WO2003065428B1 - Systeme de reglage d'etat de formation d'images, procede d'insolation, appareil d'exposition, programme, et support d'enregistrement d'information - Google Patents

Systeme de reglage d'etat de formation d'images, procede d'insolation, appareil d'exposition, programme, et support d'enregistrement d'information

Info

Publication number
WO2003065428B1
WO2003065428B1 PCT/JP2003/000833 JP0300833W WO03065428B1 WO 2003065428 B1 WO2003065428 B1 WO 2003065428B1 JP 0300833 W JP0300833 W JP 0300833W WO 03065428 B1 WO03065428 B1 WO 03065428B1
Authority
WO
WIPO (PCT)
Prior art keywords
information
optical system
projection optical
exposure apparatus
wavefront aberration
Prior art date
Application number
PCT/JP2003/000833
Other languages
English (en)
Japanese (ja)
Other versions
WO2003065428A1 (fr
Inventor
Yasuo Shimizu
Shigeru Hirukawa
Kousuke Suzuki
Tomoyuki Matsuyama
Original Assignee
Nippon Kogaku Kk
Yasuo Shimizu
Shigeru Hirukawa
Kousuke Suzuki
Tomoyuki Matsuyama
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kogaku Kk, Yasuo Shimizu, Shigeru Hirukawa, Kousuke Suzuki, Tomoyuki Matsuyama filed Critical Nippon Kogaku Kk
Priority to KR1020047011623A priority Critical patent/KR100927560B1/ko
Priority to JP2003564921A priority patent/JP4415674B2/ja
Priority to EP03734875A priority patent/EP1478010A4/fr
Publication of WO2003065428A1 publication Critical patent/WO2003065428A1/fr
Publication of WO2003065428B1 publication Critical patent/WO2003065428B1/fr
Priority to US10/901,209 priority patent/US7230682B2/en
Priority to US11/736,177 priority patent/US7405803B2/en
Priority to US11/736,134 priority patent/US7391497B2/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/18—Fire preventing or extinguishing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Un deuxième serveur de communication (930) fait l'acquisition d'une information de réglage sur un dispositif de réglage d'appareils d'exposition (9221 à 9223) sous une condition d'exposition servant de référence et une information sur la performance de formation d'images (telle que l'aberration de front d'onde) d'un système optique de projection via un premier serveur de communication (920) et calcule une valeur optimale de réglage du dispositif de réglage sous la condition d'exposition de référence selon l'information acquise. Par ailleurs, le deuxième serveur de communication fait l'acquisition d'une information de réglage sur le dispositif de réglage sous la condition d'exposition de référence et des données de mesure sur la performance de formation d'images du système optique de projection via un premier serveur de communication (920) et calcule une valeur optimale de réglage du dispositif de réglage sous la condition d'exposition de référence selon l'information acquise. Le deuxième serveur de communication contrôle le dispositif de réglage de l'appareil d'exposition via le premier serveur de communication (920) selon les résultats du calcul.
PCT/JP2003/000833 2002-01-29 2003-01-29 Systeme de reglage d'etat de formation d'images, procede d'insolation, appareil d'exposition, programme, et support d'enregistrement d'information WO2003065428A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020047011623A KR100927560B1 (ko) 2002-01-29 2003-01-29 이미지 형성 상태 조정 시스템, 노광 방법 및 노광 장치, 그리고 프로그램 및 정보 기록 매체
JP2003564921A JP4415674B2 (ja) 2002-01-29 2003-01-29 像形成状態調整システム、露光方法及び露光装置、並びにプログラム及び情報記録媒体
EP03734875A EP1478010A4 (fr) 2002-01-29 2003-01-29 Systeme de reglage d'etat de formation d'images, procede d'insolation, appareil d'exposition, programme, et support d'enregistrement d'information
US10/901,209 US7230682B2 (en) 2002-01-29 2004-07-29 Image forming state adjusting system, exposure method and exposure apparatus, and program and information storage medium
US11/736,177 US7405803B2 (en) 2002-01-29 2007-04-17 Image forming state adjusting system, exposure method and exposure apparatus, and program and information storage medium
US11/736,134 US7391497B2 (en) 2002-01-29 2007-04-17 Image forming state adjusting system, exposure method and exposure apparatus, and program and information storage medium

