WO2003029899A1 - Composition de resine polyimide photosensible positive - Google Patents

Composition de resine polyimide photosensible positive Download PDF

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Publication number
WO2003029899A1
WO2003029899A1 PCT/JP2002/009559 JP0209559W WO03029899A1 WO 2003029899 A1 WO2003029899 A1 WO 2003029899A1 JP 0209559 W JP0209559 W JP 0209559W WO 03029899 A1 WO03029899 A1 WO 03029899A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
positive photosensitive
organic group
polyimide resin
general formula
Prior art date
Application number
PCT/JP2002/009559
Other languages
English (en)
French (fr)
Inventor
Tomonari Nakayama
Masakazu Kato
Takayasu Nihira
Original Assignee
Nissan Chemical Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Industries, Ltd. filed Critical Nissan Chemical Industries, Ltd.
Priority to JP2003533051A priority Critical patent/JP3882817B2/ja
Priority to US10/488,093 priority patent/US7026080B2/en
Priority to EP02767966A priority patent/EP1431822A4/en
Priority to KR1020047004117A priority patent/KR100905682B1/ko
Publication of WO2003029899A1 publication Critical patent/WO2003029899A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2002/009559 2001-09-26 2002-09-18 Composition de resine polyimide photosensible positive WO2003029899A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003533051A JP3882817B2 (ja) 2001-09-26 2002-09-18 ポジ型感光性ポリイミド樹脂組成物
US10/488,093 US7026080B2 (en) 2001-09-26 2002-09-18 Positive photosensitive polyimide resin composition
EP02767966A EP1431822A4 (en) 2001-09-26 2002-09-18 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION
KR1020047004117A KR100905682B1 (ko) 2001-09-26 2002-09-18 포지티브형 감광성 폴리이미드 수지 조성물

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001293269 2001-09-26
JP2001-293269 2001-09-26

Publications (1)

Publication Number Publication Date
WO2003029899A1 true WO2003029899A1 (fr) 2003-04-10

Family

ID=19115097

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009559 WO2003029899A1 (fr) 2001-09-26 2002-09-18 Composition de resine polyimide photosensible positive

Country Status (7)

Country Link
US (1) US7026080B2 (ja)
EP (1) EP1431822A4 (ja)
JP (1) JP3882817B2 (ja)
KR (1) KR100905682B1 (ja)
CN (1) CN1245665C (ja)
TW (1) TWI306881B (ja)
WO (1) WO2003029899A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005336243A (ja) * 2004-05-25 2005-12-08 Nissan Chem Ind Ltd 高透明性を有するポリ（アミド酸−イミド）共重合体とそのポジ型感光性樹脂組成物およびその硬化膜
JP2006071783A (ja) * 2004-08-31 2006-03-16 Hitachi Chem Co Ltd 感光性樹脂組成物及びそれを用いた微細パターンの製造方法
WO2007125921A1 (ja) * 2006-04-28 2007-11-08 Asahi Kasei Kabushiki Kaisha 感光性樹脂組成物及び感光性フィルム
WO2007136098A1 (ja) * 2006-05-24 2007-11-29 Nissan Chemical Industries, Ltd. ゲート絶縁膜用塗布液、ゲート絶縁膜および有機トランジスタ
JP2008033158A (ja) * 2006-07-31 2008-02-14 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターン硬化膜の製造方法および電子部品
JP2008033157A (ja) * 2006-07-31 2008-02-14 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、硬化膜、パターン硬化膜の製造方法および電子部品
WO2008038550A1 (fr) * 2006-09-25 2008-04-03 Hitachi Chemical Company, Ltd. Composition sensible au rayonnement, procédé de formation d'un film de protection à base de silice, film de protection à base de silice, appareil et élément comportant un film de protection à base de silice et agent photosensibilisant destiné à isoler un film
JP2009004394A (ja) * 2006-05-24 2009-01-08 Nissan Chem Ind Ltd ゲート絶縁膜用塗布液、ゲート絶縁膜および有機トランジスタ
JP2011514985A (ja) * 2008-03-07 2011-05-12 エルジー・ケム・リミテッド ポジティブ型感光性ポリイミド組成物
TWI399597B (zh) * 2006-02-22 2013-06-21 Jsr Corp 液晶配向劑
US9172043B2 (en) 2005-10-28 2015-10-27 Nissan Chemical Industries, Ltd. Charge-transporting varnish for spray or ink jet application
CN105452383A (zh) * 2013-08-09 2016-03-30 太阳控股株式会社 感光性树脂组合物、其浮雕图案膜、浮雕图案膜的制造方法、包含浮雕图案膜的电子部件或光学制品、和包含感光性树脂组合物的粘接剂

