TW200916850A - Cooling device for sheet treated product and heat treatment system mounting the device - Google Patents
Cooling device for sheet treated product and heat treatment system mounting the device Download PDFInfo
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- TW200916850A TW200916850A TW097121599A TW97121599A TW200916850A TW 200916850 A TW200916850 A TW 200916850A TW 097121599 A TW097121599 A TW 097121599A TW 97121599 A TW97121599 A TW 97121599A TW 200916850 A TW200916850 A TW 200916850A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
- H01J7/24—Cooling arrangements; Heating arrangements; Means for circulating gas or vapour within the discharge space
- H01J7/26—Cooling arrangements; Heating arrangements; Means for circulating gas or vapour within the discharge space by flow of fluid through passages associated with tube or lamp
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
- G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Furnace Details (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Description
200916850 九、發明說明： 【發明所屬之技術領域】 本發明係關於冷卻基板等板狀被處理體（以下_ m 處理體"）之裝置、及可從加熱至冷卻一貫進行之熱處理系 統。 、 【先前技術】 為加熱處理玻璃基板等板狀之被處理體，可使用以下妒 置，即.藉由機器人等將預先對被處理體塗布特定溶液: 使其加熱乾燥後者載置於積載段，藉由導入到加熱處理室 内之熱風進行加熱處理（焙燒）。此裝置係使用於液晶顯示 器（LCD:Liquui Crystal Display)及電漿顯示器（pDp:piasma Display)、有機EL顯示器等平板顯示器（FpD Fiat Η-Display)之製造上。 如此加熱處理後之被處理體必須進行冷卻，先前係藉由 放冷進行，但此方法之缺點為太費時間。因此，進行以短 時間強制性吹風以冷卻。 譬如日本專利公開公報「特開2002-71936」號揭示了一 種被處理體之冷卻裝置。在此裝置中，分別設置加熱被處 理體之加熱處理槽與進行冷卻之冷卻槽，將加熱處理結束 後之被處理體從加熱處理槽搬送到冷卻槽以進行冷卻。此 裝置之優點為，由於不擱置時間地持續進行加熱處理時可 不使加熱處理槽之溫度下降地進行冷卻，因此可防止加熱 處理槽中所使用之能量之浪費。 【發明内容】 131850.doc 200916850 [發明所欲解決之問題] 在將加熱處理槽與冷卻槽分別設置之系統之情形 Γ 驟處理速度不相等，則整體之加熱及冷卻處理 >革^差。又’若冷卻槽中之冷卻時間較長，則每單位 時間可冷卻之被處理體之片數變少，冷卻槽之處理速度變 慢’因此為處理多數個被處理體’不得不使冷卻槽大型 化。 又，被處理體之冷卻’如前述專利公開公報所示進行， 將被處理體間隔排列，在被處理體之間將用於冷卻之空氣 從一側供給，&向另一側。因此，另一側之流動較弱，且 由於另-側之空氣溫度變高，另一側之冷卻㈣，因此有 至冷卻完成之時間變長之傾向。 特別是，被處理體為基板等精密電子零件之情形，由於 不可由含有雜質之空氣冷卻，因此使用附帶 efficiency particulate air)過濾器之風扇等流動冷卻用之空 氣。因此’所供給之空氣流速變慢，供給量亦變少，故冷 卻時間變長。 再者’有必要將加熱處理後之高溫被處理體搬入此裝 置，冷卻後將其搬出。若可在將此冷卻槽之搬入部及搬出 部保持開放狀態下進行冷卻，則由於冷卻空氣從此開放部 分流出到外部，因此另一側之空氣之流動變慢，此部分之 冷卻變得不充分，而產生必須延長冷卻時間。 本發明係提供一種可有效率冷卻加熱處理後之被處理體 的板狀被處理體之加熱及冷卻一貫系統。 131850.doc 200916850 [解決問題之技術手段] 為達成上述目的之第一態樣之被處理體冷卻裝置，係具 有被處理體之配置部、與配置於所配置之被處理體兩面中[Technical Field] The present invention relates to a device for cooling a plate-shaped object to be processed such as a substrate (hereinafter, _m treatment body), and a heat treatment system which can be continuously performed from heating to cooling. [Prior Art] In order to heat-treat a plate-shaped object to be processed such as a glass substrate, the following device may be used, that is, a specific solution is applied to the object to be processed in advance by a robot or the like: it is heated and dried, and the latter is placed in the stowage section. The heat treatment (baking) is performed by hot air introduced into the heat treatment chamber. This device is used in the manufacture of flat panel displays (FpD Fiat Η-Display) such as liquid crystal displays (LCD: Liquui Crystal Display) and plasma display (pDp: piasma Display), and organic EL displays. The object to be treated thus subjected to the heat treatment must be cooled, previously by cooling, but the disadvantage of this method is that it takes too much time. Therefore, it is forced to blow in a short time to cool. A cooling device for a processed object is disclosed in Japanese Laid-Open Patent Publication No. 2002-71936. In this apparatus, a heat treatment tank for heating the treatment body and a cooling tank for cooling are provided, and the object to be treated after the completion of the heat treatment is transferred from the heat treatment tank to the cooling tank for cooling. This apparatus is advantageous in that it is possible to prevent the waste of the energy used in the heat treatment tank by cooling without delaying the temperature of the heat treatment tank when the heat treatment is continued without being left for a while. SUMMARY OF THE INVENTION 131850.doc 200916850 [Problem to be Solved by the Invention] In the case where the heating treatment tank and the cooling tank are separately provided, the processing speeds are not equal, and the overall heating and cooling treatment is poor. In addition, if the cooling time in the cooling bath is long, the number of processed objects that can be cooled per unit time becomes small, and the processing speed of the cooling bath becomes slower. Therefore, it is necessary to process the cooling tank for processing a large number of processed objects. Large size. Further, the cooling of the object to be processed is carried out as shown in the above-mentioned patent publication, and the objects to be processed are arranged at intervals, and the air for cooling is supplied from one side to the other side between the objects to be processed. Therefore, the flow on the other side is weak, and since the air temperature on the other side becomes higher and the other side is cooled (four), there is a tendency that the time until the completion of cooling becomes longer. In particular, when the object to be processed is a precision electronic component such as a substrate, since it is not cooled by air containing impurities, a fan for flow cooling such as a fan with a filter is used. Therefore, the supplied air flow rate becomes slow, and the supply amount also decreases, so the cooling time becomes long. Further, it is necessary to carry the heat-treated high-temperature object to be processed into the apparatus, and after cooling, carry it out. When the cooling tank can be cooled while being kept in the open state, the cooling air flows out from the open portion to the outside, so that the flow of the other side of the air becomes slow, and the cooling of the portion becomes insufficient. , and the production must extend the cooling time. The present invention provides a system for heating and cooling a plate-shaped object to be processed which can efficiently cool a body to be treated after heat treatment. [Technical means for solving the problem] The object cooling device according to the first aspect of the present invention has the arrangement portion of the object to be processed and the two sides disposed on the object to be processed.