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002-020712 2002-01-29
JP2002020712 2002-01-29
JP2002-158954 2002-05-31
JP2002158954 2002-05-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/901,209 Continuation US7230682B2 (en) 2002-01-29 2004-07-29 Image forming state adjusting system, exposure method and exposure apparatus, and program and information storage medium

Publications (2)

Publication Number Publication Date
WO2003065428A1 WO2003065428A1 (fr) 2003-08-07
WO2003065428B1 true WO2003065428B1 (fr) 2004-05-13

Family

ID=27667443

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/000833 WO2003065428A1 (fr) 2002-01-29 2003-01-29 Systeme de reglage d'etat de formation d'images, procede d'insolation, appareil d'exposition, programme, et support d'enregistrement d'information

Country Status (7)

Country Link
US (3) US7230682B2 (fr)
EP (1) EP1478010A4 (fr)
JP (1) JP4415674B2 (fr)
KR (1) KR100927560B1 (fr)
CN (1) CN100345252C (fr)
TW (1) TWI223132B (fr)
WO (1) WO2003065428A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8854632B2 (en) 2006-02-21 2014-10-07 Nikon Corporation Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI220998B (en) * 2001-02-13 2004-09-11 Nikon Corp Exposure method, exposure apparatus and manufacture method of the same
US20060285100A1 (en) * 2001-02-13 2006-12-21 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method
WO2003075328A1 (fr) 2002-03-01 2003-09-12 Nikon Corporation Procede de reglage d'un systeme optique de projection, procede de prediction, procede d'evaluation, procede de reglage, procede d'exposition, dispositif d'exposition, programme et procede de fabrication dudit dispositif
DE10224363A1 (de) * 2002-05-24 2003-12-04 Zeiss Carl Smt Ag Verfahren zur Bestimmung von Wellenfrontaberrationen
JPWO2004099874A1 (ja) * 2003-04-16 2006-07-13 株式会社ニコン パターン決定方法及びシステム、マスクの製造方法、結像性能調整方法、露光方法及び装置、並びにプログラム及び情報記録媒体
JP2005079834A (ja) * 2003-08-29 2005-03-24 Pentax Corp 色変換マトリクス算出方法および画像信号処理装置
EP1679737A4 (fr) * 2003-10-31 2008-01-30 Nikon Corp Appareil d'expostion et procede de production de dispositif
JP2007528125A (ja) * 2004-02-25 2007-10-04 カール ツァイス エスエムテー アクチェンゲゼルシャフト 少なくとも一つの光学部品で構成される機器
JP4351108B2 (ja) * 2004-04-07 2009-10-28 日本電子株式会社 Ｓｅｍの収差自動補正方法及び収差自動補正装置
DE102004035595B4 (de) * 2004-04-09 2008-02-07 Carl Zeiss Smt Ag Verfahren zur Justage eines Projektionsobjektives
DE102004020983A1 (de) * 2004-04-23 2005-11-17 Carl Zeiss Smt Ag Verfahren zur Strukturbelichtung einer lichtempfindlichen Schicht
TWI396225B (zh) 2004-07-23 2013-05-11 尼康股份有限公司 成像面測量方法、曝光方法、元件製造方法以及曝光裝置
KR100639676B1 (ko) * 2004-09-21 2006-10-30 삼성전자주식회사 반도체 제조용 포토리소그라피 설비 제어시스템 및 그제어방법
JP4769448B2 (ja) * 2004-10-08 2011-09-07 キヤノン株式会社 干渉計を備えた露光装置及びデバイス製造方法
JP2006165398A (ja) * 2004-12-09 2006-06-22 Toshiba Corp 収差測定方法及び半導体装置の製造方法
JP2006216733A (ja) * 2005-02-03 2006-08-17 Canon Inc 露光装置、光学素子の製造方法及びデバイス製造方法
US7148954B2 (en) * 2005-03-23 2006-12-12 Asml Netherlands B.V. Lithographic apparatus and method for its use
KR20070115863A (ko) * 2005-03-31 2007-12-06 가부시키가이샤 니콘 노광 방법, 노광 장치 및 디바이스 제조 방법
KR20080071552A (ko) 2005-12-06 2008-08-04 가부시키가이샤 니콘 노광 방법, 노광 장치 및 디바이스 제조 방법
TWI457977B (zh) 2005-12-28 2014-10-21 尼康股份有限公司 A pattern forming method and a pattern forming apparatus, and an element manufacturing method
US8411271B2 (en) 2005-12-28 2013-04-02 Nikon Corporation Pattern forming method, pattern forming apparatus, and device manufacturing method
JP4793683B2 (ja) * 2006-01-23 2011-10-12 株式会社ニコン 算出方法、調整方法及び露光方法、並びに像形成状態調整システム及び露光装置
EP1990828A4 (fr) 2006-02-16 2010-09-15 Nikon Corp Appareil d'exposition, procédé d'exposition, et procédé de fabrication du dispositif
WO2007094407A1 (fr) 2006-02-16 2007-08-23 Nikon Corporation Appareil d'exposition, procédé d'exposition, et procédé de fabrication du dispositif
WO2007094414A1 (fr) 2006-02-16 2007-08-23 Nikon Corporation Appareil d'exposition, procédé d'exposition et procédé de fabrication de dispositif
KR101400570B1 (ko) 2006-02-21 2014-05-27 가부시키가이샤 니콘 측정 장치 및 방법, 처리 장치 및 방법, 패턴 형성 장치 및 방법, 노광 장치 및 방법, 그리고 디바이스 제조 방법
EP2541325B1 (fr) 2006-02-21 2018-02-21 Nikon Corporation Appareil d'exposition et procédé d'exposition
US20080013062A1 (en) 2006-03-23 2008-01-17 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
DE102006039895A1 (de) * 2006-08-25 2008-03-13 Carl Zeiss Smt Ag Verfahren zur Korrektur von durch Intensitätsverteilungen in optischen Systemen erzeugten Abbildungsveränderungen sowie entsprechendes optisches System
US8326068B1 (en) * 2006-08-30 2012-12-04 Maxim Integrated Products, Inc. Method and apparatus for modeling quantization matrices for image/video encoding
SG182982A1 (en) 2006-08-31 2012-08-30 Nikon Corp Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
TWI416269B (zh) 2006-08-31 2013-11-21 尼康股份有限公司 Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, and component manufacturing method
CN103645608B (zh) 2006-08-31 2016-04-20 株式会社尼康 曝光装置及方法、组件制造方法以及决定方法
KR101452524B1 (ko) 2006-09-01 2014-10-21 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
TWI596656B (zh) 2006-09-01 2017-08-21 尼康股份有限公司 Moving body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, element manufacturing method, and correction method
WO2008056735A1 (fr) 2006-11-09 2008-05-15 Nikon Corporation Unité de support, système de détection de position et système d'exposition, procédé de déplacement, procédé de détection de position, procédé d'exposition, procédé d'ajustement du système de détection, et procédé de prod
JP4989279B2 (ja) * 2007-04-05 2012-08-01 株式会社東芝 パラメータ値調整方法、半導体装置製造方法およびプログラム
JP4912205B2 (ja) * 2007-04-18 2012-04-11 キヤノン株式会社 露光装置及びデバイス製造方法
US8164736B2 (en) 2007-05-29 2012-04-24 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US8098362B2 (en) 2007-05-30 2012-01-17 Nikon Corporation Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method
WO2009013905A1 (fr) 2007-07-24 2009-01-29 Nikon Corporation Système de mesure de position, dispositif d'exposition, procédé de mesure de position, procédé d'exposition, et procédé de fabrication de composants, outil et procédé de mesure
US8194232B2 (en) 2007-07-24 2012-06-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method
US8547527B2 (en) 2007-07-24 2013-10-01 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and pattern formation apparatus, and device manufacturing method
JP5177449B2 (ja) 2007-07-24 2013-04-03 株式会社ニコン 移動体駆動方法及び移動体駆動システム、パターン形成方法及び装置、露光方法及び装置、並びにデバイス製造方法
US9025126B2 (en) * 2007-07-31 2015-05-05 Nikon Corporation Exposure apparatus adjusting method, exposure apparatus, and device fabricating method
US9304412B2 (en) 2007-08-24 2016-04-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
US8218129B2 (en) 2007-08-24 2012-07-10 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, measuring method, and position measurement system
US8237919B2 (en) 2007-08-24 2012-08-07 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads
US8867022B2 (en) 2007-08-24 2014-10-21 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, and device manufacturing method
US8023106B2 (en) 2007-08-24 2011-09-20 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US9013681B2 (en) 2007-11-06 2015-04-21 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
US9256140B2 (en) 2007-11-07 2016-02-09 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method with measurement device to measure movable body in Z direction
US8665455B2 (en) 2007-11-08 2014-03-04 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
US8422015B2 (en) 2007-11-09 2013-04-16 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
JP2009253210A (ja) * 2008-04-10 2009-10-29 Canon Inc 測定方法、測定装置、露光装置及びデバイス製造方法
NL1036701A1 (nl) * 2008-04-15 2009-10-19 Asml Holding Nv Apparatus for supporting an optical element, and method of making same.
DE102008042356A1 (de) * 2008-09-25 2010-04-08 Carl Zeiss Smt Ag Projektionsbelichtungsanlage mit optimierter Justagemöglichkeit
US8760629B2 (en) 2008-12-19 2014-06-24 Nikon Corporation Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
US8773635B2 (en) 2008-12-19 2014-07-08 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8599359B2 (en) 2008-12-19 2013-12-03 Nikon Corporation Exposure apparatus, exposure method, device manufacturing method, and carrier method
US8902402B2 (en) 2008-12-19 2014-12-02 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US8294878B2 (en) 2009-06-19 2012-10-23 Nikon Corporation Exposure apparatus and device manufacturing method
US8355114B2 (en) 2009-06-19 2013-01-15 Nikon Corporation Exposure apparatus and device manufacturing method
US20110008734A1 (en) 2009-06-19 2011-01-13 Nikon Corporation Exposure apparatus and device manufacturing method
US8446569B2 (en) 2009-06-19 2013-05-21 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
US8355116B2 (en) 2009-06-19 2013-01-15 Nikon Corporation Exposure apparatus and device manufacturing method
US8472008B2 (en) 2009-06-19 2013-06-25 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method
US8488109B2 (en) 2009-08-25 2013-07-16 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
JP5861642B2 (ja) 2009-11-09 2016-02-16 株式会社ニコン 露光装置、露光方法、露光装置のメンテナンス方法、露光装置の調整方法、デバイス製造方法、及びダミー基板
US8495528B2 (en) 2010-09-27 2013-07-23 International Business Machines Corporation Method for generating a plurality of optimized wavefronts for a multiple exposure lithographic process
JP5686567B2 (ja) * 2010-10-19 2015-03-18 キヤノン株式会社 露光条件及びマスクパターンを決定するプログラム及び方法
CN102540745B (zh) * 2010-12-22 2014-01-22 上海微电子装备有限公司 一种基于空间像主成分控制的曝光系统
US9360772B2 (en) 2011-12-29 2016-06-07 Nikon Corporation Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
US9207549B2 (en) 2011-12-29 2015-12-08 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement
NL2010262A (en) * 2012-03-07 2013-09-10 Asml Netherlands Bv Lithographic method and apparatus.
DE102012204704A1 (de) * 2012-03-23 2013-09-26 Carl Zeiss Smt Gmbh Messvorrichtung zum Vermessen einer Abbildungsgüte eines EUV-Objektives
US9772564B2 (en) 2012-11-12 2017-09-26 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method
KR102373075B1 (ko) 2012-11-30 2022-03-11 가부시키가이샤 니콘 반송 시스템, 노광 장치, 반송 방법, 노광 방법 및 디바이스 제조방법, 및 흡인 장치
KR101462848B1 (ko) * 2013-03-18 2014-11-18 에스엔유 프리시젼 주식회사 색정보를 측정할 수 있는 3차원 형상 측정 장치
CN105339846B (zh) * 2013-04-18 2018-06-12 株式会社尼康 基板处理装置以及器件制造方法
JP6478593B2 (ja) * 2014-11-28 2019-03-06 キヤノン株式会社 投影光学系の製造方法、および、デバイス製造方法
WO2016098469A1 (fr) * 2014-12-16 2016-06-23 富士フイルム株式会社 Dispositif de mesure de forme et procédé de mesure de forme
CN104568971B (zh) * 2015-02-05 2018-02-02 昆山软龙格自动化技术有限公司 一种基于数据统计数据挖掘的图像检测装置
JP6955147B2 (ja) * 2017-07-13 2021-10-27 富士通株式会社 画像処理装置、画像処理方法、及び画像処理プログラム
JP6841202B2 (ja) * 2017-10-11 2021-03-10 株式会社Sumco 半導体ウェーハの評価方法および半導体ウェーハの製造方法
NL2022112A (en) 2017-12-19 2019-06-26 Asml Netherlands Bv Lithographic Method and Apparatus
CN111273581B (zh) * 2020-01-23 2021-11-09 深圳市大拿科技有限公司 一种智能衣柜的控制方法及相关产品
JP7426845B2 (ja) * 2020-02-14 2024-02-02 キヤノン株式会社 計測方法、露光方法、物品の製造方法、プログラム及び露光装置
CN113204113B (zh) * 2021-05-20 2022-05-27 中国科学院长春光学精密机械与物理研究所 光学系统的自由曲面优化方法、装置和计算机存储介质
CN113891011B (zh) * 2021-09-30 2023-03-31 中国科学院光电技术研究所 基于波前均方根值的远场观测相机曝光时间自动调节方法

