WO2003018675A1 - Composition de resine, preimpregne, feuille laminee, et boitier de semi-conducteur - Google Patents

Composition de resine, preimpregne, feuille laminee, et boitier de semi-conducteur Download PDF

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Publication number
WO2003018675A1
WO2003018675A1 PCT/JP2002/008845 JP0208845W WO03018675A1 WO 2003018675 A1 WO2003018675 A1 WO 2003018675A1 JP 0208845 W JP0208845 W JP 0208845W WO 03018675 A1 WO03018675 A1 WO 03018675A1
Authority
WO
WIPO (PCT)
Prior art keywords
prepreg
resin composition
semiconductor package
thermosetting resin
laminated sheet
Prior art date
Application number
PCT/JP2002/008845
Other languages
English (en)
French (fr)
Inventor
Takeshi Hosomi
Masako Yamashita
Takayuki Baba
Kentaro Yabuki
Original Assignee
Sumitomo Bakelite Company Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Company Limited filed Critical Sumitomo Bakelite Company Limited
Priority to JP2003523530A priority Critical patent/JP4133817B2/ja
Priority to KR1020047002910A priority patent/KR100920535B1/ko
Priority to EP02772828A priority patent/EP1457515A4/en
Publication of WO2003018675A1 publication Critical patent/WO2003018675A1/ja
Priority to US10/789,914 priority patent/US7368497B2/en
Priority to HK05109244.0A priority patent/HK1077313A1/xx

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/259—Silicic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2002/008845 2001-08-31 2002-08-30 Composition de resine, preimpregne, feuille laminee, et boitier de semi-conducteur WO2003018675A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2003523530A JP4133817B2 (ja) 2001-08-31 2002-08-30 樹脂組成物、プリプレグ、積層板および半導体パッケージ
KR1020047002910A KR100920535B1 (ko) 2001-08-31 2002-08-30 수지 조성물, 프리프레그, 적층판 및 반도체 패키지
EP02772828A EP1457515A4 (en) 2001-08-31 2002-08-30 RESIN COMPOSITION, PREMIX, LAMINATED SHEET, AND SEMICONDUCTOR PACKAGE
US10/789,914 US7368497B2 (en) 2001-08-31 2004-02-27 Resin composition, prepreg, laminate, and semiconductor package
HK05109244.0A HK1077313A1 (en) 2001-08-31 2005-10-20 Resin composition, prepreg, laminated sheet and semiconductor package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-264385 2001-08-31
JP2001264385 2001-08-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/789,914 Continuation-In-Part US7368497B2 (en) 2001-08-31 2004-02-27 Resin composition, prepreg, laminate, and semiconductor package

Publications (1)

Publication Number Publication Date
WO2003018675A1 true WO2003018675A1 (fr) 2003-03-06

Family

ID=19090990

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008845 WO2003018675A1 (fr) 2001-08-31 2002-08-30 Composition de resine, preimpregne, feuille laminee, et boitier de semi-conducteur

Country Status (8)

Country Link
US (1) US7368497B2 (ja)
EP (1) EP1457515A4 (ja)
JP (3) JP4133817B2 (ja)
KR (1) KR100920535B1 (ja)
CN (1) CN100422244C (ja)
HK (1) HK1077313A1 (ja)
TW (1) TWI290942B (ja)
WO (1) WO2003018675A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097524A (ja) * 2003-09-05 2005-04-14 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグおよび積層板
JP2005262513A (ja) * 2004-03-17 2005-09-29 Sumitomo Bakelite Co Ltd 絶縁層付き金属箔及び多層プリント配線板
WO2005092945A1 (ja) * 2004-03-29 2005-10-06 Sumitomo Bakelite Co., Ltd. 樹脂組成物、樹脂付き金属箔、基材付き絶縁シートおよび多層プリント配線板
JP2006273950A (ja) * 2005-03-28 2006-10-12 Sumitomo Bakelite Co Ltd 樹脂組成物、積層体、配線板および配線板の製造方法
CN100383965C (zh) * 2004-01-27 2008-04-23 卡西欧计算机株式会社 半导体器件及其制造方法
WO2008099596A1 (ja) * 2007-02-14 2008-08-21 Sumitomo Bakelite Co., Ltd. キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板
JP2008254451A (ja) * 2008-06-23 2008-10-23 Matsushita Electric Works Ltd 金属箔付き絶縁シート
US8357859B2 (en) 2007-01-16 2013-01-22 Sumitomo Bakelite Co., Ltd. Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate
JP5332608B2 (ja) * 2006-03-03 2013-11-06 住友ベークライト株式会社 中間層材料およびコンポジット積層板