之至少任一側之冷卻部，前述冷卻部具有内側板、外側板 及風扇，内側板及外侧板係以内側板作為被處理體側，在 其間設置中間空間，且在被處理體所配置之整個區域上， 配置複數個連通内側板及外側板、藉由遮斷中間空間之筒 狀體所形成之第!貫通孔、與貫通内側板之第2貫通孔，藉 由作動風扇，形成從外側板之外部通過第丨貫通孔進入内 側板之内部、從第2貫通孔通過中間空間到達外部之空氣 流動，藉此進行被處理體之冷卻。 根據第一態樣，對被處理體所配置之整個區域上複數配 置的第1貝通孔與第2貫通孔，強制性流動基於風扇之空氣 流，被處理體可整體均勻地冷卻。 第二態樣之被處理體冷卻裝置，係具有被處理體之配置 部、與配置於所配置之被處理體兩面中之至少任一側之冷In the cooling unit on at least one of the sides, the cooling unit has an inner side plate, an outer side plate, and a fan, and the inner side plate and the outer side plate have an inner side plate as a to-be-processed object side, and an intermediate space is provided therebetween, and the entire object to be processed is disposed. In the region, a plurality of inner through plates and outer side plates are connected, a through hole formed by the cylindrical body that blocks the intermediate space, and a second through hole penetrating the inner side plate are formed by the fan to form the outer side plate The outside of the inside through the second through hole enters the inside of the inner panel, and the air flowing from the second through hole to the outside through the intermediate space flows, thereby cooling the object to be processed. According to the first aspect, the first beacon hole and the second through hole which are disposed in plurality in the entire area of the object to be processed are forcedly flowed by the air flow of the fan, and the object to be processed can be uniformly cooled as a whole. The object cooling device according to the second aspect is characterized in that it has a portion to be processed and a cold portion disposed on at least one of both sides of the object to be processed.
卻部，前述冷卻部具有内㈣、外側板及風4，内側板及 外侧板係以内側板作為被處理體側，且在其間設置中間空 間’且在被處理體之整個配置區域上，配置複數個連通内 :板及外側板、藉由遮斷中間空間之筒狀體所形成之第^ 貫通孔、#貫通内側板之第2貫通孔，藉由作動風扇，形 成從外部通過中間空間、從第2貫通孔進入内側板之内 部’通過第!貫通孔到達外側板之外部之空氣流動，藉此 進行被處理體之冷卻。 131850.doc 200916850 根據第二態樣，形成有連通内側板及外側板、藉由遮斷 中間空間之筒狀體形成之第〗貫通孔與貫通内側板之第2貫 通，第1貫通孔及第2貫通孔係複數配置於被處理體所配置 之整個區域上，藉由作動風扇，形成從外部通過中間空 間、從第2貫通孔進入内侧板之内部，通過第i貫通孔到達 外側板之外部之流動，進行被處理體之冷卻，因此可整體 均勻地進行被處理體之冷卻。 第三態樣之特徵在於於第一或第二態樣中，在配置部設In the case of the portion, the cooling portion has an inner portion (four), an outer side plate, and a wind 4, and the inner side plate and the outer side plate have an inner side plate as a to-be-processed object side, and an intermediate space is provided therebetween, and a plurality of intermediate portions are disposed in the entire arrangement area of the object to be processed. Inside the communication: the plate and the outer plate, the second through hole formed by the cylindrical body that blocks the intermediate space, and the second through hole that penetrates the inner plate, and the fan is used to form the intermediate space through the intermediate space. The second through hole enters the inside of the inner side plate. The air that has passed through the first through hole reaches the outer side of the outer side plate, thereby cooling the object to be processed. According to the second aspect, a through hole that connects the inner side plate and the outer side plate and that forms a cylindrical body that blocks the intermediate space, and a second through hole that penetrates the inner side plate, the first through hole and the first through hole are formed. (2) The through-holes are disposed in a plurality of the entire area of the object to be processed, and the fan passes through the intermediate space, enters the inside of the inner plate from the second through hole, and passes through the i-th through hole to the outside of the outer plate. Since the flow of the object is cooled, the object to be processed can be uniformly cooled as a whole. The third aspect is characterized in that in the first or second aspect, in the configuration part
置有複數個支撐銷，在支撐銷上載置被處理體。 根據第三態樣，由於在複數個支撐銷上載置被處理體進 行冷卻’因此在冷卻之際不易阻礙氣流，可容易地進行被 處理體之配置。 在弟四態樣中，具有配置於被處理體之下側之冷卻部的 下側冷卻部’在前述下側冷卻部之内側板之上側亦可固定 複數個支樓銷。A plurality of support pins are placed, and the object to be processed is placed on the support pins. According to the third aspect, since the object to be processed is placed on the plurality of support pins for cooling, the airflow is less likely to be blocked during cooling, and the arrangement of the object to be processed can be easily performed. In the four-side aspect, the lower side cooling unit ′ having the cooling unit disposed on the lower side of the object to be processed may fix a plurality of branch pins on the upper side of the inner side plate of the lower side cooling unit.
