Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
  • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
  • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
  • B65G47/90—Devices for picking-up and depositing articles or materials
  • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
  • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
  • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
  • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
  • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
  • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
  • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
• • G—PHYSICS
  • G02—OPTICS
  • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
  • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
  • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
  • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
  • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
  • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
  • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
  • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
  • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
  • B65G2201/02—Articles
  • B65G2201/0214—Articles of special size, shape or weigh
  • B65G2201/022—Flat
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
  • B65G2249/04—Arrangements of vacuum systems or suction cups
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T279/00—Chucks or sockets
  • Y10T279/11—Vacuum
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/53—Means to assemble or disassemble
  • Y10T29/5313—Means to assemble electrical device
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/53—Means to assemble or disassemble
  • Y10T29/5313—Means to assemble electrical device
  • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/53—Means to assemble or disassemble
  • Y10T29/5313—Means to assemble electrical device
  • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
  • Y10T29/53178—Chip component
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/53—Means to assemble or disassemble
  • Y10T29/5313—Means to assemble electrical device
  • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
  • Y10T29/53183—Multilead component
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/53—Means to assemble or disassemble
  • Y10T29/5313—Means to assemble electrical device
  • Y10T29/53261—Means to align and advance work part

Definitions

• the present invention relates to a component mounting apparatus and a component mounting method for manufacturing a flat panel display or the like represented by a liquid crystal panel, and more particularly to a substrate transport apparatus and a substrate transport method for transferring a substrate between processes.
• a board transfer device is generally used as a device for positioning a glass substrate at a work position or for transferring the glass substrate between work positions.
• FIGS. 8A and 8B show a conventional substrate transfer device.
• the conventional substrate transfer device 50 has a moving mechanism 53 that can be moved in parallel and rotationally in the XY plane, and is attached to the moving mechanism 53 to support the glass substrate 41.
• a substrate supporting portion 51 is attached to the moving mechanism 53 to support the glass substrate 41.
• the substrate transfer device 50 requires glass substrates of these various sizes. Need to be transported.
• the entire substrate supporting portion is replaced according to the size of the glass substrate to be transferred when the type of flat panel display is switched.
• FIGS. 8A and 8B when transporting a small board 41, a board support section 51 dedicated to the small board is attached to the moving mechanism 53 (see FIG. 8).
• large substrates 4 When transporting 1 ', a large-sized substrate support portion 52 dedicated to the substrate is attached to the moving mechanism 53 (FIG. 8B).
• the entire substrate support portion is replaced in accordance with the size of the glass substrate to be transferred when the type of the flat panel display is changed.
• the present invention has been made in view of such a point, and provides a substrate transport apparatus, a substrate transport method, and a substrate transport apparatus that can reduce the time required for the work of switching types such as a flat panel display. It is an object of the present invention to provide a component mounting apparatus and a component mounting method provided.
• the present invention provides, as a first solution, a moving mechanism, and a substrate supporter attached to the moving mechanism and supporting a substrate, wherein the substrate supporter is an extension supporting the substrate together with the substrate supporter.
• a substrate transfer device having a connection portion for connecting a support portion.
• the substrate support portion has a support portion main body having a support surface, and an outer periphery of the support portion main body has an end portion of the extension support portion as the connection portion. It is preferable to provide an end portion that fits with.
• the substrate supporting portion includes a supporting portion main body having a supporting surface, an adsorbing member mounted on the supporting surface of the supporting portion main body to adsorb and support the substrate, and an inside of the supporting portion main body.
• a suction pipe that is provided and connected to the suction member; and a communication section that communicates the suction pipe with the suction pipe of the additional support section.
• the communication section includes the substrate support section and the additional support section.
• the suction pipe of the substrate support and the suction pipe of the additional support be communicated with each other in conjunction with the connection with the unit.
• the substrate supporter includes: a supporter main body having a support surface; and a suction device mounted on the support surface of the supporter main body for sucking and supporting the substrate. It is preferable to have a member and an adjustment mechanism for adjusting the flatness of the substrate supported by the suction member.
