WO2004067234A1 - 真空吸着ヘッド - Google Patents

真空吸着ヘッド Download PDF

Info

Publication number
WO2004067234A1
WO2004067234A1 PCT/JP2004/000785 JP2004000785W WO2004067234A1 WO 2004067234 A1 WO2004067234 A1 WO 2004067234A1 JP 2004000785 W JP2004000785 W JP 2004000785W WO 2004067234 A1 WO2004067234 A1 WO 2004067234A1
Authority
WO
WIPO (PCT)
Prior art keywords
vacuum suction
substrate
pad
suction pad
sucked
Prior art date
Application number
PCT/JP2004/000785
Other languages
English (en)
French (fr)
Inventor
Shigeki Nagasawa
Kiyoshi Takamatsu
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Priority to US10/543,726 priority Critical patent/US7726715B2/en
Priority to JP2005504733A priority patent/JP4468893B2/ja
Priority to AT04705888T priority patent/ATE454960T1/de
Priority to DE602004025084T priority patent/DE602004025084D1/de
Priority to EP04705888A priority patent/EP1593465B1/en
Publication of WO2004067234A1 publication Critical patent/WO2004067234A1/ja
Priority to HK06108765.0A priority patent/HK1088276A1/xx

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005Vacuum work holders
    • B25B11/007Vacuum work holders portable, e.g. handheld
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005Vacuum work holders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • B25J15/06Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H3/00Separating articles from piles
    • B65H3/08Separating articles from piles using pneumatic force
    • B65H3/0808Suction grippers
    • B65H3/0883Construction of suction grippers or their holding devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00Robots
    • Y10S901/30End effector
    • Y10S901/40Vacuum or mangetic

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Valves And Accessory Devices For Braking Systems (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Liquid Crystal (AREA)
PCT/JP2004/000785 2003-01-29 2004-01-28 真空吸着ヘッド WO2004067234A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US10/543,726 US7726715B2 (en) 2003-01-29 2004-01-28 Vacuum suction head
JP2005504733A JP4468893B2 (ja) 2003-01-29 2004-01-28 真空吸着ヘッド
AT04705888T ATE454960T1 (de) 2003-01-29 2004-01-28 Vakuum saugkopf
DE602004025084T DE602004025084D1 (de) 2003-01-29 2004-01-28 Vakuum saugkopf
EP04705888A EP1593465B1 (en) 2003-01-29 2004-01-28 Vacuum suction head
HK06108765.0A HK1088276A1 (en) 2003-01-29 2006-08-08 Vacuum suction head

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003020620 2003-01-29
JP2003-020620 2003-01-29

Publications (1)

Publication Number Publication Date
WO2004067234A1 true WO2004067234A1 (ja) 2004-08-12

Family

ID=32820631

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/000785 WO2004067234A1 (ja) 2003-01-29 2004-01-28 真空吸着ヘッド

Country Status (10)

Country Link
US (1) US7726715B2 (ja)
EP (1) EP1593465B1 (ja)
JP (1) JP4468893B2 (ja)
KR (1) KR101019469B1 (ja)
CN (1) CN100396454C (ja)
AT (1) ATE454960T1 (ja)
DE (1) DE602004025084D1 (ja)
HK (1) HK1088276A1 (ja)
TW (1) TW200505626A (ja)
WO (1) WO2004067234A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008023637A (ja) * 2006-07-19 2008-02-07 Yokogawa Electric Corp 移送システム
JP2010177228A (ja) * 2009-01-27 2010-08-12 Disco Abrasive Syst Ltd 研削装置
JP2014038954A (ja) * 2012-08-17 2014-02-27 Apic Yamada Corp 半導体製造装置用吸着ヘッドおよびその製造方法
JP2014110262A (ja) * 2012-11-30 2014-06-12 Dainippon Printing Co Ltd 剥離装置および剥離方法
CN105196162A (zh) * 2014-06-17 2015-12-30 株式会社迪思科 搬送装置
JP2019513656A (ja) * 2016-04-06 2019-05-30 サン−ゴバン グラス フランス ガラスシートを支持するための装置、特に洗浄設備においてガラスシートを支持するための装置