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0712012B2 (ja) * 1985-12-11 1995-02-08 株式会社ニコン 投影露光装置
US4759626A (en) 1986-11-10 1988-07-26 Hewlett-Packard Company Determination of best focus for step and repeat projection aligners
US4786166A (en) * 1987-06-01 1988-11-22 Hewlett-Packard Company Determination of focal plane for a scanning projection aligner
CA1310205C (fr) 1988-03-31 1992-11-17 Roger L. Barr Technique d'analyse quantitative pour lentilles
DE4215154A1 (de) 1991-05-08 1992-11-12 Unitika Ltd Elektrode aus einer verbundwerkstoffbahn
US5424552A (en) 1991-07-09 1995-06-13 Nikon Corporation Projection exposing apparatus
JP2766575B2 (ja) * 1992-01-23 1998-06-18 三菱電機株式会社 投影レンズの評価装置及び評価方法
JP3230536B2 (ja) 1992-04-17 2001-11-19 オリンパス光学工業株式会社 光学性能測定方法及び装置
JP3259373B2 (ja) * 1992-11-27 2002-02-25 株式会社日立製作所 露光方法及び露光装置
JPH06235619A (ja) 1993-02-10 1994-08-23 Olympus Optical Co Ltd 波面収差測定器
US5754299A (en) * 1995-01-13 1998-05-19 Nikon Corporation Inspection apparatus and method for optical system, exposure apparatus provided with the inspection apparatus, and alignment apparatus and optical system thereof applicable to the exposure apparatus
JP3893626B2 (ja) * 1995-01-25 2007-03-14 株式会社ニコン 投影光学装置の調整方法、投影光学装置、露光装置及び露光方法
JPH09167731A (ja) * 1995-12-14 1997-06-24 Mitsubishi Electric Corp 投影露光装置、収差評価用マスクパタン、収差量評価方法、収差除去フィルター及び半導体装置の製造方法
JP3795998B2 (ja) * 1996-04-30 2006-07-12 パイオニア株式会社 波面収差補正ユニット、波面収差補正装置及び光ピックアップ
US5807647A (en) * 1996-07-03 1998-09-15 Kabushiki Kaisha Toshiba Method for determining phase variance and shifter stability of phase shift masks
US5898501A (en) * 1996-07-25 1999-04-27 Nikon Corporation Apparatus and methods for measuring wavefront aberrations of a microlithography projection lens
JP4192279B2 (ja) 1996-09-27 2008-12-10 株式会社ニコン 投影光学系の製造方法、該製造方法によって製造された投影光学系、投影露光装置および方法、並びに半導体装置の製造方法
US5978085A (en) * 1997-03-07 1999-11-02 Litel Instruments Apparatus method of measurement and method of data analysis for correction of optical system
JPH11118613A (ja) 1997-10-15 1999-04-30 Olympus Optical Co Ltd 波面収差の測定装置及び測定方法
JP3673633B2 (ja) * 1997-12-16 2005-07-20 キヤノン株式会社 投影光学系の組立調整方法
JPH11233424A (ja) 1998-02-09 1999-08-27 Nikon Corp 投影光学装置、収差測定方法、及び投影方法、並びにデバイス製造方法
DE19820785A1 (de) 1998-04-17 1999-10-21 Johannes Schwider Absolutprüfung von asphärischen Flächen unter Zuhilfenahme von diffraktiven Normalelementen und planen sowie sphärischen Referenzflächen
WO1999060361A1 (fr) 1998-05-19 1999-11-25 Nikon Corporation Instrument et procede de mesure d'aberrations, appareil et procede de sensibilisation par projection incorporant cet instrument, et procede de fabrication de dispositifs associe
JP2000047103A (ja) 1998-07-27 2000-02-18 Nikon Corp 投影光学系の調整方法
GB9820664D0 (en) * 1998-09-23 1998-11-18 Isis Innovation Wavefront sensing device
JP2000121491A (ja) 1998-10-20 2000-04-28 Nikon Corp 光学系の評価方法
