WO2005000590A1 - ノズルプレート及びその製造方法 - Google Patents
ノズルプレート及びその製造方法 Download PDFInfo
- Publication number
- WO2005000590A1 WO2005000590A1 PCT/JP2004/006226 JP2004006226W WO2005000590A1 WO 2005000590 A1 WO2005000590 A1 WO 2005000590A1 JP 2004006226 W JP2004006226 W JP 2004006226W WO 2005000590 A1 WO2005000590 A1 WO 2005000590A1
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- WIPO (PCT)
- Prior art keywords
- nozzle
- layer
- nozzle hole
- etching
- hole
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14475—Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber
Definitions
- the present invention relates to a structure of a nozzle plate used for a micro-dot forming apparatus for forming a micro-pattern by a micro-dot, and a method of manufacturing the same.
- ink-jet printers have been used literally as printers, exclusively using paper as a medium.
- attention has been paid to the versatility and low cost of the ink jet printer technology, and the formation of fine patterns such as power filters for liquid crystal display devices, which have been processed by photolithography technology in the past, has been considered.
- Attention has been focused on the application of inkjet printers to the formation of conductive patterns on printed wiring boards. Therefore, in recent years, it has become possible to form a fine pattern with high precision by directly drawing a very small ink dot on a drawing target (for example, a color filter for liquid crystal display or a printed wiring board).
- a drawing target for example, a color filter for liquid crystal display or a printed wiring board.
- minute dot forming devices that can be used has been active. ( In such a minute dot forming device, a nozzle plate having high ejection characteristics such as ejection stability and high landing accuracy is required.
- FIG. 19 (&) ⁇ FIG. 19 (b) is an explanatory view of a nozzle plate (hereinafter referred to as a conventional configuration) described in Patent Document 1. +
- a conventional chip plate is composed of 21 SOI (Siliconon Insulator) substrates.
- the SOI substrate 21 has an etching stop layer Si 0 2 layer 2 over the entire area of the support Si layer 25. 6 and an Si layer 24 as an active layer on the SiO 2 layer 26.
- An orifice 22 is formed in the Si layer 24, and a tapered portion 23 is formed in the Si layer 25. The orifice 22 and the tapered portion 23 communicate with each other. I have.
- the conventional nozzle plate manufacturing method (hereinafter referred to as the conventional method) is as follows. First, the surface of the Si layer 24 as an active layer is oxidized to form an oxide film (not shown). Then, a predetermined pattern is formed on the oxide film 2 8, dry etching is performed with this pattern as a mask, stop etching at S i ⁇ two layers 2 6 is etched Holdings top layer, sediment Fi scan 2 2 To form Next, the surface of the Si layer 25 serving as a support layer is oxidized to form an oxide film (not shown). A predetermined pattern is formed on this oxide film, and using this pattern as a mask, dry etching is performed under conditions that cause undercut, and etching is stopped by the SiO 2 layer 26 to form a tapered portion 23. . Finally, the Si 2 layer 26 between the orifice 22 and the tapered portion 23 and the oxide film on the surface are removed with a hydrofluoric acid-based etchant.
- Patent Document 1 states that the processing accuracy of the above-mentioned nozzle is within 1 micron of soil with respect to the dimensional design value. Is low.
- the present invention has been made in view of the above problems, and an object of the present invention is to provide a nozzle plate having a first nozzle hole with high forming accuracy and having a low risk of deformation such as warpage, and a method of manufacturing the same. It is in. Disclosure of the invention
- the nozzle plate of the present invention includes a first nozzle layer having a first nozzle hole for discharging a liquid substance, a second nozzle layer communicating with the first nozzle hole, and receiving a supply of the liquid substance. Between the second nozzle layer with nozzle holes, the shielding layer is locally formed around a communication portion communicating with the first nozzle hole and the second nozzle hole. It is characterized by being formed in
- the first nozzle hole is for discharging the liquid substance supplied to the second nozzle hole.
- the above-mentioned liquid substance includes not only a liquid but also a substance having such a viscosity that it can be discharged from the first nozzle hole.
- the shielding layer is formed around a communication portion where the first nozzle hole and the second nozzle hole communicate with each other, and when the first nozzle hole is etched, the shape of the opening of the first nozzle hole is formed. It is a mask that defines.
- the shielding layer is provided locally, the area of the contact portion between the first nozzle layer and the shielding layer or between the second nozzle layer and the shielding layer can be reduced. As a result, the generation of stress due to the difference in linear expansion coefficient between the first nozzle layer, the second nozzle layer, and the shielding layer can be significantly suppressed, and large warpage occurs in the nozzle plate. Can be prevented. Therefore, when joining the nozzle plate to, for example, an inkjet head, the joining accuracy can be improved, and the structural reliability of the nozzle plate itself can be increased.
- the rigidity required for the first nozzle layer and the second nozzle layer is reduced, and the thickness of the first nozzle layer and the second nozzle layer is reduced.
- the first nozzle hole and the second nozzle hole having high forming accuracy can be provided.
- the layer thicknesses of the first nozzle layer and the second nozzle layer can be reduced as described above, the first nozzle hole and the second nozzle hole can be formed small. As a result, the degree of integration of the first nozzle holes can be increased, and the resolution of drawing can be improved.
- the outer shape of the shielding layer be larger than the outer shape of the second nozzle hole in the communication portion.
- the state where the outer shape of the shielding layer matches the outer shape of the second nozzle hole in the communication part is the minimum outer shape of the locally formed shielding layer. If the outer shape of the shielding layer is smaller than the outer shape of the communicating portion of the second nozzle hole to be formed, the etching of the second nozzle hole progresses to the first nozzle layer around the shielding layer. This is because they will.
- the shielding layer is formed when the second nozzle hole is etched. It functions as a stopper, and the etching of the second nozzle hole can be reliably stopped by the shielding layer.
- the second nozzle hole does not penetrate the shielding layer, so that the thickness of the first nozzle layer is kept constant, and the liquid material There is no variation in the flow path resistance.
- the first nozzle hole is formed of a penetrating portion of the first nozzle layer and a penetrating portion of the shielding layer.
- a penetration portion having the same diameter as the diameter of the penetration portion of the shielding layer can be formed in the first nozzle layer using the shielding layer as an etching mask. This makes it possible to provide the first nozzle hole with high shape accuracy.
- the second nozzle hole has a tapered shape in which a communicating portion with the first nozzle hole is narrow.
- the second nozzle hole is tapered, turbulence does not easily occur in the supplied liquid material in the second nozzle hole, and the ejection stability of the droplet can be improved.
- both the first nozzle layer and the second nozzle layer are formed of a polymer organic material
- the shielding layer is formed of a metal material, an inorganic oxide material, and an inorganic nitride material. Desirably, it is formed from at least one of them.
- the first nozzle layer and the second nozzle layer can be easily processed by dry etching using plasma using oxygen.
- the shielding layer has high etching resistance to dry etching by the plasma using oxygen, and is hardly etched. This makes it possible to provide the first nozzle hole and the second nozzle hole with higher forming accuracy, and since the second nozzle hole formed in the second nozzle layer does not penetrate the shielding layer, 1
- the thickness of the nozzle layer can be kept constant, and there is no variation in the flow resistance of the liquid material to be discharged.
- the nozzle plate of the present invention may further comprise, in addition to the above-described configuration, the first nozzle layer and the second nozzle layer both formed of polyimide resin, and the shielding layer may be formed of Ti, Al, Au, P t, T a, W, N b, S i ⁇ 2, a l 2 ⁇ 3, S i at least is selected from N have to desirable mainly composed of one material Q
- the first nozzle layer and the second nozzle layer can be easily processed by dry etching using plasma using oxygen.
- the shielding layer has high etching resistance to dry etching by the plasma using oxygen, and is hardly etched.
- first nozzle holes Contact Yopi second nozzle hole of accuracy, since the second nozzle hole formed in the second nozzle layer and no child through the shield layer, The thickness of the first nozzle layer can be kept constant, and the flow resistance of the liquid substance does not vary.
- the nozzle plate of the present invention may be configured such that at least one of the first nozzle layer and the second nozzle layer has at least one of S i, S i ⁇ 2 , and S i 3 N 4.
- the shielding layer is formed of a material mainly containing at least one of A1, Cu, Au, Pt, A1 oxide, and A1 nitride. It is desirable to have been.
- the first nozzle layer and the second nozzle layer can be easily processed by dry etching using plasma using fluorine.
- the shielding layer has high etching resistance to the dry etching by the plasma using fluorine, and is hardly etched.
- the first nozzle hole and the second nozzle hole having higher forming accuracy can be provided.
- the first nozzle hole can be provided.
- the thickness of the layer can be kept constant, and the flow resistance of the liquid material does not vary.
- the nozzle plate of the present invention includes a nozzle layer having one or more first nozzle holes for discharging a liquid material, a nozzle layer communicating with the first nozzle hole, and supplying the liquid material.
- a reinforcing plate fixed to the nozzle layer and having a higher resistance to etching than the nozzle layer, and formed at least around the communicating portion between the first nozzle hole and the second nozzle hole. And a shielding layer.
- the first nozzle hole is for discharging the liquid substance supplied to the second nozzle hole.
- the above-mentioned liquid substance includes not only a liquid but also a substance having such a viscosity that it can be discharged from the first nozzle hole.
- the shielding layer is formed around a communicating portion between the first nozzle hole and the second nozzle hole, and when etching the first nozzle hole, a mask for defining the shape of the opening of the first nozzle hole. It becomes.
- the reinforcing plate fixed to the nozzle layer can be formed in a separate process, so that the degree of freedom in selecting a material to be used for the reinforcing plate is greatly improved.
- the shielding layer can be processed into a required minimum shape without being affected by the shape of the second nozzle hole formed in the reinforcing plate. Thereby, the area of the contact portion between the nozzle layer and the shielding layer can be reduced.
- the structural reliability of the nozzle plate itself can be increased.
- the joining accuracy can be improved.
- the layer thickness of the nozzle layer can be reduced. That is, by forming the first nozzle hole in a nozzle layer having a small layer thickness, the formation accuracy of the first nozzle hole for controlling the size of the discharged droplet can be increased.
- the nozzle layer having the first nozzle holes and the reinforcing plate having the second nozzle holes can be processed in different steps. For this reason, the diameter of the discharge hole for controlling the size of the discharged liquid droplet can be set by processing a thin nozzle layer, so that the first nozzle hole with high formation accuracy can be provided.
- the shielding layer is formed within an opening range of the second nozzle hole.
- the shielding layer falls within the opening range of the second nozzle hole, the stress generated around the shielding layer can be minimized, and the shielding layer is formed with the nozzle layer. Since the structure is not sandwiched between the reinforcing plate and the reinforcing plate, it is possible to enhance the bonding accuracy between the nozzle layer and the reinforcing plate.
- the area of the contact portion between the nozzle layer and the shielding layer can be further reduced. That is, the generation of stress due to the difference in linear expansion coefficient between the nozzle layer and the reinforcing plate and the shielding layer can be further suppressed, and large warpage of the nozzle plate can be prevented.
- the joining accuracy can be improved, and the structural reliability of the nozzle plate itself can be increased.
- the nozzle layer and the reinforcing plate must be processed in separate processes. Therefore, the first nozzle hole and the second nozzle hole can be formed small. As a result, the degree of integration of the first nozzle holes can be increased, and the resolution of drawing can be improved. .
- the first nozzle hole is formed of a penetrating portion of the first nozzle layer and a penetrating portion of the shielding layer.
- a penetration portion having the same diameter as the diameter of the penetration portion of the shielding layer can be formed in the nozzle layer using the shielding layer as an etching mask.
- the nozzle layer is formed of a polymer organic material
- the shielding layer is at least one of a metal material, an inorganic oxide material, and an inorganic nitride material.
- the reinforcing plate is made of at least one of Si, an inorganic oxide material, and a polymer organic material.
- the nozzle layer can be easily processed by dry etching using plasma using oxygen.
- the shielding layer has high etching resistance to dry etching by the above-described plasma using oxygen, and is hardly etched. Thereby, the first nozzle hole with higher forming accuracy can be provided.
- the nozzle layer is made of a polyimide resin
- the shielding layer is made of Ti, A1, Au, Pt, W, Nb, S i 0 2
- a l 2 Rei_3 is composed of one material at least is selected from S i N
- the reinforcing plate is a principal component of one at least of the S i, glass, a 1 2_Rei 3 It must be made of ceramic material or polyimide resin. Is desirable.
- the nozzle layer can be easily processed by dry etching using plasma using oxygen.
- the shielding layer has high etching resistance to dry etching by the above-described plasma using oxygen, and is hardly etched. Thereby, it is possible to provide the first nozzle hole with higher forming accuracy.
- the nozzle layer is formed of a material containing at least one of S i, S i ⁇ 2 , and S i 3 N 4 as a main component.
- the shielding layer is made of a material mainly containing at least one of A1, Cu, Au, Pt, A1 oxide, and A1 nitride, and the reinforcing plate is made of Si, glass, it is preferably formed by a ceramic stick material or Porii Mi de resin to at least mainly composed of one of the a 1 2 0 3.
- the nozzle layer can be easily processed by dry etching using plasma using fluorine.
- the shielding layer has a high etching resistance to the dry etching by the plasma using fluorine, and is hardly etched. Thereby, the first nozzle hole with higher forming accuracy can be provided.
- the nozzle layer is formed by S i 0 2 or S i 3 N 4, for example, in the case of forming the liquid-repellent film on the discharging surface of the liquid material, adhesion of the repellent liquid film. It can improve and prevent peeling and chipping.
- the shielding layer as an etching mask, etching the nozzle layer from the opening, and forming a first nozzle hole penetrating the nozzle layer from the opening.
- the shielding layer with an etching mask, c the first nozzle hole with a diameter identical to the diameter of the opening of the shielding layer can be formed in the nozzle layer This ensures that the first nozzle hole It can be formed with high precision.
- an optimum material can be selected as a material for the shielding layer as an etching mask for the first nozzle hole or as a side wall of the first nozzle hole.
- the first nozzle hole can be formed with higher accuracy.
