コンベア 12の中間部と ハンドリング装置 6, 7と合紙除去装置 8が配置された取り出し作業場 14とを往復搬送 する第 2パレット搬送コンベア 13とが備えられている。 [0019] In the turntable 5, the pallet 2 for taking out the glass substrate 3 next is placed on the upper side, and when the lower pallet 2 is empty, the turntable 5 is rotated to rotate the upper and lower pallets. This is a device that switches between the two. Instead of the turntable 5, a pallet transfer device 11 as shown in FIG. The pallet transport device 11 includes a first pallet transport conveyor 12 that also has a U-shaped conveyor force, an intermediate portion of the first pallet transport conveyor 12, handling devices 6 and 7, and an interleaf removal device 8. A second pallet transfer conveyor 13 for reciprocating transfer to and from the take-out work site 14 is provided.
[0020] 図 1に示される第 1ハンドリング装置 6及び第 2ハンドリング装置 7は、例えば多関節 産業用ロボットからなり、 3本のアーム 15の表面には、図示しない複数の吸着パットが それぞれ設けられている。パレット 2からのガラス基板 3の取り出しは、このアーム 15 によって吸着パットをガラス基板 3に押し付けてガラス基板 3を 1枚ずつ支持し、ァー ム 15を回動させて行われる。取り出したガラス基板 3は、下流に設けられたコンベア 9 , 10に載置され、コンベア 9, 10によりそれぞれ例えば洗浄装置などに搬送されるよ うになつている。 The first handling device 6 and the second handling device 7 shown in FIG. 1 are composed of, for example, an articulated industrial robot, and a plurality of suction pads (not shown) are provided on the surfaces of the three arms 15, respectively. ing. The glass substrate 3 is taken out from the pallet 2 by pressing the suction pad against the glass substrate 3 by the arm 15 to support the glass substrates 3 one by one and rotating the arm 15. The taken-out glass substrate 3 is placed on conveyors 9 and 10 provided downstream, and is conveyed by the conveyors 9 and 10 to, for example, a cleaning device.
[0021] 合紙除去装置 8も、例えば多関節産業用ロボットからなり、 1本のアーム 16の表面 には、図示しない吸着パットが設けられている。パレット 2からの合紙 4の除去は、ァー ム 16によって吸着パットを合紙 4に押し付けて合紙 4を 1枚ずつ支持し、アーム 16を 回動させて行われる。除去された合紙 4は、近傍に設けられた合紙投入ケース 17に 投入することで回収されるようになって 、る。 The slip sheet removing device 8 is also composed of, for example, an articulated industrial robot, and a suction pad (not shown) is provided on the surface of one arm 16. The removal of the interleaving paper 4 from the pallet 2 is performed by pressing the suction pad against the interleaving paper 4 by the arm 16 to support the interleaving paper 4 one by one and rotating the arm 16. The removed interleaving paper 4 is collected by being placed in an interleaving paper case 17 provided in the vicinity.
[0022] 図 2は、このようなガラス基板搬送装置 1を用いて、パレット 2からガラス基板 3を取り 出してコンベア 9, 10に載せる手順とそれに要する時間を示したタイミングチャートで
ある。先ず、第 1ハンドリング装置 6の動作について説明する。第 1ハンドリング装置 6 の取る動作 6aとは、ガラス基板 3を取りに行く動作を開始して力もガラス基板 3をァー ム 15に保持するまでをいい、この動作に 14秒かかる。第 1ハンドリング装置 6の運ぶ 動作 6bとは、保持したガラス基板 3を取り出して第 1コンベア 9まで運ぶ動作を 、、 この動作に 8秒かかる。第 1ハンドリング装置 6の置く動作 6cとは、ガラス基板 3を放し て第 1コンベア 9に載置するまでをいい、この動作に 10秒力かる。 FIG. 2 is a timing chart showing a procedure for taking out the glass substrate 3 from the pallet 2 and placing it on the conveyors 9 and 10 using such a glass substrate transfer apparatus 1 and the time required for it. is there. First, the operation of the first handling device 6 will be described. The operation 6a taken by the first handling device 6 refers to the operation until the glass substrate 3 is held by the arm 15 after starting the operation to take the glass substrate 3, and this operation takes 14 seconds. The operation 6b of carrying the first handling device 6 is the operation of taking out the held glass substrate 3 and carrying it to the first conveyor 9. This operation takes 8 seconds. The operation 6c of placing the first handling device 6 means that the glass substrate 3 is released and placed on the first conveyor 9, and this operation takes 10 seconds.
[0023] また、第 1ハンドリング装置 6の戻る動作 6dとは、第 1コンベア 9にガラス基板 3を載 置してからアーム 15を取る動作 6aの開始位置に戻すまでをいい、この動作に 8秒か かる。従って、第 1ハンドリング装置 6のガラス基板 3を取りに行く動作を開始してから 戻ってくるまでに力かる時間は 40秒である。もう一方の第 2ハンドリング装置 7と第 2コ ンベア 10を用いて行われる取る動作 7a、運ぶ動作 7b、置く動作 7c、戻る動作 7dに ついても同様である。 [0023] The return operation 6d of the first handling device 6 refers to the operation from the placement of the glass substrate 3 on the first conveyor 9 to the return to the start position of the operation 6a for removing the arm 15. It takes a second. Therefore, it takes 40 seconds for the first handling device 6 to start working to pick up the glass substrate 3 and to return. The same applies to the taking operation 7a, the carrying operation 7b, the placing operation 7c, and the returning operation 7d performed using the other second handling device 7 and the second conveyor 10.
[0024] 次に、合紙除去装置 8の動作について説明する。合紙除去装置 8の取る動作 8aと は、合紙 4を取りに行く動作を開始して力も合紙 4をアーム 16に保持するまでを ヽ 、この動作に 2秒かかる。合紙除去装置 8の運ぶ動作 8bとは、取り出した合紙 4を合 紙投入ケース 17にまで運ぶ動作をいい、この動作に 4秒かかる。合紙除去装置 8の 置く動作 8cとは、合紙投入ケース 17に合紙 4を放して合紙投入ケース 17に投入する までをいい、この動作に 10秒かかる。合紙除去装置 8の戻る動作 8dとは、合紙 4を合 紙投入ケース 17に投入して力 アーム 16を取る動作 8aの開始位置に戻すまでを!ヽ い、この動作に 4秒かかる。従って、合紙除去装置 8の合紙 4を取りに行く動作を開始 してから戻ってくるまでに力かる時間は 20秒である。 Next, the operation of the slip sheet removing device 8 will be described. The operation 8a that the slip sheet removing device 8 takes is that the operation to start taking the slip sheet 4 and the force until the slip sheet 4 is held by the arm 16 takes 2 seconds. The operation 8b of the interleaf removal device 8 is the operation of transporting the extracted interleaf paper 4 to the interleaf insertion case 17, which takes 4 seconds. The operation 8c of the slip sheet removing device 8 means that the slip sheet 4 is released into the slip sheet input case 17 and then inserted into the slip sheet input case 17, and this operation takes 10 seconds. The return operation 8d of the slip sheet removing device 8 means that the slip sheet 4 is put into the slip sheet input case 17 and the force arm 16 is taken back to the start position of 8a! This operation takes 4 seconds. Therefore, it takes 20 seconds to start the operation of taking the interleaf 4 of the interleaf removal device 8 and to return it.
[0025] このようなガラス基板搬送装置 1は、図 1に示されるように、第 1ハンドリング装置 6と 第 2ハンドリング装置 7がーのパレット 2の両側近傍に各々配置されてガラス基板 3を 交互に取り出すという構成になっている。具体的には、図 2に示されるように、第 1ノヽ ンドリング装置 6がガラス基板 3を取る動作 6aを終了すると、合紙除去装置 8が合紙 4 を取る動作 8aを開始する (矢印 。合紙除去装置 8がその合紙 4を運ぶ動作 8bを終 了すると、第 2ハンドリング装置 7が次のガラス基板 3を取る動作 7aを開始する(矢印 B)。第 2ハンドリング装置 7がそのガラス基板 3を取る動作 7aを終了すると、合紙除去
装置 8が次の合紙 4を取る動作 8aを開始する (矢印 C)。そして、合紙除去装置 8がそ の合紙 4を運ぶ動作 8bを終了すると、第 1ハンドリング装置 6が次のガラス基板 3を取 る動作 6aを開始する(矢印 D)。以下同様にして、第 1ハンドリング装置 6と第 2ハンド リング装置 7がガラス基板 3を交互に取り出していく。 [0025] As shown in FIG. 1, such a glass substrate transfer device 1 includes a first handling device 6 and a second handling device 7 arranged in the vicinity of both sides of the pallet 2 so that the glass substrates 3 are alternately arranged. It is configured to take out. Specifically, as shown in FIG. 2, when the first knocking device 6 finishes the operation 6a for taking the glass substrate 3, the slip sheet removing device 8 starts the operation 8a for taking the slip sheet 4 (arrow). When the interleaf removal device 8 finishes the operation 8b for transporting the interleaf paper 4, the second handling device 7 starts the operation 7a for taking the next glass substrate 3 (arrow B). When removing substrate 3 operation 7a, slip sheet removal Device 8 starts operation 8a to take the next slip 4 (arrow C). When the interleaf removal device 8 finishes the operation 8b for transporting the interleaf paper 4, the first handling device 6 starts an operation 6a for taking the next glass substrate 3 (arrow D). Similarly, the first handling device 6 and the second handling device 7 take out the glass substrates 3 alternately.
