WO2003029322A1 - Curing agent composition for epoxy resins, epoxy resin composition and use thereof - Google Patents

Curing agent composition for epoxy resins, epoxy resin composition and use thereof Download PDF

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Publication number
WO2003029322A1
WO2003029322A1 PCT/JP2002/009992 JP0209992W WO03029322A1 WO 2003029322 A1 WO2003029322 A1 WO 2003029322A1 JP 0209992 W JP0209992 W JP 0209992W WO 03029322 A1 WO03029322 A1 WO 03029322A1
Authority
WO
WIPO (PCT)
Prior art keywords
curing agent
anion
epoxy resin
resin composition
composition
Prior art date
Application number
PCT/JP2002/009992
Other languages
English (en)
French (fr)
Other versions
WO2003029322A9 (en
Inventor
Sunao Maeda
Tatsuhiro Urakami
Tomoyuki Kawabata
Koutarou Suzuki
Tadahito Nobori
Original Assignee
Mitsui Chemicals, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals, Inc. filed Critical Mitsui Chemicals, Inc.
Priority to EP02768102A priority Critical patent/EP1440991A4/en
Priority to JP2003532562A priority patent/JP4527977B2/ja
Priority to KR1020037010910A priority patent/KR100592638B1/ko
Priority to US10/432,368 priority patent/US6911503B2/en
Publication of WO2003029322A1 publication Critical patent/WO2003029322A1/ja
Publication of WO2003029322A9 publication Critical patent/WO2003029322A9/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
PCT/JP2002/009992 2001-09-28 2002-09-27 Curing agent composition for epoxy resins, epoxy resin composition and use thereof WO2003029322A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP02768102A EP1440991A4 (en) 2001-09-28 2002-09-27 HARDENING COMPOSITION FOR EPOXY RESINS, EPOXY RESIN COMPOSITION AND USE THEREOF
JP2003532562A JP4527977B2 (ja) 2001-09-28 2002-09-27 エポキシ樹脂組成物およびその用途
KR1020037010910A KR100592638B1 (ko) 2001-09-28 2002-09-27 에폭시수지용 경화제 조성물, 에폭시수지 조성물 및 그 용도
US10/432,368 US6911503B2 (en) 2001-09-28 2002-09-27 Curing agent composition for epoxy resins, epoxy resin composition and use thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001302166 2001-09-28
JP2001/302165 2001-09-28
JP2001/302166 2001-09-28
JP2001302165 2001-09-28

Publications (2)

Publication Number Publication Date
WO2003029322A1 true WO2003029322A1 (en) 2003-04-10
WO2003029322A9 WO2003029322A9 (en) 2003-11-13

Family

ID=26623348

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009992 WO2003029322A1 (en) 2001-09-28 2002-09-27 Curing agent composition for epoxy resins, epoxy resin composition and use thereof

Country Status (7)

Country Link
US (1) US6911503B2 (ja)
EP (1) EP1440991A4 (ja)
JP (1) JP4527977B2 (ja)
KR (1) KR100592638B1 (ja)
CN (1) CN1223622C (ja)
TW (1) TWI238167B (ja)
WO (1) WO2003029322A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003286330A (ja) * 2002-03-28 2003-10-10 Mitsui Chemicals Inc 硬化性に優れたエポキシ樹脂組成物、その硬化物およびその用途
WO2006003902A1 (ja) * 2004-07-01 2006-01-12 Mitsui Chemicals, Inc. 新規ホスファゼン担持触媒、そのための新規化合物および用途
WO2011019061A1 (ja) * 2009-08-13 2011-02-17 昭和電工株式会社 ポリグリシジルエーテル化合物の製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4731884B2 (ja) * 2004-11-10 2011-07-27 ニチアス株式会社 導電性エポキシ樹脂組成物、エポキシ樹脂成形体及び燃料電池用セパレータの製造方法
US7585904B2 (en) * 2005-01-26 2009-09-08 Hitachi Chemical Company, Ltd. Curing accelerator, curable resin composition and electronic parts device
CN102061063A (zh) * 2010-12-10 2011-05-18 湖北省京珠高速公路管理处 一种用于道路工程维修养护的环氧树脂注浆材料及其制备方法
CN102558769B (zh) * 2010-12-31 2015-11-25 第一毛织株式会社 用于封装半导体器件的环氧树脂组合物以及由该环氧树脂组合物封装的半导体器件
CN103636286B (zh) * 2011-06-23 2017-02-15 三井化学株式会社 光半导体用的表面密封剂、使用其的有机el器件的制造方法、有机el器件以及有机el显示面板
CN107365476B (zh) * 2016-05-12 2019-11-08 中山台光电子材料有限公司 树脂组合物及由其制得的成品
TWI808973B (zh) * 2017-06-28 2023-07-21 日商迪愛生股份有限公司 活性酯化合物及硬化性組成物
CN107915830A (zh) * 2017-11-27 2018-04-17 陕西生益科技有限公司 一种活性酯固化剂以及环氧树脂组合物
CN113340773A (zh) * 2021-06-10 2021-09-03 攀钢集团重庆钒钛科技有限公司 钛白粉流动性的检测方法
CN117701118B (zh) * 2023-12-14 2024-05-03 珠海市金团化学品有限公司 一种光固化水性环氧丙烯酸酯乳液的制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1077289A (ja) * 1996-02-20 1998-03-24 Mitsui Petrochem Ind Ltd ホスファゼニウム塩およびその製造方法ならびにポリアルキレンオキシドの製造方法
EP0959088A2 (en) * 1998-05-21 1999-11-24 Mitsui Chemicals, Inc. An epoxy-resin composition and use thereof
JP2000319358A (ja) * 1999-05-13 2000-11-21 Mitsui Chemicals Inc エポキシ樹脂組成物およびその用途
JP2000327748A (ja) * 1999-05-18 2000-11-28 Mitsui Chemicals Inc エポキシ樹脂組成物およびその用途
JP2000327747A (ja) * 1999-05-18 2000-11-28 Mitsui Chemicals Inc エポキシ樹脂組成物およびその用途
JP2001026644A (ja) * 1999-07-13 2001-01-30 Mitsui Chemicals Inc 末端にエーテル結合およびエステル結合を有するポリアルキレンオキシドの製造方法。