• the additional support portion includes: a support portion main body having a support surface; a suction member attached to the support surface of the support portion body to suction and support the substrate; and a flat surface of the substrate supported by the suction member. It is preferable to have an adjustment mechanism for adjusting the degree.
• an electronic component supporting member disposed on the substrate supporting portion or the additional supporting portion and supporting the electronic component mounted on the substrate is further provided.
• a detecting device for detecting a connection state of the additional support portion, and a determining device for determining whether the substrate to be transported is appropriate based on the detection result of the detecting device and the dimensions of the substrate to be transported. It is preferable to further provide.
• a moving mechanism and a substrate supporting section attached to the moving mechanism and supporting a substrate, wherein the substrate supporting section includes a first supporting section, and a first supporting section. And a second support unit for movably attached to the unit and supporting the substrate together with the first support unit.
• the driving mechanism for moving the second supporting part with respect to the first supporting part, and the second supporting part by the driving mechanism based on a size of a substrate to be transferred.
• the apparatus further includes a control device for controlling the moving amount of the unit.
• a substrate transporting method for supporting and transporting a substrate by a substrate supporting unit attached to a moving mechanism, wherein the substrate supporting unit supports the substrate with the substrate supporting unit.
• a substrate transporting method wherein the supporting portion is detachable and used in a state of the substrate supporting portion alone or in a state where the additional supporting portion is connected to the substrate supporting portion according to the size of a substrate to be supported. I will provide a.
• a component mounting apparatus for mounting an electronic component on a substrate, wherein the substrate transporting apparatus transports the substrate to a work position; and a board positioned at the work position by the substrate transporting apparatus.
• the substrate transfer device has a substrate support portion for supporting the substrate, and the substrate support portion has a connecting portion for connecting an additional support portion for supporting the substrate together with the substrate support portion.
• a component mounting apparatus characterized by the following.
• a component mounting method for mounting an electronic component on a substrate comprising: a supporting step of supporting the substrate by a substrate transfer device having a substrate supporting unit for supporting the substrate; A position determining step of positioning the substrate at the work position by the transfer device; a transfer step of transferring the electronic component to a mounting position for the substrate positioned at the work position by the substrate transfer device; And a pressure bonding step of pressing the transported electronic component on the positioned substrate, wherein the substrate supporting portion has a connecting portion for connecting an additional supporting portion supporting the substrate together with the substrate supporting portion.
• the supporting step includes attaching and detaching the additional supporting portion to and from the substrate supporting portion of the substrate transfer device via the connecting portion according to a dimension of a substrate to be supported. It provides a component mounting method characterized by comprising the that detachable process.
• an additional supporting portion that supports a substrate together with the substrate supporting portion is connected to a substrate supporting portion attached to a moving mechanism or the like. Therefore, even when the type of the flat panel display or the like is switched and the dimensions of the substrate are switched, it is possible to cope with the situation by attaching and detaching the additional support portion. Therefore, even if the size of the substrate to be transferred is large, the entire weight of the substrate supporting member (the substrate supporting portion and the additional supporting portion) can be reduced without replacing the entire substrate supporting member. Only the lighter parts (extension support parts) need to be replaced, and the operator can easily handle the extension support parts, thereby shortening the time required to switch the type of flat panel display and other products. it can.
• the substrate support portion, the additional support portion and Can be easily connected by providing an end portion which fits with an end portion of the additional support portion on the outer periphery of the support portion main body of the substrate support portion, the substrate support portion, the additional support portion and Can be easily connected.
• the connection between the suction pipes can be easily performed by providing a connection part that connects the suction pipe of the substrate support part and the suction pipe of the additional support part in conjunction with the connection between the substrate support part and the extension support part.
• the suction members of the substrate support portion and the additional support portion can be brought into a suction state by using the same vacuum source.
