MY136260A - Adhesive tape for temporary-attachment of devices - Google Patents

Adhesive tape for temporary-attachment of devices

Info

Publication number
MY136260A
MY136260A MYPI20002708A MYPI20002708A MY136260A MY 136260 A MY136260 A MY 136260A MY PI20002708 A MYPI20002708 A MY PI20002708A MY PI20002708 A MYPI20002708 A MY PI20002708A MY 136260 A MY136260 A MY 136260A
Authority
MY
Malaysia
Prior art keywords
adhesive tape
adhesive
alkyl ester
acid alkyl
carbon atoms
Prior art date
Application number
MYPI20002708A
Inventor
Kiyotaka Nagai
Toshiaki Kasazaki
Eiji Inoue
Akihiko Matsumoto
Original Assignee
Nitta Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Corp filed Critical Nitta Corp
Publication of MY136260A publication Critical patent/MY136260A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Abstract

AN ADHESIVE TAPE FOR TEMPORARY ATTACHMENT OF A DEVICE INCLUDES A SUBSTRATE FILM AND AN ADHESIVE LAYER PROVIDED ON AT LEAST ONE FACE OF THE SUBSTRATE FILM. THE ADHESIVE LAYER IS COMPOSED OF AN ADHESIVE COMPOSITION, THE ADHESIVE COMPOSITION CONTAINING A PRESSURE-SENSITIVE ADHESIVE AND A SIDE - CHAIN CRYSTALLIZABLE POLYMER. THE SIDE-CHAIN CRYSTALLIZABLE POLYMER IS OBTAINED FROM A MONOMER MIXTURE COMPRISING : ABOUT 40 TO ABOUT 70 WT.% OF AN ACRYLIC ACID ALKYL ESTER AND / OR A METHACRYLIC ACID ALKYL ESTER WHICH HAS AN AKLYL GROUP INCLUDING 1 TO 6 CARBON ATOMS; ABOUT 2 TO ABOUT 10 WT.% OF A CARBOXYL GROUP-CONTAINING ETHYLENIC UNSATURATED MONOMER; AND ABOUT 20 TO ABOUT 50 WT.% OF AN ACRYLIC ACID ALKYL ESTER AND/OR A METHACRYLIC ACID ALKYL ESTER WHICH HAS AN ALKYL GROUP INCLUDING 16 OR MORE CARBON ATOMS. THE POLYMER HAS A WEIGHT AVERAGE MOLECULAR WEIGHT OF ABOUT 3,000 TO ABOUT 25,000. SINCE THE ADHESIVE TAPE HAS A GOOD TACKINESS WITH RESPECT TO THE DEVICE AT A LOW TEMPERATURE, THE DEVICE CAN BE PROCESSED (E.G., CUT) OR TRANSFERRED BY FIXING THE DEVICE ON THE ADHESIVE TAPE AT A LOW TEMPERATURE. WHEN PEELING THE DEVICE OFF THE ADHESIVE TAPE, THE ADHESIVE TAPE IS HEATED TO A PREDETERMINED TEMPERATURE OR ABOVE SO THAT THE DEVICE CAN BE EASILY PEELED OFF THE ADHESIVE TAPE.
MYPI20002708A 1999-06-15 2000-06-14 Adhesive tape for temporary-attachment of devices MY136260A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11169013A JP2000355684A (en) 1999-06-15 1999-06-15 Pressure-sensive adhesive tape for temporarily fixing part

Publications (1)

Publication Number Publication Date
MY136260A true MY136260A (en) 2008-09-30

Family

ID=15878723

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20002708A MY136260A (en) 1999-06-15 2000-06-14 Adhesive tape for temporary-attachment of devices

Country Status (6)

Country Link
JP (1) JP2000355684A (en)
KR (1) KR100457653B1 (en)
CN (1) CN1143883C (en)
MY (1) MY136260A (en)
TW (1) TWI228533B (en)
WO (1) WO2000077114A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4888928B2 (en) * 2001-06-08 2012-02-29 日東電工株式会社 Method for manufacturing ceramic green sheet, method for manufacturing multilayer ceramic electronic component, and carrier sheet for ceramic green sheet
US7008680B2 (en) 2003-07-03 2006-03-07 3M Innovative Properties Company Heat-activatable adhesive
JP2005225617A (en) * 2004-02-13 2005-08-25 Hebaroido Kk Sharp inclination belt conveyor using thermosensitive adhesive tape
JP2005255960A (en) * 2004-03-15 2005-09-22 Nitta Ind Corp Thermosensitive adhesive tape controlled of shrinkage of substrate film
JP2005336681A (en) * 2004-05-31 2005-12-08 Nitta Ind Corp Pressure-sensitive adhesive for fixing wig and pressure-sensitive adhesive tape for fixing wig
JP2006245352A (en) * 2005-03-04 2006-09-14 Nitta Ind Corp Wafer dicing tape, and semiconductor-chip picking-up method
JP2007025276A (en) * 2005-07-15 2007-02-01 Nitta Ind Corp Heat shrinkable and easily releasable label
CN102317399B (en) * 2009-02-16 2014-08-06 新田股份有限公司 Heat-sensitive adhesive and heat-sensitive adhesive tape
JP5408774B2 (en) * 2009-04-24 2014-02-05 ニッタ株式会社 Temperature-sensitive adhesive and temperature-sensitive adhesive tape
JP5463072B2 (en) * 2009-05-12 2014-04-09 ニッタ株式会社 Microstructure manufacturing method
CN102470603B (en) * 2009-08-07 2015-03-25 新田股份有限公司 Adhesive sheet for fixing mold, and adhesive tape for fixing mold, and process for producing fine structure
JP5546232B2 (en) * 2009-12-16 2014-07-09 古河電気工業株式会社 Pressure sensitive adhesive tape for semiconductor surface protection
WO2012077293A1 (en) 2010-12-10 2012-06-14 パナソニック株式会社 Method for producing lithium-ion battery
KR101566061B1 (en) * 2012-12-27 2015-11-04 제일모직주식회사 Adhesive film, adhesive composition for the same and display member comprising the same
KR102281487B1 (en) * 2014-03-25 2021-07-26 니타 가부시키가이샤 Temperature-sensitive adhesive
JP6695271B2 (en) 2014-04-04 2020-05-20 ニッタ株式会社 Side chain crystalline polymer, temperature-sensitive adhesive, temperature-sensitive adhesive sheet and temperature-sensitive adhesive tape
JP6322469B2 (en) * 2014-04-25 2018-05-09 ニッタ株式会社 Substrate processing method
JP6514551B2 (en) * 2015-04-10 2019-05-15 ニッタ株式会社 Temperature-sensitive adhesive sheet for dicing of ceramic electronic components and method of manufacturing ceramic electronic components
JP6789001B2 (en) * 2016-05-17 2020-11-25 ニッタ株式会社 Temperature sensitive adhesive
JP7358272B2 (en) 2019-02-21 2023-10-10 マクセル株式会社 Adhesive tape and its usage

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69028528T2 (en) * 1989-05-11 1997-04-24 Landec Corp BINDING UNITS ACTIVATED BY THE TEMPERATURE
DE69225586T2 (en) * 1991-02-12 1999-01-28 Landec Corp TEMPERATURE ZONES SPECIFIC PRESSURE SENSITIVE ADHESIVE COMPOSITIONS, ADHESIVE CONTAINERS AND RELATED METHODS FOR THEIR USE
JPH09208924A (en) * 1996-02-05 1997-08-12 Nitta Ind Corp Hold-back agent for material to be worked and installing and removing of material to be worked using the same
JP3717584B2 (en) * 1996-03-14 2005-11-16 ニッタ株式会社 Easy peelable label
JP3717583B2 (en) * 1996-03-14 2005-11-16 ニッタ株式会社 Easily peelable label and its peeling method
JP3485412B2 (en) * 1996-03-15 2004-01-13 ニッタ株式会社 Temporary adhesive tape for laminated ceramic capacitor laminating process and method for producing laminated ceramic capacitor
JPH09249858A (en) * 1996-03-19 1997-09-22 Nitta Ind Corp Tacky tape for dicing semiconductor wafer

Also Published As

Publication number Publication date
KR20020034090A (en) 2002-05-08
CN1355834A (en) 2002-06-26
JP2000355684A (en) 2000-12-26
KR100457653B1 (en) 2004-11-18
TWI228533B (en) 2005-03-01
CN1143883C (en) 2004-03-31
WO2000077114A1 (en) 2000-12-21

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