[0026] この図 2のタイミングチャートと、従来技術で説明した図 6又は図 8のタイミングチヤ ートを比べると、合紙除去装置の稼働率が向上しているのがわかる。従来技術のガラ ス基板搬送装置の構成では、ハンドリング装置 1台に対して合紙除去装置 1台を備え る構成であったものに対し、本発明に係るガラス基板搬送装置では、ハンドリング装 置 2台に対して合紙除去装置 1台を備える構成であるため、合紙除去装置の稼働率 を向上させて、その台数を減らすことが可能になって 、る。 [0026] When the timing chart of FIG. 2 is compared with the timing chart of FIG. 6 or FIG. 8 described in the prior art, it can be seen that the operating rate of the slip sheet removing device is improved. In the conventional glass substrate transfer device, the glass substrate transfer device according to the present invention has a handling device 2 whereas the glass substrate transfer device according to the present invention has a configuration in which one slip sheet removing device is provided for one handling device. Since it is configured to have one slip sheet removing device for the stand, it is possible to improve the operating rate of the slip sheet removing device and reduce the number of slip sheet removing devices.
[0027] また、図 1のガラス基板搬送装置 1の設置面積と、従来技術で説明した図 7のガラス 基板搬送装置 28の設置面積を比べると、ガラス基板を取り出す処理能力は同じであ るにもかかわらず、設置面積が縮小されているのがわかる。これは、ターンテーブルと 合紙除去装置が 1台ずつ削減されたためである。また、この削減により、ガラス基板 搬送装置のコストも安くなつて 、る。 [0027] Further, when the installation area of the glass substrate transfer device 1 in FIG. 1 is compared with the installation area of the glass substrate transfer device 28 in FIG. 7 described in the prior art, the processing capability of taking out the glass substrate is the same. Nevertheless, it can be seen that the installation area has been reduced. This is because one turntable and slip-sheet removal device have been reduced. This reduction also reduces the cost of the glass substrate transfer device.
[0028] 以上説明した本発明の一実施形態に係るガラス基板搬送装置によれば、第 1のハ ンドリング装置と第 2のハンドリング装置が一のガラス基板梱包箱の両側近傍に各々 配置されてガラス基板を交互に取り出すという構成なので、従来技術のような単なる 増設と比べてターンテーブルなどのパレット搬送装置の設置面積を縮小することがで き、増設によるガラス基板搬送装置の設置面積の拡大化を抑えることができる。 [0028] According to the glass substrate transport device according to the embodiment of the present invention described above, the first handling device and the second handling device are respectively arranged in the vicinity of both sides of the one glass substrate packaging box, and the glass. Since the substrate is taken out alternately, the installation area of the pallet transfer device such as a turntable can be reduced compared to the simple addition as in the conventional technology, and the installation area of the glass substrate transfer device can be increased by the addition. Can be suppressed.
[0029] また、ガラス基板梱包箱が合紙による斜め積みパレットである場合でも、使用する合 紙除去装置の稼働率を高くすることができるので、従来技術の増設と比べて合紙除 去装置の台数削減による設置面積の縮小化が可能である。尚、本発明はこうした実 施形態に何ら限定されるものではなぐ本発明の要旨を逸脱しない範囲において、 種々なる態様で実施できることは勿論である。例えば、ガラス基板の他、榭脂製の基 板の搬送にも適用できる。更に緩衝材としての合紙も、榭脂製や布製などのものでも よく合紙に限定されない、また、パレットへの基板の積載状態においても、斜め積み の他、平積みにも適用できることは言うまでもなぐ上記実施の形態に限定されない。
[0029] Even when the glass substrate packaging box is an oblique stacking pallet made of slip paper, the operating rate of the slip sheet removal device to be used can be increased, and therefore the slip sheet removal device compared to the expansion of the prior art. The installation area can be reduced by reducing the number of units. Of course, the present invention is not limited to these embodiments and can be carried out in various modes without departing from the gist of the present invention. For example, in addition to a glass substrate, the present invention can be applied to conveyance of a resin substrate. Furthermore, the interleaving paper as a cushioning material may be made of resin or cloth, and is not limited to interleaving paper. Needless to say, it can also be applied to flat stacking in addition to diagonal stacking even when the substrate is loaded on the pallet. However, the present invention is not limited to the above embodiment.