• an adsorbing member attached to the supporting surface of the main body of the supporting portion to adsorb and support the substrate on the substrate supporting portion or the additional supporting portion;
• the substrate supporting portion is configured to be able to move the second supporting portion with respect to the first supporting portion, the type of flat panel display or the like can be switched. Even when the size of the substrate is changed, it can be dealt with only by moving the second support portion, and therefore, it is possible to reduce the time required for the work of changing the type such as a flat panel display.
• FIG. 1A and 1B are perspective views showing a first embodiment of a substrate transfer device according to the present invention.
• FIG. 2 is a partial cross-sectional view of the substrate transfer device shown in FIG. 1B,
• FIG. 3 is an enlarged view showing the II I portion of FIG. 2,
• FIGS. 1A and IB are diagrams showing modifications of the substrate transfer device shown in FIGS. 1A and IB.
• FIGS. 5A and 5B are a side view and a plan view, respectively, showing the overall configuration of a component mounting apparatus provided with the board transfer device according to the present invention.
• FIG. 6A and 6B are a plan view and a side view, respectively, showing a second embodiment of the substrate transfer device according to the present invention
• FIG. 7 is a perspective view showing a third embodiment of the substrate transfer device according to the present invention
• FIGS. 8A and 8B are perspective views showing a conventional substrate transfer device. BEST MODE FOR CARRYING OUT THE INVENTION
• FIGS. 1A to 5B First, a first embodiment of a substrate transfer apparatus according to the present invention will be described with reference to FIGS. 1A to 5B.
• the component mounting apparatus is for mounting an electronic component 42 on a glass substrate 41, and transfers a crimping tool 76 and a crimping tool 76.
• the electronic component 42 attached to the crimping tool 76 can be mounted on the glass substrate 41.
• the transfer mechanism 61 moves the crimping tool 76 in the vertical direction (Z direction).
• the Z-direction moving device 62 moves the crimping tool 76 together with the Z direction moving device 62 in the horizontal direction (Y direction).
• the electronic component 42 sucked by the crimping tool 76 can be transferred from the component delivery position T to the component mounting position B (the edge of the glass substrate 41). It has become.
• the electronic component 42 is supplied from a component supply device 64 including a tray punching mechanism and the like, and is transferred to the intermediate stage 69 by the component extraction mechanism 65.
• the component take-out mechanism 65 includes a suction nozzle 66 for sucking the electronic component 42, a Z-direction moving device 67 for moving the suction nozzle 66 in the Z direction, and a Z-direction moving device for moving the suction nozzle 66. 6 and a Y-direction moving device 68 for moving in the Y-direction.
• the intermediate stage 69 has a mounting table 70 on which the electronic component 42 is mounted, and an X-direction moving device 71 for moving the mounting table 70 in the horizontal direction (X direction).
• a component transfer device is configured by the component extraction mechanism 65, the intermediate stage 69, the transfer mechanism 61, the crimping tool 76, and the like.
• the substrate transfer device 1 includes a moving mechanism 30 that can be moved in parallel and rotationally in the XY plane, and a substrate that is attached to the moving mechanism 30 and supports the glass substrates 4 1 and 4. It has a support 10.
• the moving mechanism 30 has an X table 78, a Y table 79, and a 0 table 80, and moves the substrate supporting portion 10 to the receiving position R of the glass substrate 41, the crimping operation position W and It is configured so that it can be positioned at that of payout position D.
• a backup tool 75 is provided at the component mounting position B so as to face the crimping tool 76 positioned at the component mounting position B.
• the electronic component 42 is attached to the glass substrate 41 by the crimping tool 76.
• the edge of the glass substrate 41 corresponding to the component mounting position B is supported from below by the moving mechanism 30 of the substrate transfer device 1.
• an imaging device 77 for imaging the glass substrate 41 and the electronic component 42 is provided at the component mounting position B. Note that the knock-up tool 75 is retracted from the field of view when the imaging device 77 captures an image of the glass substrate 41 and the electronic component 42.
• a positioning mark is provided on each of the glass substrate 41 and the electronic component 42, and an imaging region including these positioning marks is imaged by the imaging device 77.
