WO2001092800A1 - Heat treatment apparatus - Google Patents
Heat treatment apparatus Download PDFInfo
- Publication number
- WO2001092800A1 WO2001092800A1 PCT/JP2001/004392 JP0104392W WO0192800A1 WO 2001092800 A1 WO2001092800 A1 WO 2001092800A1 JP 0104392 W JP0104392 W JP 0104392W WO 0192800 A1 WO0192800 A1 WO 0192800A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- heat treatment
- structural member
- insulating structural
- matsufuru
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B25/00—Annealing glass products
- C03B25/04—Annealing glass products in a continuous way
- C03B25/06—Annealing glass products in a continuous way with horizontal displacement of the glass products
- C03B25/08—Annealing glass products in a continuous way with horizontal displacement of the glass products of glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
- C03B29/04—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way
- C03B29/06—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way with horizontal displacement of the products
- C03B29/08—Glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
- F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/08—Parts thereof
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/02—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity of multiple-track type; of multiple-chamber type; Combinations of furnaces
- F27B9/028—Multi-chamber type furnaces
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/06—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated
- F27B9/08—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated heated through chamber walls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
- F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace
- F27B9/26—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace on or in trucks, sleds, or containers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D1/00—Casings; Linings; Walls; Roofs
- F27D1/14—Supports for linings
- F27D1/145—Assembling elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D1/00—Casings; Linings; Walls; Roofs
- F27D2001/0059—Construction elements of a furnace
- F27D2001/0069—Means to prevent heat conduction
Definitions
- the present invention relates to a heat treatment apparatus for heat treating a raw material, an intermediate product, or a final product.
- Plasma displays ⁇ Various documents such as panels, solar panels and resistance chips
- heat treatments such as heating and cooling
- Many effects achieved by heat treatment are known. Specifically, drying, dehydration, calcination, reaction promotion, surface modification, sealing, exhaust, anneal and the like are known.
- the heat treatment apparatus When the heat treatment apparatus is a heating furnace, the heat treatment apparatus generally has a plurality of heat treatment chambers along the transport direction of the object. Each heat treatment chamber has a space in which the object to be treated is heat-treated, that is, a heat treatment zone.
- Heating furnaces generally include a heating zone (heating chamber) for heating and raising the temperature of the workpiece, a constant temperature zone (constant temperature chamber) for keeping the temperature of the heated workpiece constant, and cooling and cooling the workpiece. It has a cooling zone (cooling room) as a heat treatment zone.
- the workpiece is subjected to a predetermined heat treatment while passing through each zone in the above-described order. Usually, heat is applied in the heating zone, and in the constant temperature zone, heat is supplied in an amount corresponding to the amount of heat released. In addition, heat is removed in the cooling zone.
- the temperature raising zone and the constant temperature zone in which heat is applied to the workpiece may be referred to as a heating zone.
- a cooling zone that removes heat from the workpiece is sometimes referred to as a cooling zone.
- the cooling zone may also be referred to as a slow cooling zone or a rapid cooling zone, depending on the temperature of the workpiece (cooling rate) that falls between entering the zone and exiting the zone.
- the slow cooling zone refers to, for example, the temperature of an object to be processed that has entered the zone.
- C / min to several tens.
- the quenching zone refers to the temperature of an object to be processed that has entered the zone, for example, several hundred.
- CZ min It refers to the zone that is lowered at the above ratio.
- the dimensions of the heating zone and the cooling zone are determined based on the heat treatment conditions such as the time required for heating, the retreat speed, and the removal temperature, and the installation space of the heat treatment equipment, based on the throughput of the object to be treated.
- the temperature in the heat treatment chamber (that is, the temperature of the heat treatment zone) needs to be maintained at a predetermined temperature state so that a predetermined heat treatment is performed in each heat treatment chamber. Therefore, the temperature inside the heat treatment chamber is controlled by appropriate heating or cooling means and a temperature monitor.
- the heat treatment apparatus having a plurality of heat treatment chambers includes a heat treatment apparatus that intermittently moves an object to be processed in a heat treatment zone in each heat treatment chamber and a heat treatment apparatus that continuously moves an object to be processed.
- An example of a heat treatment apparatus in which an object to be processed is intermittently moved is described in, for example, Japanese Patent Publication No. 1-14-1620.
- this heat treatment apparatus has a shutter device having a flat plate-shaped shutter at a boundary between heat tl heat zones, and a pair of heat insulating walls provided so as to sandwich the shutter.
- the shutter is positioned at a shielding position that shields each heating zone from each other, or at a retracted position that avoids interference with the conveyed work. That is, the shirt is positioned at the top position when the work moves between the heating zones, and is positioned at the shielding position when the work is carried into the heating zone.
- the work carried into the calo-heat zone is stopped or reciprocated in the heating zone and heat-treated so as to reach a predetermined temperature.
- the shirts shield the heating sections from each other, and the heat insulating walls provided at the boundary between the heating zones and the air layer formed between the heat insulating walls have a heat insulating effect. This minimizes the thermal effects of each heating section from other adjacent heating zones.
- the air layer formed between the insulating walls also prevents direct heat transfer from the hot zone to the cold zone. Therefore, according to this heat treatment apparatus, the temperature of each heating section can be quickly controlled to a predetermined temperature after the work is intermittently fed and the shirt is closed. That is, this heat treatment In the treatment equipment, the independence of each heat treatment zone is secured by the movable shutter and the heat insulating wall. This has the advantage that the quality of the object to be treated is ensured and the overall length of the heat treatment apparatus can be reduced.
- One of the heat treatment apparatuses that has a plurality of heat treatment chambers and in which an object to be processed is continuously moved is a heat treatment chamber having a tunnel-like structure called Matsufuru, which is heated or cooled by an appropriate heating means or cooling means. Therefore, there is an apparatus for indirectly heat-treating a workpiece while transporting the workpiece.
- the transfer of the object to be processed is performed using a transfer means such as a mesh belt conveyor or a roller hearth.
- This type of heat treatment equipment is often referred to as a matsufur furnace or a matsuful structure heating furnace.
- the heat treatment zone is defined by the walls of the Matsufuru, and this heat treatment zone is a heat treatment atmosphere maintained at a predetermined temperature by heating means arranged outside the Matsufuru.
- Heat treatment atmosphere refers to the space in which the object is placed, and applying heat to or removing heat from the object placed in the space is included in the space. This may be done by gas, heating devices, cooling devices, and / or walls that define the space.
- the “heat treatment atmosphere” is also simply called “atmosphere”.
- the gas contained in the heat treatment atmosphere is also called “atmosphere gas”.
- the object to be treated is conveyed in this heat treatment atmosphere, and is indirectly heated or cooled through the inner surface of the wall constituting the matsufuru, so that the heat treatment is performed as desired.
- the heat treatment zone since there is no heating means or the like in the heat treatment zone, for example, uneven heating and fluctuations in heating control in the heat treatment zone due to the heater shape are reduced. That is, since the heat treatment zone has a more uniform heat treatment atmosphere, the object to be treated can be stably heat treated with a desired temperature profile.
- Matsufuru is generally a metal tubular structure. As Matsufuru, for example, one that is integrally processed into a cylindrical shape is used. Alternatively, a square tubular muffle can be formed by surrounding the four sides with a heat insulating block plate.
- Fig. 13 shows an example of the basic configuration of the Matsufuru furnace.
- the illustrated Matsufuru furnace (100) has a heating zone (heating zone) that heats and raises the temperature of the workpiece along the transport direction of the workpiece. Chamber) and a cooling zone (cooling chamber) for cooling and lowering the temperature of the object to be processed.