- the shielding layer is locally formed, the area of the contact portion between the nozzle layer and the shielding layer can be reduced. Thereby, it is possible to suppress the generation of stress due to the difference in linear expansion ratio between the nozzle layer and the shielding layer, and to prevent large warpage of the nozzle plate. Therefore, when joining the nozzle plate to the ink jet head, for example, the joining accuracy can be improved, and the structural reliability of the nozzle plate itself can be increased.
- the rigidity required for the nozzle layer is reduced, and the layer thickness of the nozzle layer can be reduced. That is, the etching amount accompanying the etching of the first nozzle hole is reduced, and the formation error can be reduced. Thereby, the first nozzle hole can be formed with high accuracy.
- the first nozzle hole can be formed small. As a result, the degree of integration of the first nozzle holes can be increased, and the resolution of drawing can be improved.
- the method for manufacturing a nozzle plate of the present invention further comprises, after the above three steps, a reinforcing plate having a second nozzle hole separately formed, and a shielding plate provided on the nozzle layer. It is preferable to perform a step of joining the nozzle layer so that the layer is located inside the second nozzle hole.
- the shielding layer can be formed in a small shape so as to be located inside the second nozzle hole as long as it has a size that can serve as an etching mask when forming the first nozzle hole.
- the shielding layer since the shielding layer is located within the opening range of the second nozzle hole, the shielding layer does not contact the reinforcing plate. As a result, the generation of stress due to the difference in linear expansion coefficient between the nozzle layer and the reinforcing plate and the shielding layer can be significantly suppressed, and large warpage of the nozzle plate can be prevented.
- the manufacturing process can be simplified and the manufacturing cost can be reduced.
- a method of manufacturing a nozzle plate according to the present invention is directed to a method of manufacturing a nozzle plate having a nozzle hole for discharging a liquid, in order to solve the above-described problem.
- the first nozzle hole having the same diameter as the diameter of the opening of the shielding layer can be formed in the first nozzle layer using the shielding layer as an etching mask.
- the shielding layer functions as a stopper when etching the second nozzle hole, and the etching of the second nozzle hole can be reliably stopped by the shielding layer. That is, when etching the second nozzle layer, the second nozzle hole does not penetrate the shielding layer. As a result, the thickness of the first nozzle layer is kept constant, and the flow resistance of the liquid material does not vary.
- an optimal material can be selected as a shielding layer at the time of etching the first nozzle hole or as a side wall of the first nozzle hole.
- the first nozzle hole can be formed with higher precision.
- the shielding layer is etched from one direction, so that the etching is performed from two directions facing each other as in the conventional method. Compared to the case, the alignment between the first nozzle hole and the second nozzle hole is easier.
- the etching in the fifth step can be performed using the etching apparatus and the etching solution or the etching gas in the fourth step as they are. This simplifies the manufacturing process.
- a nozzle plate of the present invention includes a first nozzle layer having a first nozzle hole for discharging a liquid material, and a first nozzle layer communicating with the first nozzle hole.
- the first nozzle hole is formed so as to be in contact with the surface on the liquid material discharge side, and is characterized in that the first nozzle hole penetrates the first nozzle layer and communicates with the opening.
- the first nozzle hole is for discharging the liquid material supplied to the second nozzle hole, and the opening communicating with the first nozzle hole is for controlling the discharge direction and discharge amount of the liquid material. This is a portion that contributes to the ejection characteristics that greatly contributes to control.
- the liquid substance includes not only a liquid but also a substance having such a viscosity as to be able to be discharged from the first nozzle hole.
- the discharge characteristic contributing portion as the opening is formed in the discharge layer having higher etching resistance than the first nozzle layer.
- the ejection layer has high resistance to etching, so that the risk of deformation of the opening of the ejection layer is reduced. can do.
- the opening of the ejection layer formed in advance is filled with the constituent material of the first nozzle layer, and then the first nozzle layer is etched to form the first nozzle hole, and the opening is opened. Even if it is a part that contributes to the ejection characteristics, the etching resistance of the ejection layer is higher than that of the first nozzle layer, so that the etching of the first nozzle layer is surely stopped when the ejection layer is exposed. . That is, the discharge characteristic contributing portion has the same shape as the opening formed in advance.
- the formation accuracy of the above-described discharge characteristic contributing portion is greatly improved as compared with the case where the above-described discharge characteristic contributing portion of the first nozzle hole is directly formed in the first nozzle layer without providing the discharge layer in the first nozzle layer. Can be improved.
- the discharge layer is formed in the first nozzle layer.
- the thickness of the discharge layer is smaller than the thickness of the first nozzle layer.
- a main component of the ejection layer is an inorganic material.
- the ejection layer is made of an inorganic material, the above-described ejection. Even when, for example, a liquid-repellent film is formed on the ejection layer, the shape of the opening formed in the ejection layer is reduced Can be maintained.
- the outer shape of the discharge layer is defined by the boundary between the discharge layer and the first nozzle layer. It should be larger than the outer shape of the first nozzle hole on the surface.
- the ejection layer functions as a stop layer in etching the first nozzle layer. That is, when the first nozzle layer is etched from the second nozzle layer side to form the first nozzle hole, the etching automatically stops, as it were, in the discharge layer, and the first nozzle hole is formed. Is done.
- the discharge layer is locally formed around the opening.
- the contact area between the ejection layer and the first nozzle layer can be reduced.
- the joining accuracy can be improved, and the structural reliability of the nozzle plate itself can be increased.
- the generation of the stress as described above can be suppressed, the rigidity required for the first and second nozzle layers is reduced, and the layer thickness of the first and second nozzle layers is reduced. be able to. That is, the amount of etching accompanying the etching of the first nozzle hole and the second nozzle hole is reduced, and the formation error can be reduced. Thereby, it is possible to provide the first and second nozzle holes with high forming accuracy.
- the thicknesses of the first and second nozzle layers can be reduced as described above, the first and second nozzle holes can be formed small. As a result, the degree of integration of the first nozzle holes can be increased, and the resolution of drawing can be improved.
- a shielding layer having higher resistance to etching than the first nozzle layer is locally interposed between the first nozzle layer and the second nozzle layer, and the first nozzle hole is provided. Preferably penetrates the shielding layer and communicates with the second nozzle hole.
- the shielding layer is formed by etching the first nozzle layer.
- the mask When forming one nozzle hole, the mask defines the shape of the opening of the first nozzle hole.
- the shielding layer is provided locally, the area of the contact portion between the first nozzle layer and the shielding layer or between the second nozzle layer and the shielding layer can be reduced. 2
- the generation of stress due to the difference in the coefficient of linear expansion between the nozzle layer and the shielding layer can be greatly suppressed, Warpage can be prevented from occurring. Therefore, when joining the nozzle plate to, for example, an ink jet head, the joining accuracy can be improved, and the structural reliability of the nozzle plate itself can be increased.
- the rigidity required for the second nozzle layer is reduced, and the thickness of the first and second nozzle layers can be reduced. That is, the amount of etching accompanying the etching of the first nozzle hole and the second nozzle hole is reduced, and the formation error can be reduced. Thereby, it is possible to provide the first and second nozzle holes with high forming accuracy.
- the thicknesses of the first and second nozzle layers can be reduced as described above, the first and second nozzle holes can be formed small. As a result, the degree of integration of the first nozzle holes can be increased, and the resolution of drawing can be improved.
- the shielding layer has higher resistance to etching than the second nozzle layer, and the outer shape of the shielding layer is a communicating portion between the first nozzle hole and the second nozzle hole. It is preferably larger than the outer shape of the second nozzle hole in the above.
- the etching resistance of the shielding layer is made higher than that of the second nozzle layer, and the outer shape of the shielding layer is made larger than the outer shape of the second nozzle hole in the communicating portion between the first and second nozzle holes.
- the shielding layer functions as a stopper when etching the second nozzle hole, and the etching of the second nozzle hole can be reliably stopped by the shielding layer.
- the thickness of the first nozzle layer is reduced because the second nozzle hole does not penetrate the shielding layer. Is kept constant.
- the end point of the second nozzle hole processing can be set accurately on the surface of the shielding layer by the shielding layer, so that the first nozzle layer is over-etched when the second nozzle hole is processed.
- the length of the first nozzle hole can be controlled by the thickness of the first nozzle layer without being damaged. This stabilizes the flow path resistance, stabilizes the ejection stability of droplets, and improves the landing accuracy and resolution.
- the first nozzle layer has higher resistance to etching than the second nozzle layer.
- the first nozzle layer itself can function as a stopper when etching the second nozzle hole, and the etching of the second nozzle hole can be stopped by the first nozzle layer.
- the etching of the second nozzle hole can be stopped by the first nozzle layer without providing the shielding layer, the above-described stress between the first and second nozzle layers and the shielding layer is generated. Therefore, it is possible to more effectively prevent the nozzle plate from warping.
- the first nozzle hole which is a penetrating portion of the first nozzle layer, has a tapered shape in which a communicating portion with the opening is narrowed.
- the second nozzle hole has a tapered shape in which a communicating portion with the first nozzle hole is narrowed. According to the above configuration, since the second nozzle hole has a tapered shape, turbulence does not easily occur in the supplied liquid material in the second nozzle hole, and the ejection stability of droplets can be improved. it can.
- the nozzle plate of the present invention it is preferable that at least a liquid-repellent film is formed on the surface of the discharge layer on the liquid substance discharge side.
- At least the liquid repellent film is formed on the surface of the discharge layer on the liquid material discharge side, so that the meniscus shape of the liquid material formed in the opening is stable, and the liquid The ejection direction of the substance is stabilized. That is, the landing accuracy is improved and the drawing resolution is improved.
- a nozzle plate including a first nozzle layer having a first nozzle hole for discharging a liquid material, and a supply of the liquid material while communicating with the first nozzle hole. It has a second nozzle hole.
- a reinforcing plate that is fixed to the first nozzle layer, and has higher resistance to etching than the first nozzle layer, and at least around the communicating portion between the first nozzle hole and the second nozzle hole.
- a discharge layer having an opening, having a higher resistance to etching than the first nozzle layer, and formed so as to be in contact with the surface of the first nozzle layer on the liquid material discharge side.
- the first nozzle hole is characterized in that it penetrates the first nozzle layer and communicates with the opening.
- the discharge layer that contributes to the discharge characteristics as the opening is formed in the discharge layer having higher etching resistance than the first nozzle layer.
- the first nozzle layer is etched to form the first nozzle hole.
- the ejection layer has high resistance to etching, the risk of deformation of the opening of the ejection layer can be reduced.
- the etching resistance of the discharge layer is higher than that of the first nozzle layer, so that the etching of the first nozzle layer is surely stopped when the discharge layer is exposed.
- the discharge characteristic contributing portion has the same shape as the opening formed in advance.
- the formation accuracy of the discharge characteristic contributing portion is improved. It can be dramatically improved.
- the above-mentioned shielding layer serves as a mask for defining the shape of the opening of the first nozzle hole when the first nozzle hole is etched, so that the first nozzle hole can be formed with high accuracy.
- the shielding layer can be processed into a required minimum required shape without being affected by the shape of the second nozzle hole formed in the reinforcing plate. Thereby, the area of the contact portion between the first nozzle layer and the shielding layer can be reduced.
- the above-described reinforcing plate fixed to the first nozzle layer can be formed in a separate process, the degree of freedom in selecting a material to be used for the reinforcing plate is greatly improved. As a result, a highly rigid reinforcing plate can be used. It is possible to prevent the warp plate from warping.
- the generation of stress due to the difference in linear expansion coefficient between the first nozzle layer, the reinforcing plate, and the shielding layer can be significantly suppressed, and large warpage of the nozzle plate can be prevented.
- the layer thickness of the first nozzle layer can be reduced. That is, by forming the first nozzle holes in the first nozzle layer having a small layer thickness, the formation accuracy of the first nozzle holes can be further improved.
- the discharge layer is A 1, P t, A u, therefore consists at least of the A 1 2 0 3, A 1 N in material that one main component, It is preferable that the first nozzle layer is made of a silicon compound and the second nozzle layer is made of an organic resin.
- the material forming the discharge layer is formed by etching the silicon compound forming the first nozzle layer (for example, dry etching using a plasma containing fluorine) or forming the second nozzle layer.
- etching the silicon compound forming the first nozzle layer for example, dry etching using a plasma containing fluorine
- High resistance to etching of constituent organic resins eg, dry etching using oxygen-containing plasma.
- the ejection layer is not damaged during the processing of the first and second nozzle holes. That is, it is possible to configure a nozzle plate having an opening processed with extremely high processing accuracy without deforming the opening in the nozzle (first and second nozzle holes) forming process. This improves the impact accuracy and the drawing resolution.
- the silicon compound forming the first nozzle layer is etched by etching the organic resin forming the second nozzle layer (for example, using a plasma containing oxygen). Because of the high etching resistance of the first nozzle layer, the first nozzle layer is not significantly damaged by overetching when the second nozzle hole is drilled.
- the discharge layer is made of a silicon compound
- the first nozzle layer is made of a metal material containing A 1 as a main component
- the second nozzle layer is made of an organic resin. It is preferred to be composed of
- the material constituting the ejection layer is etching of a metal material mainly composed of A 1 constituting the first nozzle layer (for example, dry etching using plasma containing chlorine), or It has high etching resistance to etching of the organic resin constituting the second nozzle layer (for example, dry etching using plasma containing oxygen).
- the opening is not damaged during the processing of the first and second nozzle holes. That is, it is possible to configure a nozzle plate having an opening machined with extremely high machining accuracy without deforming the opening in the process of forming the nozzle (first and second nozzle holes). Thereby, the landing accuracy is improved, and the drawing resolution is improved.
- the metal material mainly composed of A 1 constituting the first nozzle layer is
- the first nozzle layer is formed of an organic resin
- the discharge layer is formed of Ti, Al, Au, Pt, Ta, W, Nb, Sio. 2, a 1 2_Rei 3, S i 3 N 4, at least is selected from a 1 N to be mainly one preferred material.
- the first nozzle layer can be easily processed by dry etching using plasma using oxygen.
- the ejection layer has high etching resistance to dry etching by the plasma using oxygen, and is hardly etched. Thereby, an opening with higher forming accuracy can be provided.
- the same material as that of the ejection layer can be used for the shielding layer.
- the shielding layer when the first nozzle layer is etched to form the first nozzle hole, the shielding layer can be used as a mask for defining the shape of the opening of the first nozzle hole. The processing accuracy of the first nozzle hole can be improved as compared with the patterning by the method.
- the shielding layer has an etching resistance to dry etching by plasma using oxygen when processing the second nozzle hole. Therefore, the processing of the second nozzle hole can be accurately stopped at the shielding layer.
- the first nozzle layer is formed by at least the material of one main component of the S i, S i 0 2, S i 3 N 4, the discharge layer Is formed by a material mainly composed of at least one of Al, Ni, Fe, Co, Cu, Au, Pt, A1 oxide, and A1 nitride. Is desirable.
- the first nozzle layer can be easily processed by dry etching using plasma using fluorine.
- the ejection layer has a high etching resistance to the dry etching by the plasma using fluorine, and is hardly etched. Thereby, it is possible to provide an opening with higher forming accuracy.
- the same material as that of the ejection layer can be used for the shielding layer.
- the shielding layer can be used as a mask for defining the shape of the opening of the first nozzle hole. Processing accuracy of the first nozzle hole can be improved compared to patterning.
- the shielding layer has an etching resistance to dry etching by plasma using fluorine for processing the second nozzle hole. Since it is high, the processing of the second nozzle hole can be accurately stopped at the shielding layer.
- the shielding layer has high etching resistance to dry etching by plasma using oxygen for processing the second nozzle hole. Can be accurately stopped at the shielding layer. This stabilizes the length of the first nozzle hole, stabilizes the flow path resistance, and improves the ejection stability. Wear this Improved bullet accuracy and high-resolution drawing.
- either the organic resin or Si or the Si compound can be used for the second nozzle layer, and the range of material selection is widened, and the manufacture of the nozzle plate becomes easy.
- the method for manufacturing a nozzle plate according to the present invention includes: a first nozzle hole having a first opening and a first nozzle hole for discharging a liquid substance; A method for manufacturing a nozzle plate having a first nozzle layer having the first nozzle hole, wherein a discharge layer having the first opening and having higher resistance to etching than the first nozzle layer is formed.
- the first opening is a discharge characteristic contributing portion that greatly contributes to control of the discharge direction and discharge amount of the liquid substance.
- the above-mentioned liquid substance includes not only a liquid but also a substance having a viscosity such that it can be discharged from the first nozzle hole.
- the first nozzle layer is etched in the first removal step of removing the first nozzle layer in the first opening. The etching is surely stopped when the discharge layer is exposed.
- the above-mentioned discharge characteristic contributing portion is the same as the previously formed first opening. Shape.
- the formation accuracy of the above-described discharge characteristic contributing portion is greatly improved as compared with the case where the above-described discharge characteristic contributing portion of the first nozzle hole is directly formed in the first nozzle layer without providing the discharge layer in the first nozzle layer. Can be improved.
- the second nozzle layer having lower etching resistance than the first nozzle layer is replaced with the first opening and the first nozzle hole.
- a second nozzle hole forming step is performed after the first removing step.
- the first nozzle layer functions as a stopper when etching the second nozzle hole, and without forming an etching stopper such as a shielding layer, the first nozzle layer is used for forming the second nozzle hole.
- the etching of the nozzle layer can be stopped at the first nozzle layer.
- the rigidity required for the first nozzle layer is reduced, and the layer thickness of the first nozzle layer can be reduced. Wear. In other words, the amount of etching accompanying the etching of the first nozzle hole is reduced, and the formation error can be reduced. Thereby, the first nozzle hole can be formed with high accuracy. .
- the etching is performed from two directions facing each other as in the conventional method. In comparison with the above, the alignment of the first nozzle hole and the second nozzle hole is easier.
- the method further includes the step of forming a first opening between the first nozzle layer forming step and the first nozzle hole forming step.
- a shielding layer forming step of locally forming a shielding layer having higher resistance to etching on the formed first nozzle layer corresponding to the first opening, and filling the second opening.
- a second nozzle layer is formed so as to cover the first nozzle layer, and then the second nozzle layer is etched, so that the second nozzle pierces the second nozzle layer and reaches the shielding layer. And forming a second nozzle hole for forming a hole.
- the shielding layer functions as a stopper when etching the second nozzle hole, and the etching of the second nozzle hole can be reliably stopped by the shielding layer.
- the thickness of the first nozzle layer is kept constant because the second nozzle hole does not penetrate the shielding layer.
- the end point of the processing of the second nozzle hole can be accurately set on the surface of the shielding layer by the shielding layer, so that the first nozzle layer is damaged by overetching during the processing of the second nozzle hole. Therefore, the length of the first nozzle hole can be controlled by the thickness of the first nozzle layer. This stabilizes the flow path resistance, stabilizes the ejection stability of liquid material, and achieves landing accuracy. And the resolution improves. '
- the shielding layer is formed locally, the area of the contact portion between the first nozzle layer and the shielding layer can be reduced. Thereby, it is possible to suppress the generation of stress due to the difference in linear expansion coefficient between the first nozzle layer and the shielding layer, and to prevent large warpage of the nozzle plate.
- the shielding layer is etched from one direction, the etching is performed from two directions facing each other as in the conventional method. In comparison with the above, the alignment of the first nozzle hole and the second nozzle hole is easier.
- a second removing step of removing the second nozzle layer in the first nozzle hole portion following the second nozzle hole forming step It is preferable to perform a third removing step of removing the second nozzle layer in the opening.
- the first nozzle hole forming step and the first removing step are performed successively to the second nozzle hole forming step.
- the first nozzle hole can be etched using the etching apparatus and the etching solution or the etching gas in the processing step of the second nozzle hole as they are.
- a step of forming a liquid-repellent film having lower resistance to etching than the discharge layer on the surface of the discharge layer From the first nozzle hole to remove the liquid-repellent film in the first nozzle hole.
- the liquid-repellent film that has reached the inside (inner wall) of the first opening from the surface of the ejection layer is removed by etching from the opposite side of the first opening.
- the ejection layer has high etching resistance to the etching of the lyophobic film
- the first opening is removed in the etching process for removing the lyophobic film that has entered the first opening. No deformation.
- the margin for performing the etching to remove the wrapped liquid-repellent film is increased, and the wrapped liquid-repellent film can be almost completely removed by sufficient etching.
- FIG. 1A is a perspective view showing a nozzle plate according to the first embodiment of the present invention
- FIG. 1B is an explanatory view showing a cross section taken along line AA ′ of FIG. 1A. is there.
- FIG. 2 is an explanatory diagram showing a modified example of the nozzle plate by a cross-sectional configuration. .
- 3 (a) to 3 (g) are explanatory views showing a method of manufacturing the nozzle plate according to the first embodiment of the present invention in a sectional configuration.
- FIG. 5A is a perspective view showing a nozzle plate according to the second embodiment of the present invention
- FIG. 5B is an explanatory view showing a cross section taken along the line BB ′ in FIG. 5A. is there.
- 6 (a) to 6 (g) are explanatory views showing a method of manufacturing a nozzle plate according to the second embodiment of the present invention by a cross-sectional configuration.
- FIG. 7 is a perspective view for explaining the configuration of the force absorbing plate according to the second embodiment.
- 8 (a) to 8 (c) are explanatory diagrams showing another method of manufacturing the nozzle plate according to the first embodiment of the present invention in a sectional configuration.
- FIG. 9 is an explanatory view showing another manufacturing method of the nozzle plate according to the first embodiment of the present invention by a cross-sectional configuration.
- FIGS. 10 (a) and 10 (b) are schematic diagrams illustrating a method of joining the nozzle layer and the reinforcing plate.
- FIG. 11 (a) is a perspective view showing a nozzle plate according to the third embodiment of the present invention
- FIG. 11 (b) is a cross-sectional view taken along line AA ′ of FIG. 11 (a).
- FIG. 12 is an explanatory diagram showing a modified example of the nozzle plate by a cross-sectional configuration.
- FIGS. 13 (a) to 13 (g) are explanatory views showing a method of manufacturing a nozzle plate according to the third embodiment of the present invention by a cross-sectional configuration.
- FIG. 14 is an explanatory view showing a modified example of the above-described method for manufacturing a nozzle plate by a cross-sectional configuration.
- FIG. 15 (a) is a perspective view showing a nozzle plate according to a fourth embodiment of the present invention
- FIG. 15 (b) is a cross-sectional view taken along the line BB ′ in FIG. 15 (a).
- FIGS. 16 (a) to 16 (g) are explanatory views showing a method of manufacturing a nozzle plate according to the fourth embodiment of the present invention by a cross-sectional configuration.
- FIGS. 17 (a) to 17 (c) are illustrations for explaining the step of removing the liquid-repellent film by etching.
- FIG. 18 is an explanatory diagram showing a modified example of the nozzle plate according to the third embodiment by a cross-sectional configuration.
- FIG. 19 (a) is a perspective view showing a conventional nozzle plate
- FIG. 19 (b) is an explanatory view showing a cross section taken along the line CC ′ in FIG. 19 (a).
- Fig. 1 (a) shows the nozzle plug of the present invention used in a microdot forming apparatus.
- FIG. 1B is a perspective view of a part of the rate, and FIG. 1B is a cross-sectional view taken along the line AA ′ of FIG. 1A.
- One or more liquid (liquid substance) discharge ports 9 are formed in the nozzle plate, and two liquid discharge ports 9 are shown in FIG. 1 (a).
- the nozzle plate 8 includes a first nozzle layer 1, a second nozzle layer 2, a stopper layer 3 (shielding layer), a liquid-repellent film 4, and a nozzle. It has a hole 1 1.
- a liquid-repellent film 4 is formed on the liquid ejection surface side of the first nozzle shoulder 1, and a second nozzle layer 2 is formed on the opposite side.
- the stopper layer 3 is located at the interface between the first nozzle layer 1 and the second nozzle layer 2 in the second nozzle layer 2, and is in contact with the first nozzle layer 1 and has the above-mentioned liquid discharge port 9. It is formed locally at the position where the first nozzle hole 11a with the opening as the opening is formed. That is, the first nozzle hole 11a penetrates the liquid-repellent film 4, the first nozzle layer 1, and penetrates the center of the locally formed stop layer 3. .
- the second nozzle hole 11b forms a nozzle hole 11 together with the first nozzle hole 11a, and expands from the communicating portion with the cylindrical first nozzle hole 11a. It has a tapered shape (a truncated conical shape) that opens and passes through the second nozzle layer 2 and opens at the surface 2 b on the opposite side of the liquid-repellent film 4.
- the upper base 11y of the second nozzle hole lib having a truncated cone shape is an annular shape centered on the first nozzle hole 11a, and the stopper layer 3 forms the upper base 11y.
- the diameter of the communicating part 11 x (substantially circle) between the first nozzle hole 11 a and the second nozzle hole 11 b is the outer diameter of the upper bottom 11 y of the second nozzle hole lib (the above communicating part The outer shape of the second nozzle hole 11b at 11X).
- the substantially circular opening of the first nozzle hole 11a is the liquid discharge port 9.
- the substantially circular opening of 1b is the liquid supply port 12.
- Stopper layer 3 is made of a metal material mainly composed of Ti.
- the diameter of the opening (liquid discharge port 9) of the first nozzle hole 11a is about 3 ⁇ m.
- the outer diameter of the upper bottom 11y of the second nozzle hole 11b is 1 O ⁇ m, and the diameter of the opening (liquid inlet 12) is 30 ⁇ .
- the liquid-repellent film 4 on the first nozzle layer 1 is formed of a fluoropolymer or a silicon-based polymer film.
- the stopper layer 3 is locally provided at each position where the nozzle holes 11 are formed, the interface layer between the first nozzle layer and the second nozzle layer is conventionally provided. Compared with a configuration in which a stopper layer is formed over the entirety, the generation of stress due to a difference in linear expansion coefficient between the first nozzle layer 1 and the second nozzle layer 2 and the stopper layer 3 is significantly suppressed. This can prevent the nozzle plate 8 from being greatly warped.
- the layer thickness of the first nozzle layer 1 or the second nozzle layer 2 is reduced to the conventional structure (FIG. 19 (a), FIG. 19 (b)).
- Layer 25 force (S100 ⁇ m) can be reduced.
- the first Nozzle layer 1 is 1 ⁇ m N 2nd nozzle layer 2 force 20 ⁇ ).
- the second nozzle hole lib has a tapered shape, turbulence of the liquid hardly occurs inside the second nozzle hole 1lb, and the ejection stability of the droplet can be improved.
- the second nozzle layer 2 can be made thinner as compared with the conventional configuration as described above, even if the second nozzle hole 11 b is formed in a tapered shape, the liquid inlet 12 is formed. The size can be reduced as compared with the conventional configuration. As a result, the degree of integration of the nozzle holes 11 can be increased.
- the material used for the first nozzle layer 1 is not limited to polyimide. It may be a polymer organic material other than polyimide, a Si compound material such as Sio 2 or Si 3 N 4 , or Si.
- the material used for the stopper layer 3 is not limited to a metal material containing Ti as a main component.
- etching gas plasma containing oxygen
- etchant nitric acid, potassium hydroxide aqueous solution, etc.
- Ti, Al, Cu, Au, Pt, Ta, W, Nb, etc. are the main components.
- Metallic material an inorganic oxide material composed mainly of S i ⁇ 2, A 1 2 0 3 or the like, an inorganic nitride material mainly composed of S i 3 N 4 and the like.
- the material used for the second nozzle layer 2 is not limited to polyimide.
- the material used for the second nozzle layer 2 may be a polymer organic material other than polyimide, S i Rei_2, have S i 3 N 4 and Rere ivy S i compound material, or even S i derconnection .
- the shape of the stopper layer 3 only needs to be a shape localized at the position where the nozzle hole 11 is formed, and is not limited to a substantially square shape.
- it may be circular.
- a circular shape is preferable because the shape is the most isotropic and the stress is reduced isotropically.
- one nozzle hole 11 is formed for one stop layer 3, but the present invention is not limited to this.
- a plurality of nozzle holes 11 may be formed in one stopper layer 3 if the stress can be suppressed as compared with the conventional configuration.