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Publication number Priority date Publication date Assignee Title
JP4957552B2 (ja) * 2005-09-30 2012-06-20 住友ベークライト株式会社 プリント配線板用キャリア付きプリプレグの製造方法、プリント配線板用キャリア付きプリプレグ、プリント配線板用薄型両面板の製造方法、プリント配線板用薄型両面板、及び多層プリント配線板の製造方法
CN101321813B (zh) * 2005-12-01 2012-07-04 住友电木株式会社 预成型料、预成型料的制造方法、基板及半导体装置
US7682879B2 (en) * 2006-03-28 2010-03-23 Seagate Technology Llc Edge coating a microelectronic device
US7859110B2 (en) * 2006-04-28 2010-12-28 Sumitomo Bakelite Co., Ltd. Solder resist material, wiring board using the solder resist material, and semiconductor package
US8455765B2 (en) * 2007-01-29 2013-06-04 Sumitomo Bakelite Company, Ltd. Laminated body, method of manufacturing substrate, substrate, and semiconductor device
CN101611490B (zh) * 2007-02-16 2011-07-27 住友电木株式会社 电路板的制造方法、半导体制造装置、电路板和半导体器件
KR100823998B1 (ko) * 2007-05-28 2008-04-23 전자부품연구원 동박적층판, 인쇄회로기판 및 동박적층판의 제조방법
KR100910767B1 (ko) * 2007-11-13 2009-08-04 삼성정밀화학 주식회사 함침성이 개선된 열가소성 수지 프리프레그의 제조방법 및그 방법에 의하여 제조된 열가소성 수지 프리프레그
WO2010092932A1 (ja) * 2009-02-12 2010-08-19 住友ベークライト株式会社 配線板用樹脂組成物、配線板用樹脂シート、複合体、複合体の製造方法及び半導体装置
TW201204548A (en) * 2010-02-05 2012-02-01 Sumitomo Bakelite Co Prepreg, laminate, printed wiring board, and semiconductor device
KR101842863B1 (ko) 2010-04-05 2018-03-28 니토 보세키 가부시기가이샤 실리카 미립자 보유 유리 섬유 직물의 제조 방법
KR101233668B1 (ko) * 2010-12-23 2013-02-15 전자부품연구원 반도체 패키지 기판용 수지조성물
US8823186B2 (en) 2010-12-27 2014-09-02 Shin-Etsu Chemical Co., Ltd. Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
KR101907713B1 (ko) * 2011-03-14 2018-10-12 스미토모 베이클리트 컴퍼니 리미티드 빌드업용 프리프레그
WO2013032277A2 (en) * 2011-09-02 2013-03-07 Lg Innotek Co., Ltd. Method of manufacturing substrate for chip packages and method of manufacturing chip package
TW201400294A (zh) * 2012-03-30 2014-01-01 Sumitomo Bakelite Co 被研磨物保持材及用於此之積層板
CN102676112B (zh) * 2012-06-08 2014-05-07 黑龙江省科学院石油化学研究院 低温固化氰酸酯胶粘剂及其制备方法
JP6343885B2 (ja) * 2013-08-02 2018-06-20 味の素株式会社 多層プリント配線板の製造方法
JP6277543B2 (ja) * 2013-11-27 2018-02-14 パナソニックＩｐマネジメント株式会社 コンポジット積層板及びその製造方法
JP6317472B2 (ja) 2014-04-03 2018-04-25 エルジー・ケム・リミテッド シアネート系樹脂に対する分散性に優れたシリカゾル組成物及びその製造方法
EP3152251B1 (en) * 2014-06-09 2018-05-02 Dow Global Technologies LLC Process for making curable, multi-layer fiber-reinforced prepreg
CN104191794B (zh) * 2014-09-18 2015-12-30 苏州生益科技有限公司 一种层压板的制备方法
US11040517B2 (en) * 2016-11-09 2021-06-22 Showa Denko Materials Co., Ltd. Printed wiring board and semiconductor package
JP6928908B2 (ja) * 2017-04-07 2021-09-01 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、プリント配線板及びフレックスリジッドプリント配線板
CN110181903B (zh) * 2019-06-06 2021-04-13 江门建滔电子发展有限公司 一种高频高速覆铜板及其制备方法
CN111690231A (zh) * 2020-06-08 2020-09-22 安徽宏飞钓具有限公司 基于高性能纤维复合材料军工产品外包装的制备方法