- the object to be processed passes through each zone sequentially and continuously, and during this time, a predetermined heat treatment is applied to the object to be processed.
- the Matsufur furnace shown in Fig. 13 will be described in more detail.
- Matsufuru (2) which forms the heating zone, is made of metallic material and its outer wall is surrounded by an electric heater module (1).
- the heated Matsufuru (2) is heated by the electric heater module (1) and is maintained at a predetermined temperature according to the desired heat treatment.
- the cooling muffle (8) that forms the cooling zone is also made of metallic material.
- a cooling water pipe (7) is arranged on the surface of the cooling matsufur (8), and the inside of the rejected matsufur (8) is maintained at a predetermined temperature by the cooling water passing through the cooling water pipe (7).
- the entire pine cone, including the heater module (1), is surrounded by walls (or outer panels) (110).
- the mesh belt (3) which is the carrier, moves continuously in one direction.
- the object (4) to be heat-treated is placed on the mesh velvet (3) and moves from the loading section (5) to the unloading section (6).
- the mesh belt is arranged in parallel with the installation surface of the device (the ⁇ - ⁇ plane shown in FIG. 13) and moves in the X direction.
- roller hearths As a carrier other than the mesh belt, a number of cylindrical rollers are used so that their longitudinal direction is perpendicular to the transport direction and parallel to the installation surface of the device (the X- ⁇ plane shown in Fig. 13). (That is, along the direction ⁇ in FIG. 13). Such carriers are commonly referred to as "roller hearths". When a roller hearth is used, the workpiece is conveyed by the rotation of the rollers.
- the workpiece (4) is heated while passing through the heated Matsufuru (2) maintained at a predetermined temperature.
- the mesh belt (3) and the workpiece (4) are heated pine full
- FIG. 14 shows the connection between the heating pine hull (10) around which the heater (9) is arranged and the cooling pine hull (13) whose cooling water pipe (11) is bonded to the surface with heat-resistant cement (12). Is schematically shown in a sectional view. Heated pine full (10) The cooling matsufuru (13) is mechanically connected to the cooling matsufur (13) by a port no nut (18) at a connection portion (a flange in the illustrated embodiment) (16).
- a sealing material (17) made of a non-combustible material (for example, asbestos or non-combustible carbon-based material) is sandwiched between the connection portions (16).
- the sealing material prevents the atmosphere gas contained in the heat treatment zone (14a, 14b) in each Matsufuru (10, 13) from leaking from the connection to the outside atmosphere (15) of each Matsufuru (10, 13). Used to prevent. In such a Matsufuru furnace, the heating zone is hardly independent because the object to be treated (25) is continuously fed.
- the ratio of heat energy used for heat treatment of an object to be treated that is, effective heat efficiency
- the effective thermal efficiency refers to the ratio of the thermal energy used for the heat treatment of the object to be processed among the energy input to the heat treatment apparatus by the heating heater (9).
- heat loss most of the heat energy supplied by the heater (9) is wasted energy that is not used for actual heat treatment, and can be called heat loss.
- the effective heat efficiency is 5% or less, although the heat capacity of the object is generally extremely small. .
- This is due to the fact that heat treatment is performed in a stable and large heat treatment atmosphere to maintain product quality and yield.
- the lower the effective thermal efficiency the greater the amount of thermal energy that must be supplied to the heat treatment equipment. This will increase the running cost of the heat treatment equipment and, consequently, the cost of the product. Therefore, cost reduction by reducing the energy supplied to the heat treatment apparatus (ie, energy saving) is desired.
- energy saving of production equipment such as heat treatment equipment that consumes a large amount of heat energy has been strongly desired from the viewpoint of coexistence with production activities of companies and the global environment.
- Effective thermal efficiency tends to be lower in heat treatment equipment that includes two heat treatment chambers adjacent to each other, where the temperature difference in the heat treatment chamber is large. That is, the heat loss in the case of the heat treatment apparatus shown in FIG. 1 3, the connecting portion smell heating Matsufuru (10) cooling Matsufuru 3) and Occurs most often.
- the reason why the heat treatment equipment is a matsufurn furnace equipped with a heated matsufuru and a cooled matsufuru as shown in Fig. This will be explained together with the heat transfer path followed by the heat.
- Another heat transfer path is water flowing through the cooling water pipe located outside the cooling pineapple.
- the heat released from the water flowing through the rejection water pipe to the outside of the furnace includes the heat released from the object and the carrier heated in the heated Matsufuru.
- the heat released from the carrier or the like is ultimately transmitted to the ambient gas in the cooling matsufuru and transmitted to the wall of the cooling muffle, or the contact between the carrier and the cooling muffle or the carrier
- the heat radiation generated between the cooling muffle and the wall of the cooling muffle transfers it to the wall of the reject muffle and then to the water flowing through the cooling water pipe located outside the cooling muffle, raising the temperature of the water, thereby increasing the temperature of the furnace. It will be released outside.
- heat transfer path there is a path using an atmospheric gas as a medium.
- the release of heat through this route means that heat is taken out of the furnace by the supply and exhaust of atmospheric gas. All the heat released in this way results in heat loss.
- the amount of heat brought out by the atmosphere gas varies depending on the heat treatment method. For example, when a drying process for evaporating an organic solvent or the like is performed as a heat treatment, the supply and exhaust amount of the atmospheric gas increases, and accordingly, the amount of heat taken out also increases.
- the amount of the solvent that evaporates during the heat treatment is small (for example, when firing ceramics)
- the amount of supply and exhaust of the atmospheric gas can be small, and therefore, the amount of heat taken out of the furnace Is very small compared to the amount of heat released through the furnace wall and cooling water.
- the proportion of the heat energy released through each of the above heat transfer paths depends on the type of heat treatment apparatus and operating conditions.
- temperature conditions supply of atmospheric gas in the heat treatment zone It varies depending on the displacement, the transport speed of the workpiece, and the type of workpiece.
- the heat energy released from the furnace wall is about 30 to 20% of the heat input energy, and is released outside the furnace by cooling water. Heat is about 70 to 80% of the heat input energy.
- the heat taken out by the atmospheric gas changes depending on the exhaust condition of the atmospheric gas, and becomes several% to several tens% of the heat input energy.
- the ratio of heat released through each heat transfer path can be calculated from the heat input energy, the temperature in the heat treatment chamber, the temperature of the object to be treated, the temperature of the water flowing through the cooling water pipe, and the flow rate.
- the carrier force ⁇ the amount of heat released is large.
- the carrier is heated to the same temperature as the ambient gas in order to keep the temperature around the object to be treated in the heating zone constant.
- the carrier is configured to have a high heat resistance suitable for carrying the object to be processed in the heat treatment space.
- the size of the carrier tends to increase, and the heat capacity of the carrier necessarily increases accordingly.
- the greater the heat capacity the greater the energy required to raise the temperature. Therefore, when the carrier is cooled, a large amount of heat energy stored in it is released.
- the transfer body is indispensable for transferring the object to be processed to an atmosphere at a desired temperature in the heat treatment apparatus.
- the heat energy released from the carrier is supplied only for the purpose of keeping the temperature around the object to be treated constant, and therefore results in heat loss. This heat loss usually accounts for about 20 to 30% of the heat input energy.
- the present inventors found that in the Matsufuru furnace described above, of the heat released through the water flowing through the cooling water pipe, about 25 to 45% of the heat input energy We have found that the corresponding heat comes from the conduction of heat from the Matsufuru walls that define the heating zone to the Matsufuru walls that define the cooling zone. Then, by providing a means for effectively suppressing this heat conduction in the heat treatment apparatus, the heat treatment apparatus of the present invention, in which the heat loss is smaller than that of the conventional heat treatment apparatus, has been completed.