- the diameter of the communicating portion 11X between the first nozzle hole 11a and the second nozzle hole lib is above the second nozzle hole 11b.
- the diameter is smaller than, but not limited to, the diameter of the bottom 1 1 y.
- the diameter of the communication portion 11X may be the same as the diameter of the contact portion 11y.
- the second nozzle hole 11b has a truncated conical shape (tapered shape) in which the communicating portion 11X with the first nozzle hole 11a is narrowed, but the present invention is not limited to this. Absent. For example, as shown in FIG.
- the side wall of the second nozzle hole 11 b may be formed in a so-called straight shape (cylindrical shape) perpendicular to the stopper layer 3.
- the liquid inlet 12 of the second nozzle hole lib can be made smaller, and the degree of integration of the nozzles can be further increased.
- the second nozzle hole lib is inserted into the bulged text as shown in Fig. 8 (c). It may have a tapered shape.
- the nozzle plate is configured to include the first nozzle layer 1, the stopper layer 3, and the second nozzle layer 2, whereby
- the thickness of the nozzle plate 8 can be kept to a necessary minimum, the liquid inlet 12 of the nozzle plate 8 can be made smaller, thereby accumulating the nozzle holes 11. The degree can be improved. Along with this, it becomes possible to draw high-resolution images.
- the nozzle plate 8 is reinforced by the second nozzle layer 2 having a large film thickness, the rigidity of the entire nozzle plate 8 is high, and the nozzle plate 8 is less likely to be warped, and is easily handled.
- the stopper layer 3 is set to be thinner than the first nozzle layer 1, when the stopper layer 3 is etched using photolithography technology.
- the first nozzle layer 1 is not directly processed using the photolithography technique without using the stop layer 3, but is additionally processed.
- the first nozzle layer 1 can be processed by a processing method having a high etching selectivity using the stopper layer 3 as a mask with a high shape accuracy of the nozzle layer, so that the size of the discharged droplet can be controlled.
- One nozzle hole 1 la can be formed with high precision.
- FIGS. 3 (a) to 3 (g) are diagrams illustrating the steps of manufacturing the nozzle plate according to the present embodiment.
- FIG. 4 shows a modification of the step shown in FIG. 3 (c).
- a sacrificial layer 5 is formed on a substrate 6 made of Si, glass, or the like for temporary holding of an arbitrary thickness by wet plating using Ni (see FIG. 3 (a)).
- the thickness of the sacrificial layer 5 is 10 m.
- a coating type polyimide resin having a thickness of 1 ⁇ m is formed on the sacrificial layer 5 to form the first nozzle layer 1 (first step, FIG. 3 (b)).
- the coating type polyimide resin was applied on the sacrificial layer 5 by spin coating, and was baked at 350 ° C. for 2 hours.
- a stopper layer 3 is formed on the first nozzle layer 1 ⁇ Second step, FIG. 3 (c)) 0
- a sputtering method is used.
- a stopper layer 3 having a thickness of 0.5 ⁇ m (500 A) is formed.
- the stopper layer 3 is formed into a resist having a predetermined shape by photolithography.
- After forming the pattern it is processed into a substantially square shape with a side length of 20 m by dry etching using Ar ions such as ion milling. At the time of this dry etching, one opening 11a having a diameter of 3 ⁇ m is formed inside the above substantially square.
- the opening 11 ai is a part of the first nozzle hole 11 a in a pattern for forming a first nozzle hole 11 a described later. '
- a second nozzle layer 2 is formed on the first nozzle layer 1 and the stopper layer 3 with a thickness of 20 ⁇ (third step, FIG. 3 (d)).
- the second nozzle layer 2 was formed by applying a coating type polyimide resin by a spin coating method in the same manner as the first nozzle layer 1, and baked at 350 ° C. for 2 hours to have a thickness of 20 m.
- the opening 11a of the stopper layer 3 is also filled with polyimide resin.
- a resist pattern 7 is formed on the second nozzle layer 2 by photolithography, and dry etching is performed using a gas containing oxygen as a main component, so that the second nozzle layer 2 has a tapered shape ( A second nozzle hole lib with a truncated cone shape was formed (fourth process, Fig. 3 (e)).
- the dry etching can be stopped at the stopper layer 3. That is, in the portion where the stopper layer 3 is exposed except the opening 11 ai of the stopper layer 3, the drying does not further proceed.
- the etch rate of the resist pattern 7 is made substantially equal to the etch rate of the polyimide resin of the second nozzle layer 2, and the resist pattern pattern 7 is set to 1
- a method was used in which the resist pattern 7 was formed into a taper shape by performing a post beta at 50 ° C. for 60 minutes, and this shape was transferred to the second nozzle layer 2 by etching. That is, as shown in FIG. 9, a resist pattern 7 having an etch rate substantially equal to that of the polyimide resin (second nozzle layer 2) and having a tapered cross section is formed, and the same speed as the etching of the polyimide resin is formed.
- Etch resist pattern 7 with, and widen the edge of resist pattern 7.
- the polyimide resin (the second nozzle layer 2) is also etched, and the wall surface of the etching (the wall surface of the second nozzle hole lib) has a tapered wall surface formed by the initial resist (the resist wall). It has the same shape as pattern 7). Since the resist pattern 7 and the etch rate of the second nozzle layer 2 are substantially equal, it is desirable that the resist pattern 7 be formed thicker than the second nozzle layer 2.
- etching for processing the first nozzle hole 11a is performed on the first nozzle layer 1 (fifth step, see FIG. 3 (e)).
- the first nozzle hole 11a is formed into a shape (substantially circular, having a diameter of 3 / zm) determined by the opening 11a of the stopper layer 3 formed in the previous step.
- the stopper layer 3 is hardly etched by the dry etching mainly containing oxygen in this step, the pattern formed on the stopper layer 3 does not change and the first nozzle hole 11 a As shown in FIG. 3 (e), the first nozzle hole 11a can be formed with high precision.
- the resist pattern 7 is removed by using a resist stripper, and the nozzle plate 8 is immersed in an aqueous solution containing nitric acid and water as a main component and only the sacrificial layer 5 is etched.
- Fig. 3 (f) Ti which forms the polyimide resin and the stopper layer 3 which forms the first nozzle layer 1 and the second nozzle layer 2 is: The etching liquid for the sacrificial layer 5 Since the sacrifice layer 5 is hardly etched, the shape of the sacrifice layer 5 is not changed and the structural reliability is not reduced.
- a liquid-repellent film 4 is formed on the surface of the first nozzle layer 1 (FIG. 3 (g)).
- a fluoropolymer is used for the purpose of considering the ease of application, and this is applied to the surface of the first nozzle layer 1 by a method such as stamping, and a liquid repellent film 4 is formed by a high molecular weight film.
- the lyophobic film that has flowed into the first nozzle hole 11a is dry-etched from the side of the second nozzle hole 11b using a plasma containing oxygen after forming the lyophobic film. It was removed. Thereby, the damage of the nozzle plate 8 can be minimized.
- the stopper layer 3 is used as a mask (shielding layer) and the first nozzle hole 11a is etched.
- the nozzle hole 11a can be formed with high precision.
- the etching is automatically stopped by the stopper layer 3, and the etching depth of the second nozzle hole lib can be defined.
- the first nozzle hole 11a can be formed with higher accuracy.
- the first nozzle layer 1 or the second nozzle layer 2 can be formed thin, the first nozzle layer 1 and the second nozzle layer 1 are etched when the first nozzle hole 11a and the second nozzle hole 11b are etched. The amount of etching of layer 2 can be small, and the formation error is small. Therefore, the nozzle holes 11 can be formed with high accuracy.
- the stopper layer 3 is etched from one direction, so that the stopper layer 3 faces each other as in the conventional method. Compared to the case where etching is performed from two directions, the positioning of the first nozzle hole 11a and the second nozzle hole lib is easier.
- the etching apparatus and the etching solution or the etching gas in the fourth process are used as they are.
- the fifth step of etching can be performed. This simplifies the manufacturing process.
- Ni is used as the sacrificial layer 5
- polyimide resin is used as the first nozzle layer 1 and the second nozzle layer 2
- stopper layer 3 is used as the stopper layer 3.
- T i was used, it is not limited to this combination.
- the sacrificial layer 5 may be made of nitric acid such as Al, Cu, etc., or KOH, depending on the combination of materials used for the first nozzle layer 1, the second nozzle layer 2, and the stopper layer 3.
- a material that is soluble in an aqueous solution or a material that can be etched by oxygen plasma, such as polyimide, can be used.
- a vapor deposition method, a sputtering method, a coating method, or the like can be used depending on the material other than the plating.
- the stopper layer 3 has 44
- a material having high resistance to the etching of the sacrifice layer 5 and the etching of the first nozzle hole 11a and the second nozzle hole 11b can be used.
- Table 1 shows the materials used (sacrifice layer, 1st nozzle layer, stopper layer, 2nd nozzle layer) and processing methods (stopper layer, 1st nozzle hole, 2nd nozzle hole, sacrifice layer). Preferred combinations are shown below.
- the first nozzle layer 1, the second nozzle layer 2 is not limited to good Una polymeric organic material Porii Mi de resins, non-machine silicon compounds such as S i or S io 2 You can choose.
- T i is fried resistance low that used in this embodiment for this etching, It is desirable to use a material having etching resistance such as Au as the stop layer 3.
- the stopper layer 3 also has the combination shown in Table 1 in addition to Ti. Therefore, the materials listed in the table can be used. Note that Ti, which is the material of the stopper layer 3, can be etched even by plasma using a mixed gas of CF 4 and oxygen. However, the first nozzle layer 1 (polyimide) formed below T i is etched faster than T i by the plasma of the gas, and is greatly damaged. Therefore, in the present embodiment, the dry etching method using Ar ions is employed for patterning the stopper layer 3. As described above, the dry etching method using Ar ions, which has a small difference between the etch rate of the stopper layer 3 and the etch rate of the first nozzle layer 1, minimizes damage to the first nozzle layer 1. The puttering of the stopper layer 3 can be performed while keeping the limit.
- the stopper layer 3 is formed in a square shape, but is not limited to this.
- any shape and size may be used so that the second nozzle hole 11 b reaches the stopper layer 3 and the progress of the etching stops.
- the shape and size (required minimum size) be such that warpage of the nozzle plate 8 due to the stress of the stopper layer 3 can be further reduced.
- step 2 the shape of the stopper layer 3 and the opening 11 a ⁇ serving as the pattern for forming the first nozzle hole 11 a were simultaneously formed, but the two etching steps were performed. Can also be created.
- step 2 as shown in FIG. 4, the first nozzle hole 11a may be machined at the time of forming the nozzle hole processing pattern (the stove layer 3 having the opening 11ai). .
- step 3 when forming the second nozzle layer 2 (step 3), the opening 11 a a previously processed is buried, so in step 5, the corresponding portion is processed again.
- step 4 the mask material and the etching conditions when processing the second nozzle hole 11b are optimized, and the side wall bulges (curved surface) as shown in FIGS. 8 (a) to 8 (c). 2) Nozzle hole 1 1.b with a hole can also be formed.
- the liquid-repellent film 4 is not limited to a fluoropolymer, but may be a silicon-based polymer film, DLC (diamond-like carbon), or the like.
- the first nozzle hole 11a is processed by a highly selective processing means using the opening 11ai of the stopper layer 3 as a mask.
- the change in the processing shape of the first nozzle hole 11a due to a small change, a variation in the thickness of the first nozzle layer 1 due to an over-etch, etc. is small, and the processing with high shape accuracy and high reproducibility can be performed.
- the second nozzle hole 11b is highly selective with respect to the stopper layer 3. Therefore, the processing of the second nozzle hole lib can be stopped at the stopper layer 3 with good reproducibility. For this reason, the influence of the processing accuracy of the second nozzle hole 11b on the processing accuracy of the first nozzle hole 11a is negligible, the shape accuracy of the liquid discharge port 9 is high, and the nozzle plate with a thick layer is thick. 8 can be manufactured stably.
- FIG. 5 (a) is a perspective view of a part of the nozzle plate of the present invention used in the microdot forming apparatus
- FIG. 5 (b) is a view taken along the line BB ′ of FIG. 5 (a). It is sectional drawing.
- One or more liquid (liquid substance) discharge ports 90 are formed in the nozzle plate, and two liquid discharge ports 90 are shown in FIG. 5 (a).
- the nozzle plate 80 has a nozzle layer 10, a stopper layer 30 (shielding layer), a reinforcing plate 20, and a nozzle hole 110.
- a liquid-repellent film 40 is formed on the liquid discharge surface side of the nozzle layer 10, and a force-absorbing plate 20 is bonded to the opposite side.
- the stopper layer 30 is located at the interface between the nozzle layer 10 and the reinforcing plate 20 and is locally located at the position where the first nozzle hole 110a having the liquid discharge port 90 as an opening is formed. Is formed. That is, the first nozzle hole 110 a penetrates the liquid-repellent film 40 and the nozzle layer 10, and penetrates the central part of the locally formed stopper layer 30. .
- the rectangular parallelepiped second nozzle hole 110b penetrates the reinforcing plate 20, and the nozzle hole 110 is formed together with the cylindrical first nozzle hole 110a. Constitute.
- the stopper layer 30 is located inside the second nozzle hole 110b (within the opening range) at the interface between the nozzle layer 10 and the reinforcing plate 20. Therefore, the bottom surface (substantially square shape) corresponding to the opening of the second nozzle hole 110b is the liquid supply port 120, and the bottom surface 110b corresponding to the back wall of the second nozzle hole 110b.
- the contact surface (substantially square with holes) between the nozzle layer 10 and the stopper layer 30 is located inside y (substantially square). Note that a communication portion 11 Ox (substantially circular) between the first nozzle hole 110a and the second nozzle hole 110b is located inside (in the center of) the contact surface.
- the nozzle layer 10 is formed of a polyimide film having a thickness of 1 ⁇ m.
- the stopper layer 30 is made of a metal material mainly composed of Ti, and is formed in a substantially square shape with 1 ⁇ ⁇ per side in order to reduce warpage due to stress of the entire nozzle plate 80. .