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KR100628276B1 (ko) * 2004-11-05 2006-09-27 엘지.필립스 엘시디 주식회사 스크라이브 장비 및 이를 구비한 기판의 절단장치 및이것을 이용한 기판의 절단방법
ITTO20060124A1 (it) * 2006-02-22 2007-08-23 Famatec S P A Organo di presa per la movimentazione di manufatti in ceramica cruda
DE102006058299A1 (de) * 2006-12-11 2008-06-12 Robert Bosch Gmbh Handhabungswerkzeug für Bauelemente, insbesondere elektronische Bauelemente
CA2685274A1 (en) 2007-04-26 2008-11-06 Pace Innovations, L.C. Vacuum gripping apparatus
US8028850B2 (en) * 2007-09-22 2011-10-04 Israel Harry Zimmerman Self-anchoring beverage container with directional release and attachment capability
WO2009068624A1 (en) * 2007-11-27 2009-06-04 Pilkington Italia S.P.A. Glazing
JP5185668B2 (ja) * 2008-03-26 2013-04-17 東京医研株式会社 止血装置
TWI381908B (zh) * 2011-01-21 2013-01-11 Chime Ball Technology Co Ltd Suction device
TWI437672B (zh) 2011-12-16 2014-05-11 利用氣體充壓以抑制載板翹曲的載板固定方法
US8757418B2 (en) 2012-11-01 2014-06-24 Israel Harry Zimmerman Self-anchoring low-profile container anchor with directional release and attachment capability
CN104870344A (zh) * 2012-12-21 2015-08-26 肖特兄弟公司 吸杯
KR101355860B1 (ko) * 2013-02-22 2014-01-28 에스케이하이닉스 주식회사 가이드 일체형 진공 흡반
CN103192402B (zh) * 2013-04-14 2014-12-10 苏州科技学院 一种压电超声振动吸附拾取器
KR101477631B1 (ko) * 2013-04-30 2014-12-31 (주)엠프리시젼 흡착 패드 및 그 제조 방법
JP6186256B2 (ja) * 2013-11-20 2017-08-23 株式会社ディスコ 加工装置
KR101469688B1 (ko) 2014-03-21 2014-12-05 한국뉴매틱(주) 진공 시스템용 체크-밸브 어셈블리
CN104199218B (zh) * 2014-08-18 2017-07-25 深圳市华星光电技术有限公司 液晶滴注装置
SE538811C2 (sv) * 2015-04-22 2016-12-13 Lundin Christer Leak preventing appliance and method for preventing liquid from leaking out of a damaged tank
KR102300081B1 (ko) * 2015-04-27 2021-09-08 삼성디스플레이 주식회사 합착 장치 및 이를 이용한 곡면 표시 장치의 제조 방법
US9814332B2 (en) 2015-06-29 2017-11-14 Israel Harry Zimmerman Anchoring device with directional release and attachment capability and protection against inadvertent release
DE102015213818A1 (de) * 2015-07-22 2017-01-26 Asys Automatisierungssysteme Gmbh Vorrichtung zur Handhabung von flachen Substraten
CA3156185A1 (en) * 2015-09-08 2017-03-16 Berkshire Grey Operating Company, Inc. Systems and methods for providing dynamic vacuum pressure in an articulated arm end effector
CN106217089B (zh) * 2016-08-15 2018-05-01 中国工程物理研究院化工材料研究所 机械加工装夹用真空吸盘的气水分离结构
NL2018243B1 (en) 2017-01-27 2018-08-07 Suss Microtec Lithography Gmbh Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector
CN111050991A (zh) * 2017-09-07 2020-04-21 新光株式会社 固定装置
KR102540859B1 (ko) * 2018-05-29 2023-06-07 (주)포인트엔지니어링 마이크로 led 전사헤드 및 이를 이용한 마이크로 led 전사 시스템
CN110544661A (zh) * 2018-05-29 2019-12-06 普因特工程有限公司 微led转印头及利用其的微led转印系统
KR102540860B1 (ko) * 2018-05-29 2023-06-07 (주)포인트엔지니어링 마이크로 led 전사헤드 및 이를 이용한 마이크로 led 전사 시스템
CN108942999A (zh) * 2018-09-01 2018-12-07 亚米拉自动化技术(苏州)有限公司 一种新型型材组合式海绵吸盘
CN109533960B (zh) * 2018-12-13 2020-05-15 西安交通大学 一种基于壁虎仿生结构辅助的真空吸附结构及制作方法
CN109733873B (zh) * 2018-12-13 2020-03-31 西安交通大学 一种负压辅助的仿生干粘附拾取结构及制备工艺
US11241802B2 (en) 2019-02-18 2022-02-08 Material Handling Systems, Inc. Dual-material vacuum cup for a vacuum-based end effector
CN110323175B (zh) * 2019-04-16 2023-01-06 深圳市正鸿泰科技有限公司 一种具有吸力调节功能的便捷型芯片分拣设备
CN109968272B (zh) * 2019-04-22 2020-12-08 湖州达立智能设备制造有限公司 一种用于曲面led显示屏的气吸装置
KR20210007327A (ko) * 2019-07-11 2021-01-20 미래에이티 주식회사 플렉시블 회로기판 공정용 흡착 장치
CN114174017A (zh) 2019-08-08 2022-03-11 伯克希尔格雷股份有限公司 用于在可编程运动装置中提供具有噪声减低的顺应性末端执行器的系统和方法
CA3168227A1 (en) 2020-01-17 2021-07-22 Material Handling Systems, Inc. Vacuum-based end effector with extendible vacuum cup
CN111584416A (zh) * 2020-04-30 2020-08-25 南通通富微电子有限公司 一种晶圆搬运装置及晶圆减薄设备
EP3909723A1 (en) * 2020-05-13 2021-11-17 Joulin Cemma Vacuum gripper device with foam layer secured by magnetic attraction
FR3115847B1 (fr) * 2020-10-29 2023-01-13 Airbus Helicopters Outil de préhension et robot muni dudit outil
US11551964B2 (en) * 2020-11-17 2023-01-10 Western Digital Technologies, Inc. Semiconductor wafer transfer arm
US11542980B2 (en) 2020-12-30 2023-01-03 Israel Harry Zimmerman Universal quick-release anchor member
US11415266B2 (en) 2020-12-30 2022-08-16 Israel Harry Zimmerman Quick-release anchoring apparatus with self-mounted anchor member
US11255482B1 (en) 2020-12-30 2022-02-22 Israel Harry Zimmerman Quick-release anchoring apparatus with acceleration damping
US20230228373A1 (en) * 2022-01-14 2023-07-20 Mighty Ventures, Inc. Handheld electronic device case with quick-release anchoring capability
US11522988B2 (en) 2021-04-09 2022-12-06 Mighty Ventures, Inc. Object holder with quick-release anchoring capability
US11525475B2 (en) 2021-03-03 2022-12-13 Mighty Ventures, Inc. Object holder with quick-release anchoring capability
WO2023059668A1 (en) * 2021-10-07 2023-04-13 Lam Research Corporation End effector pad design for bowed wafers
DE102022107301A1 (de) * 2022-03-28 2023-09-28 Bundesdruckerei Gmbh Sauggreifer zum Handhaben von Folien