- heat equivalent to about 5 to 20 ° / 0 of the heat input energy is used to reduce the convective heat transfer between the atmosphere in the heating muffle and the atmosphere in the cooling muffle, and the heat muffle. It was found to be from radiant heat transfer from the inner surface of the wall to the cooling zone.
- FIG. 12 shows an example of a thermal diagram of a conventional electric heating type Matsufuru furnace created based on the knowledge newly obtained by the present inventors.
- FIG. 12 is a heat treatment chart for baking an object to be processed, in which a small amount of atmospheric gas is supplied and exhausted with little evaporation of a solvent. It should be noted that the heat diagram shown is merely an example, and the ratio of the released heat varies depending on the type of heat treatment and the operating conditions of the furnace.
- heat treatment refers to treatment of an object to be heated, constant temperature, temperature reduction, or a combination thereof, and includes raising, lowering, or maintaining a constant temperature of the object.
- the treatment may be a combination of the above, either applying heat to or removing heat from the object to be treated, or any of these various combinations (including possibly insulating). It should be noted that this process may be performed.
- at least one property of the workpiece for example, moisture retention, weight, electric resistance, transmittance, formed film thickness or uniformity, internal stress or strain, strength, composition, etc. is determined. So change I do.
- the process of applying heat to the workpiece includes a process of raising the temperature of the workpiece to a predetermined temperature for a predetermined time and a process of maintaining the temperature of the workpiece at a predetermined temperature for a predetermined time. And a process of exposing the workpiece to a predetermined temperature change condition.
- the process of removing heat from the workpiece is a method that does not apply heat, that is, a method that uses natural cooling, or a surface that absorbs heat that can be blown by power or controlled at a predetermined temperature.
- the method includes a process of lowering the temperature of an object to be processed by a method of forcible cooling using a heat-dissipating surface or the like.
- the cooling process includes the above-described slow cooling.
- the workpiece is gradually cooled, the workpiece is subjected to a cooling process in a heat treatment zone where the temperature is lower than the temperature of the workpiece by a heater or the like in order to prevent a rapid temperature drop.
- a heater or the like in order to prevent a rapid temperature drop.
- a heat treatment apparatus of the present invention that is, a heat treatment apparatus provided with a means for effectively suppressing heat conduction between the walls of Matsufuru will be described.
- a heat treatment apparatus including a plurality of muffles as a heat treatment chamber, wherein an object to be processed is transferred and heat-treated in the muffle, wherein the temperatures in the muffles are different from each other.
- One set of two adjacent Matsufuru is connected via a heat insulating structural member, and the heat insulating structural member provides a heat treatment apparatus having a tunnel structure through which an object to be processed passes.
- the temperature inside the muffle is generally the temperature of the ambient gas inside the muffle. Heat conduction occurs between the two Matsufuru with different temperatures in the muffle.
- the heat treatment apparatus of the present invention reduces heat loss due to heat conduction between the Matsufuru by interposing a heat insulating structural member between two Matsufuru where such heat conduction occurs.
- the heat insulating structural member is a member configured to reduce heat conduction between muffles.
- the heat insulating structural member has a tunnel structure so that the transfer of the object between the muffle and the Matsufuru is not hindered, and the object passes through the inside of the tunnel structure.
- a heat insulating structural member having a “tunnel structure” means that the heat insulating structural member is open. It has a cavity that has an opening and an outlet, and has a structure in which an object to be processed carried in from the inlet is discharged from the outlet. That is, the heat-insulating structural member having the tunnel structure has a hollow portion that penetrates in the transport direction of the workpiece. The cut section formed when this hollow portion is cut in a direction perpendicular to the transport direction of the workpiece does not form a completely closed surface, but always has an open portion. Therefore, when the heat insulation structural member is arranged between the heat treatment chambers Matsufuru and Matsufuru, the tunnel structure of the heat insulation structural member provides a passage connecting the heat treatment chambers. Such a tunnel structure is formed by defining a cavity with walls.
- the heat insulating structural member used in the present invention also has a substantial length (dimension) in the transport direction of the object to be processed. That is, the heat insulating structural member is not in a plate shape or a sheet shape.
- the heat insulating structural member provided to reduce the heat conduction between Matsufuru is specifically configured as follows.
- the wall of the heat-insulating structural member is made of a material having a lower thermal conductivity than the material of Matsufuru.
- the heat insulating structural member is configured so that the thickness of the wall is not constant, that is, partially reduced. Increasing the thickness of the wall reduces the area of the cross section perpendicular to the direction of heat transfer (for example, the direction from the heated matsufur to the cooling matsufull) (hereinafter, this surface is referred to as the heat conduction cross section). For example, it is possible to effectively prevent heat from being transmitted from the heated matsufur to the cooling muffle in the cross section.
- Walls having a partially reduced thickness are walls having recesses (eg, grooves).
- At least a part of the heat insulating structural member is made of a thin plate. That is, at least a part of the wall of the heat insulating structural member is made a thin plate.
- “thin plate” refers to a plate-like object having a thickness smaller than the thickness of the wall of Matsufuru!
- at least a part of this heat-insulating structural member is made of a plate-like material having a small heat conduction cross-sectional area, and effectively suppresses heat conduction between the pinholes.
- the heat insulating structural member may be a combination of at least two of the above configurations (1) to (3).
- the insulating structure is compared to the case without the insulating structure.
- the heat energy supplied to the heat treatment apparatus is reduced by 10% or more.
- the heat-insulating plate member is provided on at least one of both ends of the tunnel structure of the heat-insulating structural member without obstructing the passage of the object.
- a heat-insulating plate-shaped member is a surface that prevents convective heat transfer that occurs when space is not provided between spaces separated by it and that prevents radiant heat transfer from one space to the other space. Refers to a plate-like material that gives
- the heat-insulating plate-like member has a surface having a large heat reflectance, such as a mirror surface, in order to reduce heat loss due to heat radiation from the surface.
- the heat-insulating plate member is provided on at least one of both ends of the heat-insulating structural member. As a result, a part of the cavity of the heat insulating structural member and the heat treatment zone in Matsufuru are separated by the heat insulating plate at both ends of the heat insulating structural member. It can be said that both ends of the heat insulating structural member are ends on the side in contact with the heat insulating structural member of each Matsufuru.
- the aspect in which the heat-insulating plate member is provided on at least one of both ends of the heat-insulating structural member includes an aspect in which the heat-insulating plate member is sandwiched between the heat-insulating structural member and Matsufuru;
- the end of the muffle includes an aspect force S attached to the inner wall surface of the muffle, for example, by welding or bonding.
- the heat-insulating plate-shaped member is provided so that the surface for preventing heat transfer is at an angle to the direction of heat transfer (generally, the direction in which the object is transported) (ie, is not parallel).
- the heat transfer prevention surface of the heat-insulating plate-shaped member is orthogonal to the direction of heat transfer.
- the heat-insulating plate-shaped member may be provided inside the tunnel structure of the heat-insulating structural member, that is, inside the hollow portion of the heat-insulating structural member.
- the heat-insulating plate-like member is attached to the inner wall surface of the heat-insulating structural member by welding or bonding.
- the heat-insulating structural member may be composed of two parts, and a heat-insulating plate member may be interposed between the two parts.
- the heat-insulating plate member is provided without obstructing the passage of the object. Specifically, if an opening or a notch is provided in the heat-insulating plate-shaped member so that the object and, in some cases, the carrier can pass through the opening and the notch, the passage of the object is prevented. Absent.
- the heat-insulating plate-like member By using the heat-insulating plate-like member, convective heat transfer generated between the atmospheres of the heating zone and the cooling zone and radiant heat transfer from the inner surface of the wall of the heating muffle are effectively suppressed. Therefore, by using the heat-insulating plate member in combination with the heat-insulating structural member, the heat loss in the heat treatment apparatus can be further reduced.
- the heat-insulating structural member combined with the heat-insulating plate-shaped member is a heat-insulating structural member having a configuration of any one of the above (1) to (3) or a configuration in which at least two of the above (1) to (3) are combined. .
- a heat treatment apparatus including Matsufuru as a heat treatment chamber has been described.
- the present invention can be applied to a heat treatment apparatus including a plurality of non-muffle heat treatment chambers.
- a heat treatment apparatus is, for example, one in which a heating means or a cooling means is provided in a heat treatment chamber, and an object to be processed is directly heated or cooled.
- the present invention provides, in the second aspect, a heat treatment apparatus including a plurality of heat treatment chambers, in which an object to be processed is transferred and heat-treated in the heat treatment chamber, wherein the temperatures in the heat treatment chambers are different from each other.
- a heat treatment apparatus including a plurality of heat treatment chambers, in which an object to be processed is transferred and heat-treated in the heat treatment chamber, wherein the temperatures in the heat treatment chambers are different from each other.
- One set of two adjacent heat treatment chambers is connected via a heat insulating structural member, and the heat insulating structural member provides a heat processing apparatus having a tunnel structure through which an object to be processed passes.
- the heat treatment apparatus provided in the second aspect includes the heat treatment apparatus provided in the first aspect.
- the heat treatment apparatus provided in the first aspect is the heat treatment apparatus provided in the second aspect, wherein at least one set of two adjacent heat treatment chambers having different temperatures in the heat treatment chamber. Is a muffle, which corresponds to the two muffles connected via a heat insul
- the heat insulating structural member is inserted between the walls defining the two heat treatment chambers, and effectively suppresses heat conduction generated between the heat treatment chambers.
- the specific configuration of the heat insulating structural member is the same as that described above for the heat insulating structural member between Matsufuru, and is selected according to the material and thickness of the wall of the heat treatment chamber.
- the heat treatment apparatus provided in the second aspect, it is preferable to use a combination of a heat-insulating plate member and a heat-insulating structural member. Even in that case, the heat loss in the heat treatment apparatus is smaller.
- the heat insulating structural member is disposed between two adjacent heat treatment chambers where heat conduction occurs at the connection (in the case of a muffle furnace, between muffles).
- the heat-insulating structural member is placed between the high-temperature heat treatment room and the low-temperature heat treatment room where the temperature in one heat treatment room (generally, the temperature of the atmosphere gas in the heat treatment room) is higher than that of the other heat treatment room (in the case of a Matsufuru furnace, the high temperature Mfflu Between Matsufuru).
- the combination of the heat treatment chambers in which the heat-insulating structural members are disposed is, for example, a heating chamber or an annealing chamber in which the inside of one heat treatment is heated by a heater or the like and the temperature in the heat treatment chamber is 400 ° C. or more. Is a cooling room (quenching room) in which the temperature in the heat treatment room is about room temperature.
- the temperature in one heat treatment chamber is several tens of degrees higher than that of the other. It may be set to be higher than C (for example, 20 ° C).
- C for example, 20 ° C.
- Insulating structural members may be located between two such adjacent heat treatment chambers.
- heat-insulating plate-like member When using a heat-insulating plate-like member, it is preferable to provide the heat-insulating plate-like member at the end of the heat-insulating structural member on the side in contact with the heat treatment room (heating room) where the temperature inside the heat treatment room is high. By providing a heat-insulating plate member near the high-temperature heat treatment chamber, heat loss can be further reduced.
- the effects provided by the heat treatment apparatus of the present invention are as follows.
- the heat treatment apparatus of the present invention is characterized in that a heat insulating structural member and a heat-insulating plate-like member are appropriately disposed between two adjacent heat treatment chambers (for example, Matsufuru).
- a heat treatment apparatus for example, a pine-full-type heating furnace
- the amount of heat loss in a heat treatment apparatus can be reduced, so that the total heat energy consumed in the heat treatment apparatus can be reduced. Therefore, according to the present invention, energy saving can be achieved without affecting the quality and yield of the product after heat treatment, and the product can be manufactured at low cost. It can be manufactured at a low cost.
- the heat insulating structural member and the heat-insulating plate-like member do not include a member that is mechanically moved (for example, vertically moved) using a motor or the like. Therefore, the heat treatment apparatus of the present invention can achieve the above-described effects well even when the temperature in one of the two adjacent heat treatment chambers is so high that mechanical movement by a motor or the like becomes difficult. To play. Furthermore, the heat-insulating structural member and the heat-insulating plate-like member can suppress heat transfer between two adjacent heat-treating chambers without causing the atmosphere gas in the heat-treating chamber to leak out of the heat-treating chamber. Therefore, according to the heat treatment apparatus of the present invention, the object to be treated can be stably heat treated with higher effective thermal efficiency without disturbing the atmosphere gas in the heat treatment chamber. BRIEF DESCRIPTION OF THE FIGURES
- FIG. 1 is a cross-sectional view partially schematically illustrating an example of a heat treatment apparatus of the present invention in which a heat insulating structure member is arranged between a heated matsu full and a cooled matsu full.
- FIG. 2 is a cross-sectional view partially schematically illustrating another example of the heat treatment apparatus of the present invention in which a heat insulating structural member is disposed between a heated matsu full and a cooled matsu full.
- FIG. 3 is a cross-sectional view schematically and partially showing still another example of the heat treatment apparatus of the present invention in which a heat insulating structural member is disposed between a heating muffle and a cooling muffle.
- FIG. 4 is a perspective view schematically showing an example of a wall of a heat insulating structural member having a concave portion.
- FIG. 5 is a cross-sectional view partially schematically showing still another example of the heat treatment apparatus of the present invention in which a heat insulating structural member made of a thin plate is disposed between a heated matsu full and a cooled matsu full.
- FIG. 6 is a cross-sectional view partially schematically showing still another example of the heat treatment apparatus of the present invention in which another heat insulating structural member made of a thin plate is arranged between a heating muffle and a cooling muffle.
- FIG. 7 is a cross-sectional view partially schematically illustrating still another example of the heat treatment apparatus of the present invention in which a deformable heat insulating structural member is disposed between a heating muffle and a cooling muffle.
- FIG. 8 is a cross-sectional view partially schematically showing still another example of the heat treatment apparatus of the present invention in which another deformable heat-insulating structural member is arranged between a heated pine full and a cooled pine full.
- FIG. 9 is a partial schematic view of still another example of the heat treatment apparatus of the present invention in which a heat insulating structural member is disposed between a heating muffle and a cooling muffle, and a heat insulating plate member is disposed between a heating muffle and a heat insulating structural member.
- FIGS. 10A to 10C are schematic front views, each schematically showing an example of a heat-insulating plate-like member, as viewed from the traveling direction of the object to be processed.
- FIG. 11 is a graph comparing the power consumption of the heat treatment apparatus of the present invention with that of the conventional heat treatment apparatus.
- Fig. 12 is an example of the heat balance chart of a conventional Matsufur structure heating furnace.
- FIG. 13 is a perspective view of a conventional pine-full heating furnace.
- FIG. 14 is a cross-sectional view schematically showing a connection portion of a muffle of a conventional muffle structure type heating furnace.