- the diameter of the opening (liquid discharge port 90) of the first nozzle hole 110a is 3 ⁇ m.
- the liquid-repellent film 40 is formed from a polymer material having a fluoropolymer.
- the reinforcing plate 20 is made of Si having a thickness of ⁇ , and the opening (liquid supply port 120) of the above-described substantially square second nozzle hole 110b has a side of 30 ⁇ m. Has become. '
- the stopper layer 30 only needs to be a shielding layer when etching the first nozzle hole 110a described later, so that the stopper layer 30 is provided inside the second nozzle hole 110b. It is formed in a small shape to be located.
- the contact surface between the nozzle layer 10 and the stopper layer 30 is minimized.
- the contact surface between the reinforcing plate 20 and the stopper layer 30 can be eliminated, the linear expansion between the nozzle layer 10 and the reinforcing plate 20 and the stopper layer 30 can be eliminated.
- the generation of stress due to the difference in the rates can be significantly suppressed as compared with the conventional and the configurations of the first embodiment. As a result, it is possible to prevent the nozzle plate 80 from being largely warped. .
- the material used for the nozzle layer 10 is not limited to polyimide. It may be a high molecular organic material other than polyimide, a Si compound material such as sio 2 , S i 3N4, or S i.
- the material used for the stopper layer 30 is not limited to a metal material containing Ti as a main component.
- a material having high resistance to the etching that is, oxygen-containing plasma, fluorine-containing plasma, nitric acid, and water oxidation Any material having high resistance to a potassium aqueous solution or the like may be used.
- Examples include a metal material, an inorganic oxide material, and an inorganic nitride material.
- the material used for the reinforcing plate 20 is not limited to S i. S i 0 2, such S i 3 N 4 may be a S i compound material.
- the shape of the stopper layer 30 may be any shape that is localized at the position where the nozzle hole 110 is formed, and is not limited to a substantially square shape. For example, it may be circular. A circular shape is preferable because the shape is the most isotropic and the stress is also reduced isotropically. Further, as shown in FIG. 5A, in this embodiment, one nozzle hole 110 is formed for one stop layer 30, but the present invention is not limited to this. If the stress can be reduced compared to the conventional configuration For example, a plurality of nozzle holes 110 may be formed in one stop layer 30. Further, the second nozzle hole 110b provided in the reinforcing plate 20 is not limited to a rectangular parallelepiped shape (a cross section is a square shape). It may be cylindrical or tapered (frusto-conical).
- the nozzle plate As described above, by forming the nozzle plate with the nozzle layer 10, the stopper layer 30, and the reinforcing plate 20,
- the thickness of the nozzle plate 80 can be kept to the minimum necessary, the liquid inlet 120 of the nozzle plate 80 can be made small, and as a result, the nozzle The degree of integration of the holes 110 can be improved. Along with this, it becomes possible to draw high-resolution images.
- stopper layer 30 can be processed into a required minimum shape without being affected by the shape of the second nozzle hole 110 b formed in the reinforcing plate 20, The warpage of the nozzle plate 80 due to the difference in the coefficient of linear expansion can be further reduced.
- the stopper layer 30 is set thinner than the nozzle layer 10, the stopper layer 30 is etched using photolithography technology.
- the shape accuracy of the processing is high and the nozzle layer 10 can be processed by the processing method having high selectivity using the stopper layer 30 as a mask, the size of the discharged droplet can be controlled.
- One nozzle hole 110a can be formed with high precision.
- FIG. 6 (a) to 6 (g) show a manufacturing process of the nozzle plate according to the present embodiment.
- a method of manufacturing the nozzle plate according to the present embodiment will be described with reference to FIG.
- a sacrificial layer 50 is formed by wet plating using Ni on a substrate 60 made of Si, glass, or the like for temporary holding of an arbitrary thickness (FIG. 6 (a)).
- the thickness of the sacrificial layer 50 is 10 ⁇ m.
- a coating type polyimide resin having a thickness of 1 ⁇ m is formed on the sacrificial layer 50 to form a nozzle layer 10 (FIG. 6 (b)).
- the above-mentioned coating type polyimide resin is applied on the sacrificial layer 50 by spin coating, and is then applied. C was fired for 2 hours.
- a stopper layer 30 (shielding layer) is formed on the nozzle layer 10 (FIG. 6C).
- a stopper layer 30 having a thickness of 500 A is formed by a sputtering method using a material mainly composed of Ti.
- the stopper layer 30 is formed by dry etching with Ar ions such as ion milling and has a side length of about 10 ⁇ m. Process into a square shape. At the time of this dry etching, one opening 110 ai having a diameter of 3 ⁇ is formed inside the above-mentioned substantially square.
- the opening 110 ai is a forming pattern of a first nozzle hole 110 a described later, and forms a part of the first nozzle hole 110 a.
- a resist pattern 70 having a pattern corresponding to the opening llO ai of the stopper layer 30 is formed. That is, the opening is formed so that the opening 110 ai of the stopper layer 30 is located at the opening 70 a of the resist pattern 70.
- the nozzle layer 10 is etched from the opening ll O ai force to form a first nozzle hole 110a. This etching is performed by dry etching using a gas containing oxygen as a main component. ( Figure 6 (d)).
- the first nozzle hole 110a can be formed with an extremely high processing accuracy of 0.1 m, which is close to the photolithography pattern accuracy.
- the thickness of the resist 70 is preferably larger than the thickness of the nozzle layer 10, and in the present embodiment, the thickness of the resist is 2 ⁇ m.
- a reinforcing plate 20 having a rectangular parallelepiped second nozzle hole 11 Ob with a side of 15 ⁇ m is placed so that the stopper layer 30 is arranged in the second nozzle hole 110 b.
- Position and glue see Fig. 6 (e)
- a method of observing the bonding surface of each member (nozzle layer .10 and reinforcing plate 20) with a camera or the like, moving the above members by a predetermined amount from the observation position, and mechanically joining was used.
- FIG. 10 (a) shows the positioning (alignment phase) and FIG. 10 (b) shows the joining (joining phase) in this method.
- the bonding surface of the reinforcing plate 20 was observed by the camera 61 in the reinforcing plate position measuring area 65, and the second nozzle hole 110b was observed. Measure the contour pattern.
- the nozzle layer position measurement area 67 the bonding surface of the nozzle layer 10 is observed by the camera 62, and the contour pattern of the stopper layer 30 is measured.
- an appropriate movement amount of the nozzle layer 10 and the reinforcing plate 20 is calculated from the above measurement results, and the nozzle layer 10 and the reinforcing plate are calculated according to the appropriate moving amount. 20 is moved to the appropriate position in the joint area 66 (alignment phase).
- the joining surface is pressure-bonded up and down without observing the joining surface in real time, and the joining plate 20 and the nozzle layer 10 are joined.
- the reinforcing plate 20 is made of Si, and an epoxy resin having high chemical resistance is used as the adhesive. At the time of bonding, it is desirable to cure at room temperature so that the nozzle plate 80 does not warp due to the difference in linear expansion coefficient between the adhesive and the nozzle layer 10 or the reinforcing plate 20.
- a liquid-repellent film 40 is formed on the surface of the nozzle layer 10 (FIG. 6 (g)).
- a fluoropolymer was used for the purpose of considering the ease of application.
- a plasma containing oxygen was removed by dry etching from the b side. This can minimize damage to the nozzle plate 8.0.
- a method of manufacturing the reinforcing plate 20 will be briefly described with reference to FIG.
- an Si substrate 3 2 having a thickness of 100 ⁇ m in the direction of arrow D was bonded to the surface 33 on which the grooves of the Si substrate 31 having the above grooves were formed using an epoxy-based adhesive. I do.
- it is cut by a dicing device in the direction perpendicular to the groove (the direction of arrow D in the figure).
- the cross section is a substantially square having a side of 15; um
- a thickness of 50 m in the direction of the arrow F is obtained.
- a plurality of reinforcing plates 20 can be cut out.
- the above method is merely an example of a method for manufacturing the reinforcing plate 20.
- the second nozzle hole 110b along the direction of the arrow E in the figure (a substantially square cross section of 15 ⁇ m on a side)
- the reinforcing plate 20 having a plurality of rows in the direction of arrow D in the figure can also be manufactured.
- the staggered second nozzle holes 110b can be formed.
- the stopper layer 30 is formed in the first nozzle hole 110a. Any size may be used as long as it becomes a shielding layer (mask) during tuning. Therefore, stopper layer 30 can be formed in a smaller shape than in the first embodiment. ⁇
- the nozzle plate 80 can be manufactured simply and stably.
- Ni is used for the sacrificial layer 50
- polyimide resin is used for the nozzle layer 10
- Si is used for the reinforcing plate 20
- Ti is used for the stopper layer 30. Not limited.
- the sacrificial layer 50 may be made of nitric acid such as Al, Cu, or the like, depending on the combination of materials used for the nozzle layer 10, the reinforcing plate 20, and the stopper layer 30.
- a material that is soluble in an aqueous KOH solution or a material that can be etched by oxygen plasma, such as polyimide, can be used.
- an evaporation method, a sputtering method, a coating method, or the like can be used depending on the material other than the plating.
- the stopper layer 30 can be made of a material having high resistance to the etching of the sacrificial layer 50 and the etching of the first nozzle hole 110a.
- Table 2 shows the preferred materials (sacrifice layer, nozzle layer, stopper layer, reinforcing plate) and processing methods (stopper layer, first nozzle hole, removal of sacrificial layer). Show a good combination
- nozzle layer 1 0 is not limited to good Una polymeric organic gear cost Porii Mi de resins, and inorganic silicon compounds such as S i or S i 0 2.
- the reinforcing plate 2 it can be used Ceramic or Porii Mi de resin trough ivy material mainly composed of glass or A 1 2_Rei 3 other than S i.
- T i is the material of the scan stopper layer 3 0 may be etched in a plasma using a mixed gas of CF 4 and oxygen.
- the nozzle layer 10 (polyimide) formed below T i is etched faster than T i by the plasma of the above gas, and is greatly damaged. Therefore, in the present embodiment, the dry etching method using Ar ions is employed for patterning the stop layer 30.
- the stopper layer 3 By adopting a dry etching method using Ar ions that has a small difference in etch rate between the nozzle layer 10 and the nozzle layer 10, the stop layer 30 can be patterned while minimizing damage to the nozzle layer 10. .
- the thickness of the nozzle plate 80 can be kept to the minimum necessary, the liquid inlet 120 of the nozzle plate 80 can be made smaller, and as a result, the nozzle hole can be reduced.
- the degree of integration of 110 can be improved. Along with this, it becomes possible to draw high-resolution images.
- the nozzle plate 80 can be manufactured easily and stably.
- the nozzle plate 8 (80) of the above embodiment is characterized in that the thickness of the stopper layer 3 (30) is smaller than that of the first nozzle layer 1 (nozzle layer 10). It can also be.
- the stopper layer 3 (30) is set thinner than the first nozzle layer 1 (nozzle layer 10).
- the first nozzle layer 1 (nozzle layer 10) is directly applied to the photolithography technology without using the stopper layer 3 (30).
- the first nozzle layer 1 or the second nozzle layer 2 is formed of a material selected from a high molecular weight organic material or Si or an inorganic silicon compound, respectively.
- the stopper layer 3 can be characterized by being formed of a material having high resistance to the processing means of the first nozzle layer 1 or the second nozzle layer 2.
- the nozzle plate 8 having the above configuration, since the first nozzle holes 11 a are formed in the first nozzle layer 1 so as to penetrate the stopper layer 3, the shape accuracy of the first nozzle holes 11 a is high. . Also, since the second nozzle hole 1 1b formed in the second nozzle layer 2 does not penetrate the stopper layer 3, the thickness of the first nozzle layer 1 is constant, and the variation in flow path resistance There is no.
- the method of manufacturing the nozzle plate 8 (80) in the above embodiment includes a step of attaching the first nozzle layer 1 (nozzle layer 10) ′ and a step of attaching the first nozzle layer 1 (nozzle layer 10). Forming a stopper layer 3 (30) on the stopper layer 3; forming an opening in the stopper layer 3 (30); and forming the stopper layer 3 (30) on the stopper layer 3 (30). As the mask, the first nozzle hole 1 1a (1 10a) And a step of separating the first nozzle layer 1 (nozzle layer 10) from the supporting substrate.
- the nozzle plate 8 (80) having the above structure, when forming the opening of the stopper layer 3 (30) serving as a mask for the first nozzle hole 11a (110a), 1 Since the nozzle layer 1 (nozzle layer 10) is supported by the support substrate, the above-described opening can be processed with high accuracy, and therefore, the first nozzle hole that is processed using this opening as a mask 1 1 a (1 1 0 a) is formed with high precision.
- the method for manufacturing a nozzle plate according to the above embodiment may be characterized in that the processing of the first nozzle hole 11a or the second nozzle hole 11b is performed by dry etching.
- the first nozzle hole 11a or the second nozzle hole 11b is processed by etching having high anisotropy.
- the first nozzle hole 11a or the second nozzle hole The nozzle hole lib can be machined with high machining accuracy.
- the shielding layer can also serve as a droplet discharge signal transmitting unit.
- the nozzle plate according to the present invention can be applied to ink jets of any of a bubble jet (registered trademark) system, a piezoelectric ejection system, and an electrostatic ejection system.
- FIG. 11 (a) is a perspective view of a part of the nozzle plate of the present invention used in the microdot forming apparatus, and FIG. It is arrow sectional drawing.
- the nozzle plate 8 has one or more liquid material discharge outlets (opening or first opening) (hereinafter referred to as discharge outlets) 11 c. In FIG. 11 (a), two nozzles are provided.
- the first nozzle layer 1 having a liquid-repellent film 4 on the liquid material discharge side of the nozzle plate 8, and the second nozzle layer on the liquid material supply side.
- a layer 2 is formed, and a discharge layer 14 is formed in the first nozzle layer 1, and a stopper layer 3 (shielding layer) is formed in the second nozzle layer 2.
- a nozzle hole 11 is formed so as to penetrate the first nozzle layer 1, the stopper layer 3, and the second nozzle layer 2).
