WO2000077114A1 - Bande adhesive destinee a fixer provisoirement des pieces - Google Patents
Bande adhesive destinee a fixer provisoirement des pieces Download PDFInfo
- Publication number
- WO2000077114A1 WO2000077114A1 PCT/JP2000/003814 JP0003814W WO0077114A1 WO 2000077114 A1 WO2000077114 A1 WO 2000077114A1 JP 0003814 W JP0003814 W JP 0003814W WO 0077114 A1 WO0077114 A1 WO 0077114A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- weight
- pressure
- adhesive tape
- adhesive
- sensitive adhesive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11169013A JP2000355684A (ja) | 1999-06-15 | 1999-06-15 | 部品の仮止め粘着テープ |
JP11/169013 | 1999-06-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000077114A1 true WO2000077114A1 (fr) | 2000-12-21 |
Family
ID=15878723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2000/003814 WO2000077114A1 (fr) | 1999-06-15 | 2000-06-12 | Bande adhesive destinee a fixer provisoirement des pieces |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2000355684A (ja) |
KR (1) | KR100457653B1 (ja) |
CN (1) | CN1143883C (ja) |
MY (1) | MY136260A (ja) |
TW (1) | TWI228533B (ja) |
WO (1) | WO2000077114A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7008680B2 (en) | 2003-07-03 | 2006-03-07 | 3M Innovative Properties Company | Heat-activatable adhesive |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4888928B2 (ja) * | 2001-06-08 | 2012-02-29 | 日東電工株式会社 | セラミックグリーンシートの製造方法、積層セラミック電子部品の製造方法およびセラミックグリーンシート用キャリアシート |
JP2005225617A (ja) * | 2004-02-13 | 2005-08-25 | Hebaroido Kk | 感温性粘着テープを利用した急角度昇降ベルトコンベア |
JP2005255960A (ja) * | 2004-03-15 | 2005-09-22 | Nitta Ind Corp | 基材フィルムの収縮を抑制した感温性粘着テープ |
JP2005336681A (ja) * | 2004-05-31 | 2005-12-08 | Nitta Ind Corp | カツラ固定用粘着剤およびカツラ固定用粘着テープ |
JP2006245352A (ja) * | 2005-03-04 | 2006-09-14 | Nitta Ind Corp | ウエハのダイシング用テープ、半導体チップのピックアップ方法 |
JP2007025276A (ja) * | 2005-07-15 | 2007-02-01 | Nitta Ind Corp | 熱収縮易剥離ラベル |
KR101639700B1 (ko) * | 2009-02-16 | 2016-07-14 | 니타 가부시키가이샤 | 감온성 점착제 및 감온성 점착 테이프 |
JP5408774B2 (ja) * | 2009-04-24 | 2014-02-05 | ニッタ株式会社 | 感温性粘着剤および感温性粘着テープ |
JP5463072B2 (ja) * | 2009-05-12 | 2014-04-09 | ニッタ株式会社 | 微細構造の製造方法 |
JP5329666B2 (ja) * | 2009-08-07 | 2013-10-30 | ニッタ株式会社 | モールド固定用粘着シートおよびモールド固定用粘着テープ、並びに微細構造の製造方法 |
JP5546232B2 (ja) * | 2009-12-16 | 2014-07-09 | 古河電気工業株式会社 | 感圧型半導体ウエハ表面保護用粘着テープ |
WO2012077293A1 (ja) | 2010-12-10 | 2012-06-14 | パナソニック株式会社 | リチウムイオン電池の製造方法 |
KR101566061B1 (ko) * | 2012-12-27 | 2015-11-04 | 제일모직주식회사 | 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재 |
CN106133102B (zh) * | 2014-03-25 | 2019-08-20 | 霓达株式会社 | 感温性粘合剂 |
JP6695271B2 (ja) | 2014-04-04 | 2020-05-20 | ニッタ株式会社 | 側鎖結晶性ポリマー、感温性粘着剤、感温性粘着シートおよび感温性粘着テープ |
JP6322469B2 (ja) * | 2014-04-25 | 2018-05-09 | ニッタ株式会社 | 基板加工方法 |
JP6514551B2 (ja) * | 2015-04-10 | 2019-05-15 | ニッタ株式会社 | セラミック電子部品のダイシング用感温性粘着シートおよびセラミック電子部品の製造方法 |
JP6789001B2 (ja) * | 2016-05-17 | 2020-11-25 | ニッタ株式会社 | 感温性粘着剤 |
JP7358272B2 (ja) | 2019-02-21 | 2023-10-10 | マクセル株式会社 | 粘着テープ及びその使用方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990013420A1 (en) * | 1989-05-11 | 1990-11-15 | Landec Labs, Inc. | Temperature-activated adhesive assemblies |
WO1992013901A1 (en) * | 1991-02-12 | 1992-08-20 | Landec Corporation | Temperature zone specific pressure-sensitive adhesive compositions, and adhesive assemblies and methods of use associated therewith |
JPH09208924A (ja) * | 1996-02-05 | 1997-08-12 | Nitta Ind Corp | 被加工物用保持剤およびそれを用いた被加工物の脱着方法 |
JPH09249858A (ja) * | 1996-03-19 | 1997-09-22 | Nitta Ind Corp | 半導体ウエハダイシング用粘着テープ |
JPH09251273A (ja) * | 1996-03-14 | 1997-09-22 | Nitta Ind Corp | 易剥離性ラベル |
JPH09251272A (ja) * | 1996-03-14 | 1997-09-22 | Nitta Ind Corp | 易剥離性ラベルおよびその剥離方法 |
JPH09251923A (ja) * | 1996-03-15 | 1997-09-22 | Nitta Ind Corp | 積層セラミックコンデンサ積層工程用の仮止め粘着テープ及び積層セラミックコンデンサの製造方法 |
-
1999
- 1999-06-15 JP JP11169013A patent/JP2000355684A/ja active Pending
-
2000
- 2000-06-12 CN CNB00808890XA patent/CN1143883C/zh not_active Expired - Fee Related
- 2000-06-12 WO PCT/JP2000/003814 patent/WO2000077114A1/ja active IP Right Grant
- 2000-06-12 KR KR10-2001-7015948A patent/KR100457653B1/ko not_active IP Right Cessation
- 2000-06-13 TW TW089111486A patent/TWI228533B/zh not_active IP Right Cessation
- 2000-06-14 MY MYPI20002708A patent/MY136260A/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990013420A1 (en) * | 1989-05-11 | 1990-11-15 | Landec Labs, Inc. | Temperature-activated adhesive assemblies |
WO1992013901A1 (en) * | 1991-02-12 | 1992-08-20 | Landec Corporation | Temperature zone specific pressure-sensitive adhesive compositions, and adhesive assemblies and methods of use associated therewith |
JPH09208924A (ja) * | 1996-02-05 | 1997-08-12 | Nitta Ind Corp | 被加工物用保持剤およびそれを用いた被加工物の脱着方法 |
JPH09251273A (ja) * | 1996-03-14 | 1997-09-22 | Nitta Ind Corp | 易剥離性ラベル |
JPH09251272A (ja) * | 1996-03-14 | 1997-09-22 | Nitta Ind Corp | 易剥離性ラベルおよびその剥離方法 |
JPH09251923A (ja) * | 1996-03-15 | 1997-09-22 | Nitta Ind Corp | 積層セラミックコンデンサ積層工程用の仮止め粘着テープ及び積層セラミックコンデンサの製造方法 |
JPH09249858A (ja) * | 1996-03-19 | 1997-09-22 | Nitta Ind Corp | 半導体ウエハダイシング用粘着テープ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7008680B2 (en) | 2003-07-03 | 2006-03-07 | 3M Innovative Properties Company | Heat-activatable adhesive |
Also Published As
Publication number | Publication date |
---|---|
MY136260A (en) | 2008-09-30 |
CN1355834A (zh) | 2002-06-26 |
KR100457653B1 (ko) | 2004-11-18 |
KR20020034090A (ko) | 2002-05-08 |
CN1143883C (zh) | 2004-03-31 |
TWI228533B (en) | 2005-03-01 |
JP2000355684A (ja) | 2000-12-26 |
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