- a heat treatment apparatus is a heat treatment apparatus including a plurality of Matsufuru as a heat treatment chamber, in which an object to be processed is transported and heat-treated in the Matsufuru.
- Examples of such a heat treatment apparatus include one in which all heat treatment chambers are matsuful, and one in which only some heat treatment chambers are matsuful.
- the heat treatment apparatus includes one or more heating zones and Z or one or more cooling zones depending on the type of heat treatment.
- the heat treatment equipment includes a heating zone as well as a constant temperature zone as necessary.
- the heating zone and the cooling zone can be arranged in any combination so that the object is heat-treated as desired.
- the above cooling zones may be arranged in this order.
- one or more heating zones and one or more cooling zones may be alternated.
- a force for raising the temperature, a heating zone for maintaining the temperature, a heating zone for maintaining the temperature, and a cooling zone so that the workpiece passes through the heating zone, the constant temperature zone, and the cooling zone in this order.
- Different types of heat treatment zones may be arranged in this order.
- the heat treatment zone used in the conventional muffle furnace The misalignment arrangement can also be applied.
- a large heat conduction occurs at a connection portion between two adjacent Matsufuru (for example, between adjacent Matsufuru having a temperature difference of 800 ° C or more in Matsufuru).
- a heat insulating structural member is provided. A preferred embodiment of the heat insulating structural member will be described with reference to the drawings.
- Figure 1 shows an example of a thermal insulation structural member provided between a heating muffle and a cooling muffle, and composed of a wall made of a material having a thermal conductivity smaller than that of the material constituting the muffle.
- Fig. 1 schematically shows the connection between the heating muffle (10) and the cooling muffle (13), as in Fig. 14.
- the same reference numerals as those used in Fig. 14 are used. Represents the same elements that they represent in Figure 14.
- the object proceeds in each muffle in the X direction on a plane parallel to the XY plane in FIG.
- the y direction corresponds to a direction perpendicular to the plane of the drawing.
- the heated Matsufuru (10) and the cooled Matsufuru (13) have penetrating cavities extending in the X direction as heat treatment zones (14a, 14b) so that the workpiece can proceed.
- the heated matsufuru (10) has a cross section perpendicular to the direction in which the heat treatment zone (14a) extends (the X direction in the figure) (hereinafter, unless otherwise noted, the “cavity” is simply referred to as “cross section”).
- cross-section has, for example, a tunnel structure is arcuate or rectangular, cooling Matsufuru monument 3) has a tunnel structure which in cross-section for example arcuate or rectangular heat treatment zone (14 b) .
- the cross-sectional area of the heat treatment zone (14a) of the heating muffle (10) is larger than that of the heat treatment zone (14b) of the cooling matsufuru 3 ).
- the heating Matsufuru (10) and the cooling Matsufuru (13) are equipped with a heater (9) and a cooling water pipe (11), respectively, on two ⁇ planes parallel to the ⁇ XY plane.
- the object to be treated is heated by the heated Matsufuru (10) to a high temperature (for example, 800 ° C), and then cooled by the cooled Matsufuru (13) to a temperature similar to room temperature. Therefore, the inside of the cooling Matsufuru (13) corresponds to the rapid cooling zone.
- the material constituting the wall of the heat insulating structural member (19) is added so as to have a heat conductivity smaller than that of the material forming the heating matsufuru (10) and the cooling muffle (13).
- the choice is made according to the materials that make up the heated pine full (10) and the cooled pine full (13).
- Matsufuru is made of a metal material such as stainless steel or Inconel. Therefore, the heat-insulating structural member is made of a material having a thermal conductivity lower than those of the materials, specifically, an inorganic material selected from ceramics, silica, bricks, and the like, or a porous material made of these inorganic materials.
- the heat insulating structural member (19) also has a tunneling structure provided with a penetrating hollow portion (190) extending in the X direction so that the object to be processed can advance inside the heat insulating structural member (19).
- the hollow portion (190) of the heat insulating structural member (19) is formed so as to coincide with the cross section of the heat treatment zone (14b) of the cooling matsufur (13).
- the wall surface and the inner wall surface of the heat insulating structural member (19) are arranged so as to be flush. Therefore, part (19d) of the end face of the heat insulating structural member (19) is exposed to the heating zone.
- one of the heat insulating structural members (19) (the upper wall in FIG. 1) is thicker than the other one of the walls parallel to the xy plane.
- the heat insulating structural member (19) has a flange (19a) as a connecting portion at an end thereof for connection with each Matsufuru.
- the Matsufuru connection (16) and the heat insulation structural member connection (19a) are mechanically connected by a Porto Z nut (18).
- a sealing material (17) made of non-combustible material is sandwiched between the connection points (16, 19a) between Matsufuru and the heat insulating structural member. This is used to prevent the atmosphere gas inside each matsufur (10, 13) from leaking from the connection between the matsuful and the heat insulating structural member.
- the heat insulating structural member shown in FIG. 1 is merely an example of a heat insulating structural member made of a material having a low thermal conductivity. Another example is shown in FIG. In FIG. 2, the same reference numerals as those used in FIG. 1 represent the same elements as those represented in FIG. FIG. 2 also shows a carrier (mesh belt) (24) and a workpiece (25) not shown in FIG.
- Insulation structural members made of materials with low thermal conductivity are used for heat treatment and the entire heat treatment equipment. It may have any shape and size as long as it does not adversely affect the mechanical strength and the like of the steel and can effectively suppress the heat conduction between the pineapples.
- the heat insulating structural member may be designed in consideration of the dimensions of the muffle, the difference between the temperatures in the adjacent heat treatment chambers (the temperature of the atmosphere gas), and the degree to which the heat conduction generated between the muffles should be suppressed.
- the cross section of the cavity may be rectangular, circular, semi-circular, or arcuate.
- the cavity has a semicircular (or arcade) cross-sectional shape, a length of 100 to 300 mm, and a wall thickness of 100 to 3 mm.
- the heat-insulating structural members that are Cheom. However, this is only an example, and the shape and dimensions of the heat insulating structural member are appropriately selected according to the type of the workpiece.
- Figure 3 shows an example of a heat-insulating structural member located between Matsufuru, where the thickness of the walls constituting the heat-insulating structural member is constant.
- the same reference numerals as those used in FIG. 1 represent the same elements as those represented in FIG.
- the heat insulating structural member shown in FIG. 3 has a groove-shaped recess (20a) extending in the y direction on the outer surface of a wall parallel to the X-y plane of the heat insulating structural member shown in FIG.
- a groove-shaped recess (20a) extending in the y direction on the outer surface of a wall parallel to the X-y plane of the heat insulating structural member shown in FIG.
- the shape of the recesses, the depth of the recesses, the number of the recesses, the direction of the recesses, etc. do not adversely affect the heat treatment and the mechanical strength of the entire heat treatment apparatus, and have heat conduction between the mats. It is not limited to a specific shape, depth, number, direction, etc., as long as it can be effectively suppressed.
- the groove-shaped ⁇ portion may be rectangular instead of wedge-shaped as shown in FIG.
- the groove-shaped concave portion may extend in the X direction instead of the y direction. In general, as the depth of the concave portion is larger and the number of ⁇ portions is larger, the heat conduction between the pineapples can be further suppressed, and the heat loss can be reduced.
- the recess may be anywhere on the wall of the insulating structural member.
- insulation structural members for example, insulation structural members
- the recess is preferably provided on the side close to the heated Matsufuru (hot Matsufuru).
- the recess may be on the inside surface in addition to the outside surface of the wall of the heat insulating structural member. Alternatively, the recess may be on only the inner surface of the wall of the insulating structural member, or may be on both the outer and inner surfaces.