• the imaging result obtained by the imaging device 77 is processed by an image processing device (not shown), and the positions of the glass substrate 41 and the electronic component 42 are recognized.
• FIGS. 1A and 1B each show a case where a small glass substrate and a large glass substrate used in a flat panel display are supported.
• the substrate transfer device 1 has a moving mechanism 30 that can be moved in parallel and rotationally in the XY plane, and is attached to the moving mechanism 30 so that the glass substrates 4 1 and 4 1 ′.
• the substrate supporting portion 10 has a supporting portion main body 11, and on the outer periphery thereof, as a connecting portion for connecting the additional supporting portion 20, a support portion main body 21 of the additional supporting portion 20 is provided. An end 1 la that fits into the end 2 lb provided on the inner periphery is provided.
• the glass substrate 41 ′ is supported in a state where the additional support portion 20 is added to the substrate support portion 10.
• a suction pad (suction member) 12 for sucking and supporting the glass substrate 41 and a flatness for adjusting the flatness of the glass substrate 41 are provided on the upper surface (support surface) of the support portion main body 11 of the substrate support portion 10.
• a board flatness adjustment jig (adjustment mechanism) 13 is attached on the upper surface (support surface) of the support portion main body 21 of the additional support 20.
• the board flatness adjusting jigs 13 and 23 can be configured as columns that can adjust the height and the mounting direction on the support surfaces of the support body 11 and 21. Then, the board flatness adjusting jigs 13 and 23 thus configured cooperate with the suction pads 12 and 22 to effectively correct the warpage and undulation of the glass substrates 41 and 41 ′. Specifically, for example, the height measuring device 74 (see FIG. 5A) is moved along the edges of the glass substrates 41, 41 'to measure the warpage and undulation at the edges of the glass substrates 41, 41'. The heights and positions of the columns are adjusted by the board flatness adjusting jigs 13 and 23 in accordance with the measured warpage and undulation.
• the glass substrates 41 and 41 ' are sucked from below by the suction pads 12 and 22.
• the glass substrates 41 and 41 ′ are warped and undulated by the downward suction force of the suction pads 12 and 22 and the upward reaction force of the columns as the substrate flatness adjusting jigs 13 and 23. Is corrected so that the heights at the edges of the glass substrates 41, 41 'are kept uniform.
• the substrate transfer device 1 further includes a detection device 16 for detecting a connection state of the additional support portion 20 to the substrate support portion 10.
• the detection device 16 is movable between an outer region of the additional support portion 20 and an inner region of the substrate support portion 10 shown in FIG. 1B, and based on a change in an output signal during this movement, the detection device 16 Detects the presence or absence of connection.
• the determination device 17 determines whether the glass substrate to be transported is appropriate or not. If the determination device 17 determines that the glass substrate to be transported is not appropriate, a warning or the like may be issued to the operator.
• FIGS. 2 and FIG. 3 the suction pad 12, the support body 11 of the substrate support 10 and the support body 21 of the additional support 20
• Suction tubes 14, 24 connected to 22 are provided.
• a vacuum source (not shown) is connected to at least one of the suction pipes 14, 24.
• the suction tubes 14 and 24 are respectively opened at the ends 11 a and 2 lb of the support body 11 and 21 with the concave portion 15 and the protrusion 25 provided respectively.
• the concave portion 15 and the protruding portion 25 are connected via the seal member 31 in conjunction with the connection between the substrate supporting portion 10 and the additional supporting portion 20 at the end portions 11 &, 2 lb of the supporting portion main bodies 11, 21.
• the suction pipe 14 of the substrate support 10 and the suction pipe 24 of the additional support 20 communicate with each other in a sealed state.
• a valve seat 15a is formed in the concave portion 15, and a ball valve 15b is urged by a spring 15c on the valve seat 15a.
• the suction pipe 14 closes the ball valve 15 b by abutting on the valve seat 15 a, and connects the substrate support portion 10 to the additional support portion 20.
