MY127834A - Temporary attachment adhesive tape for multilayer ceramic capacitor and method for producing multilayer ceramic capacitor - Google Patents
Temporary attachment adhesive tape for multilayer ceramic capacitor and method for producing multilayer ceramic capacitorInfo
- Publication number
- MY127834A MY127834A MYPI9701054A MY127834A MY 127834 A MY127834 A MY 127834A MY PI9701054 A MYPI9701054 A MY PI9701054A MY 127834 A MY127834 A MY 127834A
- Authority
- MY
- Malaysia
- Prior art keywords
- polymer
- multilayer ceramic
- ceramic capacitor
- adhesive tape
- temporary attachment
- Prior art date
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Ceramic Capacitors (AREA)
- Laminated Bodies (AREA)
Abstract
A TEMPORARY ATTACHMENT ADHESIVE TAPE FOR A MULTILAYER CERAMIC CAPACITOR INCLUDES A SUBSTRATE FILM AND AN ADHESIVE LAYER PROVIDED ON ONE FACE OR BOTH FACES OF THE SUBSTRATE FILM. THE ADHESIVE LAYER IS FORMED OF A POLYMER COMPOSITION CONTAINING A POLYMER HAVING A FIRST-ORDER MELTING TRANSITION WHICH OCCURS OVER A TEMPERATURE RANGE NARROWER THAN ABOUT ABOUT 15°C. THE POLYMER IS A SIDE-CHAIN CRYSTALLIZABLE POLYMER. THE SIDE-CHAIN CRYSTALLIZABLE POLYMER IS PRESENT IN THE POLYMER COMPOSITION IN AN AMOUNT EFFECTIVE TO RENDER THE POLYMER COMPOSITION SUBSTANTIALLY NONTACKY AT ROOM TEMPERATURE OR LOWER AND TACKY AT TEMPERATURES ABOVE ROOM TEMPERATURE. THE SIDE-CHAIN CRYSTALLIZABLE POLYMER IS A POLYMER MAINLY COMPOSED OF ACRYLATE AND/OR METHACRYLATE HAVING A LINEAR ALKYLGROUP OF 10 OR MORE CARBON ATOMS AS A SIDE-CHAIN.(FIG 1F)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP05974396A JP3485412B2 (en) | 1996-03-15 | 1996-03-15 | Temporary adhesive tape for laminated ceramic capacitor laminating process and method for producing laminated ceramic capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
MY127834A true MY127834A (en) | 2006-12-29 |
Family
ID=13122024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI9701054 MY127834A (en) | 1996-03-15 | 1997-03-13 | Temporary attachment adhesive tape for multilayer ceramic capacitor and method for producing multilayer ceramic capacitor |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3485412B2 (en) |
KR (1) | KR100334418B1 (en) |
MY (1) | MY127834A (en) |
TW (1) | TW362226B (en) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3565411B2 (en) | 1999-06-10 | 2004-09-15 | ニッタ株式会社 | Temporary adhesive tape for raw sheet for ceramic electronic component and method for producing ceramic electronic component |
JP4391623B2 (en) * | 1999-06-10 | 2009-12-24 | ニッタ株式会社 | Temporary adhesive tape for raw sheet for ceramic electronic component and method for manufacturing ceramic electronic component |
JP2000355684A (en) * | 1999-06-15 | 2000-12-26 | Nitta Ind Corp | Pressure-sensive adhesive tape for temporarily fixing part |
JP4050485B2 (en) * | 2001-07-31 | 2008-02-20 | Tdk株式会社 | Manufacturing method of laminated part and sheet for producing laminated part |
JP4321673B2 (en) * | 2002-06-21 | 2009-08-26 | フジコピアン株式会社 | Temporary adhesive sheet for raw sheets for ceramic electronic components |
JP2005336681A (en) * | 2004-05-31 | 2005-12-08 | Nitta Ind Corp | Pressure-sensitive adhesive for fixing wig and pressure-sensitive adhesive tape for fixing wig |