- the concave portion can be formed, for example, by cutting a wall constituting the heat insulating structural member. Alternatively, a wall formed to have a concave portion may be used.
- the recess is preferably a groove having a wedge-shaped cross section having a width of about 30 to 50 mm and a depth force of about 5 to 15 mm, and a circumferential direction of a cross section of the cavity. Extending (ie, surrounding the cavity). Preferably, two to five such recesses are formed in one heat insulating structural member.
- the wall of the heat-insulating structural member having the groove-shaped concave portion is one mode of the wall of the heat-insulating structural member having an irregular thickness.
- Another example of a wall of a heat insulating structural member having a non-uniform thickness is a wall provided with a plurality of small recesses (20b) on an outer surface and / or an inner surface of the wall as shown in FIG.
- the wall having a non-uniform thickness is formed of a material having a lower thermal conductivity than that of the material forming the Matsufuru. If such a wall is used to form the heat insulating structural member, the heat conduction between the muffle and the Matsufuru can be more effectively suppressed.
- Figs. 5 and 6 show an example of a heat-insulating structural member that is disposed between a heated matsufur (10) and a cooled matsufur (13) and that is entirely made of thin plates.
- the same reference numerals as those used in FIGS. 1 and 2 represent the same elements as those represented in FIGS. 1 and 2.
- the heat conduction cross-sectional area of the wall is small throughout, thereby effectively suppressing the heat conduction between the pineapples.
- the heat insulating structural member (21) is formed entirely of a thin plate, and has a penetrating cavity (210) extending in the X direction.
- the cross section of the cavity (210) is rectangular.
- the heat insulating structural member (21) is provided with a flange (21a) formed by bending a thin plate. By adjusting the bending angle of this flange (21a), the cross-sections of both ends of the cavity (210) can be adjusted for the heated matsuful (10) and the cooled matsuful (13), respectively. It matches the cross section of the heat treatment zone (14a, 14b).
- FIG. 6 it connects the insulating structural member made of a thin plate (2 1), the Matsufuru connecting portion (16) using a connecting member (22).
- the heat insulating structural member (21) is fixed to the connecting member (22) by a suitable means (for example, heat resistant adhesive, force crimping, welding, or the like).
- the connecting member (22) is made of, for example, the same material (for example, stainless steel) as the material constituting Matsufuru.
- the shape, size, material, etc. of the heat insulating structural member at least partially made of a thin plate do not adversely affect the mechanical strength of the heat treatment and heat treatment equipment as a whole, as long as the heat conduction between Matsufuru can be effectively suppressed. Is not limited to a specific one. However, the mechanical strength of the heat-insulating structural members made of thin plates tends to be low, and when using thin plates, it is particularly necessary to consider this point.
- the thickness of the sheet is smaller than the thickness of the walls that make up Matsufuru. If the thickness of the walls that make up Matsufuru is not constant, the thickness of the sheet is preferably smaller than the smallest thickness of the walls of Matsufuru. The smaller the thickness of the sheet, the less heat energy can be transferred between Matsufuru and Matsufuru.
- the thickness of the lamella is preferably between 12 and 1/20, more preferably between lZl0 and 1/20 of the thickness of the pine full wall.
- the material constituting the thin plate is not limited to a specific material.
- the thin plate may be made of, for example, the same material as that of Matsufuru, and specifically, the thin plate may be made of stainless steel or Inconel.
- the sheet may be made of a material with low thermal conductivity, for example, ceramic, carbon or quartz glass.
- the thin plate may be a mesh material made of the above-mentioned material, and may be a mesh material for filtration that does not substantially transmit gas when there is no pressure difference.
- the thin plate may be one in which a mesh material is covered with a metal foil, or one in which a plurality of mesh materials are stacked.
- the thin plate may be made of a heat-resistant resin.
- the thin plate may constitute only a part of the heat insulating structural member.
- a part of a heat insulating structural member May be formed as a thin plate, and the other portions may be formed of thick walls made of a material having a low thermal conductivity so as to secure the mechanical strength of the heat treatment apparatus.
- the heat-insulating structural member is a rectangular body having a cavity with a rectangular or square cross section
- one set of opposing walls is made of a thin plate
- the other set of walls is made of a thin material made of a material having low thermal conductivity (
- the wall may have the same thickness as or thicker than the wall of Matsufuru).
- heating causes elongation and thermal deformation of the pineapple, causing stress to concentrate at the joints of the pineapple, resulting in gaps between the muffles and leakage of atmospheric gas inside the muffle. .
- the same is likely to occur at the connection between the muffle and the heat insulating structural member when the heat insulating structural member is provided between Matsufuru and Matsufuru.
- the strong disadvantage can be avoided by making the heat insulating structural member a structure that can be easily deformed. That is, by allowing the deformable heat-insulating structural member to act as a kind of stress absorbing material, concentration of stress on the connection portion can be mitigated even if the pine full occurs.
- the heat insulating structural member has a structure as shown in FIG.
- FIG. 7 shows an example of a heat-insulating structural member entirely formed of a thin plate, which can be deformed.
- the same reference numerals as those used in FIG. 5 indicate the same elements as those represented in FIG.
- the heat-insulating structural member (21) shown in FIG. 7 uses a thin plate having a plurality of bent portions (23), and the ribs (23a) of the bent portion (23) are perpendicular to the traveling direction of the workpiece. It is designed to be.
- This bent portion (23) is deformed immediately when elongation and Z or thermal deformation of the pine full occurs, thereby preventing stress from being concentrated on a connection portion between the pine full and the heat insulating structural member.
- the rib of the bent portion extends in a direction perpendicular to the traveling direction of the workpiece as shown in the figure, but in any direction as long as it is not parallel to the traveling direction of the workpiece. May be extended.
- the bent portion may be formed such that the rib is formed on the inner wall surface of the heat insulating structural member.
- the lip of the bend may be curved without a sharp top.
- FIG. 8 shows another example of a deformable heat insulating structural member.
- FIG. 8 The same reference numerals as those used in Fig. 1 represent the same elements as those represented in Fig. 1.
- the heat insulating structural member (19) shown in FIG. 8 is made of a material having a lower thermal conductivity than the material of Matsufuru, as in FIG.
- the illustrated heat-insulating structural member (19) expands and contracts as the hook portion (19b) slides in the concave portion (19c), and absorbs the extension in the X direction generated in the pine-full portion.
- This easily deformable heat-insulating structural member is also useful as a means for effectively preventing atmospheric gas leakage at the connection between the muffles.
- the easily deformable heat-insulating structural member is not only a member that suppresses heat conduction between Matsufuru, but also a connecting structural member that further improves the sealing of the connecting part of Matsufuru. May be arranged.
- FIG. 9 shows an example of a heat treatment apparatus including a heat-insulating plate member, and corresponds to an arrangement in which the heat-insulating plate member is arranged in the heat treatment apparatus shown in FIG.
- the same reference numerals as those used in FIG. 6 indicate the same elements as those represented in FIG.
- FIG. 10A is a front view of the heat-insulating plate-like member viewed from the traveling direction of the object.
- the heat-insulating plate-like member (26) is a connecting member between the heated pine full connection part (30) and the heat insulating structural member
- the heat-insulating plate-like member (26) is rectangular and has an opening (29) having a size necessary for the passage of the object (25) and the carrier (24). Yes.
- the four sides of the heat-insulating plate-like member (26) are sandwiched between the heating pine full connecting portion (30) and the connecting member (22) of the heat insulating structural member.