- the liquid-repellent film 4 is formed on the liquid material ejection surface of the nozzle plate 8, and the first nozzle layer 1 is formed so as to be in contact with the liquid-repellent film 4.
- the ejection layer 14 is locally formed in the first nozzle 1 layer, and the surface of the first nozzle layer 1 on the lyophobic film 4 side and the surface of the ejection layer 14 on the lyophobic film 4 side are different. It is formed flush.
- the second nozzle layer 2 is formed such that one surface thereof is in contact with the surface of the first nozzle layer 1 opposite to the surface on which the liquid repellent film 4 is formed.
- the stopper layer 3 is locally formed in the second nozzle 2 layer such that one surface thereof is in contact with the first nozzle layer 1. .
- the nozzle hole 11 penetrating the liquid-repellent film 4, the discharge layer 14, the first nozzle layer 1, and the second nozzle layer 2 is provided with the liquid-repellent film 4, the discharge layer 14, the first nozzle layer 1, and the nozzle hole 11.
- the first nozzle hole 11 a is a penetrating portion of the top layer 3, and the second nozzle hole 11 b is a penetrating portion of the second nozzle layer 2.
- the first nozzle hole 11 a is provided with a discharge port 11 c which is a penetrating portion of the liquid repellent film 4 and the discharge layer 14, and a penetrating portion of the first nozzle layer 1 and the stopper layer 3.
- the first nozzle hole portion, which is a portion, is composed of 1 d force.
- the discharge layer 14 is located at the interface between the liquid-repellent film 4 and the first nozzle layer 1 in the first nozzle layer 1 and is in contact with the liquid-repellent film 4 and the discharge port 1 1c
- the stopper layer 3 is located at the interface between the first nozzle layer 1 and the second nozzle layer 2 in the second nozzle layer 2. In addition to being in contact with the first nozzle layer 1, it is formed locally at the position where the first nozzle hole lid is formed.
- the liquid material supplied from the inlet opening of the second nozzle hole lib formed on the back surface of the nozzle plate 8 (the surface opposite to the surface on which the liquid-repellent film 4 is formed) ′ is supplied to the second nozzle hole 11 b and For example, the liquid is discharged as droplets from the discharge port 11 c via the first nozzle hole lid.
- the shape at the time of discharging the liquid substance is not limited to the shape of a droplet.
- the discharge port 11c and the first nozzle hole lid are both cylindrical, and the second nozzle hole 11b is , A tapered shape that expands flared from the communicating part with the first nozzle hole 11d
- the upper bottom 11a of the cylindrical first nozzle hole 11d is formed in an annular shape centered on the substantially discharge port 11c, and the discharge layer 14 is formed by the upper bottom 11a. Success And exposed. Therefore, the diameter of the communicating part 11 jS (substantially circular) between the discharge port 11 c and the first nozzle hole 11 d is the outer diameter of the upper bottom 11 ⁇ of the first nozzle hole lid (the above-mentioned communicating part). The outer diameter of the first nozzle hole 11 d at 1 1 ⁇ ).
- the upper bottom 11y of the second nozzle hole lib having a truncated cone shape is a ring shape centered on the substantially first nozzle hole 11d, and the stopper layer 3 is the upper bottom 11y. Is exposed. Therefore, the diameter of the communication portion 11 X (substantially circular) between the first nozzle hole 11 d and the second nozzle hole lib is the outer diameter of the upper bottom 11 y of the second nozzle hole 11 b (the above communication portion 1 The outer diameter of the second nozzle hole 1 1b at 1X).
- a 0.5 ⁇ Ti film mainly containing Ti is used for the ejection layer 14. Also, a polyimide film having a thickness of about 1 m is used for the first nozzle layer 1, and a polyimide film having a thickness of about 20111 is used for the second nozzle layer 2.
- the stopper layer 3 is made of a metal material containing Ti as a main component, and has a substantially square shape with a side of about 20 ⁇ m in order to reduce warpage due to stress of the entire nozzle plate 8.
- the diameter of the discharge port 11 c corresponding to the opening of the first nozzle hole 11 a is about 3 ⁇ m.
- the outer diameter of the upper bottom 11y of the second nozzle hole 11b is 1 O / ⁇ m, and the diameter of the inlet opening (liquid inlet 12) is 30 ⁇ .
- the liquid-repellent film 4 on the ejection layer 14 and the first nozzle layer 1 is formed of a fluoropolymer or silicon-based polymer film having a thickness of about 0 to 0.5 m. Yes.
- the liquid-repellent film 4 removes an extra area that goes around the discharge port 11c by dry etching as described later, but prevents the shape of the discharge pile from being significantly deformed by the dry etch. In addition, it is desirable that the film thickness is smaller than the film thickness of the discharge port 11c.
- the shape of the discharge port 11c of the nozzle plate 8, which greatly affects the landing accuracy, is determined by the processing accuracy of the Ti film of 0.5 m.
- the processing accuracy of the exit 1 1c is very high, and with this, a very high landing accuracy can be secured.
- the thickness of the ejection layer 14 may be reduced. As a result, the amount of etching of the ejection layer 14 is reduced, so that the time for exposing the ejection layer 14 to the etching agent can be shortened.
- the rigidity of the ejection layer 14 may be reduced, and the structural reliability of the ejection port 11 c may be reduced.
- the discharge layer 14 Since the discharge layer 14 is formed so as to be in contact with the surface of the first nozzle layer 1 on the liquid repellent film 4 side and inside the first nozzle layer 1, the discharge layer 14 is reinforced. Therefore, the shape accuracy of the discharge port 11c can be improved while maintaining the structural reliability of the discharge port 11c.
- the stopper layer 3 is provided locally at each position where the nozzle holes 11 (first nozzle holes 11 d) are formed, the stopper layer 3 is formed between the first nozzle layer 1 and the second nozzle layer 2. Compared to the configuration in which the stopper layer 3 is formed over the entire interface, the generation of stress due to the difference in the linear expansion coefficient between the first nozzle layer 1 and the second nozzle layer 2 and the stopper layer 3 is greatly reduced. Therefore, it is possible to prevent the nozzle plate 8 from being largely warped.
- the second nozzle hole lib is tapered, the second nozzle hole 1 Liquid turbulence does not easily occur inside 1b, and the discharge stability of the liquid substance can be improved.
- the liquid repellent film 4 can prevent the liquid substance from adhering to the ejection layer 14 near the ejection port 1.1c.
- the material used for the ejection layer 14 is not limited to a metal material containing Ti as a main component.
- the etching process of the first nozzle layer 1 and the second nozzle layer 2, the etching of the sacrificial layer 5 (see FIG. 13 (f)) described later, and the etching process of the liquid-repellent film 4 wrapped around the discharge port 11 c At this time, materials having high resistance to such etching, ie, etching gas (plasma containing oxygen, plasma containing fluorine, etc.) or etchant (a nitric acid, potassium hydroxide aqueous solution, etc.) Any material having high resistance may be used.
- T i, A l, C u, C o, F e, N i, A u, P t, T a, W metal mainly composed of N b such material, S i 0 2, inorganic oxide material composed mainly of a 1 2 0 3 or the like, an inorganic nitride material, and the like composed mainly of S i 3 N 4, a 1 N , etc., in combination with the Etsuchingugasu or Etchan DOO You can choose.
- the material used for the first nozzle layer 1 is not limited to polyimide. It may be a polymer organic material other than polyimide, a Si compound material such as sio 2 , Si 3 N 4 , or Si.
- the material used for the stopper layer 3 is not limited to a metal material containing Ti as a main component.
- a material having high resistance to such etching that is, an etching gas (oxygen gas) is used. Contain Any material may be used as long as it has high resistance to plasma (eg, plasma containing fluorine) or etchant (eg, nitric acid, potassium hydroxide aqueous solution). Specifically, T i, A l, C u, C o, F e,.
- N i, A u, P t, T a, W metal mainly composed of N b such material, S i ⁇ 2 , inorganic oxide material composed mainly of a 1 2 03, etc., an inorganic nitride material mainly composed of S i 3 N 4, a 1 N , and the like.
- the material used for the second nozzle layer 2 is not limited to polyimide.
- the material used for the second nozzle layer 2 may be a polymer organic material other than Porii Mi de, S i 0 2, S i 3 N 4 such S i compound material or S i derconnection may,.
- the shape of the discharge layer 14 may be any shape as long as it is localized at the position where the discharge port 11c is formed, and is not limited to a substantially square shape.
- it may be circular.
- a circular shape is preferable because the shape is the most isotropic and the stress is also reduced isotropically.
- one ejection layer 1 in this embodiment, one ejection layer 1
- one of the discharge ports 1 1 c are formed against it if it is possible to suppress the stress from the limiting c of conventional configuration to a plurality of discharge ports in a single ejection layer 1 4 11c may be formed.
- the shape of the stopper layer 3 only needs to be localized at the position where the nozzle hole 11 is formed, and is not limited to a substantially square shape. For example, it may be circular. A circular shape is preferable because the shape is the most isotropic and the stress is reduced isotropically.
- one nozzle hole 11 (first nozzle hole lid) is formed for one stopper layer 3. It is not limited to. '' Lower stress than conventional configuration If possible, a plurality of nozzle holes 11 (first nozzle hole lid) may be formed in one stopper layer 3.
- the force S is set so that the diameter of the discharge port 11c is slightly smaller than the diameter of the first nozzle hole 11d.
- the diameter of the discharge port '11c and the diameter of the first nozzle hole 11d may be the same.
- the diameter of the communication portion 11X between the first nozzle hole portion 11d and the second nozzle hole lib is equal to the diameter of the second nozzle hole lib. It is smaller than the diameter of the upper base 1 1 y, but is not limited to this.
- the diameter of the communication portion 11X may be the same as the diameter of the contact portion 11y.
- the second nozzle hole lib has a truncated conical shape (tapered shape) in which the communicating portion 11X with the first nozzle hole 11a (first nozzle hole lid) is narrowed.
- the side wall of the second nozzle hole l ib may be formed in a so-called straight shape (cylindrical shape) perpendicular to the stopper layer 3.
- the liquid inlet 12 of the second nozzle hole l i b can be made smaller, and the degree of integration of the nozzle 11 can be further increased.
- the second nozzle hole l ib may have a bulging tapered shape as shown in FIG. 8 (c).
- the nozzle plate 8 is configured to include the discharge layer 14, the first nozzle layer 1, the stopper layer 3, and the second nozzle layer 2.
- Discharge layer 1 4 force Material with high resistance to etching means of liquid repellent film 4
- the shape of the discharge port 1 1c does not change. Deterioration of processing accuracy can be prevented.
- the rigidity of the discharge layer 14, which is a thin layer, can be maintained by the first nozzle layer 1. At the time of discharge, deformation of the discharge port 11c can be minimized, and discharge stability is improved.
- the thickness of the nozzle plate 8 can be kept to the minimum necessary, the liquid inlet 12 of the nozzle plate 8 can be reduced, thereby improving the degree of integration of the nozzle holes 11. be able to. Along with this, it becomes possible to draw high-resolution images.
- the size of the liquid material to be discharged is controlled.
- the discharge port 11c is not affected.
- FIGS. 13 (a) to 13 (g) are diagrams illustrating the steps of manufacturing the nozzle plate according to the present embodiment.
- FIG. 14 is a modified example of the step shown in FIG. 13 (c).
- a sacrificial layer 5 is formed on a substrate 6 made of Si, glass, or the like for temporary holding of an arbitrary thickness by wet plating using Ni (see FIG. 13 (a)).
- the thickness of the sacrificial layer 5 is 10 ⁇ .
- a Ti film having a thickness of 0.5 ⁇ is formed on the sacrificial layer 5 by vapor deposition or the like, and is formed into a substantially square shape with a side of 7 zm using photolithography.
- a resist pattern having an outer shape of 4 and a shape of a circular discharge port 11 c having a diameter is formed. Thereafter, the outer shape of the discharge layer 14 and the opening 11ci serving as the discharge port 11c are simultaneously processed by a dry etching method (discharge layer forming step).
- Dry etching using plasma containing a mixed gas of CF 4 and oxygen was employed for the processing of the outer shape and the opening 11 ci of the ejection layer 14 described above.
- the Ti film can be processed at high speed and with high accuracy, and the etching selectivity with Ni constituting the sacrificial layer 5 is high (N i is hardly etched).
- the processing can prevent the sacrificial layer 5 from being significantly damaged and prevent the flatness of the surface of the sacrificial layer 5 from significantly deteriorating.
- a coating type polyimide resin is formed to a thickness of 1 ⁇ m on the sacrificial layer 5 to form a first nozzle layer 1 (first nozzle layer forming step, FIG. 13B).
- the coating type polyimide resin was applied on the sacrificial layer 5 by spin coating, and baked at 350 ° C. for 2 hours.
- the opening 11 ci serving as the discharge port 11 c formed in the discharge layer 14 is filled with polyimide resin (see 11 c 2).
- shielding layer forming step FIG. 13 (c)
- a stopper layer 3 having a thickness of 0.5 ⁇ (500 5) is formed by a sputtering method using a material mainly containing T i.
- the stopper layer 3 is formed into a substantially square shape having a side of 20 ⁇ m by dry etching using Ar ions such as ion milling. Process into shape.
- one opening 11 di (second opening) having a diameter of 3 zm is formed inside the above-described substantially square.
- the opening 11 d is a pattern for forming a first nozzle hole 11 a (first nozzle hole lid) described later, and forms a part of the first nozzle hole 11 d.
- the second nozzle layer 2 is formed with a thickness of 20 wm on the first nozzle layer 1 and the stopper layer 3 (second nozzle hole forming step, FIG. 13 (d)).
- the second nozzle layer 2 was formed by applying a coating type polyimide resin by a spin coat method in the same manner as the first nozzle layer 1, and baked at 350 ° C. for 2 hours to have a thickness of 20 m.
- the opening 11 d; L of the stopper layer 3 is also filled with the polyimide resin (see 11 d 2 ).
- a resist pattern 7 is formed on the second nozzle layer 2 by photolithography, and dry etching is performed using a gas containing oxygen as a main component.
- the dry etching can be stopped at the stopper layer 3. That is, dry etching does not proceed further in the portion where the stop layer 3 is exposed except for the opening 11 d i of the stop layer 3.