—第五態樣之特徵在於在第三或第四態樣中，支撐銷可伸 縮或可上下動藉由支撐銷之伸縮或上下動可改變冷卻部 與被處理體之距離。 根據第五態樣’由於支撐鎖可伸縮或可上下動，藉由支 撐銷之伸縮或上下動可改變冷卻部與被處理體之距離，因 此根據需要，可改變用於冷卻 7丨您礼机之速度，提高被處理 體之搬入及搬出之作業性。 第八態樣之特徵在於，於能揭】&二砂& > 於心'樣1〜5進而將第1貫通孔與第 2貝通孔父互排列配置。 131850.doc 200916850 根據第六態樣，由於交互排列配置第1貫通孔與第2貫通 孔’因此可穩定用於冷卻之氣流。 第七態樣中’第1貫通孔及第2貫通孔之配置成棋盤格之 花樣狀。在此’所謂第1貫通孔及第2貫通孔之配置成棋盤 格之彳匕樣狀’係指第1貫通孔及第2貫通孔之配列縱橫排 列，不論縱及橫之排列，第〗貫通孔與第2貫通孔皆交互排 列。 第八態樣之特徵在於在第一至第七態樣中，開放有相對 之2面。 根據第八態樣’配置部由於開放有相對之2面，因此可 從任一面搬入被處理體，從另一面搬出被處理體。 第九態樣係一種熱處理系統，其具有進行被處理體之加 熱處理之加熱處理裝置、第一至第八態樣之被處理體冷卻 裝置、及取出加熱處理後之被處理體，搬入到前述被處理 體冷卻裝置之搬入裝置。 [發明之效果] 本發明之被處理體冷卻裝置，小型而可有效率進行被處 理體之冷卻。 【實施方式】 以下對於本發明之實施例進行說明。 第1實施態樣之被處理體冷卻裝置丨，如圖i、圖2所示， 具有由上側冷卻部20與下側冷卻部3〇構成之冷卻部1〇、與 形成於上側冷卻部20與下側冷卻部3〇之間的被處理體配置 部11。在配置部11配置有板狀之被處理體9〇，藉由位於被 131850.doc •10- 200916850 處理體90兩面的上側冷卻部2〇與下側冷卻部3〇進行冷卻。 上側冷卻部20具有内側板21與外側板22。被處理體9〇位 於内側板21之下面側。在内側板21與外側板22之間存在中 間空間23。内側板21及外側板22為大致同樣大小之長方形 狀’相對之邊21a、21b、22a、22b與側板40、41接合。 内側板21，如圖2所示具有貫通被處理體配置部丨〗侧與 中間空間23側之貫通孔24與25。貫通孔24以圓形之孔連通 於筒狀體26。又，貫通孔25成正方形狀（以下稱為第2貫通 孔）。 在外側板22上，設置有貫通中間空間23與外部之貫通孔 27。此貫通孔27為圓形’設置於對應内側板2丨之貫通孔24 之位置。貫通孔27連通於筒狀體26作為兩者一體形成第j 貫通孔28。 此第1貫通孔28 ’藉由筒狀體26遮斷與中間空間23之 間，連通外部與被處理體配置部丨丨。在第丨貫通孔28内配 置有風扇2 9。 第1貝通孔28及第2貫通孔25形成複數組，交互排列地縱 橫配置，如圖3所示，整體呈棋盤格狀。且，第i貫通孔28 及第2貫通孔25配置於被處理體9〇所配置之整個區域上。 因此’被處理體90藉由上側冷卻部2〇被整體冷卻。 風扇29位於第1貫通孔28之内部，藉由風扇29在該貫通 孔28内引起氣流。第1貫通孔28複數設置於上側冷卻部 20各貝通孔28具有風扇29。氣流如圖4所示，全部朝向 被處理體配置部U，藉由貫通孔28内之風扇29,空氣在上 131850,doc 200916850 側冷卻部20之整個區域中從外部向被處理體配置部丨丨流 動。 下側冷卻部30為與上側冷卻部2〇同樣之構造，如圖1、 圖2所示，具有内側板3丨、外側板32，内側板3丨配置為被 處理體90側。又，在内側板3丨與外側板32之間形成中 間 33。 = 内側板3 1及外部板3 2為長方形狀，大致同樣大小，相對 之邊31a、31b、32a、32b與側板40、41接合。藉此，上側 冷卻部20之内側板21、下側冷卻部3〇之内側板3丨及側板 4〇、41形成一個被包圍之空間，在此空間形成被處理體配 置°卩11。又，被處理體配置部1丨，所配置之被處理體90之 板面（上面、下面）以外的相對之2個面開放，具有開放面 11a、11b。如圊1之箭頭所示，從開放面Ua、Ub進行被 處理體90之搬入及搬出。 中間空間23、33，亦藉由各個内側板2丨、3丨、各個外側 板22、32、及側板40、41包圍，開放與被處理體配置部丄i 相同之側，具有開放面23a、23b、33a、33b。 在下側冷卻部30之内側板31上，具有貫通被處理體配置 部11側與中間空間33側之圓形貫通孔34、與正方形狀之貫 通孔35，貫通孔35作為第2貫通孔而起作用。 在外側板32 ’設置有貫通中間空間33與外部之圓形貫通 孔37。貫通孔37設置於對應内側板以貫通孔处位置， 貫通孔34與貫通孔37經由筒狀體％連通而形成第】貫通孔 38。又，此第1貫通孔38上配置有風扇％。 131850.doc -12- 200916850 第1貫通孔38及第2貫通孔35形成複數個，該等交互排列 地縱橫配置，呈棋盤格，該配置係配合第1貫通孔28及第2 貫通孔25。 設置於下側冷卻部30之第i貫通孔38之風扇39亦與設置 於上側冷卻部20之風扇29同樣，均為可使第i貫通孔38内 發生氣流。第1貫通孔38内之氣流方向，如圖4所示所有風 扇39共通為被處理體配置部丨丨方向。結果，藉由上側冷卻 部20及下側冷卻部30之全部風扇29、39所產生之氣流方向 為朝向被處理體配置部11側之方向。 如此’在本實施態樣之冷卻部10中，風扇29、39作動 ¥，產生從第1貫通孔2 8、3 8向被處理體配置部丨丨之流 動，外側板22、32之外側之外部空氣向被處理體配置部i i 流動。 下側冷卻部30之内側板31之上側，即，在被處理體配置 部11側’配置有用於載置被處理體9〇之支撐銷43，在内側 板3 1之上側固定。支撐銷43，避開内側板3 1之貫通孔34及 貝通孔3 5而形成複數個，長度相同。因此，載置於支撑銷 43之上的被處理體90 ,與内側板3丨平行地配置，被處理體 90與内側板3 1之間隔’在整個區域大致相同。 又，支撐銷43之前端部分由於尖而與被處理體9〇成接近 點接觸之狀態，可減少與被處理體9〇之接觸部分，又，在 冷卻之際，可對更廣之面積吹氣流，提高冷卻性。 所配置之被處理體90位於冷卻部1 〇之上側冷卻部2〇與下 側冷卻部3 0之間。藉由風扇2 9、3 9之作動，外部之空氣從 131850.doc •13· 200916850 上側冷卻部20之第1貫通孔28及下側冷卻部3〇之第1貫通孔 38流入被處理體配置部u，向被處理體卯之上面及下面流 動’吹到該被處理體90之上面及下面。 奪走被處理體90之熱而溫度上升之空氣，如圖4所示， 從第2貫通孔25、35流到中間空間23、33。此係由於第1貫 通孔28、38與第2貫通孔25、35相鄰地配置，成相互夾持 之位置關係，因此在被處理體配置部u之開放部11&、nb 上空氣幾乎不流動，主要流到中間空間23、33。再者，空 氣流向中間空間23、33之開放面23a、23b、33a、33b而排 出。 其次’對於被處理體冷卻裝置1之使用方法進行說明。 在本實施態樣之被處理體冷卻裝置1中，一同使用未圖 示之加熱處理裝置、搬入裝置、搬出裝置。且，藉此該等 裝置成為熱處理系統5。 且’由被處理體冷卻裝置1冷卻之被處理體9〇，藉由前 述加熱處理裝置以高溫加熱處理，藉由搬入裝置從加熱處 理裝置移動到被處理體冷卻裝置丨之被處理體配置部u , 冷卻之後，藉由搬出裝置從被處理體冷卻裝置1搬出。 加熱處理裝置、搬入裝置、搬出裝置，可使用周知者。 譬如，作為加熱處理裝置，可使用利用電加熱器等之烤 爐，又，作為搬入裝置及搬出裝置，可使用機器人式手 臂。 藉由搬入裝置之搬入，從開放面Ua開始進行。此所搬 入之剛加熱處理後之被處理體9〇，如圖2、圖4所示，載置 131850.doc -14· 200916850 於支撐銷43之上。藉由使風扇29、39作動，向内部供給外 側板22、32外側之外部空氣，來冷卻被處理體90。 此外部之空氣，由於在被處理體9〇之整個區域供給，因 此不會如先前般，在沿被處理體9〇之面流動空氣時成為問 題之下游側之冷卻能力下降，而可均一的冷卻。 冷卻至特定溫度以下之被處理體90，藉由搬出裝置從開 放面11 b搬出，其後，搬入其他被處理體9〇按次序冷卻。 風扇29、39之作動，可僅在進行冷卻時作動，又，亦可經 常作動。 在本實施態樣之被處理體冷卻裝置1中，在設置於相對 位置的開放面11a、lib中，進行被處理體90之搬入、搬 出。因此，將熱處理系統5之被處理體冷卻裝置丨之前後步 驟的配置設為直線狀、進而可容易地將整體配置設為直線 狀。- The fifth aspect is characterized in that in the third or fourth aspect, the support pin can be stretched or can be moved up and down by the expansion or contraction of the support pin to change the distance between the cooling portion and the object to be processed. According to the fifth aspect, since the support lock is retractable or can be moved up and down, the distance between the cooling portion and the object to be processed can be changed by the expansion or contraction of the support pin, so that it can be changed for cooling 7 根据 according to the need. The speed increases the workability of loading and unloading of the object to be processed. The eighth aspect is characterized in that the first through hole and the second through hole parent are arranged alternately with each other in the first and second passholes. According to the sixth aspect, since the first through hole and the second through hole ' are arranged alternately, the air flow for cooling can be stabilized. In the seventh aspect, the first through hole and the second through hole are arranged in a checkerboard pattern. Here, the phrase "the first through hole and the second through hole are arranged in a checkerboard pattern" means that the arrangement of the first through hole and the second through hole is arranged vertically and horizontally, and the vertical and horizontal alignments are arranged. Both the hole and the second through hole are alternately arranged. The eighth aspect is characterized in that in the first to seventh aspects, the opposite sides are open. According to the eighth aspect, the arrangement portion has two opposing surfaces, so that the object to be processed can be carried from either side and the object to be processed can be carried out from the other side. The ninth aspect is a heat treatment system including a heat treatment device that performs heat treatment of the object to be processed, a