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008023637A (ja) * 2006-07-19 2008-02-07 Yokogawa Electric Corp 移送システム
JP2010177228A (ja) * 2009-01-27 2010-08-12 Disco Abrasive Syst Ltd 研削装置
JP2014038954A (ja) * 2012-08-17 2014-02-27 Apic Yamada Corp 半導体製造装置用吸着ヘッドおよびその製造方法
JP2014110262A (ja) * 2012-11-30 2014-06-12 Dainippon Printing Co Ltd 剥離装置および剥離方法
CN105196162A (zh) * 2014-06-17 2015-12-30 株式会社迪思科 搬送装置
JP2016004909A (ja) * 2014-06-17 2016-01-12 株式会社ディスコ 搬送装置
TWI649157B (zh) * 2014-06-17 2019-02-01 日商迪思科股份有限公司 搬送裝置
JP2019513656A (ja) * 2016-04-06 2019-05-30 サン−ゴバン グラス フランス ガラスシートを支持するための装置、特に洗浄設備においてガラスシートを支持するための装置
JP7115985B2 (ja) 2016-04-06 2022-08-09 サン-ゴバン グラス フランス ガラスシートを支持するための装置、特に洗浄設備においてガラスシートを支持するための装置

Also Published As

Publication number Publication date
TW200505626A (en) 2005-02-16
DE602004025084D1 (de) 2010-03-04
JP4468893B2 (ja) 2010-05-26
HK1088276A1 (en) 2006-11-03
US7726715B2 (en) 2010-06-01
EP1593465B1 (en) 2010-01-13
JPWO2004067234A1 (ja) 2006-05-18
KR101019469B1 (ko) 2011-03-07
KR20050101172A (ko) 2005-10-20
ATE454960T1 (de) 2010-01-15
EP1593465A1 (en) 2005-11-09
CN100396454C (zh) 2008-06-25
CN1744970A (zh) 2006-03-08
US20060232085A1 (en) 2006-10-19
TWI309993B (ja) 2009-05-21
EP1593465A4 (en) 2008-07-23

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