- the P-side hot plate-like member (26) shields the end of the heated pineapple except for an opening necessary for the object to pass through.
- the atmosphere gas flows from the heat treatment zone (14a) of the heated matsufur (10) to the heat treatment zone (14b) of the cooled matsufur (13), and the heated matsufur ( Radiation heat (corresponding to the outlined arrow in the figure) is effectively prevented from being transmitted from the inner wall of (10) into the cooling matsufur (13).
- FIGS. 10B and 10C Another embodiment of the heat-insulating plate member is shown in FIGS. 10B and 10C.
- the heat-insulating plate-like member shown in FIG. 1OB is a rectangular plate-like member.
- This heat-insulating plate member is The length in the z direction is longer than the length in the Z direction of the cross section of the heat treatment zone (indicated by a broken line) so that a gap (29 ') through which the object (25) and the carrier (24) pass is formed. Small.
- the heat-insulating plate-like member shown in Fig. 1OC is a rectangular plate-like member with cutouts (29 ") large enough to allow the workpiece (25) and the carrier (24) to pass through.
- This heat-insulating plate also has a z-direction length smaller than the z-direction length of the cross-section (indicated by the dashed line) of the heat treatment zone (or the cavity of the heat-insulating structural member).
- the heat-insulating plate-like member shown in FIGS. 1OB and 1OC is attached to the inner wall surface of the heated matsufull so that, for example, the end of the heating zone in contact with the heat-insulating structural member is shielded.
- the heat-insulating plate-like member shown in FIGS. 10B and 10C may be sandwiched between the pine full and the heat insulating structural member as shown in FIG. In that case, a gap corresponding to the thickness of the heat-insulating plate-like member may be formed at a connection portion between the Matsufuru one heat-insulating structural members where the heat-insulating plate-like member is not sandwiched.
- the gap may be prevented from occurring by making the dimensions of a part of the heat insulating structural member different from those of the other parts.
- the heat-insulating plate-like members shown in FIGS. 1OA to 1C are merely examples, and may have other shapes.
- the heat-insulating plate member may be formed of any material as long as it does not adversely affect the heat treatment and the mechanical strength of the entire heat treatment apparatus.
- the heat-insulating plate-like member is preferably, for example, a metal plate such as a stainless steel plate or a filter-like mesh material that does not substantially pass gas when there is no pressure difference. Further, it is preferable that the heat-insulating plate-like member has a small surface emissivity in order to reduce radiant heat transfer by itself. As a method of reducing the surface emissivity, for example, there is a method of polishing the surface of the heat-insulating plate-shaped member.
- the heat treatment apparatus has been described by taking the connection portion between the heated matsufur and the cooled matsufur as an example.
- a heat insulating structure member is provided between a pair of adjacent two matsufurus in which the temperature in one matsufuru is higher than the temperature in the other matsufuru, that is, between a high temperature muffle and a low temperature muffle.
- the combination of heated matsufuru and cooled matsufuru described above is one of the combinations of high temperature matsufuru and low temperature muffle.
- high-temperature muffle and low-temperature muffle is, for example, a calo-heat muffle-heat muffle in which the temperature in one matsufuru is 50 ° C or more higher than that of the other, with an insulating structural member provided between them.
- a heat treatment device is also included in the present invention.
- a plurality of heat insulating structural members may be provided in one heat treatment apparatus.
- the present invention is applied not only to the matsufurn furnace but also to other heat treatment apparatuses having a plurality of heat treatment chambers.
- the present invention is also applicable to a batch heating furnace and the like.
- the material, shape, dimensions, etc. of the heat insulating structural member for example, the thermal conductivity of the material of the wall of the heat insulating structural member, and the case where a part of the wall of the heat insulating structural member is formed of a thin plate
- the thickness of the thin plate may be selected according to the material and thickness of the wall of the heat treatment chamber.
- heat-insulating plate members as shown in FIGS. 10A to 10C may be provided as appropriate.
- the transfer device for the object to be processed is not limited to the mesh belt as illustrated, but may be another transfer device such as a roller hearth.
- the object to be processed is continuously or intermittently transferred in the heat treatment chamber by these transfer devices.
- the heat treatment apparatus of the present invention may include, if necessary, other components or elements not described above, which are commonly used in the heat treatment apparatus (for example, a supply / exhaust apparatus). Can be provided. Industrial applicability
- the present invention can be preferably applied to a heat treatment apparatus having a plurality of heat treatment chambers, regardless of a transfer method, a heating method, Z, or use.
- the heat treatment apparatus of the present invention performs heat treatment in the manufacturing process of various products such as plasma 'display' panels, solar cell panels and resistance chips, as well as various electronic products as final products.
- various products such as plasma 'display' panels, solar cell panels and resistance chips, as well as various electronic products as final products.
- up or Down means “up” and “down” in the vertical direction when the transport surface and transport direction of the object are horizontal to the ground surface, and when simply referred to as "length", It means the length in the direction parallel to the moving direction of the object.
- width refers to a direction parallel to the transport surface of the workpiece and perpendicular to the traveling direction of the workpiece.
- a heat treatment device consisting of one heated matsufuru and one cooling matsufuru, which heat-insulates structural members formed of walls made of a material with low thermal conductivity between the heating muffle and the cooling muffle as shown in Fig. 2. was prepared.
- -Matsufuru's shape a tubular body with a semicircular cross section with an arcuate upper side wall, with a flange integrated into the end face as a connecting part by welding;
- -Matsufuru's shape a tubular body with a rectangular cross-section, with a flange integrated into the end face as a connecting part by welding;
- Width x height x length 1086ramX 35 OmmX 100 mm;
- a heat-insulating structural member consisting of a thin plate was provided between the heated matsu full and the cooled matsu full to produce a heat treatment apparatus.
- the heating muffle and the cooling muffle in the heat treatment apparatus of the second embodiment are the same as those of the first embodiment.
- a stainless steel plate having a thickness of 1.0 was prepared as a thin plate, and this was used to construct a heat-insulating structural member (21) having a length of 10 Oram and a rectangular cross section.
- a connecting member (22) made of stainless steel was used to connect the heat insulating structural member and Matsufuru.
- the thin plate constituting the heat insulating structural member (21) was fixed to the connecting member (22) by welding.
- a heat treatment apparatus was fabricated in which (26) was disposed between the heated matsuful connection part (30) and the connection member (22) of the heat insulating structural member.
- the heated matsufur, the cooling muffle, the heat insulating structural members, and the like in the heat treatment apparatus of the third embodiment are the same as those of the second embodiment.
- a stainless steel plate with a thickness of 1.0 and a surface emissivity of 0.01 was used as the heat-insulating plate member (26).
- the heat-insulating plate-like member has an opening (29) with a height of 25 mm and a width of 980 mm so that the mesh belt (4) and the workpiece (25) can pass through.
- the temperature settings of the heat sink for heating the heating zone were all set at 850 ° C.
- the amount of cooling water for cooling the cooling zone was set to 5 m 3 / min
- the total power consumption supplied to the heating furnace was measured with the conveyance speed of the mesh belt at 10 O mmZmin.
- the power consumption supplied to each muffle structure type heating furnace is shown in Fig. 11 for comparison.
- the power consumed by the entire furnace was 40 kW.
- the power consumption of the heat treatment apparatus of the comparative example is compared with the power consumption of 40 kW as the reference 100, the power consumption of the heat treatment apparatuses of Examples 1 to 3 corresponding to the present invention is 15 times higher than that of the comparative example. About 25%.
- the heater power consumption could be reduced most (25%). From this, it is understood that the combination of the heat-insulating plate member and the heat-insulating structural member is most effective in reducing the power consumption.