body cooling device of the first to eighth aspects, and a body to be processed after the heat treatment is taken out, and is carried in the foregoing The carrying device of the object cooling device. [Effects of the Invention] The object cooling device of the present invention is small and can efficiently cool the object to be processed. [Embodiment] Hereinafter, embodiments of the invention will be described. As shown in FIGS. 1 and 2, the object cooling device 第 according to the first embodiment has a cooling unit 1〇 composed of an upper cooling unit 20 and a lower cooling unit 3〇, and a cooling unit 1〇 formed by the upper cooling unit 20 and The object arrangement portion 11 between the lower side cooling portions 3A. The plate-shaped object to be processed 9 is placed in the arranging portion 11, and is cooled by the upper side cooling unit 2'' and the lower side cooling unit 3'' located on both sides of the processing body 90130.doc.10-200916850. The upper side cooling unit 20 has an inner side plate 21 and an outer side plate 22 . The object to be processed 9 is placed on the lower side of the inner side plate 21. There is an intermediate space 23 between the inner side panel 21 and the outer side panel 22. The inner side panel 21 and the outer side panel 22 are substantially rectangular in shape. The opposite sides 21a, 21b, 22a, and 22b are joined to the side plates 40 and 41. As shown in Fig. 2, the inner panel 21 has through holes 24 and 25 that penetrate the side of the object to be processed portion and the side of the intermediate space 23. The through hole 24 communicates with the cylindrical body 26 in a circular hole. Further, the through hole 25 has a square shape (hereinafter referred to as a second through hole). The outer plate 22 is provided with a through hole 27 penetrating the intermediate space 23 and the outside. The through hole 27 is formed in a circular shape at a position corresponding to the through hole 24 of the inner side plate 2A. The through hole 27 communicates with the tubular body 26 to form the jth through hole 28 integrally. The first through hole 28' is blocked between the intermediate space 23 by the tubular body 26, and communicates with the outside and the object arrangement portion 丨丨. A fan 209 is disposed in the first through hole 28. The first pass hole 28 and the second through hole 25 form a complex array, and are arranged vertically and horizontally in an alternating manner. As shown in Fig. 3, the whole is a checkerboard shape. Further, the i-th through hole 28 and the second through hole 25 are disposed over the entire area where the object to be processed 9 is disposed. Therefore, the object to be processed 90 is integrally cooled by the upper side cooling unit 2''. The fan 29 is located inside the first through hole 28, and the fan 29 causes an air flow in the through hole 28. The first through holes 28 are provided in plurality in the upper cooling unit. Each of the through holes 28 has a fan 29. As shown in Fig. 4, the airflow is directed toward the target object arranging portion U, and the air is supplied from the outside to the object to be processed portion in the entire region of the upper portion 131850 and the doc 200916850 side cooling portion 20 by the fan 29 in the through hole 28.丨 flow. The lower cooling unit 30 has the same structure as the upper cooling unit 2A. As shown in Figs. 1 and 2, the lower cooling unit 30 has an inner side plate 3丨 and an outer side plate 32, and the inner side plate 3丨 is disposed on the side of the object to be processed 90. Further, an intermediate portion 33 is formed between the inner side plate 3'' and the outer side plate 32. = The inner side plate 3 1 and the outer side plate 3 2 have a rectangular shape and are substantially the same size, and the opposite sides 31a, 31b, 32a, 32b are joined to the side plates 40, 41. Thereby, the inner side plate 21 of the upper side cooling unit 20, the inner side plate 3 of the lower side cooling part 3, and the side plates 4, 41 form a space surrounded by the space to be processed. Further, the object to be processed portion 1b is open to the opposite two faces other than the plate surface (upper surface and lower surface) of the object to be processed 90, and has open surfaces 11a and 11b. As shown by the arrow of 圊1, the object to be processed 90 is carried in and out from the open surfaces Ua and Ub. The intermediate spaces 23 and 33 are also surrounded by the inner side plates 2丨, 3丨, the outer side plates 22 and 32, and the side plates 40 and 41, and open to the same side as the object arrangement unit 丄i, and have an open surface 23a. 23b, 33a, 33b. The inner side plate 31 of the lower side cooling unit 30 has a circular through hole 34 penetrating the side of the object to be processed portion 11 and the side of the intermediate space 33, and a through hole 35 having a square shape, and the through hole 35 serves as a second through hole. effect. The outer side plate 32' is provided with a circular through hole 37 penetrating the intermediate space 33 and the outside. The through hole 37 is provided at a position corresponding to the inner side plate at the through hole, and the through hole 34 and the through hole 37 communicate with each other via the cylindrical body % to form a through hole 38. Further, the fan % is disposed on the first through hole 38. 