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4424219A1 (de) * 1994-07-09 1996-01-11 Basf Ag Verfahren zur Herstellung von 2,5-Dihydrofuran
US5990352A (en) * 1996-02-20 1999-11-23 Mitsui Chemicals, Inc. Phosphazenium salt and preparation process thereof, and process for producing poly(alkylene oxide)
JP3703296B2 (ja) * 1997-05-22 2005-10-05 三井化学株式会社 ポリマーの製造方法
JP3838795B2 (ja) * 1997-12-22 2006-10-25 三井化学株式会社 ［トリス（ジメチルアミノ）ホスホニオアミノ］トリス［トリス（ジメチルアミノ）ホスホラニリデンアミノ］ホスホニウムジクロリドおよびその製造方法
JP3966641B2 (ja) * 1998-04-16 2007-08-29 三井化学株式会社 オキシアルキレン誘導体の製造方法
JP3688120B2 (ja) * 1998-06-11 2005-08-24 三井化学株式会社 エポキシ樹脂組成物およびその用途
JP3973304B2 (ja) * 1998-10-29 2007-09-12 三井化学株式会社 ２−オキサゾリドン誘導体の製造方法
JP2000355606A (ja) * 1999-04-13 2000-12-26 Mitsui Chemicals Inc ポリマーの製造方法
JP4439620B2 (ja) * 1999-07-23 2010-03-24 三井化学株式会社 ホスファゼニウム塩の製造方法
JP2001040084A (ja) * 1999-08-03 2001-02-13 Mitsui Chemicals Inc ポリオールの製造方法
JP4409002B2 (ja) * 1999-09-22 2010-02-03 三井化学株式会社 ホスファゼニウム塩の製造方法
JP2002069160A (ja) * 1999-12-14 2002-03-08 Mitsui Chemicals Inc 液晶表示セル用シール剤、液晶表示セルシール剤用組成物及び液晶表示素子
JP4612219B2 (ja) * 2000-04-20 2011-01-12 三井化学株式会社 置換芳香族化合物の製造方法
JP4718666B2 (ja) * 2000-06-06 2011-07-06 三井化学株式会社 エポキシ樹脂組成物および接着シート
JP2004018720A (ja) * 2002-06-18 2004-01-22 Mitsui Chemicals Inc 半導体装置用接着剤

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1077289A (ja) * 1996-02-20 1998-03-24 Mitsui Petrochem Ind Ltd ホスファゼニウム塩およびその製造方法ならびにポリアルキレンオキシドの製造方法
EP0959088A2 (en) * 1998-05-21 1999-11-24 Mitsui Chemicals, Inc. An epoxy-resin composition and use thereof
JP2000319358A (ja) * 1999-05-13 2000-11-21 Mitsui Chemicals Inc エポキシ樹脂組成物およびその用途
JP2000327748A (ja) * 1999-05-18 2000-11-28 Mitsui Chemicals Inc エポキシ樹脂組成物およびその用途
JP2000327747A (ja) * 1999-05-18 2000-11-28 Mitsui Chemicals Inc エポキシ樹脂組成物およびその用途
JP2001026644A (ja) * 1999-07-13 2001-01-30 Mitsui Chemicals Inc 末端にエーテル結合およびエステル結合を有するポリアルキレンオキシドの製造方法。

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003286330A (ja) * 2002-03-28 2003-10-10 Mitsui Chemicals Inc 硬化性に優れたエポキシ樹脂組成物、その硬化物およびその用途
WO2006003902A1 (ja) * 2004-07-01 2006-01-12 Mitsui Chemicals, Inc. 新規ホスファゼン担持触媒、そのための新規化合物および用途
JPWO2006003902A1 (ja) * 2004-07-01 2008-04-17 三井化学株式会社 新規ホスファゼン担持触媒、そのための新規化合物および用途
JP4685011B2 (ja) * 2004-07-01 2011-05-18 三井化学株式会社 新規ホスファゼン担持触媒、そのための新規化合物および用途
WO2011019061A1 (ja) * 2009-08-13 2011-02-17 昭和電工株式会社 ポリグリシジルエーテル化合物の製造方法
JPWO2011019061A1 (ja) * 2009-08-13 2013-01-17 昭和電工株式会社 ポリグリシジルエーテル化合物の製造方法

Also Published As

Publication number Publication date
KR100592638B1 (ko) 2006-06-23
CN1489608A (zh) 2004-04-14
JPWO2003029322A1 (ja) 2005-01-13
TWI238167B (en) 2005-08-21
JP4527977B2 (ja) 2010-08-18
CN1223622C (zh) 2005-10-19
EP1440991A4 (en) 2005-01-05
KR20030077636A (ko) 2003-10-01
EP1440991A1 (en) 2004-07-28
WO2003029322A9 (en) 2003-11-13
US20040044167A1 (en) 2004-03-04
US6911503B2 (en) 2005-06-28

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