• the ball valve 15b is pushed down by the protrusion 25 and is opened.
• a communicating portion is configured by the concave portion 15, the protruding portion 25, and the seal member 31.
• the electronic component supporting members 32 which support the electronic components 42, 42 ′ mounted on the glass substrates 41, 41 ′,
• Each of the electronic component support members 32 and 32 ′ has a shape (FIG. 4A and FIG. 4B) that fits with the end 11 a of the support body 11 of the board support 10, or supports the extension support 20. end 21 a and the mating shape of such parts body 21 then (Fig. 4 C and Fig. 4D) may to c, the operation of the first embodiment of the present invention having such a structure described I do.
• the electronic component 42 is mounted on the small glass substrate 41.
• the small-sized glass substrate 41 is supported only by the substrate supporting part 10, and the connection of the additional supporting part 20 is unnecessary.
• the electronic component 42 is supplied from the component supply device 64, The parts are transferred to the intermediate stage 69 by the component take-out mechanism 65.
• the component take-out mechanism 65 moves the suction nozzle 66 in the Z direction and the Y direction by the Z-direction transfer device 67 and the Y-direction movement device 68.
• the electronic component 42 sucked by the suction nozzle 66 is transferred to the mounting table 70 of the intermediate stage 69.
• the intermediate stage 69 moves the mounting table 70 in the X direction by the X-direction moving device 71, and transfers the electronic component 42 mounted on the mounting table 70 to the component delivery position.
• the transfer mechanism 61 moves the crimping tool 76 in the Z and Y directions by the Z-direction moving device 62 and the Y-direction moving device 63, and at the component transfer position T, the crimping tool 76 After the electronic components 42 mounted on the mounting table 70 of the intermediate stage 69 are sucked, the electronic components 42 sucked by the crimping tool 76 are moved from the component delivery position T to the component mounting position B ( (The edge of the glass substrate 41).
• the substrate support 10 is positioned at the receiving position R of the glass substrate 41 by the moving mechanism 30, and the glass substrate supplied from the supply means (not shown) at the receiving position R. 4 1 is supported by the suction pad 1 2 and the board flatness adjustment jig 13.
• the substrate supporting unit 10 is moved by the moving mechanism 30 to the pressing position W of the electronic component 42 on the glass substrate 41. Then, at this crimping operation position W, the glass substrate 41 is aligned with the electronic component 42 positioned at the component mounting position B while being sucked by the crimping tool 76 by the transfer mechanism 61.
• the relative positional relationship is recognized using the device 77 and the image processing device.
• the pressing tool 24 is moved by the Z-direction moving device 62 and the Y-direction moving device 63 of the transfer mechanism 61, or the moving mechanism of the substrate transfer device 1 is moved.
• the substrate support 10 By moving the substrate support 10 by 30 (X table 78, Y table 79 and 0 table 80), the electronic component 42 attracted to the crimping tool 76 is aligned with the glass substrate 41. I do.
• the electronic component 42 adsorbed by the crimping tool 76 is attached to the glass substrate.
• the electronic component 42 is temporarily attached to the glass substrate 41 via a connecting member (not shown) such as an anisotropic conductive film.
• the substrate supporting unit 10 moves the electronic component 42 by the moving mechanism 30 to transport the crimped glass substrate 41 to the next work process. Moved to payout position D.
• an additional support 20 corresponding to the difference between the glass substrate 41 ′ and the glass substrate 41 is connected to the substrate support 10. That is, an end portion 11a provided on the outer periphery of the support portion main body 11 of the substrate support portion 10 and an end portion 21b provided on the inner periphery of the support portion main body 21 of the additional support portion 20 are fitted together.
• the large glass substrate 41 ' is supported by the substrate support 10 and the additional support 20.
• the substrate supporting unit 10 to which the additional supporting unit 20 is connected is positioned at the receiving position R of the glass substrate 41 'by the moving mechanism 30, and receives the glass substrate 4 ⁇ f supplied from a supplying means (not shown).