131850.doc -12- 200916850 A plurality of first through holes 38 and second through holes 35 are formed in a plurality of rows, which are arranged in a vertical and horizontal direction, and are arranged in a checkerboard. This arrangement is to match the first through holes 28 and the second through holes 25. Similarly to the fan 29 provided in the upper cooling unit 20, the fan 39 provided in the i-th through hole 38 of the lower cooling unit 30 can generate airflow in the i-th through hole 38. In the airflow direction in the first through hole 38, as shown in Fig. 4, all the fans 39 are common to the object arrangement portion 丨丨 direction. As a result, the airflow direction generated by all of the fans 29 and 39 of the upper cooling unit 20 and the lower cooling unit 30 is directed toward the object arrangement portion 11 side. In the cooling unit 10 of the present embodiment, the fans 29 and 39 are actuated, and the flow from the first through holes 28 and 38 to the object arrangement portion 丨丨 is generated, and the outer plates 22 and 32 are outside. The outside air flows to the object arrangement portion ii. On the upper side of the inner side plate 31 of the lower side cooling unit 30, that is, the support pin 43 for placing the object to be processed 9 is placed on the side of the object to be processed portion 11 and is fixed to the upper side of the inner side plate 31. The support pin 43 is formed in plural numbers and has the same length while avoiding the through hole 34 of the inner side plate 31 and the through hole 35. Therefore, the object to be processed 90 placed on the support pin 43 is disposed in parallel with the inner side plate 3, and the interval ' between the object to be processed body 90 and the inner side plate 31 is substantially the same throughout the entire area. Further, the front end portion of the support pin 43 is in close contact with the object to be processed 9 due to the sharp point, so that the contact portion with the object to be processed 9 can be reduced, and when it is cooled, the wider area can be blown. Airflow for improved cooling. The object to be processed 90 to be placed is located between the upper portion of the cooling portion 1A and the lower portion of the cooling unit 2''. By the action of the fans 2 9 and 39 , the outside air flows into the object to be processed from the first through hole 28 of the upper side cooling unit 20 and the first through hole 38 of the lower side cooling unit 3 of the 131850.doc •13·200916850 The portion u flows to the upper surface and the lower surface of the object to be processed and is blown onto the upper surface and the lower surface of the object to be processed 90. The air which has taken the heat of the object to be processed 90 and whose temperature rises, as shown in FIG. 4, flows from the second through holes 25 and 35 to the intermediate spaces 23 and 33. Since the first through holes 28 and 38 are disposed adjacent to the second through holes 25 and 35 and are in a positional relationship with each other, the air is hardly formed on the opening portions 11 & nb of the workpiece arrangement portion u. The flow mainly flows to the intermediate spaces 23, 33. Further, the air flow is discharged to the open faces 23a, 23b, 33a, 33b of the intermediate spaces 23, 33. Next, the method of using the object cooling device 1 will be described. In the object cooling apparatus 1 of the present embodiment, a heat treatment device, a loading device, and a carry-out device, which are not shown, are used together. Moreover, these devices become the heat treatment system 5. The object to be processed 9 冷却 cooled by the object cooling device 1 is heated by the heat treatment device by the heat treatment device, and moved from the heat treatment device to the object arrangement portion of the object cooling device by the loading device. u, after cooling, it is carried out from the object cooling device 1 by the carry-out device. A well-known person can be used for the heat treatment device, the carry-in device, and the carry-out device. For example, as the heat treatment device, an oven using an electric heater or the like can be used, and as the carry-in device and the carry-out device, a robot hand can be used. The loading is carried out from the open surface Ua by the loading device. As shown in Fig. 2 and Fig. 4, the object to be processed 9 搬 after the heat treatment is placed on the support pin 43 as shown in Figs. 2 and 4 . By operating the fans 29 and 39, the outside air outside the outer plates 22 and 32 is supplied to the inside to cool the object to be processed 90. Since the air of the other part is supplied to the entire area of the object to be processed 9 不会, the cooling ability on the downstream side which becomes a problem when the air flows along the surface of the object to be processed 9 is not lowered as in the prior art, and the air can be uniform. cool down. The object to be processed 90 cooled to a specific temperature or lower is carried out from the opening surface 11b by the carry-out device, and thereafter, the other object to be processed 9 is loaded and cooled in order. The operation of the fans 29, 39 can be actuated only when cooling is performed, or can be actuated frequently. In the object cooling apparatus 1 of the present embodiment, the object to be processed 90 is carried in and out of the open surfaces 11a and 11b provided at the relative positions. Therefore, the arrangement of the workpiece cooling device of the heat treatment system 5 before and after the step is linear, and the entire arrangement can be easily made linear.