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01934346A EP1293741B1 (en) | 2000-05-30 | 2001-05-25 | Heat treatment apparatus |
US10/048,227 US6623269B2 (en) | 2000-05-30 | 2001-05-25 | Thermal treatment apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-160095 | 2000-05-30 | ||
JP2000160095 | 2000-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001092800A1 true WO2001092800A1 (en) | 2001-12-06 |
Family
ID=18664341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/004392 WO2001092800A1 (en) | 2000-05-30 | 2001-05-25 | Heat treatment apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US6623269B2 (ja) |
EP (1) | EP1293741B1 (ja) |
KR (1) | KR100469522B1 (ja) |
TW (1) | TW494218B (ja) |
WO (1) | WO2001092800A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003091462A1 (fr) * | 2002-04-23 | 2003-11-06 | Chugai Ro Co., Ltd. | Four de traitement thermique du type a moufle vertical |
EP1475446A1 (en) * | 2002-02-12 | 2004-11-10 | Dowa Mining Co., Ltd. | Heat treatment furnace |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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US20020195201A1 (en) * | 2001-06-25 | 2002-12-26 | Emanuel Beer | Apparatus and method for thermally isolating a heat chamber |
EP1964819B1 (en) * | 2005-11-18 | 2017-05-10 | Hoya Corporation | Process for producing a molded article |
US9242889B2 (en) * | 2005-11-18 | 2016-01-26 | Hoya Corporation | Method of manufacturing formed article, glass material, and method of determining shape of glass material and mold |
RU2416576C2 (ru) * | 2005-11-30 | 2011-04-20 | Хойа Корпорейшн | Способ производства формованного изделия, покрывающий элемент и формовочное устройство, содержащее таковой |
JP4245177B2 (ja) * | 2006-07-10 | 2009-03-25 | 日立プラズマディスプレイ株式会社 | 熱処理装置 |
KR100760927B1 (ko) * | 2007-03-08 | 2007-09-21 | (주)태영열처리 | 등온 제어냉각장치 |
KR100905307B1 (ko) * | 2007-03-08 | 2009-07-02 | (주)태영열처리 | 등온 제어냉각장치를 이용한 강종의 등온어널링 열처리방법 |
GB0800940D0 (en) * | 2008-01-18 | 2008-02-27 | Milled Carbon Ltd | Recycling carbon fibre |
JP5393664B2 (ja) * | 2008-05-30 | 2014-01-22 | Hoya株式会社 | レンズ用鋳型の製造方法 |
EP2402132A4 (en) * | 2009-02-27 | 2014-10-15 | Hoya Corp | DEVICE FOR PRODUCING A FORM FOR A LENS AND METHOD FOR PRODUCING A GLASS GLASS |
WO2010098137A1 (ja) * | 2009-02-27 | 2010-09-02 | Hoya株式会社 | レンズ用鋳型の製造方法および眼鏡レンズの製造方法 |
WO2011130518A1 (en) | 2010-04-14 | 2011-10-20 | Babcock & Wilcox Technical Services Y-12, Llc | Heat treatment furnace |
KR101034730B1 (ko) * | 2010-06-29 | 2011-05-17 | 배덕수 | 매생이를 주원료로 한 즉석 식품 제조 방법 |
Citations (3)
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US3807943A (en) * | 1970-08-10 | 1974-04-30 | Anchor Hocking Corp | Muffle furnace for treatment of articles on conveyor |
JPH05295449A (ja) * | 1992-04-20 | 1993-11-09 | Nisshin Steel Co Ltd | マッフルを備える竪型熱処理炉 |
JPH073274Y2 (ja) * | 1988-10-17 | 1995-01-30 | 光洋リンドバーグ株式会社 | 炉のシール装置 |
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US1485118A (en) * | 1921-01-28 | 1924-02-26 | Norton Co | Muffle tunnel kiln |
FR2317394A1 (fr) * | 1975-07-10 | 1977-02-04 | Roannais Const Textiles Atel | Dispositif pour le traitement thermique des fils |
US4397451A (en) * | 1981-06-10 | 1983-08-09 | Chugai Ro Kogyo Co., Ltd. | Furnace for the heat treatment of scale-covered steel |
DE3343654C2 (de) * | 1983-12-02 | 1985-08-29 | Reiner 7302 Ostfildern Sarnes | Verfahren zum Abgrenzen von Schutzgaszonen in Durchlauföfen |
US4767324A (en) * | 1987-05-26 | 1988-08-30 | General Electric Company | Transition section for muffle furnace |
DE3934103A1 (de) * | 1989-10-12 | 1991-04-25 | Ipsen Ind Int Gmbh | Ofen zur partiellen waermebehandlung von werkzeugen |
JP3093864B2 (ja) * | 1992-04-20 | 2000-10-03 | 日新製鋼株式会社 | マッフルを備える竪型熱処理炉 |
JPH06137766A (ja) * | 1992-10-27 | 1994-05-20 | Daido Steel Co Ltd | 竪型熱処理炉におけるマッフル |
JPH073274A (ja) | 1993-04-22 | 1995-01-06 | Isobe Tekko Kk | 石油燃焼煤の利用方法 |
JPH07316672A (ja) * | 1994-05-27 | 1995-12-05 | Nisshin Steel Co Ltd | 水素ガスを含む雰囲気ガスを使用する竪型熱処理炉 |
JP3445733B2 (ja) | 1997-11-04 | 2003-09-08 | 株式会社ノリタケカンパニーリミテド | 熱処理装置 |
US6217317B1 (en) * | 1998-12-15 | 2001-04-17 | Consolidated Engineering Company, Inc. | Combination conduction/convection furnace |
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2001
- 2001-05-25 EP EP01934346A patent/EP1293741B1/en not_active Expired - Lifetime
- 2001-05-25 US US10/048,227 patent/US6623269B2/en not_active Expired - Fee Related
- 2001-05-25 KR KR10-2002-7000507A patent/KR100469522B1/ko not_active IP Right Cessation
- 2001-05-25 WO PCT/JP2001/004392 patent/WO2001092800A1/ja active IP Right Grant
- 2001-05-28 TW TW090112791A patent/TW494218B/zh not_active IP Right Cessation
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US3807943A (en) * | 1970-08-10 | 1974-04-30 | Anchor Hocking Corp | Muffle furnace for treatment of articles on conveyor |
JPH073274Y2 (ja) * | 1988-10-17 | 1995-01-30 | 光洋リンドバーグ株式会社 | 炉のシール装置 |
JPH05295449A (ja) * | 1992-04-20 | 1993-11-09 | Nisshin Steel Co Ltd | マッフルを備える竪型熱処理炉 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1475446A1 (en) * | 2002-02-12 | 2004-11-10 | Dowa Mining Co., Ltd. | Heat treatment furnace |
EP1475446B1 (en) * | 2002-02-12 | 2013-03-13 | Dowa Thermotech Co., Ltd. | Heat treatment furnace |
WO2003091462A1 (fr) * | 2002-04-23 | 2003-11-06 | Chugai Ro Co., Ltd. | Four de traitement thermique du type a moufle vertical |
Also Published As
Publication number | Publication date |
---|---|
KR20020038688A (ko) | 2002-05-23 |
US6623269B2 (en) | 2003-09-23 |
EP1293741A4 (en) | 2004-11-17 |
EP1293741B1 (en) | 2008-11-12 |
EP1293741A1 (en) | 2003-03-19 |
TW494218B (en) | 2002-07-11 |
US20030118966A1 (en) | 2003-06-26 |
KR100469522B1 (ko) | 2005-02-02 |
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