• the substrate supporting unit 10 is moved by the moving mechanism 30 to the pressing operation position W of the electronic component 42 'to the glass substrate 41'.
• the substrate supporting unit 10 moves the electronic component 42 'to the next work step by moving the glass substrate 41' crimped to the next work step. To the payout position D.
• Note c is similar to the case of mounting the electronic components 42 on a small glass substrate 41, an end portion 11 provided in the outer periphery of the support body 11 of the substrate support 10
• the concave section 15 and the projection section provided on the ends 11a and 21b are interlocked therewith.
• 25 is connected via the seal member 31, and the ball valve 15b is opened, whereby the suction pipe 14 of the substrate support 10 and the suction pipe 24 of the additional support 20 communicate in a sealed state.
• the substrate support 10 and the additional support 20 can use the same vacuum source (not shown) to bring the suction pads 12, 22 into the suction state.
• the extension supporter 20 supporting the glass substrate it is possible to connect the extension supporter 20 supporting the glass substrate together with the substrate supporter 10 to the substrate supporter 10 attached to the moving mechanism 30. It is designed to be able to Even when the type of spray or the like is switched and the dimensions of the glass substrate are switched, it is possible to cope with the situation by attaching and detaching the additional support portion 20. For this reason, even when the size of the glass substrate to be transferred is large, a part of the substrate supporting member (the substrate supporting portion 10 and the additional supporting portion 20) is replaced without replacing the entire substrate supporting member.
• the attachment / detachment can be performed simply by fitting the end portion 21 b of the additional support portion 20 to the end portion 11 a of the board support portion 10. Can be done at any time.
• the glass substrates 41, 41 ' are supported by using the suction pads 12, 22 of the substrate support portion 10 and the additional support portion 20, and the substrate flatness adjusting jigs 13, 23.
• the electronic component 42 can be favorably mounted on the substrates 41 and 41 '.
• extension support portion 20 is connected to the substrate support portion 10 .
• present invention is not limited to this, and the support portion main body 21 of the extension support portion 20 is not limited to this.
• a larger number of additional support portions may be sequentially connected using the end portions 21a provided on the outer periphery.
• the suction pipes 14 and 24 are connected to the end portions 11 a and 2 lb of the support body 11 and 21 of the substrate support portion 10 and the additional support portion 20.
• the present invention is not limited to this, and it is also possible to connect the suction pipes 14 and 24 to the outside of the substrate support portion 10 and the additional support portion 20 using a dedicated pipe joint. Further, it is of course possible to suction the suction pipes 14, 24 independently from each other without connecting the suction pipes 14, 24 by a vacuum source (not shown).
• Second embodiment Second embodiment
• FIGS. 6A and 6B a second embodiment of the substrate transfer apparatus according to the present invention will be described with reference to FIGS. 6A and 6B.
• the second embodiment of the present invention is the same as the first embodiment shown in FIGS. 1A to 5B except that the configuration of the substrate transfer device is different.
• the same parts as those in the first embodiment shown in FIGS. 1A to 5B are denoted by the same reference numerals, and detailed description is omitted.
• the substrate transfer device 35 includes a moving mechanism 30 capable of moving in parallel and rotating in the XY plane, and a moving mechanism 3. And a substrate support portion 36 for supporting the glass substrate.
• the substrate support portion 36 is composed of a fixed support portion (first support portion) 37 and a movable support portion (first support portion) movably attached to the fixed support portion 37 via a slide mechanism 39. (2 support portions) 38 so that the movable support portion 38 can be moved according to the dimensions of the glass substrate.
• a substrate flatness adjusting jig for adjusting the flatness of the glass substrate.
• a drive mechanism 81 for driving a slide mechanism 39 to move the movable support section 38 with respect to the fixed support section 37 is further provided, and a control device is provided based on the dimensions of the glass substrate to be transferred. The amount of movement of the movable support section 38 by the drive mechanism 81 may be controlled by the control mechanism 82.