開放面11a、llb之中’可僅使用任一方進行被處理體9〇 之搬入、搬出。此情形’未用於被處理體90之搬入、搬出 之另一方之開放面11a、llb以關閉為佳。 熱處理系統5所使用之被處理體冷卻裝置丨之數量，既可 ^台亦可為複數台。&台數可依照進行冷卻之時間與每 單位時間進行冷卻之被處理體9〇之片數來決定。如後所 述，’可使用利用有複數台與被處理體冷卻裝置丨相同構造 的被處理體冷卻單元8的被處理體冷卻裝置〇亦可使 被處理體冷卻裝置4作為熱處理系統5。 風扇29、39可配置於其他位置。譬如，如請示之第2 131850.doc 200916850 實施態樣之被處理體冷卻裝置2，亦可採用將風扇29、39 配置於第2貫通孔25、35之中間空間23、33側，而不設置 於第1貫通孔28、38之構成。且，藉由此被處理體冷卻裝 置2之風扇29、39，產生從被處理體配置部丨丨流向中間空 間23、33側之氣流。藉此，第2貫通孔25、35之被處理體 配置部11側附近之壓力下降，因此，外部之空氣從第i貫 通孔28、38流入到被處理體配置部1丨，可產生與被處理體 冷卻裝置1同樣之空氣流動’進行被處理體9〇之冷卻。 再者’冷卻部10在被處理體90之兩面，設置有上侧冷卻 部20與下側冷卻部30，亦可僅設置其中一方。譬如，亦可 採用如圖6所示之第3實施態樣之被處理體冷卻裝置3，僅 設置上側冷卻部20之構成。又’本實施態樣之上側冷卻部 20為與第1實施態樣之被處理體冷卻裝置1相同者，但亦可 採用與第2實施態樣之被處理體冷卻裝置2相同之構造。 在被處理體冷卻裝置3上，設置有複數個用於載置被處 理體90之支撐銷53，但此支撐銷53可伸縮。且，藉由伸縮 支撐銷53，可改變冷卻部1〇(上側冷卻部20)與被處理體9〇 之距離。 伸長支撐銷53時，上側冷卻部20與被處理體9〇之距離接 近，可加速由外部供給用於冷卻之空氣之流動。又，由於 可加大被處理體90之下侧之間隙，因此可容易地進行搬入 被處理體90之作業。 在被處理體冷卻裝置3上，設置有輸送滾筒50，此輸送 滚筒50可進行冷卻後之被處理體90之搬入及搬出。輸送滾 131850.doc -16 - 200916850 筒50具有軸部51與滾筒部52。且，藉由使軸部51旋轉、滚 筒部52旋轉’滾筒部52上之被處理體9〇移動，進行被處理 體90之搬入與搬出。 由於本實施態樣之被處理體冷卻裝置3之支撐銷5 3為可 伸縮，因此在冷卻後，藉由將支撐銷53縮短至被處理體9〇 接觸於滾筒部52之程度，可在冷卻時，不使滾筒部52與被 處理體90接觸，而在搬送時確實地使被處理體9〇接觸於滾 筒部52。 又’若可使載置於支撐銷53之被處理體9〇上下動，則支 撐銷53不可伸縮亦可。此情形，使支撐銷53本身上下動， 可改變上侧冷卻部2 〇與被處理體9 〇之距離’使被處理體9 〇 與滾筒部52成為接觸或不接觸之狀態。 譬如，使位於支撐銷53下側，進行支撐銷53之固定的板 構件60可升降’可藉由板構件6〇之升降使支撐銷53上下 動。 在被處理體冷卻裝置1、2、3中，用於冷卻之空氣從外 ^ 部流入到被處理體配置部11，但此流入為第1貫通孔28、 3 8之外側板22、3 2側，為被處理體冷卻裝置1、2、3整體 之上面及下面。因此，在此面配置過濾器等，可將從外部 流入之空氣變成雜質少之空氣。又，藉由將此過濾器與外 側板22、32隔著間隙配置，可採用面積大之過濾器，可減 小通過過濾器時之阻力。 在開放面23a ' 23b、33a、33b上，設置用於排氣之機 構，可強制性排氣由於冷卻被處理體9〇而加熱之空氣。譬 131850.doc 200916850 如’作為用於該排氣之機構，可使用橫流風扇等。 在被處理體冷卻裝置1、2、3中，藉由作動風扇29、 39形成從外側板22之外部通過第i貫通孔28、38，進入 内側板21、31内部之被處理體配置部u，從第2貫通孔 25、35通過中間空間23、33至外部之流動，進行被處理體 90之冷卻，但亦可逆旋轉風❸9、39，產生與上述流動相 反之流動，以進行被處理體9G之冷卻。具體而纟，形成從 外部通過中間空間23、33、從第2貫通孔25、28進入内側 板之内部之被處理體配置部u ’通過第i貫通孔至外側板 22、32之外部的流動，進行被處理體90之冷卻。又，此情 形，被處理體冷卻裝置i、2、3之構造可使用相同者。 又，可使用如圖7所示之第4實施態樣之被處理體冷卻裝 置4進行被處理體9〇之冷卻。被處理體冷卻裝置4具有複數 個被處理體冷卻單元8，可藉由各個被處理體冷卻單元8冷 卻被處理體90。此被處理體冷卻單元8，可使用與上述被 處理體冷卻裝置1相同構造者1置有上側冷卻部20及下 側冷部部3G。，藉由上側冷卻部2()及下側冷卻部冷卻 被處理體90。X，被處理體9〇配置於支撐鎖43之上。 在被f理體冷卻裝置4中，進而具有排氣部6卜配管部 62、導管63、冷卻裝置65，成可強制性排氣由於冷卻被處 理體90而加熱之空氣來進行冷卻之構造。排氣㈣設置於 被處理體冷卻單元8(被處理體冷卻裝置υ之上側冷卻部2〇 及下側冷卻部3〇之開放面別、33_。排氣部61之内部成 空洞狀’通過開放面23b、33b連通内部空間& 131850.doc 200916850 各排範部61連接合流於配管部6 2，連接於導管6 3。再 者，導管63與冷卻裝置65相連。冷卻裝置65為可冷卻空氣 之裝置’本實施態樣之冷卻裝置6 5係使用水冷式者。使導 管63作動後’可吸引配管部62側之空氣，使其向冷卻裝置 65側移動。因此，藉由被處理體90之冷卻而加熱之高溫空 氣，從内部空間23、33通過配管部62、導管63進入冷卻裝 置65 ’在冷卻裝置65中冷卻，該冷卻後之空氣從排出口 65a排出。 伙排出品65 a排出之空氣，可再次用於被處理體％之冷 卻。因此，在潔淨室等使用被處理體冷卻裝置4之情形， 亦可反覆使用清淨度咼之空氣’又，可防止室溫之上升。 在被處理體冷卻裝置4之本體部66，對應各個被處理體 冷卻單元8形成有搬出入部66a，被處理體9〇之搬入及搬 出’可由此搬出入部66a進行。 如此，在被處理體冷卻裝置4中，由於具有複數個被處 理體冷卻單元8,因此可同時進行複數個被處理體9〇之冷 卻。又，由於可將冷卻被處理體9〇而加熱之空氣集中排氣 後在冷卻裝置65中冷卻，因此可防止周圍之溫度上升。 【圖式簡單說明】 圖1係顯示本發明之第1實施態樣之被處理體冷卻裝置之 立體圖。 圖2係顯示圖丨所示之被處理體冷卻裝置之部分破斷立體 圖。 圖3係顯示圖i所示之被處理體冷卻裝置之内側板與風扇 131850.doc -19- 200916850 之說明圖。 圖4係圖1所示之被處理體冷卻裝置之A-Λ截面圖。 圖5係本發明之第2實施態樣之被處理體冷卻裝置之截面 圖。 圖6係本發明之第3實施態樣之被處理體冷卻裝置之截面 圖。 圖7係本發明之第4實施態樣之被處理體冷卻裝置之截面 圖。Among the open surfaces 11a and 11b, the object to be processed 9 can be carried in and out using only one of them. In this case, it is preferable that the open surfaces 11a and 11b which are not used for loading and unloading the object to be processed 90 are closed. The number of the object cooling devices used in the heat treatment system 5 may be either a table or a plurality of units. The number of & can be determined in accordance with the number of times the cooling is performed and the number of processed objects 9 冷却 which are cooled per unit time. As will be described later, the object cooling device 4 of the object cooling unit 8 having the same structure as that of the object cooling device 可 can be used as the heat treatment system 5. The fans 29, 39 can be placed in other locations. For example, in the object to be cooled device 2 of the second aspect of the present invention, the fans 29 and 39 may be disposed on the intermediate spaces 23 and 33 of the second through holes 25 and 35 without being provided. The first through holes 28 and 38 are configured. By the fans 29 and 39 of the object cooling device 2, the airflow from the object arrangement portion 丨丨 to the intermediate spaces 23 and 33 is generated. As a result, the pressure in the vicinity of the side of the object arrangement portion 11 of the second through holes 25 and 35 is lowered. Therefore, the outside air flows into the object arrangement portion 1 from the i-th through holes 28 and 38, and can be generated and The same flow of air as the treatment body cooling device 1 performs cooling of the object to be treated 9 . Further, the 'cooling unit 10' is provided with the upper side cooling unit 20 and the lower side cooling unit 30 on both surfaces of the object to be processed 90, and only one of them may be provided. For example, the object cooling device 3 according to the third embodiment shown in Fig. 6 may be employed, and only the upper cooling unit 20 may be provided. Further, the upper side cooling unit 20 of the present embodiment is the same as the object cooling apparatus 1 of the first embodiment, but the same structure as the object cooling apparatus 2 of the second embodiment may be employed. On the object cooling device 3, a plurality of support pins 53 for placing the object to be processed 90 are provided, but the support pins 53 are expandable and contractible. Further, by the telescopic support pin 53, the distance between the cooling portion 1 (the upper cooling