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JPS62169828A (ja) * 1986-01-22 1987-07-27 Teijin Ltd プリント回路用基板の製造方法
JPH01245038A (ja) * 1988-03-27 1989-09-29 Matsushita Electric Works Ltd 無機物粒子分散樹脂の含浸方法
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JP2005097524A (ja) * 2003-09-05 2005-04-14 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグおよび積層板
CN100383965C (zh) * 2004-01-27 2008-04-23 卡西欧计算机株式会社 半导体器件及其制造方法
US7550843B2 (en) 2004-01-27 2009-06-23 Casio Computer Co., Ltd. Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member
JP2005262513A (ja) * 2004-03-17 2005-09-29 Sumitomo Bakelite Co Ltd 絶縁層付き金属箔及び多層プリント配線板
JP4501475B2 (ja) * 2004-03-17 2010-07-14 住友ベークライト株式会社 絶縁層付き金属箔及び多層プリント配線板
KR101184139B1 (ko) * 2004-03-29 2012-09-18 스미토모 베이클라이트 가부시키가이샤 수지 조성물, 수지 부착 금속박, 기재 부착 절연시트 및다층 프린트 배선판
WO2005092945A1 (ja) * 2004-03-29 2005-10-06 Sumitomo Bakelite Co., Ltd. 樹脂組成物、樹脂付き金属箔、基材付き絶縁シートおよび多層プリント配線板
US7655871B2 (en) 2004-03-29 2010-02-02 Sumitomo Bakelite Company Limited Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring board
JP2006273950A (ja) * 2005-03-28 2006-10-12 Sumitomo Bakelite Co Ltd 樹脂組成物、積層体、配線板および配線板の製造方法
JP5332608B2 (ja) * 2006-03-03 2013-11-06 住友ベークライト株式会社 中間層材料およびコンポジット積層板
US8357859B2 (en) 2007-01-16 2013-01-22 Sumitomo Bakelite Co., Ltd. Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate
JPWO2008099596A1 (ja) * 2007-02-14 2010-05-27 住友ベークライト株式会社 キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板
WO2008099596A1 (ja) * 2007-02-14 2008-08-21 Sumitomo Bakelite Co., Ltd. キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板
US8637151B2 (en) 2007-02-14 2014-01-28 Sumitomo Bakelite Co., Ltd. Interlayer dielectric film with carrier material and multilayer printed circuit board therewith
JP2008254451A (ja) * 2008-06-23 2008-10-23 Matsushita Electric Works Ltd 金属箔付き絶縁シート

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EP1457515A1 (en) 2004-09-15
CN1608100A (zh) 2005-04-20
US7368497B2 (en) 2008-05-06
HK1077313A1 (en) 2006-02-10
JP2010215911A (ja) 2010-09-30
EP1457515A4 (en) 2004-11-24
JPWO2003018675A1 (ja) 2004-12-09
JP2012031428A (ja) 2012-02-16
CN100422244C (zh) 2008-10-01
JP4133817B2 (ja) 2008-08-13
JP5573331B2 (ja) 2014-08-20
KR100920535B1 (ko) 2009-10-08
US20040234741A1 (en) 2004-11-25
KR20040029080A (ko) 2004-04-03
TWI290942B (en) 2007-12-11

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