- the etch rate of the resist pattern 7 and the etch rate of the polyimide resin of the second nozzle layer 2 are made substantially equal, and the resist pattern is formed.
- the resist pattern 7 was formed into a taper shape by subjecting 7 to a post beta at 150 ° C. for 60 minutes, and a method of transferring this shape to the second nozzle layer 2 by etching was used.
- a resist pattern 7 having an etch rate substantially equal to that of the polyimide resin (second nozzle layer 2) and having a tapered cross section is formed, and has the same speed as the etching of the polyimide resin.
- the polyimide resin (the second nozzle layer 2) is also etched, and the wall surface of the etching (the wall surface of the second nozzle hole lib) has a tapered wall surface (the resist pattern) initially formed by the resist. It has the same shape as 7).
- the resist pattern 7 and the etch rate of the second nozzle layer 2 are substantially equal, it is desirable that the resist pattern 7 be formed to be thicker than the second nozzle layer 2.
- the first nozzle layer 1 is subjected to etching for processing the first nozzle holes 11a (the first nozzle holes 11d and the discharge ports 11c). Perform the process (first nozzle hole forming step, first removing step, see Fig. 13 (e)). At this time, the first nozzle hole 11a has a shape (substantially circular, 3 ⁇ m in diameter) determined by the opening 11 of the stopper layer 3 formed by the first nozzle hole lid in the previous step. ), And the discharge port 11 c is formed in the pattern formed in the discharge layer 14 (having the same shape as the opening 11 c (that is, the pattern existing in the opening llci of the discharge layer 14). 1. Material of nozzle layer 1 (1
- the stopper layer 3 and the ejection layer 14 are hardly etched by the dry etching mainly containing oxygen in this step.
- the first nozzle layer 1 is etched to have substantially the same diameter as the opening 11 d 1 of the stopper layer 3 (substantially perpendicular to the stopper layer 3), and the outlet 11 c of the discharge layer 14 is removed.
- the dry etching is stopped when the portion to be removed is exposed, and the first nozzle hole 11d is formed.
- the first nozzle layer 1 material present in the opening 1 1 c of the ejection layer 1 4 (see 1 1 c 2) is etched away, the discharge port 1 1 c is formed.
- the resist pattern 7 was removed using a resist stripper, and the nozzle plate 8 was removed from the substrate 6 by immersing it in an aqueous solution mainly composed of nitric acid and water and etching only the sacrificial layer 5. Remove (Fig. 13 (f)).
- the polyimide resin for forming the first nozzle layer 1 and the second nozzle layer 2 and the Ti for forming the stopper layer 3 or the ejection layer 14 are formed of the sacrificial layer 5 described above. Since the etching is hardly performed by the etching solution, the etching of the sacrificial layer 5 does not cause a change in shape or a decrease in structural reliability.
- a liquid-repellent film 4 is formed on the surface of the first nozzle layer 1 (FIG. 13 (g)).
- a fluoropolymer is used for the purpose of considering the ease of application.
- a lyophobic film 4 was formed from a polymer film.
- the lyophobic film 4 wrapped into the first nozzle hole 11a is dry-etched from the side of the second nozzle hole 11b using plasma containing oxygen after the lyophobic film 4 is formed. This has been removed. Thereby, the damage of the nozzle plate 8 can be minimized. The details will be described below.
- FIGS. 17 (a) to 17 (c) are diagrams for schematically explaining the dry etching process when removing the wraparound of the liquid repellent film 4, and show the first nozzle hole 11 a and the discharge layer 1.
- FIG. 4 is an enlarged view of a discharge port 11 c formed in FIG. That is, when the liquid-repellent film 4 is applied and baked on the liquid material ejection surface side of the nozzle plate 8, as shown in FIG. 17 (a), the liquid-repellent film 4 turns around the first nozzle hole 11a ( It is attached to the inner wall of the discharge port 11c and the first nozzle hole 11d).
- Such wrapped liquid-repellent film 4 has to be removed because it becomes a major factor in deteriorating the shape accuracy of the first nozzle hole 11a (especially the outlet 11c).
- the liquid-repellent film 4 that has wrapped around in this manner is removed by dry etching using an oxygen-containing plasma.
- an organic material such as polyimide resin is formed on the first nozzle layer 1.
- side nozzles are formed in the first nozzle layer 1 formed below the shielding layer 3 and undercuts are formed below the shielding layer 3 as shown in Fig. 17 (b).
- a driver using oxygen-containing plasma is used.
- the discharge layer 14 having high resistance to the dry etching is formed so as to be in contact with the liquid-repellent film 4, and the discharge layer 14 determines the shape of the discharge port 1lc. There is no change in the shape of the discharge port 11c due to this (see Fig. 17 (c)). As a result, a very high precision nozzle hole 11 (first nozzle hole 11a) can be formed. '
- each discharge port 11 c of the nozzle plate 8 having 200 discharge ports 11 c formed using the process of the present embodiment was evaluated, the variation was ⁇ 0.15. Very high precision of ⁇ m. In addition, the warpage of nozzle plate 8 was very flat, less than 10 ⁇ .
- the discharge port 11c (the opening 11c has a thickness of 0.
- the discharge port 11 c can be formed with high precision.
- the discharge layer 14 functions as an etching stopper that defines the shape of the discharge port 11c, and as the etching progresses.
- the first nozzle hole 1 1 d is etched to etch the first nozzle layer 1 using the topper layer 3 as a mask (shielding layer). Can be formed with high precision.
- the etching is automatically stopped at the stopper layer 3, and the etching depth of the second nozzle hole lib is defined. be able to.
- the first nozzle hole 11d can be formed with higher precision.
- the first nozzle layer 1 or the second nozzle layer 2 can be formed thin, the first nozzle layer 1 and the second nozzle layer 2 are not etched when the first nozzle hole 11 d and the second nozzle hole lib are etched.
- the etching amount of the nozzle layer 2 can be reduced, and the formation error is reduced. Therefore, the nozzle holes 11 can be formed with high accuracy.
- the stopper layer 3 is etched from one direction, the etching is performed from two directions so as to face each other. As compared with the case where the first nozzle hole 11a and the second nozzle hole 11b are aligned with each other, it is easier.
- the etching in the first nozzle hole forming process is performed.
- the etching of the first nozzle hole forming step and the second nozzle hole forming step can be performed using the apparatus and the etching liquid or the etching gas as they are. This simplifies the manufacturing process.
- Ni is used as the sacrificial layer 5
- polyimide resin and the stopper layer 3 are used as the first nozzle layer 1 and the second nozzle layer 2.
- T i was used for the calculation, but it is not limited to this combination.
- the sacrificial layer 5 may be made of Al, Cu, or the like depending on the combination of the materials used for the first nozzle layer 1, the second nozzle layer 2, and the stopper layer 3. Materials that are soluble in nitric acid or KOH aqueous solution, or materials that can be etched by oxygen plasma, such as polyimide, can be used. Also, as for the method of forming the sacrificial layer 5, besides plating, a vapor deposition method, a spatter method, a coating method, or the like can be used depending on the material.
- a material that is slightly damaged by the etching of the sacrificial layer 5 can be used.
- a material having high resistance to the etching of the sacrificial layer 5 and the etching of the first and second nozzle holes 11a and 1lb is used. it can.
- Table 3 shows the materials used (sacrifice layer, discharge layer, first nozzle layer, stopper layer, second nozzle layer) and processing methods (discharge layer, stopper layer, first nozzle hole, Preferred combinations are shown below for the second nozzle hole and sacrificial layer removal).
- the first nozzle layer 1, the second nozzle layer 2 is not limited to good Una polymeric organic material Porii Mi de ⁇ fat-free machine silicon, such as S i or S i o 2
- Porii Mi de ⁇ fat-free machine silicon such as S i or S i o 2
- the compound can be selected.
- the silicon compounds such as the S i 0 2 and S i wrap around the aforementioned Since it has high resistance to the etching means for removing the liquid repellent film 4, the shape change of the first nozzle hole 11a can be prevented, and the shape stability of the discharge port 11c can be further improved. improves.
- the stop layer 3 can be patterned while keeping the thickness to a minimum.
- the ejection layer 14 in the ejection layer forming step or the stopper layer 3 (in the shielding layer forming step) is formed in a square shape, but is not limited thereto.
- the first nozzle hole 11a first nozzle hole lid
- the second nozzle hole 11b Any shape and size may be used so that the nozzle holes lib reach the discharge layer 14 or the stopper layer 3, respectively, and stop the etching.
- the shape and shape of the nozzle plate 8 can reduce the warpage of the nozzle plate 8 due to the stress of the discharge layer 14 or the stopper layer 3. And the size, that is, the minimum required size.
- the shape of the stopper layer 3 and the opening 11 d.i serving as the pattern for forming the first nozzle hole 11 d were simultaneously formed. It can also be formed by an etching step (etching for forming the shape of the stopper layer 3 and etching for forming the opening 11 d ⁇ ).
- the first nozzle hole lid in forming the processing pattern of the first nozzle hole lid (the opening 11 d of the stopper layer 3 in the shielding layer forming step, as shown in FIG. 14, the first nozzle hole 1
- the first nozzle hole lid when forming the second nozzle layer 2, the first nozzle hole lid previously processed is filled with the material for forming the second nozzle layer 2. Therefore, in the first nozzle hole forming step, the relevant portion is processed again.
- the mask material and etching conditions for processing the second nozzle hole 11b are optimized, and the side wall is formed as shown in FIGS. 8 (a) to 8 (c).
- the second nozzle hole 11b having a bulge (curved surface) can also be formed.
- a mask 13 is formed on the second nozzle layer 2 by using a mask 13 such as Si ⁇ 2 having high resistance to oxygen plasma etching. 8 (a)), and etch the oxygen plasma etch at a high gas pressure, eg, 500 mTorr (see FIG. 8 (b)).
- a high gas pressure eg, 500 mTorr
- a droplet discharge port 11c having substantially the same shape (diameter) as the opening 11Cl can be formed, and the discharge port 1 has a dramatic shape accuracy.
- Nozzle plate 8 with 1 c can be manufactured c
- the shape of the discharge port 11 c does not change.
- the nozzle plate 8 with high shape accuracy can be stably manufactured.
- the reinforcing plate 20 having the second nozzle hole 11 b may be joined to the first nozzle layer 1. That is, a liquid-repellent film 4 is formed on the liquid substance discharge side, a first nozzle layer 1 having a first nozzle hole lid is formed so as to be in contact with the liquid-repellent film 4, and has a discharge port 11c.
- the ejection layer 14 is locally formed in the first nozzle 1 layer, and the surface of the ejection layer 14 on the liquid repellent film 4 side is flush with the surface of the first nozzle layer 1 on the liquid repellent film 4 side.
- the first nozzle layer 1 has a local stopper layer 3 in contact with this one side.
- the reinforcing plate 20 having the second nozzle hole lib is joined together, and the discharge port 11c, the first nozzle hole 11d and the second nozzle hole 11b communicate with each other. It may be. .
- Embodiment 4 of the present invention is described below with reference to the drawings.
- FIG. 15 (a) is a perspective view of a part of a nozzle plate of the present invention used in a microdot forming apparatus
- FIG. 15 (b) is a cross-sectional view of B_B in FIG. 15 (a).
- the nozzle plate 8 is provided with one or more liquid material discharge outlets (opening or first opening) (hereinafter referred to as discharge outlets) 11c. In FIG. The outlets 1 1c are shown.
- a layer 2 is formed, and a discharge layer 14 is formed in the first nozzle layer 1.
- the discharge layer 14 penetrates the liquid repellent film 4, the discharge layer 14, the first nozzle layer 1, and the second nozzle layer 2. Thus, the nozzle hole 11 is formed.
- a liquid-repellent film 4 is formed on the liquid material discharge surface of the nozzle plate 8, and the first nozzle layer 1 is formed so as to be in contact with the liquid-repellent film 4.
- the ejection layer 14 is locally formed in the first nozzle 1 layer, and furthermore, the surface of the first nozzle layer 1 on the liquid repellent film 4 side and the surface of the ejection layer 14 on the liquid repellent film 4 side. Are formed flush with each other.
- the second nozzle layer 2 is formed such that one surface thereof is in contact with the surface of the first nozzle layer 1 opposite to the surface on which the liquid repellent film 4 is formed.
- the nozzle hole 11 penetrating the liquid-repellent film 4, the ejection layer 14, the first nozzle layer 1, and the second nozzle layer 2 has the liquid-repellent film 4, the ejection layer 14, and the first nozzle layer 11. It comprises a first nozzle hole 11 a which is a penetrating part of the nozzle layer 1 and a second nozzle hole 11 b which is a penetrating part of the second nozzle layer 2. Further, the first nozzle hole 11 a is provided with a discharge port 11 c which is a penetrating part of the liquid repellent film 4 and the discharge layer 14, and a first nozzle hole 1 which is a penetrating part of the first nozzle layer 1. Consists of 1 d.
- the discharge layer 14 is located at the interface between the liquid-repellent film 4 and the first nozzle layer 1 in the first nozzle layer 1, and comes into contact with the liquid-repellent film 4, and the discharge port 1 It is formed locally at the formation position of 1c.
- the liquid material supplied from the opening of the second nozzle hole 11 1b formed on the back surface of the nozzle plate 8 (the surface opposite to the surface on which the liquid repellent film 4 is formed) is supplied to the second nozzle hole lib and the second nozzle hole lib.
- the liquid is discharged as a liquid substance through the discharge port 11c through the first nozzle hole lid.
- both the discharge port 11 c and the first nozzle hole 11 d have a cylindrical shape
- the second nozzle hole 11 b is Nozzle hole 1 1d
- the upper bottom 11 of the cylindrical first nozzle hole 11d is substantially annular in shape centering on the discharge port 11c, and the discharge layer 14 is formed of the upper bottom 11 ⁇ . It is exposed.
- the discharge layer 14 is made of a metal material containing Pt as a main component, and has a thickness of 0.5 ⁇ and a side of 10 ⁇ m in order to reduce the stress of the entire nozzle plate 8. Is formed in a substantially square shape.
- the first nozzle layer 1 of the present embodiment is a Si 2 layer having a thickness of 2 ⁇ .
- the second nozzle layer 2 is made of an organic material containing a polyimide resin as a main component, and has a thickness of 20.
- the diameter of the discharge port 11 c is 3 ⁇ , and the discharge port 11 c is processed perpendicularly to the film surface up to the portion communicating with the first nozzle hole 11 d.
- the first nozzle hole lid is machined to a diameter of 4 ⁇ . ⁇ at the communication part with the discharge port 11 c, so that the lid is substantially flush with the membrane surface up to the communication part with the second nozzle hole 11 b. It is machined vertically.
- the second nozzle hole lib is machined to a diameter of 10 ⁇ m at the communicating part with the first nozzle hole 11d, and has a tapered shape (frustoconical shape) that spreads out at the bottom. 2 Opened at the opening 12 opposite to the liquid repellent film 4 through the nozzle layer 2.
- the ejection port 1 1 is etched by etching the first nozzle hole 11 d.
- the shape of 1c can be prevented from being deformed.
- the shape of the discharge port 11 c of the nozzle plate 8 that greatly affects the landing accuracy is determined by the processing accuracy of the 0.5 ⁇ m Pt film, the processing accuracy of the discharge port 11 c is improved. Very high, and with this, very high landing accuracy can be ensured.
- the processing accuracy of the discharge port 11 c can be improved, but the rigidity of the discharge layer 14 decreases, and the structural characteristics of the discharge port 11 c are reduced. Reliability is reduced.
- the first nozzle layer 1 is formed so as to be in contact with the ejection layer 14, The discharge layer 14 is reinforced, and the shape accuracy of the discharge port 11 c can be improved without lowering the structural reliability of the discharge layer 14.
- the shape of the first nozzle hole 11d is formed by processing the second nozzle hole lib.
- the first nozzle layer 1 is not completely removed due to over-etching during lib machining of the second nozzle hole, while not significantly deforming.
- the material used for the ejection layer 14 is not limited to a metal material containing Pt as a main component.
- Etching of the first nozzle hole 11a, etching of the second nozzle hole 11b, etching of the sacrificial layer 5 (described later), and etching of the liquid-repellent film 4 that has entered the discharge port 11c ( At this time, a material having high resistance to the etching, that is, a material having high resistance to plasma containing fluorine, plasma containing oxygen, nitric acid, potassium hydroxide aqueous solution, or the like may be used. It can be selected by a combination of the etching of the sacrificial layer 5, the processing method of the first nozzle hole 11a, and the method of processing the second nozzle hole lib.
- a l, A u , P t, A 1 2 0 3, A 1 N a metal material or inorganic oxide mainly comprising S i 0 2, etc. Materials and inorganic nitride materials.
- the material used for the first nozzle layer 1 is not limited to S i ⁇ 2.
- the material used for the second nozzle layer 2 is not limited to polyimide, either. Any material that can be favorably processed by dry etching using plasma containing oxygen gas can be used. For example, an organic resin other than polyimide may be used.
- the shape of the ejection layer 14 may be any shape as long as it is localized at the position where the ejection port 11 c is formed, and is not limited to a substantially square shape. For example, it may be circular. A circular shape is preferable because the shape is the most isotropic and the stress is reduced isotropically. Further, as shown in FIG. 15 (a), in the present embodiment, one discharge port 11c is formed for one discharge layer 14, but the present invention is not limited to this. A plurality of discharge ports 11 c may be formed in one discharge layer 14.
- the second nozzle hole l ib is
- the communicating part 11d with 1d has a frustoconical shape (tapered shape) with a narrowed X, but is not limited to this.
- the side wall of the second nozzle hole 11b may be formed in a so-called straight shape (cylindrical shape) perpendicular to the surface of the nozzle plate 8.
- the liquid inlet 12 of the second nozzle hole lib can be made smaller, and the degree of integration of the nozzles can be further increased.
- the nozzle plate 8 is provided with the first nozzle layer 1 and the second nozzle layer 2 which are highly resistant to the etching agent of the first nozzle layer 1 and the ejection layer 14 and the second nozzle layer 2 which are resistant to the etching agent of the second nozzle layer 2.
- the ejection layer 14 uses a material having high resistance to the etching means of the liquid-repellent film 4, the liquid-repellent film 4 that has entered the first nozzle hole 11a is removed. At this time, the shape of the discharge port 11c does not change, and it is possible to prevent the processing accuracy of the discharge port 11c from deteriorating in the manufacturing process.
- FIGS. 16 (a) to 16 (g) show a manufacturing process of the nozzle plate according to the present embodiment.
- a method for manufacturing the nozzle plate according to the present embodiment will be described with reference to FIGS. 16 (a) to 16 (g).
- a sacrifice layer 5 is formed on a substrate 6 made of Si, glass, or the like for temporary holding of an arbitrary thickness by wet plating using Ni.
- the thickness of the sacrificial layer 5 is 10 m.
- a 0.5 ⁇ m-thick Pt film is formed on the sacrificial layer 5 by vapor deposition or the like, and the outer shape of the discharge layer 14 and the discharge port 11 c are formed using photolithography. A resist pattern having the shape of is formed. Thereafter, the outer shape of the discharge layer 14 and the opening 11ci serving as the discharge port 11c are simultaneously processed by dry etching (discharge layer forming step, FIG. 16 (a)).
- the dry etching is performed by a method in which physical processing is dominant, using sputter etching using Ar. .
- this processing is performed with very high precision, etching conditions with high anisotropy are used.
- the first consisting of S i ⁇ 2 film on the sacrificial layer 5 or the discharge layer 1 4
- the nozzle layer 1 is formed by the P_CVD method (first nozzle layer forming step, FIG. 16 (b)).
- the stress of the SO 2 ⁇ film to be formed can be controlled by the composition of the gas used for the film formation, the gas pressure, and the RF power for generating the plasma, and the stepped portion can be controlled. Because of good adhesion, cracks and the like do not occur at the step portion of the discharge layer 14. Therefore, the structural reliability as a film is high, so that the structural reliability of the entire nozzle plate 8 is high.
- a resist pattern is formed on the first nozzle layer 1 by photolithography, and an opening 11 d to become the first nozzle hole 11 d is formed by reactive ion etching (RIE) containing fluorine gas.
- RIE reactive ion etching
- the opening 11 ci serving as the discharge outlet 11 c are processed (first nozzle hole forming step, first removing step, Fig. 16 (c)).
- the shape of the opening 11 di is larger than the opening 11 ci so that the etching of the first nozzle hole 11 d stops at the discharge layer 14 (and the shape of the discharge layer 14 (Smaller than the outer shape)
- a coating type polyimide resin having a thickness of 20 ⁇ m is formed on the first nozzle layer 1 to form a second nozzle layer 2 (second nozzle layer forming step, FIG. 1). 6 (d)).
- the coating type polyimide resin was applied onto the first nozzle layer 1 by spin coating, and was baked at 350 ° C. for 2 hours.
- the openings 11 d and 11 c 1 are filled with polyimide resin (see 11 c 2 and 11 d 2 ).
- a resist pattern 7 is formed on the second nozzle layer 2 by photolithography (FIG. 16 (e)).
- the first nozzle hole 11 d and the discharge port 1 l'c are formed continuously, and the etching is stopped at the discharge layer 14 (the discharge port 11 c of the discharge layer 14).
- dry etching stops when the discharge layer 14 is exposed.
- the present invention is not limited to this.
- the above etching is intentionally stopped at the first nozzle layer 1, and the formation of the discharge port 11 c (etching of the portion 11 c 2 filled with the first nozzle layer 1) is performed in another step (different method or condition). Etching is also possible.
- the shape of the first nozzle hole 11a filled with the polyimide resin in the previous process is reproduced by the removal of the polyimide resin.
- the previous shape 1 1 Cl is reproduced.
- the resist pattern 7 is removed using a resist stripper.
- the laminate to become the nozzle plate 8 is removed from the substrate 6 by dipping in an aqueous solution containing nitric acid and water as main components and etching only the sacrificial layer 5 (FIG. 16 (f)).
- a liquid-repellent film 4 is formed on the surface of the first nozzle layer 1 (see FIG. 16 (g) BS).
- a fluoropolymer was used for the purpose of considering the ease of application, and this was applied to the surface of the first nozzle layer 1 by a method such as a stamp, and the liquid-repellent film 4 was formed by a polymer film. .
- the lyophobic film 4 wrapping into the first nozzle hole 11a is dry-etched from the side of the second nozzle hole 11b using plasma containing oxygen after the lyophobic film 4 is formed. This was removed, and nozzle plate 8 was completed. Thereby, the damage of the nozzle plate 8 can be minimized.
- N i the sacrificial layer 5, S i 0 2 to the ejection layer 1 4 P i :, first nozzle layer 1, polyimide resin in the second nozzle layer 2, was used, It is not limited to this combination.
- the sacrificial layer 5 may be composed of a nitric acid solution such as Al, Cu, etc. Can be used.
- a vapor deposition method, a sputtering method, a coating method, or the like can be used depending on the material other than the plating.
- the second nozzle layer 2 can be made of a material that is slightly damaged by the etching of the sacrificial layer 5.
- an organic resin that can be etched using a plasma containing oxygen is preferable.
- an organic resin having a molecular structure in which molecular chains are crosslinked with each other is used, the heat resistance and the environmental resistance of the second nozzle layer 2 are high, and the reliability of the nozzle plate 8 can be improved.
- the ejection layer 14 and the first nozzle layer 1 can be made of a material having high resistance to etching of the sacrificial layer 5 and etching of the second nozzle hole 11b. +
- a material having high resistance to the etching of the sacrificial layer 5, the etching of the second nozzle holes 11b, and the etching of the first nozzle holes 11a can be used for the ejection layer 14.
- Table 4 shows the materials used (sacrifice layer, ejection layer, first nozzle layer, second nozzle layer, nozzle layer) and processing methods (ejection port, first nozzle hole, second nozzle hole, removal of sacrificial layer). Preferred combinations are shown.
- the first nozzle layer 1 is not limited to the S i Compound Do you Yo of S i ⁇ 2, if it is possible to use a concentrated nitric acid to the etching of the sacrificial layer 5, the surface not It is possible to use a material such as A1 that works. It is possible to work with a high selectivity to the S io 2 by dry etching using a plasma containing A 1 Haji first gas can be increased to the al machining accuracy of the discharge ports 1 1 c.
- the liquid-repellent film 4 is not limited to a fluoropolymer, but may be a silicon-based polymer film, DLC (diamond-like carbon), or the like.
- the liquid-repellent film 4 that has turned into the first nozzle hole 11a is removed, and at this time, the discharge port 11c is removed. Since the shape does not change, the nozzle plate 8 having the first nozzle holes 11a with high forming accuracy can be stably manufactured.
- the first nozzle hole 11a or the second nozzle hole 11b is processed by etching having high anisotropy. 2
- the nozzle hole lib can be machined with high machining accuracy.
- the manufacturing method of the nozzle plate 8 in the above embodiment is that the processing of the discharge port 1.1c, the first nozzle hole 11a or the second nozzle hole 11b is performed by dry etching. It can also be a feature.
- the ejection layer 14 or the first nozzle layer 1 is formed on the sacrificial layer 5 formed on the substrate 6, TO
- the ejection layer 14 provided with the ejection port 11c which requires high shape accuracy, is protected by the sacrificial layer 5 and the substrate 6 until the final stage of the nozzle manufacturing process.
- the outlet 1 1c will not be damaged by the handling of.
- the nozzle plate 8 can be easily manufactured while maintaining the high accuracy of the shape of the discharge port 11 c, so that the nozzle plate 8 having the high-precision discharge port 11 c can be stably manufactured. As a result, the production yield of the nozzle plate 8 can be improved.
- a configuration in which the liquid-repellent film 4 is not formed can be adopted.
- the shape accuracy of the ejection port 11c is further improved.
- the present invention relates to an electrophotographic developing device and an image forming device for visualizing an electrostatic latent image formed on an image carrier using a developer, and PT / JP2004 / 006226
- the present invention can be used for applications such as a developing device and an image forming device that transport a developer to a developing position on an image carrier using a traveling wave electric field.
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/562,080 US7568785B2 (en) | 2003-06-27 | 2004-04-28 | Nozzle plate and method of manufacturing the same |
US11/786,410 US20070195123A1 (en) | 2003-06-27 | 2007-04-10 | Nozzle plate and method of manufacturing the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-185637 | 2003-06-27 | ||
JP2003185637 | 2003-06-27 | ||
JP2003-209835 | 2003-08-29 | ||
JP2003209835A JP4021383B2 (ja) | 2003-06-27 | 2003-08-29 | ノズルプレート及びその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/786,410 Division US20070195123A1 (en) | 2003-06-27 | 2007-04-10 | Nozzle plate and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
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WO2005000590A1 true WO2005000590A1 (ja) | 2005-01-06 |
Family
ID=33554476
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PCT/JP2004/006226 WO2005000590A1 (ja) | 2003-06-27 | 2004-04-28 | ノズルプレート及びその製造方法 |
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Country | Link |
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US (2) | US7568785B2 (ja) |
JP (1) | JP4021383B2 (ja) |
WO (1) | WO2005000590A1 (ja) |
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US20100040830A1 (en) * | 2006-04-28 | 2010-02-18 | Xaar Technology Limited | Droplet Deposition Component |
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US10569544B2 (en) | 2016-07-12 | 2020-02-25 | Hewlett-Packard Development Company, L.P. | Multi-layered nozzle fluid ejection device |
US11225070B2 (en) * | 2018-01-23 | 2022-01-18 | Hewlett-Packard Development Company, L.P. | Fluidic dies with beveled edges underneath electrical leads |
BR112022020501A2 (pt) * | 2020-04-14 | 2022-12-06 | Hewlett Packard Development Co | Matriz de ejeção de fluido com camada nanocerâmica estampada |
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Also Published As
Publication number | Publication date |
---|---|
JP2005066890A (ja) | 2005-03-17 |
US20060176338A1 (en) | 2006-08-10 |
US20070195123A1 (en) | 2007-08-23 |
US7568785B2 (en) | 2009-08-04 |
JP4021383B2 (ja) | 2007-12-12 |
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