portion 20) and the object to be processed 9A can be changed. When the support pin 53 is extended, the distance between the upper side cooling portion 20 and the object to be processed 9 is close to that the flow of the air for cooling supplied from the outside can be accelerated. Further, since the gap on the lower side of the object to be processed 90 can be increased, the work of carrying in the object to be processed 90 can be easily performed. The object cooling device 3 is provided with a transport roller 50 which can carry in and carry out the cooled processed object 90. The conveying roller 131850.doc -16 - 200916850 The cylinder 50 has a shaft portion 51 and a drum portion 52. By rotating the shaft portion 51 and rotating the roller portion 52 to move the object to be processed 9 on the drum portion 52, the object to be processed 90 is carried in and out. Since the support pin 53 of the object cooling device 3 of the present embodiment is retractable, after the cooling, the support pin 53 is shortened to the extent that the object to be treated 9 is in contact with the roller portion 52, and can be cooled. At this time, the roller portion 52 is not brought into contact with the object to be processed 90, and the object to be processed 9 is surely brought into contact with the roller portion 52 at the time of conveyance. Further, if the object to be processed 9 placed on the support pin 53 is moved up and down, the support pin 53 may not be stretchable. In this case, the support pin 53 itself is moved up and down, and the distance between the upper side cooling unit 2 〇 and the object to be processed 9 ′ can be changed to bring the object to be processed 9 〇 into contact with or not in contact with the drum unit 52. For example, the plate member 60 located on the lower side of the support pin 53 and fixed by the support pin 53 can be raised and lowered. The support pin 53 can be moved up and down by the lifting and lowering of the plate member 6〇. In the object cooling apparatuses 1, 2, and 3, the air for cooling flows into the workpiece arrangement portion 11 from the outer portion, but the inflow is the first through holes 28, 38, and the outer side plates 22, 3 2 On the side, the upper and lower surfaces of the apparatus 1, 2, and 3 are cooled. Therefore, a filter or the like is disposed on the surface to change the air flowing in from the outside into the air having less impurities. Further, by arranging the filter and the outer side plates 22, 32 with a gap therebetween, a filter having a large area can be used, and the resistance when passing through the filter can be reduced. On the open faces 23a' 23b, 33a, 33b, a mechanism for exhausting is provided, and it is possible to forcibly exhaust the air heated by cooling the object to be processed 9 〇.譬 131850.doc 200916850 As a mechanism for the exhaust, a cross flow fan or the like can be used. In the object cooling apparatuses 1, 2, and 3, the operation fans 29 and 39 are formed to pass through the i-th through holes 28 and 38 from the outside of the outer side plate 22, and enter the object arrangement portion u inside the inner plates 21 and 31. The second through-holes 25 and 35 pass through the intermediate spaces 23 and 33 to the outside to cool the object to be processed 90. However, the airflows 9 and 39 may be reversely rotated to generate a flow opposite to the flow to perform the object to be processed. 9G cooling. Specifically, the flow from the outside through the intermediate spaces 23 and 33 and from the second through holes 25 and 28 into the inside of the inner panel passes through the i-th through hole to the outside of the outer plates 22 and 32. Cooling of the object to be processed 90 is performed. Further, in this case, the same configuration can be used for the structures of the object cooling devices i, 2, and 3. Further, the object to be processed body 4 can be cooled by using the object cooling device 4 of the fourth embodiment shown in Fig. 7 . The object cooling device 4 has a plurality of object cooling units 8 which can be cooled by the respective object cooling units 8. In the object cooling unit 8, the upper side cooling unit 20 and the lower side cold part 3G can be placed in the same structure as the object cooling apparatus 1 described above. The object to be processed 90 is cooled by the upper cooling unit 2 () and the lower cooling unit. X, the object to be processed 9 is disposed on the support lock 43. Further, the physico-system cooling device 4 further includes a venting portion 6, a pipe portion 62, a duct 63, and a cooling device 65, and is configured to forcibly exhaust air cooled by cooling the body 90 to be cooled. The exhaust gas (4) is provided in the object cooling unit 8 (the open surface of the object cooling device υ upper side cooling unit 2 〇 and the lower side cooling unit 3 、, 33_. The inside of the exhaust unit 61 is hollow) The surfaces 23b and 33b communicate with the internal space & 131850.doc 200916850. Each of the rows 61 is connected to the piping portion 62 and connected to the conduit 63. Further, the conduit 63 is connected to the cooling device 65. The cooling device 65 is a coolable air. In the cooling device 6.5 of the present embodiment, the water-cooled type is used. After the conduit 63 is actuated, the air on the side of the pipe portion 62 can be sucked and moved to the side of