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CN100397959C (zh) * 2003-05-06 2008-06-25 三菱瓦斯化学株式会社 贴金属层合物
JP5209844B2 (ja) * 2004-11-30 2013-06-12 株式会社リコー 電子素子及びその製造方法、演算素子並びに表示素子
JP2006206756A (ja) * 2005-01-28 2006-08-10 Sony Chem Corp ポリイミド化合物及びフレキシブル配線板
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US7435989B2 (en) * 2005-09-06 2008-10-14 Canon Kabushiki Kaisha Semiconductor device with layer containing polysiloxane compound
EP2639638A1 (en) * 2005-11-30 2013-09-18 Sumitomo Bakelite Co., Ltd. Positive photosensitive resin composition, and semiconductor device and display therewith
JP4586920B2 (ja) * 2006-04-24 2010-11-24 Ｊｓｒ株式会社 感光性樹脂組成物
EP2102268A2 (en) * 2006-12-12 2009-09-23 E.I. Du Pont De Nemours And Company Crystalline encapsulants
JP2009019105A (ja) 2007-07-11 2009-01-29 Nitto Denko Corp ポリイミドからなる光半導体素子封止用樹脂
WO2009022405A1 (ja) * 2007-08-13 2009-02-19 I.S.T. Corporation 感光性ポリイミド前駆体組成物及びこれを用いた電子部品
KR101110938B1 (ko) * 2007-10-26 2012-03-14 아사히 가세이 가부시키가이샤 폴리이미드 전구체 및 폴리이미드 전구체를 포함하는 감광성 수지 조성물
WO2009078365A1 (ja) 2007-12-14 2009-06-25 Nissan Chemical Industries, Ltd. ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物
KR101115058B1 (ko) * 2008-07-09 2012-02-13 주식회사 엘지화학 폴리이미드-폴리아믹산 공중합체, 이의 제조방법, 이를포함하는 감광성 조성물 및 이에 의해 제공된 보호막
US8257901B2 (en) * 2009-03-10 2012-09-04 Lg Chem, Ltd. Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same
JP5796712B2 (ja) 2009-04-23 2015-10-21 日産化学工業株式会社 ポリヒドロキシイミドの製造方法
JP5450658B2 (ja) * 2009-07-15 2014-03-26 エルジー ケム． エルティーディ． 感光性ポリイミドおよびそれを含む感光性樹脂組成物
US8288656B2 (en) * 2009-08-28 2012-10-16 Lg Chem, Ltd. Low temperature curable photosensitive resin composition and dry film manufactured by using the same
CN102140169B (zh) * 2010-01-28 2013-08-21 长春人造树脂厂股份有限公司 水溶性聚酰亚胺树脂、其制法及其用途
WO2011126076A1 (ja) * 2010-04-09 2011-10-13 大日本印刷株式会社 薄膜トランジスタ基板
KR20130035779A (ko) * 2011-09-30 2013-04-09 코오롱인더스트리 주식회사 포지티브형 감광성 수지 조성물，이로부터 형성된 절연막 및 유기발광소자
SG11201501594UA (en) * 2012-09-25 2015-05-28 Toray Industries Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition
TWI484293B (zh) 2012-11-07 2015-05-11 Chi Mei Corp 感光性樹脂組成物及其應用