JP4729268B2 (en) * | 2004-05-31 | 2011-07-20 | ニッタ株式会社 | Easy removal tape for wigs |
JP5379455B2 (en) * | 2008-11-25 | 2013-12-25 | ニッタ株式会社 | Temperature sensitive adhesive |
CN102317399B (en) | 2009-02-16 | 2014-08-06 | 新田股份有限公司 | Heat-sensitive adhesive and heat-sensitive adhesive tape |
JP5408774B2 (en) * | 2009-04-24 | 2014-02-05 | ニッタ株式会社 | Temperature-sensitive adhesive and temperature-sensitive adhesive tape |
JP5551959B2 (en) * | 2010-04-09 | 2014-07-16 | ニッタ株式会社 | Easy peelable adhesive sheet and easy peelable adhesive tape |
JP2012052038A (en) | 2010-09-01 | 2012-03-15 | Nitto Denko Corp | Temporary fixing sheet for manufacturing process of electronic part |
KR101058697B1 (en) * | 2010-12-21 | 2011-08-22 | 삼성전기주식회사 | Mounting structure of ciruit board having thereon multi-layered ceramic capacitor, method thereof, land pattern of circuit board for the same, packing unit for multi-layered ceramic capacitor taped horizontally and aligning method thereof |
JP5661537B2 (en) * | 2011-03-31 | 2015-01-28 | ニッタ株式会社 | Temperature sensitive adhesive |
JP6005387B2 (en) * | 2012-04-13 | 2016-10-12 | ニッタ株式会社 | Manufacturing method of ceramic parts |
CN103788900B (en) * | 2012-11-02 | 2016-09-28 | 蔡正仁 | The glue-line of fixing electronic component adhesive tape and structure |
JP6734010B2 (en) | 2014-03-18 | 2020-08-05 | ニッタ株式会社 | Temperature-sensitive adhesive sheet and temperature-sensitive adhesive tape |
JP6289960B2 (en) | 2014-03-27 | 2018-03-07 | ニッタ株式会社 | Temperature sensitive adhesive |
KR102452985B1 (en) | 2015-04-01 | 2022-10-11 | 니타 가부시키가이샤 | Temperature-sensitive adhesive composition |
KR102453521B1 (en) | 2015-04-03 | 2022-10-12 | 니타 가부시키가이샤 | Temperature-sensitive adhesive tape and temperature-sensitive adhesive sheet |
JP6399565B2 (en) * | 2016-07-14 | 2018-10-03 | ソマール株式会社 | Adhesive composition and adhesive sheet |
JP6989277B2 (en) * | 2017-04-05 | 2022-01-05 | スリーエム イノベイティブ プロパティズ カンパニー | Adhesives, articles containing the adhesives, and how to use them |
JP6829142B2 (en) * | 2017-04-21 | 2021-02-10 | ニッタ株式会社 | How to process temperature-sensitive adhesives and workpieces |
WO2018235907A1 (en) * | 2017-06-23 | 2018-12-27 | 積水化学工業株式会社 | Resin composition, inorganic fine particle-dispersed slurry composition, inorganic fine particle-dispersed sheet, method for manufacturing all-solid-state battery, and method for manufacturing laminated ceramic capacitor |
CN108559425B (en) * | 2018-05-11 | 2020-01-17 | 华南协同创新研究院 | Solvent-free adhesive for preventing warping of FDM printing device, printing platform and manufacturing method of solvent-free adhesive |
TW202135928A (en) | 2020-01-16 | 2021-10-01 | 日商霓塔股份有限公司 | Thermosensitive microparticle |
KR20230159695A (en) | 2021-03-26 | 2023-11-21 | 니타 가부시키가이샤 | Temperature sensitive adhesive and workpiece processing method |
-
1996
- 1996-03-15 JP JP05974396A patent/JP3485412B2/en not_active Expired - Lifetime
-
1997
- 1997-03-11 TW TW086103000A patent/TW362226B/en not_active IP Right Cessation
- 1997-03-13 MY MYPI9701054 patent/MY127834A/en unknown
- 1997-03-14 KR KR1019970008768A patent/KR100334418B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP3485412B2 (en) | 2004-01-13 |
TW362226B (en) | 1999-06-21 |
JPH09251923A (en) | 1997-09-22 |
KR100334418B1 (en) | 2002-10-25 |
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