US6100978A (en) * 1998-10-21 2000-08-08 Naulleau; Patrick P. Dual-domain point diffraction interferometer
JP2000146757A (ja) 1998-11-12 2000-05-26 Hitachi Ltd 投影レンズの収差測定方法
US6248486B1 (en) 1998-11-23 2001-06-19 U.S. Philips Corporation Method of detecting aberrations of an optical imaging system
JP3742242B2 (ja) 1999-03-15 2006-02-01 株式会社東芝 収差評価方法
WO2000055890A1 (fr) * 1999-03-18 2000-09-21 Nikon Corporation Systeme d'exposition et procede de mesure d'aberration pour son systeme optique de projection, et procede de production pour ce dispositif
JP2000331923A (ja) 1999-05-24 2000-11-30 Nikon Corp 投影光学系およびその結像特性調整方法並びに投影露光装置
US6118535A (en) * 1999-06-02 2000-09-12 Goldberg; Kenneth Alan In Situ alignment system for phase-shifting point-diffraction interferometry
FR2797957B1 (fr) 1999-08-24 2001-11-16 Thomson Csf Procede et dispositif pour la mesure d'impedance d'antenne
JP2001230193A (ja) 2000-02-18 2001-08-24 Canon Inc 波面収差測定方法及び投影露光装置
EP1128217B1 (fr) * 2000-02-23 2007-08-29 ASML Netherlands B.V. Méthode de mesure des aberrations dans un système optique de formation d'image
TWI256484B (en) * 2000-02-23 2006-07-01 Asml Netherlands Bv Method of measuring aberration in an optical imaging system
TW500987B (en) * 2000-06-14 2002-09-01 Asm Lithography Bv Method of operating an optical imaging system, lithographic projection apparatus, device manufacturing method, and device manufactured thereby
JP4005763B2 (ja) * 2000-06-30 2007-11-14 株式会社東芝 投影光学系の収差補正方法及び半導体装置の製造方法
EP1246014A1 (fr) * 2001-03-30 2002-10-02 ASML Netherlands B.V. Appareil lithographique
US6459480B1 (en) * 2000-09-14 2002-10-01 Advanced Micro Devices, Inc. Measurement method of Zernike coma aberration coefficient
JP2002184667A (ja) * 2000-12-14 2002-06-28 Nikon Corp 補正部材の製造方法、投影光学系の製造方法および露光装置の調整方法
AU2002222663A1 (en) 2000-12-18 2002-07-01 Nikon Corporation Wavefront measuring apparatus and its usage, method and apparatus for determining focusing characteristics, method and apparatus for correcting focusing characteristics, method for managing focusing characteristics, and method and apparatusfor exposure
EP1355140A4 (fr) * 2000-12-28 2006-11-15 Nikon Corp Procede de mesure et d'ajustement de caracteristiques d'imagerie, procede et systeme d'exposition, programme et support d'enregistrement et procede de production de dispositif
JP4552337B2 (ja) 2000-12-28 2010-09-29 株式会社ニコン 投影光学系の製造方法及び露光装置の製造方法
JP4436029B2 (ja) * 2001-02-13 2010-03-24 株式会社ニコン 投影光学系の製造方法及び調整方法、露光装置及びその製造方法、デバイス製造方法、並びにコンピュータシステム
TWI220998B (en) * 2001-02-13 2004-09-11 Nikon Corp Exposure method, exposure apparatus and manufacture method of the same
WO2003075328A1 (fr) * 2002-03-01 2003-09-12 Nikon Corporation Procede de reglage d'un systeme optique de projection, procede de prediction, procede d'evaluation, procede de reglage, procede d'exposition, dispositif d'exposition, programme et procede de fabrication dudit dispositif