KR102386553B1 (ko) * 2015-01-27 2022-04-14 도레이 카부시키가이샤 수지, 감광성 수지 조성물 및 그들을 사용한 전자 부품, 표시 장치
EP3453733B1 (en) * 2016-05-02 2023-01-18 Mitsubishi Gas Chemical Company, Inc. Polyimide resin, polyimide resin composition, and polyimide film
US20170327654A1 (en) * 2016-05-10 2017-11-16 Sumitomo Chemical Company, Limited Optical film and optical member using optical film
KR102079423B1 (ko) * 2016-10-31 2020-02-19 주식회사 엘지화학 폴리이미드 필름 형성용 조성물 및 이를 이용하여 제조된 폴리이미드 필름
JP7063273B2 (ja) * 2016-12-27 2022-05-09 日産化学株式会社 基板保護層形成用組成物
KR20180093203A (ko) * 2017-02-10 2018-08-21 삼성디스플레이 주식회사 폴리아믹산, 폴리이미드 필름 및 폴리이미드 필름의 제조 방법
JP6663380B2 (ja) * 2017-03-22 2020-03-11 信越化学工業株式会社 ポリイミド前駆体の重合体、ポジ型感光性樹脂組成物、ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
JP7292260B2 (ja) * 2018-03-30 2023-06-16 株式会社カネカ ポリアミド酸およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法
WO2020150918A1 (zh) * 2019-01-23 2020-07-30 律胜科技股份有限公司 感光性树脂组合物及其应用
JP7066918B2 (ja) * 2019-04-02 2022-05-13 日本化薬株式会社 ビスマレイミド化合物、それを用いた感光性樹脂組成物、その硬化物及び半導体素子
TWI795064B (zh) * 2020-11-09 2023-03-01 南韓商Ｌｇ化學股份有限公司 光敏樹脂組成物、包括其之光敏材料、包括其之黑色基質以及包括其之電子元件
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Publication number Priority date Publication date Assignee Title
EP0424940A2 (en) * 1989-10-27 1991-05-02 Nissan Chemical Industries Ltd. Positive photosensitive polyimide resin composition
JPH04284455A (ja) * 1991-03-14 1992-10-09 Toshiba Corp 感光性樹脂組成物
EP0863436A1 (en) * 1997-03-03 1998-09-09 Hitachi Chemical Co., Ltd. Heat resistant photosensitive polymer composition, process for forming pattern and semiconductor device
WO2001040873A1 (fr) * 1999-11-30 2001-06-07 Nissan Chemical Industries, Ltd. Composition de resine de polyimide photosensible de type positif
JP2001183834A (ja) * 1999-12-22 2001-07-06 Dainippon Printing Co Ltd ポジ型感光性樹脂組成物、及びそれを用いたパターン形成方法
WO2001075525A1 (fr) * 2000-03-30 2001-10-11 Nissan Chemical Industries, Ltd. Composition de resine polyimide photosensible positive
WO2002029494A1 (fr) * 2000-10-04 2002-04-11 Nissan Chemical Industries, Ltd. Composition de resine de polyimide photosensible positive