Claims
[1] 複数の基板が収納された一の基板梱包箱から該基板を取り出す第 1のハンドリング 装置及び第 2のハンドリング装置と、前記第 1のハンドリング装置により取り出された 基板を搬送する第 1のコンベア及び前記第 2のハンドリング装置により取り出された基 板を搬送する第 2のコンベアとを備えると共に、前記第 1のハンドリング装置と前記第 2のハンドリング装置が前記一の基板梱包箱の両側近傍に各々配置されて前記基板 を交互に取り出すことを特徴とする基板搬送装置。 [1] A first handling device and a second handling device that take out a substrate from a single substrate packaging box in which a plurality of substrates are stored, and a first transporting the substrate taken out by the first handling device And a second conveyor for transporting the substrate taken out by the second handling device, and the first handling device and the second handling device are located near both sides of the one substrate packaging box. A substrate transfer apparatus, wherein the substrate transfer apparatus is alternately arranged to take out the substrates alternately.
[2] 前記基板梱包箱は、複数の基板及び該基板に挟んだ緩衝材とを積み重ねた状態 で積載するパレットであり、更に、前記緩衝材を取り去る一の緩衝材除去装置を備え ると共に、この緩衝材除去装置が前記第 1のハンドリング装置と前記第 2のハンドリン グ装置の間の近傍に配置されていることを特徴とする請求項 1に記載の基板搬送装 置。 [2] The substrate packaging box is a pallet on which a plurality of substrates and a buffer material sandwiched between the substrates are stacked, and further includes a buffer material removing device for removing the buffer material, 2. The substrate transfer device according to claim 1, wherein the buffer material removing device is disposed in the vicinity between the first handling device and the second handling device.
[3] 前記第 1のハンドリング装置が基板を取る動作を終了すると、前記緩衝剤除去装置 が緩衝剤を取る動作を開始し、該緩衝剤除去装置が該緩衝剤を運ぶ動作を終了す ると、前記第 2のハンドリング装置が次の基板を取る動作を開始し、該第 2のハンドリ ング装置 7が該基板を取る動作を終了すると、前記緩衝剤除去装置が次の緩衝剤を 取る動作を開始し、該緩衝剤除去装置が該緩衝剤を運ぶ動作を終了すると、前記第 1のハンドリング装置が更に次の基板を取る動作を開始するという手順を繰り返し行う ことを特徴とする請求項 2に記載の基板搬送装置。
[3] When the operation of taking the substrate is finished by the first handling device, the buffer removal device starts the operation of taking the buffer, and when the buffer removal device is finished carrying the buffer. When the second handling device starts the operation of taking the next substrate and the second handling device 7 finishes the operation of taking the substrate, the buffer removing device takes the operation of taking the next buffer agent. 3. The method of claim 2, wherein, when the buffer removal device finishes the operation of carrying the buffer, the first handling device repeats the procedure of starting the operation of taking the next substrate. The board | substrate conveyance apparatus of description.
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JP2007521175A JPWO2006134709A1 (en) | 2005-06-17 | 2006-04-05 | Substrate transfer device |
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- 2006-04-05 CN CN2006800202346A patent/CN101193811B/en not_active Expired - Fee Related
- 2006-04-05 KR KR1020077026701A patent/KR100956807B1/en not_active IP Right Cessation
- 2006-04-05 WO PCT/JP2006/307186 patent/WO2006134709A1/en active Application Filing
- 2006-05-04 TW TW095115916A patent/TW200740678A/en not_active IP Right Cessation
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020040103A1 (en) * | 2018-08-23 | 2020-02-27 | 川崎重工業株式会社 | Robot and robot system comprising same |
JP2020028952A (en) * | 2018-08-23 | 2020-02-27 | 川崎重工業株式会社 | Robot and robot system comprising the same |
JP7117193B2 (en) | 2018-08-23 | 2022-08-12 | 川崎重工業株式会社 | ROBOT AND ROBOT SYSTEM INCLUDING THE SAME |
US11845621B2 (en) | 2018-08-23 | 2023-12-19 | Kawasaki Jukogyo Kabushiki Kaisha | Robot and robot system having the same |
Also Published As
Publication number | Publication date |
---|---|
TWI318959B (en) | 2010-01-01 |
TW200740678A (en) | 2007-11-01 |
KR20080014779A (en) | 2008-02-14 |
CN101193811B (en) | 2011-11-23 |
KR100956807B1 (en) | 2010-05-11 |
CN101193811A (en) | 2008-06-04 |
JPWO2006134709A1 (en) | 2009-01-08 |
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