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8854632B2 (en) 2006-02-21 2014-10-07 Nikon Corporation Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method
US9423705B2 (en) 2006-02-21 2016-08-23 Nikon Corporation Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method

Also Published As

Publication number Publication date
US7391497B2 (en) 2008-06-24
JPWO2003065428A1 (ja) 2005-05-26
US20050206850A1 (en) 2005-09-22
EP1478010A1 (fr) 2004-11-17
WO2003065428A1 (fr) 2003-08-07
US7405803B2 (en) 2008-07-29
EP1478010A4 (fr) 2007-12-12
CN1625798A (zh) 2005-06-08
US7230682B2 (en) 2007-06-12
US20070188726A1 (en) 2007-08-16
KR100927560B1 (ko) 2009-11-23
TW200401961A (en) 2004-02-01
JP4415674B2 (ja) 2010-02-17
CN100345252C (zh) 2007-10-24
KR20040086306A (ko) 2004-10-08
TWI223132B (en) 2004-11-01
US20070188727A1 (en) 2007-08-16

Similar Documents

Publication Publication Date Title
WO2003065428B1 (fr) Systeme de reglage d'etat de formation d'images, procede d'insolation, appareil d'exposition, programme, et support d'enregistrement d'information
EP1231516A3 (fr) Méthode pour la formation et l adaptation d un système optique et appareil d exposition, détermination de la spécification et système d ordinateur correspondant
TW200717186A (en) Exposure apparatus and method
WO2005031467A3 (fr) Procede d'eclairage microlithographique et systeme d'eclairage par projection permettant de mettre en oeuvre ledit procede
EP4239646A3 (fr) Système chirurgical pour superposer des données d'instrument chirurgical sur une construction virtuelle tridimensionnelle d'un organe
TW200705133A (en) Lithographic apparatus and device manufacturing method
TW200537234A (en) Keystone distortion correction of projector
WO2005111932A8 (fr) Interventions guidees par des images accentuees par des donnees
JP2002359184A (ja) マスクエラー係数補償によりライン幅をコントロールするｄｕｖスキャナ
TW200628999A (en) Lithographic apparatus and device manufacturing method
JP2006210503A5 (fr)
JP2003257842A (ja) 近接効果補正装置、近接効果補正方法、記憶媒体及びプログラム
JP2002324752A5 (fr)
JPWO2021215057A5 (fr)
JP2011501446A5 (fr)
CN105812654A (zh) 光学设备和控制方法
US9904170B2 (en) Reticle transmittance measurement method, projection exposure method using the same, and projection exposure device
EP1418748A3 (fr) Dispositif (imagerie à laser), procédé et logiciel de traitement d'images
JP2010074043A (ja) 半導体製造方法および半導体製造装置
TW201913729A (zh) 圖案化方法、微影蝕刻裝置及物品製造方法
JP2005310958A (ja) パターン形成方法およびその装置ならびに設計データの補正方法およびその装置
JP2005243710A5 (fr)
JP2008182684A (ja) 歪曲補正方法、歪曲補正装置、歪曲補正プログラム、及びディジタルカメラ
JP2006080948A (ja) 複数台モニタの色合わせ装置及び方法
JP2817779B2 (ja) 投影露光装置

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
B Later publication of amended claims

Effective date: 20030728

WWE Wipo information: entry into national phase

Ref document number: 2003564921

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020047011623

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20038029316

Country of ref document: CN

Ref document number: 10901209

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2003734875

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2003734875

Country of ref document: EP