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Publication number Priority date Publication date Assignee Title
EP0424940A2 (en) * 1989-10-27 1991-05-02 Nissan Chemical Industries Ltd. Positive photosensitive polyimide resin composition
JPH04284455A (ja) * 1991-03-14 1992-10-09 Toshiba Corp 感光性樹脂組成物
EP0863436A1 (en) * 1997-03-03 1998-09-09 Hitachi Chemical Co., Ltd. Heat resistant photosensitive polymer composition, process for forming pattern and semiconductor device
WO2001040873A1 (fr) * 1999-11-30 2001-06-07 Nissan Chemical Industries, Ltd. Composition de resine de polyimide photosensible de type positif
JP2001183834A (ja) * 1999-12-22 2001-07-06 Dainippon Printing Co Ltd ポジ型感光性樹脂組成物、及びそれを用いたパターン形成方法
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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4678142B2 (ja) * 2004-05-25 2011-04-27 日産化学工業株式会社 高透明性を有するポリ（アミド酸−イミド）共重合体の感光性樹脂組成物およびその硬化膜
JP2005336243A (ja) * 2004-05-25 2005-12-08 Nissan Chem Ind Ltd 高透明性を有するポリ（アミド酸−イミド）共重合体とそのポジ型感光性樹脂組成物およびその硬化膜
JP2006071783A (ja) * 2004-08-31 2006-03-16 Hitachi Chem Co Ltd 感光性樹脂組成物及びそれを用いた微細パターンの製造方法
US9172043B2 (en) 2005-10-28 2015-10-27 Nissan Chemical Industries, Ltd. Charge-transporting varnish for spray or ink jet application
TWI399597B (zh) * 2006-02-22 2013-06-21 Jsr Corp 液晶配向劑
WO2007125921A1 (ja) * 2006-04-28 2007-11-08 Asahi Kasei Kabushiki Kaisha 感光性樹脂組成物及び感光性フィルム
KR101385856B1 (ko) 2006-05-24 2014-04-17 닛산 가가쿠 고교 가부시키 가이샤 게이트 절연막용 도포액, 게이트 절연막 및 유기 트랜지스터
JP2009004394A (ja) * 2006-05-24 2009-01-08 Nissan Chem Ind Ltd ゲート絶縁膜用塗布液、ゲート絶縁膜および有機トランジスタ
WO2007136098A1 (ja) * 2006-05-24 2007-11-29 Nissan Chemical Industries, Ltd. ゲート絶縁膜用塗布液、ゲート絶縁膜および有機トランジスタ
US10573834B2 (en) 2006-05-24 2020-02-25 Nissan Chemical Industries, Ltd. Coating liquid for gate insulating film, gate insulating film and organic transistor
JP2008033157A (ja) * 2006-07-31 2008-02-14 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、硬化膜、パターン硬化膜の製造方法および電子部品
JP2008033158A (ja) * 2006-07-31 2008-02-14 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターン硬化膜の製造方法および電子部品
WO2008038550A1 (fr) * 2006-09-25 2008-04-03 Hitachi Chemical Company, Ltd. Composition sensible au rayonnement, procédé de formation d'un film de protection à base de silice, film de protection à base de silice, appareil et élément comportant un film de protection à base de silice et agent photosensibilisant destiné à isoler un film
US8158981B2 (en) 2006-09-25 2012-04-17 Hitachi Chemical Company, Ltd. Radiation-sensitive composition, method of forming silica-based coating film, silica-based coating film, apparatus and member having silica-based coating film and photosensitizing agent for insulating film
JP2011514985A (ja) * 2008-03-07 2011-05-12 エルジー・ケム・リミテッド ポジティブ型感光性ポリイミド組成物
US8758976B2 (en) 2008-03-07 2014-06-24 Lg Chem Ltd. Positive photosensitive polyimide composition
CN105452383A (zh) * 2013-08-09 2016-03-30 太阳控股株式会社 感光性树脂组合物、其浮雕图案膜、浮雕图案膜的制造方法、包含浮雕图案膜的电子部件或光学制品、和包含感光性树脂组合物的粘接剂

Also Published As

Publication number Publication date
KR20040044970A (ko) 2004-05-31
JPWO2003029899A1 (ja) 2005-01-20
JP3882817B2 (ja) 2007-02-21
EP1431822A1 (en) 2004-06-23
TWI306881B (ja) 2009-03-01
CN1556939A (zh) 2004-12-22
EP1431822A4 (en) 2005-01-05
KR100905682B1 (ko) 2009-07-03
US7026080B2 (en) 2006-04-11
US20040197699A1 (en) 2004-10-07
CN1245665C (zh) 2006-03-15

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