• FIGS. 6A and 6B when transferring a small glass substrate, the glass substrate is supported while the movable support portion 38 is in contact with the fixed support portion 37 (see FIGS. 6A and 6B).
• FIGS. 6A and 6B When transporting a large glass substrate, support the glass substrate while moving the movable support section 38 away from the fixed support section 37 to a predetermined position (see the solid line in Fig. 6B) (Fig. 6). A and phantom lines in Figure 6B).
• the movable supporting portion 38 can be moved relative to the fixed supporting portion 37 in the substrate supporting portion 36, the Even when the size of the glass substrate is changed by switching the product type such as the top panel display, it can be dealt with only by moving the movable support 38. Therefore, as in the first embodiment described above, it is possible to reduce the time required for the work of changing the type of flat panel display or the like and to reduce the running cost.
• the third embodiment of the present invention is similar to the first embodiment shown in FIGS. 1A to 5B except that the glass substrate is supported only by the additional support portion of the substrate transfer device. This is the same as the embodiment.
• the same parts as those in the first embodiment shown in FIGS. 1A to 5B are denoted by the same reference numerals, and detailed description is omitted.
• the substrate transfer device can be configured such that an additional pad 20 and a substrate flatness adjustment jig are not provided on the substrate support 20. Only the suction pad 22 and the board flatness adjusting jig 23 are provided.
• additional support portions 20 a, 20 b, and 20 c having different outer shapes are prepared, and the additional support portions 20 a, 20 a, and 20 c are provided according to the size of the glass substrate to be transferred.
• the configuration is such that 20 b and 20 c are exchanged.
• the connecting portion with the substrate supporting portion 10 has a common structure among the additional supporting portions 20a, 20b, and 20c. That is, each of the additional support portions 20a, 20b, and 20c is provided with an end portion 21b that fits with the end portion 11a of the substrate support portion 10.
• the extension support section 20 & is connected to the board support section 10 by fitting. Then, the small glass substrate 41a is sucked and supported by the suction pad 22 and the substrate flatness adjusting jig 23 provided on the additional support portion 20a.
• an intermediate supporting member 2Ob corresponding to the medium-sized glass substrate 41b is selected, and the outer periphery of the supporting member body 11 of the substrate supporting member 10 is selected.
• the end support 11 Ob provided on the extension support 2 Ob and the end 2 lb provided on the inner periphery of the additional support 2 Ob are fitted to each other to connect the additional support 2 Ob to the substrate support 10.
• the medium-sized glass substrate 41b is sucked and supported by the suction pad 22 and the substrate flatness adjusting jig 23 provided on the additional support portion 20b.
• the largest one of the three types of additional support portions 20a, 20b, and 20c corresponding to the large glass substrate 41c is used. 0c is selected, and the end 11a provided on the outer periphery of the support body 11 of the substrate support 10 and the end 2lb provided on the inner periphery of the additional support 20c are fitted. Then, the additional support portion 20c is connected to the substrate support portion 10. Then, the large glass substrate 41c is sucked and supported by the suction pad 22 and the substrate flatness adjusting jig 23 provided on the additional support portion 20c.
• the dimensions of the glass substrates 4 la, 41 b, and 41 c to be transported are set on the substrate supporting part 10 attached to the moving mechanism 30. Since the combined extension support sections 20a, 20b, and 20c can be connected, even if the type of flat panel display is switched and the dimensions of the glass substrate are switched, the extension support section is supported. This can be dealt with by attaching and detaching only the sections 20a, 20b, and 20c. Therefore, similar to the case of the first embodiment described above, it is possible to change the type of flat panel display or the like. The required time and running cost can be reduced.
• the glass substrates 41a, 41b, and 41c are supported using the suction pads 22 of the additional support portions 20a, 20b, and 20c and the substrate flatness adjustment jigs 23.
• the flatness of the edge of the glass substrate 41a, 4lb, 41c on which the electronic components are mounted is adjusted.
• a glass substrate used in a flat panel display or the like has been described as an example. However, the present invention is not limited to this. Can be applied to any of the substrates.

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