the cooling device 65. Therefore, the object to be processed 90 The high-temperature air heated and cooled is cooled from the internal space 23, 33 through the piping portion 62 and the duct 63 into the cooling device 65', and is cooled in the cooling device 65. The cooled air is discharged from the discharge port 65a. The air can be reused for the cooling of the object to be treated. Therefore, in the case where the object cooling device 4 is used in a clean room or the like, the air of the cleanliness can be used repeatedly, and the rise in the room temperature can be prevented. Being served The main body portion 66 of the body cooling device 4 is formed with the carry-in/out portion 66a for each of the target object cooling units 8, and the carry-in and carry-out of the object to be processed 9 can be carried out by the carry-in/out portion 66a. Thus, in the object cooling device 4 Since there are a plurality of objects to be processed, the cooling unit 8 can simultaneously perform cooling of a plurality of objects to be processed. Further, since the air heated by cooling the object to be processed 9 is concentrated and exhausted, it is cooled in the cooling device 65. Fig. 1 is a perspective view showing the object cooling device according to the first embodiment of the present invention. Fig. 2 is a view showing the object to be cooled as shown in Fig. Fig. 3 is an explanatory view showing the inner side plate of the object cooling device shown in Fig. i and the fan 131850.doc -19- 200916850. Fig. 4 is a body cooling device shown in Fig. 1. Fig. 5 is a cross-sectional view of a body cooling device according to a second embodiment of the present invention. Fig. 6 is a cross-sectional view showing a body cooling device according to a third embodiment of the present invention. 7 series A fourth embodiment of the invention, a sectional view of the cooling apparatus of the aspects of the body to be treated.
5 【主要元件符號說明】 、2、3 ' 4 被處理體冷卻裝置 熱處理系統 8 10 被處理體冷卻單元 冷卻部 11 20 215 [Description of main component symbols], 2, 3 ' 4 Cooling device for processed object Heat treatment system 8 10 Cooling unit for processed object Cooling unit 11 20 21
被處理體配置部 上側冷卻部 内側板 22 23 25 28 29 30 31 32 外側板 中間空間 弟2貫通孔 第1貫通孔 風扇 下側冷卻部 内側板 外側板 131850.doc •20- 200916850Object to be processed part Upper side cooling part Inner side plate 22 23 25 28 29 30 31 32 Outer side plate Intermediate space 2nd through hole 1st through hole Fan Lower side cooling part Inner side plate Outside side plate 131850.doc •20- 200916850
33 中間空間 35 第2貫通孔 38 第1貫通孔 39 風扇 43、53 支撐銷 90 被處理體 11a 開放面 lib 開放面 21a 邊 21b 邊 22a 邊 22b 邊 23a 開放面 23b 開放面 27 貫通孔 31a 邊 31b 邊 32a 邊 32b 邊 33a 開放面 33b 開放面 34 貫通孔 40 側板 41 側板 131850.doc -21 ·33 Intermediate space 35 Second through hole 38 First through hole 39 Fan 43, 53 Support pin 90 Object to be processed 11a Open surface lib Open surface 21a Side 21b Side 22a Side 22b Side 23a Open surface 23b Open surface 27 Through hole 31a Side 31b Side 32a Side 32b Side 33a Open Face 33b Open Face 34 Through Hole 40 Side Plate 41 Side Plate 131850.doc -21 ·
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007179003A JP4559454B2 (en) | 2007-07-06 | 2007-07-06 | Plate cooling device, heat treatment system |
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| TW200916850A true TW200916850A (en) | 2009-04-16 |
| TWI431335B TWI431335B (en) | 2014-03-21 |
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| TW097121599A TWI431335B (en) | 2007-07-06 | 2008-06-10 | A cooling device for a plate-shaped treated body, and a heat treatment system incorporated in the apparatus |
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| JP (1) | JP4559454B2 (en) |
| KR (1) | KR20090004701A (en) |
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| JP5856890B2 (en) * | 2012-03-29 | 2016-02-10 | 株式会社Ｓｃｒｅｅｎホールディングス | Heat treatment equipment |
| CN103626389B (en) * | 2012-08-29 | 2016-01-13 | 英属开曼群岛商精曜有限公司 | Heat sink and working method thereof |
| KR101802888B1 (en) | 2016-01-15 | 2017-12-29 | 주식회사 비아트론 | Thermal processing system having recirculation cooling unit |
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| JP2782791B2 (en) * | 1989-06-06 | 1998-08-06 | 松下電器産業株式会社 | Reflow equipment |
| JP3274089B2 (en) * | 1997-08-19 | 2002-04-15 | タバイエスペック株式会社 | Hybrid type heat treatment equipment |
| JP4473814B2 (en) * | 2001-02-23 | 2010-06-02 | 株式会社タムラ製作所 | heating furnace |
| US6938432B2 (en) * | 2002-01-10 | 2005-09-06 | Espec Corp. | Cooling apparatus and a thermostat with the apparatus installed therein |
| JP2005079466A (en) * | 2003-09-02 | 2005-03-24 | Furukawa Electric Co Ltd:The | Reflow device having cooling mechanism and reflow furnace using the reflow device |
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2007
- 2007-07-06 JP JP2007179003A patent/JP4559454B2/en not_active Expired - Fee Related
-
2008
- 2008-06-10 TW TW097121599A patent/TWI431335B/en not_active IP Right Cessation
- 2008-07-03 KR KR1020080064201A patent/KR20090004701A/en not_active Application Discontinuation
- 2008-07-04 CN CN2008101303152A patent/CN101338976B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090004701A (en) | 2009-01-12 |
| CN101338976B (en) | 2011-07-20 |
| CN101338976A (en) | 2009-01-07 |
| JP4559454B2 (en) | 2010-10-06 |
| TWI431335B (en) | 2014-03-21 |
| JP2009013031A (en) | 2009-01-22 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |