TWI265189B - Adhesive tape for temporary-attachment of green sheets for ceramic electronic devices and method for producing ceramic electronic devices - Google Patents
Adhesive tape for temporary-attachment of green sheets for ceramic electronic devices and method for producing ceramic electronic devicesInfo
- Publication number
- TWI265189B TWI265189B TW089111282A TW89111282A TWI265189B TW I265189 B TWI265189 B TW I265189B TW 089111282 A TW089111282 A TW 089111282A TW 89111282 A TW89111282 A TW 89111282A TW I265189 B TWI265189 B TW I265189B
- Authority
- TW
- Taiwan
- Prior art keywords
- ceramic electronic
- electronic devices
- green sheets
- adhesive tape
- adhesive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
An adhesive tape for temporary attachment of green sheets for a ceramic electronic device includes a substrate film and an adhesive layer provided on at least one face of the substrate film. The adhesive layer is composed of an adhesive composition, the adhesive composition containing a pressure-sensitive adhesive and about 1 to about 30 wt.% of a side-chain crystallizable polymer on the basis of the adhesive composition, wherein the side-chain crystallizable polymer contains as a main component an acrylic acid alkyl ester and/or a methacrylic acid alkyl ester which has a straight-chain alkyl group including 16 or more carbon atoms as a side chain. An adhesive tape for temporary attachment of green sheets for ceramic electronic devices can be provided such that a large adhesion strength is obtained when temporarily attaching green sheets for ceramic electronic devices, and that when a work is to be removed, peeling can easily occur without contaminating the work.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16450999A JP4391623B2 (en) | 1999-06-10 | 1999-06-10 | Temporary adhesive tape for raw sheet for ceramic electronic component and method for manufacturing ceramic electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
TWI265189B true TWI265189B (en) | 2006-11-01 |
Family
ID=15794522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089111282A TWI265189B (en) | 1999-06-10 | 2000-06-09 | Adhesive tape for temporary-attachment of green sheets for ceramic electronic devices and method for producing ceramic electronic devices |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4391623B2 (en) |
KR (1) | KR100457652B1 (en) |
CN (1) | CN1272396C (en) |
MY (1) | MY132153A (en) |
TW (1) | TWI265189B (en) |
WO (1) | WO2000077113A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI477574B (en) * | 2009-07-02 | 2015-03-21 | Nitta Corp | Adhesive tape with functional film and transfer method for functional film |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI302561B (en) * | 2004-01-28 | 2008-11-01 | Lg Chemical Ltd | Releasable adhesive composition |
JP2006245353A (en) * | 2005-03-04 | 2006-09-14 | Nitta Ind Corp | Fastening adhesive tape, and method of manufacturing laminated ceramic capacitor |
KR100843449B1 (en) * | 2006-08-31 | 2008-07-03 | 삼성전기주식회사 | Ceramic sheet product and its production method |
JP5276314B2 (en) * | 2007-12-21 | 2013-08-28 | 東京応化工業株式会社 | Adhesive composition and adhesive film |
JP5408869B2 (en) * | 2007-12-25 | 2014-02-05 | 京セラ株式会社 | Adhesive resin composition and method for producing ceramic substrate using the same |
JP5639446B2 (en) * | 2010-11-09 | 2014-12-10 | ニッタ株式会社 | Easy peelable adhesive sheet and easy peelable adhesive tape |
KR20130142405A (en) * | 2012-06-19 | 2013-12-30 | 삼성디스플레이 주식회사 | Display device and method of manufacturing a display device |
CN105073932B (en) * | 2013-04-05 | 2017-09-22 | 霓达株式会社 | The method of temporarily fixing of interim fixation double-sided adhesive tape and the machined object using the adhesive tape |
JP6542562B2 (en) * | 2015-04-03 | 2019-07-10 | ニッタ株式会社 | Temperature sensitive adhesive |
JP2016199725A (en) * | 2015-04-14 | 2016-12-01 | ニッタ株式会社 | Temperature-sensitive adhesive sheet for producing ceramic electronic component and method for producing ceramic electronic component |
JP6789001B2 (en) * | 2016-05-17 | 2020-11-25 | ニッタ株式会社 | Temperature sensitive adhesive |
JP6967908B2 (en) * | 2016-09-09 | 2021-11-17 | ニッタ株式会社 | A temperature-sensitive adhesive sheet and a method for manufacturing a wafer using the same. |
JP7319766B2 (en) * | 2018-08-10 | 2023-08-02 | 日東電工株式会社 | Adhesive sheet |
JP7271169B2 (en) * | 2018-12-27 | 2023-05-11 | 日東電工株式会社 | Adhesive sheet |
JP7358272B2 (en) * | 2019-02-21 | 2023-10-10 | マクセル株式会社 | Adhesive tape and its usage |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69028528T2 (en) * | 1989-05-11 | 1997-04-24 | Landec Corp | BINDING UNITS ACTIVATED BY THE TEMPERATURE |
EP0571548B1 (en) * | 1991-02-12 | 1998-05-20 | Landec Corporation | Temperature zone specific pressure-sensitive adhesive compositions, and adhesive assemblies and methods of use associated therewith |
JPH09208924A (en) * | 1996-02-05 | 1997-08-12 | Nitta Ind Corp | Hold-back agent for material to be worked and installing and removing of material to be worked using the same |
JP3717584B2 (en) * | 1996-03-14 | 2005-11-16 | ニッタ株式会社 | Easy peelable label |
JP3717583B2 (en) * | 1996-03-14 | 2005-11-16 | ニッタ株式会社 | Easily peelable label and its peeling method |
JP3485412B2 (en) * | 1996-03-15 | 2004-01-13 | ニッタ株式会社 | Temporary adhesive tape for laminated ceramic capacitor laminating process and method for producing laminated ceramic capacitor |
JPH09249858A (en) * | 1996-03-19 | 1997-09-22 | Nitta Ind Corp | Tacky tape for dicing semiconductor wafer |
JPH09270580A (en) * | 1996-03-29 | 1997-10-14 | Sumitomo Kinzoku Electro Device:Kk | Manufacture of multilayer ceramic board |
JP3565411B2 (en) * | 1999-06-10 | 2004-09-15 | ニッタ株式会社 | Temporary adhesive tape for raw sheet for ceramic electronic component and method for producing ceramic electronic component |
-
1999
- 1999-06-10 JP JP16450999A patent/JP4391623B2/en not_active Expired - Lifetime
-
2000
- 2000-06-09 KR KR10-2001-7015873A patent/KR100457652B1/en active IP Right Grant
- 2000-06-09 TW TW089111282A patent/TWI265189B/en not_active IP Right Cessation
- 2000-06-09 WO PCT/JP2000/003796 patent/WO2000077113A1/en active IP Right Grant
- 2000-06-09 MY MYPI20002604A patent/MY132153A/en unknown
- 2000-06-09 CN CNB008087210A patent/CN1272396C/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI477574B (en) * | 2009-07-02 | 2015-03-21 | Nitta Corp | Adhesive tape with functional film and transfer method for functional film |
Also Published As
Publication number | Publication date |
---|---|
KR100457652B1 (en) | 2004-11-18 |
JP4391623B2 (en) | 2009-12-24 |
JP2000351946A (en) | 2000-12-19 |
CN1272396C (en) | 2006-08-30 |
CN1355833A (en) | 2002-06-26 |
WO2000077113A1 (en) | 2000-12-21 |
MY132153A (en) | 2007-09-28 |
KR20020034089A (en) | 2002-05-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |