TWI477574B - Adhesive tape with functional film and transfer method for functional film - Google Patents

Adhesive tape with functional film and transfer method for functional film Download PDF

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TWI477574B
TWI477574B TW098138017A TW98138017A TWI477574B TW I477574 B TWI477574 B TW I477574B TW 098138017 A TW098138017 A TW 098138017A TW 98138017 A TW98138017 A TW 98138017A TW I477574 B TWI477574 B TW I477574B
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functional film
adhesive layer
adhesive
film
side chain
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TW098138017A
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Chinese (zh)
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TW201102418A (en
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Shinichi Nakano
Shinichiro Kawahara
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Nitta Corp
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025Transfer laminating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B32B37/065Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method resulting in the laminate being partially bonded
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/201Adhesives in the form of films or foils characterised by their carriers characterised by the release coating composition on the carrier layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/12Photovoltaic modules
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Description

附有功能膜之黏著帶及功能膜的轉印方法Transfer film with functional film and transfer method of functional film

本發明係關於具備無機密封膜等功能膜之黏著帶及功能膜的轉印方法。The present invention relates to a method of transferring an adhesive tape and a functional film having a functional film such as an inorganic sealing film.

近來,太陽能及平面顯示器等裝置係藉由有機材料構成含有密封膜等功能膜之主要構件,且謀求彈性化、輕量化、薄膜化、大型基板化等(例如,參照專利文獻1及2)。In recent years, devices such as solar energy and flat-panel displays are mainly composed of a functional material such as a sealing film, and are made of an organic material, and are made to be flexible, lightweight, thinned, and large-sized. (for example, refer to Patent Documents 1 and 2).

但是,相較於由玻璃等無機材料所形成之密封膜(無機密封膜),由有機材料所形成之密封膜(有機密封膜)之氣體阻隔性較差。因此,藉由有機密封膜密封之裝置容易受外界空氣中的水分及氧等影響而劣化,而有壽命短的問題。However, the sealing film (organic sealing film) formed of an organic material has a poor gas barrier property as compared with a sealing film (inorganic sealing film) formed of an inorganic material such as glass. Therefore, the device sealed by the organic sealing film is easily deteriorated by the influence of moisture and oxygen in the outside air, and has a problem of short life.

另一方面,在使用無機密封膜代替有機密封膜的情形中,由於輕量化等目的,有必要將無機密封膜予以薄膜化。然而,經薄膜化之無機密封膜的強度弱,在運送時容易破裂。專利文獻3記載有藉由在樹脂膜上依序層積含氟之聚矽氧橡膠(silicone rubber)層及金屬箔所形成的配線基板形成用轉印片。若依據該轉印片,藉由在聚矽氧橡膠層上層積經薄膜化之無機密封膜以代替前述金屬箔,則亦被認為可較安全地使用無機密封膜。On the other hand, in the case where an inorganic sealing film is used instead of the organic sealing film, it is necessary to thin the inorganic sealing film for the purpose of weight reduction or the like. However, the thinned inorganic sealing film is weak in strength and is easily broken during transportation. Patent Document 3 discloses a transfer sheet for forming a wiring board formed by sequentially depositing a fluorine-containing silicone rubber layer and a metal foil on a resin film. According to the transfer sheet, it is considered that the inorganic sealing film can be used more safely by laminating the thinned inorganic sealing film on the polyoxysulfide rubber layer instead of the metal foil.

但是,專利文獻3所記載的轉印片由於在黏著劑層使用聚矽氧橡膠,而有以下的問題。亦即,聚矽氧橡膠的黏著力通常為一定,保持無機密封膜時的黏著力與取出時的黏著力實質上相同。因此,若將聚矽氧橡膠的黏著力設計成較弱而使無機密封膜容易取出,則在運送時等,無機密封膜有自聚矽氧橡膠剝離的疑慮。反之,若將聚矽氧橡膠的黏著力設計成較強,則在取出時施加過度的力於無機密封膜,該無機密封膜會變形或破損。此外,由於聚矽氧橡膠係昂貴的,並且無法重複使用,故回收再利用性差而不經濟。However, the transfer sheet described in Patent Document 3 has the following problems because polyfluorene rubber is used in the adhesive layer. That is, the adhesive strength of the polyoxyethylene rubber is usually constant, and the adhesive force when holding the inorganic sealing film is substantially the same as the adhesive force at the time of taking out. Therefore, when the adhesive strength of the polyoxyxene rubber is designed to be weak and the inorganic sealing film is easily taken out, the inorganic sealing film may be peeled off from the polyoxyethylene rubber during transportation or the like. On the other hand, if the adhesive strength of the polyoxyxene rubber is designed to be strong, an excessive force is applied to the inorganic sealing film at the time of removal, and the inorganic sealing film may be deformed or broken. In addition, since the polyoxyxene rubber is expensive and cannot be reused, the recycling property is poor and uneconomical.

[專利文獻1]日本國特開2009-40951號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-40951

[專利文獻2]日本國特開2009-110873號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-110873

[專利文獻3]日本國特開2003-60329號公報[Patent Document 3] Japanese Patent Laid-Open Publication No. 2003-60329

本發明的課題係提供可安全地取出功能膜且回收再利用性優異的附有功能膜之黏著帶及功能膜的轉印方法。An object of the present invention is to provide a transfer method of a functional film-attached adhesive tape and a functional film which can safely take out a functional film and which is excellent in recyclability.

本發明之附有功能膜之黏著帶係具備:基材膜、層積於該基材膜的單面之黏著劑層、層積於該黏著劑層的表面之功能膜。前述黏著劑層含有感壓性接著劑及側鏈結晶性聚合物,同時,在該側鏈結晶性聚合物的熔點以上之溫度下,接著力會下降。The adhesive film with a functional film of the present invention comprises a base film, an adhesive layer laminated on one side of the base film, and a functional film laminated on the surface of the adhesive layer. The pressure-sensitive adhesive layer contains a pressure-sensitive adhesive and a side chain crystalline polymer, and at the same time, at a temperature equal to or higher than the melting point of the side chain crystalline polymer, the force is lowered.

本發明功能膜的轉印方法為將前述附有功能膜之黏著帶中的功能膜轉印至轉印構件的方法,其包含下述(i)及(ii)的步驟:The transfer method of the functional film of the present invention is a method of transferring the functional film in the adhesive film with the functional film described above to the transfer member, which comprises the following steps (i) and (ii):

(i)經由接著層將轉印構件接著至前述功能膜的表面之步驟。(i) a step of attaching the transfer member to the surface of the aforementioned functional film via the adhesive layer.

(ii)繼而,將前述黏著劑層的溫度設成前述側鏈結晶性聚合物的熔點以上之溫度而使黏著力下降,並自前述黏著劑層將功能膜取出,而將功能膜自黏著劑層轉印至轉印構件的步驟。(ii) Next, the temperature of the adhesive layer is set to a temperature equal to or higher than the melting point of the side chain crystalline polymer to lower the adhesive force, and the functional film is taken out from the adhesive layer to form a functional film self-adhesive agent. The step of transferring the layer to the transfer member.

此外,本發明中前述「功能膜」係指具有預定的功能且在單獨使用時會強度不足而難以使用的膜。前述功能除了密封功能以外,可列舉如電/電子的功能(導電性、絕緣性、壓電性、介電性等)、光學的功能(反射性、遮光性、偏光性、折射率控制功能等)、磁的功能(硬磁性、軟磁性、非磁性、透磁性等)、化學的功能(撥水性、吸著性、觸媒性、吸水性、離子傳導性、氧化還原性等)、熱的功能(傳熱性、絕熱性、熱膨脹控制功能等)等,亦可為此等功能以外的其他功能。Further, in the present invention, the above-mentioned "functional film" means a film which has a predetermined function and which is insufficient in strength and difficult to use when used alone. In addition to the sealing function, the above functions include electrical/electronic functions (electrical conductivity, insulating properties, piezoelectricity, dielectric properties, etc.) and optical functions (reflectivity, light blocking property, polarizing property, refractive index control function, etc.). ), magnetic functions (hard magnetic, soft magnetic, non-magnetic, magnetic permeability, etc.), chemical functions (water repellency, sorption, catalytic, water absorption, ion conductivity, redox, etc.), hot Functions (heat transfer, heat insulation, thermal expansion control, etc.), etc., and other functions other than these functions.

依據本發明,由於功能膜係藉由基材膜及設於該基材膜的單面之黏著劑層所保持,故可藉由前述基材膜賦予剛性至功能膜,且由於前述黏著劑層係作為緩衝材而發揮功能,故在運送時等可吸收功能膜所受的外力。並且,由於前述黏著劑層含有感壓性接著劑及側鏈結晶性聚合物,故在將黏著劑層加熱至側鏈結晶性聚合物的熔點以上之溫度時,側鏈結晶性聚合物會顯示流動性而阻礙前述感壓性接著劑的黏著性,藉此可使黏著力下降。因此,在取出功能膜時,可藉由將黏著劑層的溫度加熱至前述側鏈結晶性聚合物的熔點以上之溫度而使黏著力充分下降,因而可安全地使用功能膜。According to the present invention, since the functional film is held by the base film and the adhesive layer provided on one side of the base film, the rigidity can be imparted to the functional film by the base film, and the adhesive layer is formed by the adhesive layer. Since it functions as a cushioning material, it can absorb the external force received by a functional film at the time of conveyance. Further, since the pressure-sensitive adhesive layer contains a pressure-sensitive adhesive and a side chain crystalline polymer, when the pressure-sensitive adhesive layer is heated to a temperature equal to or higher than the melting point of the side chain crystalline polymer, the side chain crystalline polymer is displayed. The fluidity hinders the adhesion of the pressure-sensitive adhesive, whereby the adhesive force can be lowered. Therefore, when the functional film is taken out, the adhesive force can be sufficiently lowered by heating the temperature of the adhesive layer to a temperature equal to or higher than the melting point of the side chain crystalline polymer, so that the functional film can be used safely.

又,由於係利用側鏈結晶性聚合物的相變化,故可重複使用,而可顯示優異的回收再利用性。再者,由於黏著劑層係作為緩衝材而發揮功能,故可依據功能膜的構成而捲取成捲狀,亦可應付由所謂的捲至捲製程(roll-to-roll process)所進行的連續生產。Further, since the phase change of the side chain crystalline polymer is utilized, it can be reused and exhibits excellent recycling property. Further, since the adhesive layer functions as a cushioning material, it can be wound into a roll depending on the configuration of the functional film, and can also cope with a so-called roll-to-roll process. Continuous production.

<附有功能膜之黏著帶><Adhesive tape with functional film>

下文中,針對關於本發明之附有功能膜之黏著帶(下文中有時亦稱為「黏著帶」)之一實施形態,列舉功能膜係使用無機密封膜的情形為例,並參照第1圖予以詳細說明。如該圖所示,本實施形態的附有功能膜之黏著帶10係在基材膜1的單面依序層積黏著劑層2、無機密封膜3及離型層4所構成。In the following, an embodiment in which the functional film-attached adhesive tape (hereinafter sometimes referred to as "adhesive tape") of the present invention is used, and the case where the functional film is an inorganic sealing film is exemplified, and reference is made to the first. The figure will be described in detail. As shown in the figure, the functional film-attached adhesive tape 10 of the present embodiment is formed by sequentially laminating the adhesive layer 2, the inorganic sealing film 3, and the release layer 4 on one surface of the base film 1.

作為基材膜1者,可列舉如聚乙烯、聚對苯二甲酸乙二酯、聚丙烯、聚酯、聚醯胺、聚醯亞胺、聚碳酸酯、乙烯-醋酸乙烯酯共聚物、乙烯-丙烯酸乙酯共聚物、乙烯-聚丙烯共聚物、聚氯乙烯等合成樹脂膜。Examples of the substrate film 1 include polyethylene, polyethylene terephthalate, polypropylene, polyester, polyamine, polyimine, polycarbonate, ethylene-vinyl acetate copolymer, and ethylene. a synthetic resin film such as an ethyl acrylate copolymer, an ethylene-polypropylene copolymer, or a polyvinyl chloride.

基材膜1可由單層體或複層體所構成,其厚度則以約25至250μm較宜。藉此,可對無機密封膜3賦予剛性。為了使對於黏著劑層2之密著性提高,可對基材膜1施行例如電暈放電處理、電漿處理、噴砂處理(blast treatment)、化學蝕刻處理、底漆處理(primer treatment)等表面處理。The base film 1 may be composed of a single layer or a laminate, and has a thickness of about 25 to 250 μm. Thereby, rigidity can be imparted to the inorganic sealing film 3. In order to improve the adhesion to the adhesive layer 2, the substrate film 1 may be subjected to surfaces such as corona discharge treatment, plasma treatment, blast treatment, chemical etching treatment, primer treatment, and the like. deal with.

黏著劑層2含有感壓性接著劑及側鏈結晶性聚合物。前述感壓性接著劑沒有特別限定,只要是具有黏著性的聚合物即可,可列舉如天然橡膠接著劑、合成橡膠接著劑、苯乙烯/丁二烯乳膠(latex)接著劑、丙烯酸系接著劑等。The adhesive layer 2 contains a pressure-sensitive adhesive and a side chain crystalline polymer. The pressure-sensitive adhesive is not particularly limited as long as it is a polymer having adhesiveness, and examples thereof include a natural rubber adhesive, a synthetic rubber adhesive, a styrene/butadiene latex adhesive, and an acrylic adhesive. Agents, etc.

列舉前述丙烯酸系接著劑為例說明時,作為構成該丙烯酸系接著劑的單體者,可列舉如具有碳數1至12的烷基之(甲基)丙烯酸酯等;作為該(甲基)丙烯酸酯者,可列舉如(甲基)丙烯酸乙基己酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯等。此外,亦可使用具有羥基烷基之(甲基)丙烯酸酯等;作為該(甲基)丙烯酸酯者,可列舉如(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基己酯等。可將例示之此等單體以1種或混合2種以上使用。In the case of exemplifying the acrylic adhesive, the monomer constituting the acrylic adhesive may, for example, be a (meth) acrylate having an alkyl group having 1 to 12 carbon atoms; Examples of the acrylate include ethylhexyl (meth)acrylate, methyl (meth)acrylate, ethyl (meth)acrylate, and butyl (meth)acrylate. Further, a (meth) acrylate having a hydroxyalkyl group or the like can also be used. Examples of the (meth) acrylate include hydroxyethyl (meth)acrylate and hydroxypropyl (meth)acrylate. Methyl) hydroxyhexyl acrylate and the like. These exemplified monomers may be used alone or in combination of two or more.

聚合方法並無特別限定,可採用例如溶液聚合法、塊狀聚合法、懸浮聚合法、乳化聚合法等。例如當採用溶液聚合法時,可將前述所例示的單體混合至溶劑,並在約40至90℃攪拌約2至10小時,藉此使前述單體聚合。The polymerization method is not particularly limited, and for example, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method, or the like can be employed. For example, when a solution polymerization method is employed, the above-exemplified monomers may be mixed to a solvent and stirred at about 40 to 90 ° C for about 2 to 10 hours, whereby the aforementioned monomers are polymerized.

使前述單體聚合所得之聚合物的重量平均分子量較宜為25萬至100萬。前述重量平均分子量若太小,則取出無機密封膜3之際,黏著劑層2會殘留在無機密封膜3上,而有所謂殘糊變多的疑慮。此外,前述重量平均分子量若太太,則黏著劑層2的凝聚力會變得過高而使黏著力下降。前述重量平均分子量係藉由凝膠滲透層析法(GPC)測定前述聚合物並將所得到的測定值進行聚苯乙烯換算後之值。The weight average molecular weight of the polymer obtained by polymerizing the above monomers is preferably from 250,000 to 1,000,000. When the weight average molecular weight is too small, when the inorganic sealing film 3 is taken out, the adhesive layer 2 remains on the inorganic sealing film 3, and there is a concern that the amount of the residue is increased. Further, if the weight average molecular weight is too large, the cohesive force of the adhesive layer 2 may become too high to lower the adhesive force. The weight average molecular weight is a value obtained by measuring the polymer by gel permeation chromatography (GPC) and converting the obtained measured value into polystyrene.

另一方面,前述側鏈結晶性聚合物為在未達熔點的溫度下結晶化且在熔點以上的溫度下顯示流動性的聚合物。亦即,前述側鏈結晶性聚合物係對應於溫度變化而可逆地引起結晶狀態及流動狀態。黏著劑層2中,係在前述熔點以上的溫度下使前述側鏈結晶性聚合物顯示流動性時,以黏著力會下降的比例含有前述側鏈結晶性聚合物。因此,在取出無機密封膜3時,若將黏著劑層2加熱至前述側鏈結晶性聚合物的熔點以上之溫度,則會由於使前述側鏈結晶性聚合物顯示流動性而阻礙前述感壓性接著劑的黏著性,藉此而使黏著力下降,所以可輕易取出無機密封膜3。此外,若將黏著劑層2冷卻至未達前述側鏈結晶性聚合物的熔點之溫度,則會由於使前述側鏈結晶性聚合物結晶化而回復黏著性,故可重複使用。On the other hand, the side chain crystalline polymer is a polymer which crystallizes at a temperature not reaching the melting point and exhibits fluidity at a temperature equal to or higher than the melting point. That is, the side chain crystalline polymer reversibly causes a crystal state and a flow state in response to a change in temperature. In the adhesive layer 2, when the side chain crystalline polymer exhibits fluidity at a temperature equal to or higher than the melting point, the side chain crystalline polymer is contained in a ratio at which the adhesive strength is lowered. Therefore, when the inorganic sealing film 3 is taken out, when the adhesive layer 2 is heated to a temperature equal to or higher than the melting point of the side chain crystalline polymer, the side chain crystalline polymer exhibits fluidity and hinders the aforementioned pressure sensitiveness. The adhesiveness of the adhesive prevents the adhesive force from being lowered, so that the inorganic sealing film 3 can be easily taken out. Further, when the pressure-sensitive adhesive layer 2 is cooled to a temperature which does not reach the melting point of the side chain crystalline polymer, the side chain crystalline polymer is crystallized to restore the adhesiveness, so that it can be reused.

前述熔點係意指藉由某種平衡過程而使最初已整合為有秩序之排列的聚合物的特定部分變成無秩序狀態的溫度,且其係藉由示差熱掃描熱量計(DSC)以10℃/分鐘的條件測定所得之值。前述熔點為30℃以上,較宜為30至70℃。若欲將前述熔點設為預定值,可藉由改變側鏈結晶性聚合物的組成等而任意地進行。The aforementioned melting point means a temperature at which a specific portion of the polymer which has been originally integrated into an ordered arrangement is changed into an disordered state by a certain equilibrium process, and which is 10 ° C by a differential thermal scanning calorimeter (DSC). The value obtained is determined by the condition of minutes. The aforementioned melting point is 30 ° C or higher, preferably 30 to 70 ° C. If the melting point is to be a predetermined value, it can be arbitrarily carried out by changing the composition of the side chain crystalline polymer or the like.

前述側鏈結晶性聚合物的組成可列舉如:由20至100重量份之具有碳數16以上的直鏈狀烷基之(甲基)丙烯酸酯、0至70重量份之具有碳數1至6的烷基之(甲基)丙烯酸酯、及0至10重量份之極性單體聚合而得之聚合物等。The composition of the aforementioned side chain crystalline polymer may, for example, be 20 to 100 parts by weight of a (meth) acrylate having a linear alkyl group having 16 or more carbon atoms, and 0 to 70 parts by weight having a carbon number of 1 to A polymer of (meth) acrylate of 6 and a polymer obtained by polymerizing 0 to 10 parts by weight of a polar monomer.

作為前述具有碳數16以上的直鏈狀烷基之(甲基)丙烯酸者,可列舉如(甲基)丙烯酸十六酯、(甲基)丙烯酸十八酯、(甲基)丙烯酸二十酯、(甲基)丙烯酸二十二酯等具有碳數16至22的直鏈烷基之(甲基)丙烯酸酯。作為前述具有碳數1至6的烷基之(甲基)丙烯酸酯者,可列舉如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸己酯等。作為前述極性單體者,可列舉如:丙烯酸、甲基丙烯酸、巴豆酸、伊康酸、馬來酸、富馬酸等含有羧基之乙烯系不飽和單體;(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基己酯等具有羥基之乙烯系不飽和單體等。此等可使用一種或混合二種以上使用。Examples of the (meth)acrylic acid having a linear alkyl group having 16 or more carbon atoms include hexadecyl (meth) acrylate, octadecyl (meth) acrylate, and stearyl (meth) acrylate. And a (meth) acrylate having a linear alkyl group having 16 to 22 carbon atoms, such as behenyl (meth)acrylate. Examples of the (meth) acrylate having an alkyl group having 1 to 6 carbon atoms include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and (methyl). ) hexyl acrylate and the like. Examples of the polar monomer include a carboxyl group-containing ethylenically unsaturated monomer such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid or fumaric acid; and (meth)acrylic acid 2-hydroxyl group. An ethylenically unsaturated monomer having a hydroxyl group such as ethyl ester, 2-hydroxypropyl (meth)acrylate or 2-hydroxyhexyl (meth)acrylate. These may be used alone or in combination of two or more.

聚合方法並無特別限定,可採用例如溶液聚合法、塊狀聚合法、懸浮聚合法、乳化聚合法等。例如當採用溶液聚合法時,可將前述所例示的單體混合至溶劑,並在約40至90℃攪拌約2至10小時,藉此使前述單體聚合。The polymerization method is not particularly limited, and for example, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method, or the like can be employed. For example, when a solution polymerization method is employed, the above-exemplified monomers may be mixed to a solvent and stirred at about 40 to 90 ° C for about 2 to 10 hours, whereby the aforementioned monomers are polymerized.

前述側鏈結晶性聚合物的重量平均分子量為2000以上,較宜為2000至20000。前述重量平均分子量若太小,則取出無機密封膜3之際,會有殘糊變多的疑慮。此外,前述重量平均分子量若太太,則即使將側鏈結晶性聚合物之溫度設為熔點以上之溫度,亦難以顯示流動性,故黏著力會難以變低。前述重量平均分子量係藉由GPC測定側鏈結晶性聚合物並將所得到的測定值進行聚苯乙烯換算後之值。The weight average molecular weight of the side chain crystalline polymer is 2,000 or more, and more preferably 2,000 to 20,000. When the weight average molecular weight is too small, when the inorganic sealing film 3 is taken out, there is a fear that the amount of the residue becomes large. In addition, if the weight average molecular weight is too large, even if the temperature of the side chain crystalline polymer is set to a temperature equal to or higher than the melting point, it is difficult to exhibit fluidity, so that the adhesive strength is hard to be lowered. The weight average molecular weight is a value obtained by measuring a side chain crystalline polymer by GPC and converting the obtained measured value into polystyrene.

以固形份換算時,相對於感壓性接著劑100重量份,係以1至20重量份(較宜為1至10重量份)的比例含有側鏈結晶性聚合物。藉此,在未達側鏈結晶性聚合物之熔點的溫度中可確保充分之黏著力,且在前述熔點以上的溫度下側鏈結晶性聚合物顯示流動性時,黏著力會下降。相對於此,側鏈結晶性聚合物的含量太少時,即使將黏著劑層2加熱至側鏈結晶性聚合物之熔點以上的溫度,黏著力亦難以降低。此外,側鏈結晶性聚合物的含量太多時,則黏著劑層2的黏著力會下降而難以保持無機密封膜3。In the conversion of the solid content, the side chain crystalline polymer is contained in an amount of from 1 to 20 parts by weight (more preferably from 1 to 10 parts by weight) based on 100 parts by weight of the pressure-sensitive adhesive. Thereby, sufficient adhesion can be ensured at a temperature at which the melting point of the side chain crystalline polymer is not reached, and when the side chain crystalline polymer exhibits fluidity at a temperature equal to or higher than the above melting point, the adhesive force is lowered. On the other hand, when the content of the side chain crystalline polymer is too small, even if the adhesive layer 2 is heated to a temperature equal to or higher than the melting point of the side chain crystalline polymer, the adhesion is hard to be lowered. Further, when the content of the side chain crystalline polymer is too large, the adhesive force of the adhesive layer 2 is lowered to make it difficult to hold the inorganic sealing film 3.

黏著劑層2的厚度為15至400μm,較宜為120至150μm。黏著劑層2的厚度太薄時,黏著劑層2難以發揮作為緩衝材的功能,而難以吸收搬送時等無機密封膜3所承受的外力。此外,黏著劑層2的厚度太厚時,則難以調製厚度均勻的黏著劑層,而變得難以安定地保持無機密封膜3。The thickness of the adhesive layer 2 is 15 to 400 μm, preferably 120 to 150 μm. When the thickness of the adhesive layer 2 is too small, the adhesive layer 2 hardly functions as a cushioning material, and it is difficult to absorb an external force which the inorganic sealing film 3 receives during transportation. Further, when the thickness of the adhesive layer 2 is too thick, it is difficult to prepare an adhesive layer having a uniform thickness, and it becomes difficult to stably maintain the inorganic sealing film 3.

為了於基材膜1的單面設置黏著劑層2,只要將已將感壓性接著劑層及側鏈結晶性聚合物以預定比例添加至溶劑中而成的塗佈液予以塗佈在基材膜1的單面並使其乾燥即可。於前述塗佈液中可添加例如交聯劑、增黏劑(tackifier)、可塑劑、老化防止劑、紫外線吸收劑等各種添加劑。前述塗佈一般而言可藉由刮刀塗佈機、滾筒塗佈機、壓延塗佈機、逗號式塗佈機(comma coater)等來進行。此外,依據塗佈厚度及塗佈液的黏度,亦可藉由凹版塗佈機、桿式塗佈機等來進行。In order to provide the adhesive layer 2 on one surface of the base film 1, a coating liquid obtained by adding a pressure-sensitive adhesive layer and a side chain crystalline polymer to a solvent at a predetermined ratio is applied to the base. One side of the material film 1 can be dried. Various additives such as a crosslinking agent, a tackifier, a plasticizer, an anti-aging agent, and an ultraviolet absorber may be added to the coating liquid. The coating can be generally carried out by a knife coater, a roll coater, a calender coater, a comma coater or the like. Further, depending on the coating thickness and the viscosity of the coating liquid, it may be carried out by a gravure coater, a bar coater or the like.

無機密封膜3係由無機系材料所構成,且具有密封功能。構成無機密封膜3的材料可列舉如石英玻璃、鹼性玻璃、鈉鈣玻璃(soda-lime glass)、鉛玻璃、硼矽酸玻璃、鋁矽酸玻璃、氧化矽玻璃(silica glass)等玻璃;鋁、鉬、鉭等金屬。The inorganic sealing film 3 is made of an inorganic material and has a sealing function. Examples of the material constituting the inorganic sealing film 3 include glass such as quartz glass, alkali glass, soda-lime glass, lead glass, borosilicate glass, aluminosilicate glass, and silica glass; Aluminum, molybdenum, niobium and other metals.

無機密封膜3的厚度為0.01至100μm,較宜為0.01至1μm。如此之厚度之無機密封膜3係強度非常弱而容易破損,使用性差。依據本實施形態,係藉由以前述基材膜1及黏著劑層2支持該無機密封膜3,而可安全地予以使用。The inorganic sealing film 3 has a thickness of 0.01 to 100 μm, preferably 0.01 to 1 μm. The inorganic sealing film 3 having such a thickness is very weak and easily broken, and has poor usability. According to the present embodiment, the inorganic sealing film 3 is supported by the base film 1 and the adhesive layer 2, and can be used safely.

離型層4係為保護無機密封膜3之表面者。離型層4可列舉:在例如由聚對苯二甲酸乙二酯等所構成的膜表面塗佈聚矽氧等離型劑者。離型層4的厚度以約10至100μm為適當。The release layer 4 is a surface that protects the surface of the inorganic sealing film 3. The release layer 4 may be, for example, a release agent such as polyfluorene oxide coated on the surface of a film made of polyethylene terephthalate or the like. The thickness of the release layer 4 is suitably about 10 to 100 μm.

<功能膜的轉印方法><Transfer method of functional film>

其次,關於前述附有功能膜之黏著帶10中的無機密封膜3的轉印方法,參照第2圖詳細地予以說明。又,在第2圖中,與前述第1圖為相同之構成部分係賦予相同的元件符號並省略其說明。Next, the transfer method of the inorganic sealing film 3 in the adhesive film 10 with the functional film described above will be described in detail with reference to FIG. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and their description is omitted.

如第2圖(a)、(b)所示,首先,使黏著帶10之離型層4朝箭號A方向移動,而將離型層4從無機密封膜3剝離。藉此,使無機密封膜3的表面3a露出。其次,將剝離離型層4後的黏著帶10a以第2圖(c)所示的方式予以上下反轉。藉此,使無機密封膜3的表面3a朝向下方。As shown in Fig. 2 (a) and (b), first, the release layer 4 of the adhesive tape 10 is moved in the direction of the arrow A, and the release layer 4 is peeled off from the inorganic sealing film 3. Thereby, the surface 3a of the inorganic sealing film 3 is exposed. Next, the adhesive tape 10a after peeling off the release layer 4 is reversed up and down in the manner shown in Fig. 2(c). Thereby, the surface 3a of the inorganic sealing film 3 is directed downward.

另一方面,在無機密封膜3的下方,配置轉印構件20。該轉印構件20係藉由無機密封膜3所密封者,可列舉如太陽電池中的太陽能電池單元、平面顯示器中的發光元件等。On the other hand, the transfer member 20 is disposed below the inorganic sealing film 3. The transfer member 20 is sealed by the inorganic sealing film 3, and examples thereof include a solar battery cell in a solar cell, a light-emitting element in a flat panel display, and the like.

在該轉印構件20的表面形成接著層21。構成接著層21的接著劑,只要是能夠將無機密封膜3與轉印構件20予以接著固定者,則無特別限定,例如可列舉反應硬化型接著劑、熱硬化型接著劑、紫外線硬化型接著劑等光硬化型接著劑等。An adhesive layer 21 is formed on the surface of the transfer member 20. The adhesive agent constituting the adhesive layer 21 is not particularly limited as long as the inorganic sealing film 3 and the transfer member 20 can be attached to each other. Examples thereof include a reaction-curable adhesive, a thermosetting adhesive, and an ultraviolet curing type. A photocurable adhesive such as a solvent.

接著層21可藉由將前述接著劑塗佈於轉印構件20的表面而形成。又,接著層21亦可藉由將前述接著劑塗佈於無機密封膜3之表面3a而形成。接著層21的厚度宜為1至100μm,較宜為大約10至50μm。Next, the layer 21 can be formed by applying the aforementioned adhesive to the surface of the transfer member 20. Further, the adhesive layer 21 can also be formed by applying the above-mentioned adhesive to the surface 3a of the inorganic sealing film 3. The thickness of layer 21 is then preferably from 1 to 100 μm, more preferably from about 10 to 50 μm.

在轉印構件20的表面形成接著層21後,使黏著帶10a朝箭號B方向移動,如第2圖(d)所示,將轉印構件20經由接著層21而接著於無機密封膜3的表面3a。此接著可藉由以對應於前述所例示之各接著劑的硬化方法使前述接著劑硬化而進行。After the adhesive layer 20 is formed on the surface of the transfer member 20, the adhesive tape 10a is moved in the direction of the arrow B. As shown in Fig. 2(d), the transfer member 20 is attached to the inorganic sealing film 3 via the adhesive layer 21. Surface 3a. This can be carried out by hardening the above-mentioned adhesive in a curing method corresponding to each of the above-exemplified adhesives.

然後,使用氣體等加熱手段將環境溫度加熱至前述側鏈結晶性聚合物之熔點以上的溫度,使黏著劑層2的黏著力降低。若要列舉具體例,則在使用熔點50℃之側鏈結晶性聚合物的情形中,通常若加熱至60℃左右即充分地使黏著劑層2的黏著力降低。Then, the ambient temperature is heated to a temperature equal to or higher than the melting point of the side chain crystalline polymer by a heating means such as a gas to lower the adhesion of the adhesive layer 2. In the case of using a side chain crystalline polymer having a melting point of 50 ° C, the adhesion of the pressure-sensitive adhesive layer 2 is usually sufficiently lowered by heating to about 60 ° C.

其後,如第2圖(e)所示,將黏著劑層2與基材膜1朝箭號C方向移動。藉此,將無機密封膜3從黏著劑層2取出,並將無機密封膜3從黏著劑層2轉印至轉印構件20。此時,黏著劑層2的黏著力由於上述之理由而充分地降低,故在取出時對無機密封膜3施加的負荷小。Thereafter, as shown in Fig. 2(e), the adhesive layer 2 and the base film 1 are moved in the direction of the arrow C. Thereby, the inorganic sealing film 3 is taken out from the adhesive layer 2, and the inorganic sealing film 3 is transferred from the adhesive layer 2 to the transfer member 20. At this time, since the adhesive force of the adhesive layer 2 is sufficiently lowered for the above reasons, the load applied to the inorganic sealing film 3 at the time of taking out is small.

對於已取出無機密封膜3後的黏著帶10b,當將黏著劑層2冷卻至未達前述側鏈結晶性聚合物之熔點的溫度時,由於前述側鏈結晶性聚合物會進行結晶化,而使黏著力回復。因此,只要在黏著力已回復的黏著劑層2上依序層積另外的無機密封膜3與離型層4,即可作為新的附有功能膜之黏著帶10而重複使用。In the adhesive tape 10b from which the inorganic sealing film 3 has been taken out, when the adhesive layer 2 is cooled to a temperature that does not reach the melting point of the side chain crystalline polymer, the side chain crystalline polymer is crystallized. Resist the adhesion. Therefore, as long as the additional inorganic sealing film 3 and the release layer 4 are sequentially laminated on the adhesive layer 2 whose adhesive force has recovered, it can be reused as a new functional film-attached adhesive tape 10.

以上,已針對本發明的若干實施形態予以顯示,惟本發明並非限定於以上的實施形態者,在申請專利範圍所記載的範圍內,皆可進行各種改善與變更。例如,在前述附有功能膜之黏著帶所相關的實施形態中,係列舉無機密封膜為例作為功能膜而進行說明,但本發明所相關之功能膜並未限定於此,對於無機功能膜以外的功能膜,亦即具有密封功能以外的其他功能、且在單獨使用時會強度不足而難以使用的膜,皆適合使用。The above is a description of the embodiments of the present invention, and the present invention is not limited to the above embodiments, and various modifications and changes can be made within the scope of the claims. For example, in the embodiment related to the adhesive tape with the functional film described above, the inorganic sealing film is exemplified as a functional film. However, the functional film according to the present invention is not limited thereto, and the inorganic functional film is not limited thereto. A functional film other than the functional film, that is, a film having a function other than the sealing function and which is insufficient in strength when used alone, is suitable for use.

此外,在前述實施形態中,係針對在黏著劑層上直接層積無機密封膜的情形進行說明,但在黏著劑層與無機密封膜之間亦可介置例如非黏著層。藉此,可使無機密封膜更容易地被取出。Further, in the above embodiment, the case where the inorganic sealing film is directly laminated on the adhesive layer will be described. However, for example, a non-adhesive layer may be interposed between the adhesive layer and the inorganic sealing film. Thereby, the inorganic sealing film can be taken out more easily.

前述非黏著層係意指實質上不具有黏著力的層。前述非黏著層並非為覆蓋黏著劑層之表面全面的均勻的層,而是為使黏著劑層之表面呈部分性地露出的不均勻的層。亦即,前述非黏著層為例如呈點狀、斑狀等形狀的非黏著性之層。The aforementioned non-adhesive layer means a layer having substantially no adhesion. The non-adhesive layer is not a uniform layer covering the entire surface of the adhesive layer, but an uneven layer partially exposing the surface of the adhesive layer. That is, the non-adhesive layer is a non-adhesive layer having a shape such as a dot or a spot.

若調整從前述非黏著層露出的黏著劑層的表面面積,即可調整黏著劑層與功能膜的接觸面積。若使前述接觸面積變大,則黏著力變強。相反地,若使前述接觸面積變小,則黏著力變弱。因此,若使非黏著層介置於黏著劑層與功能膜之間,則可簡單地控制黏著劑層的黏著力,因此可更輕易地取出功能膜。此外,從非黏著層露出的黏著劑層的表面面積的比例可因應黏著劑層之黏著力和功能膜而任意地設定,而非為有特別限定者。The contact area of the adhesive layer with the functional film can be adjusted by adjusting the surface area of the adhesive layer exposed from the non-adhesive layer. When the contact area is increased, the adhesive force is increased. Conversely, when the contact area is made small, the adhesive force is weak. Therefore, if the non-adhesive layer is interposed between the adhesive layer and the functional film, the adhesive force of the adhesive layer can be easily controlled, so that the functional film can be taken out more easily. Further, the ratio of the surface area of the adhesive layer exposed from the non-adhesive layer can be arbitrarily set in accordance with the adhesive force of the adhesive layer and the functional film, and is not particularly limited.

前述非黏著層可藉由例如蒸鍍、噴乾(spray dry)、濺鍍等予以形成。特別是以效率佳地形成非黏著層之觀點而言,以蒸鍍為佳。在以蒸鍍形成非黏著層時,只要在以非黏著層覆蓋黏著劑層之表面全面之前停止蒸鍍即可。採用前述噴乾、濺鍍時亦相同。The non-adhesive layer can be formed by, for example, evaporation, spray drying, sputtering, or the like. In particular, vapor deposition is preferred from the viewpoint of efficiently forming a non-adhesive layer. When the non-adhesive layer is formed by vapor deposition, the vapor deposition may be stopped before the surface of the adhesive layer is covered with the non-adhesive layer. The same applies to the above-described spray drying and sputtering.

以前述非黏著層的組成而言,只要為實質上不具有黏著力者即可。若要列舉具體例,則可列舉聚矽氧、氟樹脂、二氧化矽(SiO2 )等,特別以氟樹脂為適宜。前述氟樹脂可列舉如四氟乙烯/六氟丙烯共聚物(FEP)、聚四氟乙烯(PTFE)、四氟乙烯/全氟烷基乙烯基醚共聚物(PFA)等。The composition of the non-adhesive layer may be any one that does not substantially have adhesion. Specific examples thereof include polyfluorene oxide, fluororesin, cerium oxide (SiO 2 ), and the like, and a fluororesin is particularly preferable. Examples of the fluororesin include a tetrafluoroethylene/hexafluoropropylene copolymer (FEP), a polytetrafluoroethylene (PTFE), a tetrafluoroethylene/perfluoroalkyl vinyl ether copolymer (PFA), and the like.

前述非黏著層的厚度以1μm以下為佳,以600nm以下為更佳。非黏著層的厚度若太大,則難以使黏著劑層與功能膜均勻地接觸,故不宜。此外,在介置有非黏著層之情形下的剝離通常係發生在非黏著層與功能膜之間。The thickness of the non-adhesive layer is preferably 1 μm or less, more preferably 600 nm or less. If the thickness of the non-adhesive layer is too large, it is difficult to uniformly contact the adhesive layer with the functional film, which is not preferable. In addition, the peeling in the case where a non-adhesive layer is interposed is usually between the non-adhesive layer and the functional film.

以下列舉合成例與實施例而詳細說明本發明,惟本發明非為僅限定於以下的合成例與實施例者。此外,在以下的說明中,「份」係意指重量份。The present invention will be described in detail below with reference to Synthesis Examples and Examples, but the present invention is not limited to the following Synthesis Examples and Examples. In addition, in the following description, "part" means the weight part.

(合成例1)(Synthesis Example 1)

以丙烯酸乙基己酯52份、丙烯酸甲酯40份、丙烯酸羥基乙酯8份、及作為起始劑的PERBUTYL ND(日油公司製) 0.2份的比例,分別添加至200份之甲苯,以60℃攪拌5小時,而使此等單體聚合。所得到之共聚物的重量平均分子量為46萬。52 parts of ethyl hexyl acrylate, 40 parts of methyl acrylate, 8 parts of hydroxyethyl acrylate, and 0.2 parts of PERBUTYL ND (manufactured by Nippon Oil Co., Ltd.) as a starter were added to 200 parts of toluene, respectively. The monomers were polymerized by stirring at 60 ° C for 5 hours. The obtained copolymer had a weight average molecular weight of 460,000.

(合成例2)(Synthesis Example 2)

以丙烯酸乙基己酯92份、丙烯酸羥基乙酯8份、及作為起始劑的PERBUTYL ND(日油公司製) 0.2份的比例,分別添加至200份之甲苯,以60℃攪拌5小時,而使此等單體聚合。所得到之共聚物的重量平均分子量為47萬。92 parts of ethyl hexyl acrylate, 8 parts of hydroxyethyl acrylate, and 0.2 parts of PERBUTYL ND (manufactured by Nippon Oil Co., Ltd.) as a starter were added to 200 parts of toluene, respectively, and stirred at 60 ° C for 5 hours. The monomers are polymerized. The obtained copolymer had a weight average molecular weight of 470,000.

(合成例3)(Synthesis Example 3)

以丙烯酸二十二酯40份、丙烯酸十八酯35份、丙烯酸甲酯20份、丙烯酸5份、作為鏈轉移劑(chain transfer agent)的十二基硫醇(dodecyl mercaptan) 6份、及作為起始劑的PERHEXYL PV(日油公司製) 1.0份的比例,分別添加至100份之甲苯,以80℃攪拌5小時,而使此等單體聚合。所得到之共聚物的重量平均分子量為8000,熔點為52℃。40 parts of behenyl acrylate, 35 parts of octadecyl acrylate, 20 parts of methyl acrylate, 5 parts of acrylic acid, dodecyl mercaptan as a chain transfer agent, and as A ratio of 1.0 part of PERHEXYL PV (manufactured by NOF Corporation) of the initiator was added to 100 parts of toluene, and the mixture was stirred at 80 ° C for 5 hours to polymerize the monomers. The obtained copolymer had a weight average molecular weight of 8,000 and a melting point of 52 °C.

(合成例4)(Synthesis Example 4)

以丙烯酸十八酯95份、丙烯酸5份、作為鏈轉移劑的十二基硫醇5份、及作為起始劑的PERHEXYL PV(日油公司製) 1.0份的比例,分別添加至100份之甲苯,以80℃攪拌5小時,而使此等單體聚合。所得到之共聚物的重量平均分子量為8500,熔點為51℃。95 parts of octadecyl acrylate, 5 parts of acrylic acid, 5 parts of dodecyl thiol as a chain transfer agent, and 1.0 part of PERHEXYL PV (manufactured by NOF Corporation) as a starter were added to 100 parts, respectively. Toluene was stirred at 80 ° C for 5 hours to polymerize the monomers. The obtained copolymer had a weight average molecular weight of 8,500 and a melting point of 51 °C.

將前述合成例1至4的各共聚物顯示於表1。其中,前述重量平均分子量係以GPC測定共聚物後將所得到之測定值進行聚苯乙烯換算後之值。前述熔點係使用DSC並以10℃/分鐘的測定條件所測得的值。Each of the copolymers of the above Synthesis Examples 1 to 4 is shown in Table 1. Here, the weight average molecular weight is a value obtained by measuring the copolymer by GPC and converting the obtained measured value into polystyrene. The above melting point is a value measured by DSC using a measurement condition of 10 ° C /min.

(實施例1)(Example 1)

相對於上述所得之合成例1的共聚物溶液100份,添加以固形份換算下之5份的合成例3之共聚物溶液、以及0.5份之異氰酸酯交聯劑而得到黏著劑溶液,將此黏著劑溶液塗佈於厚度100μm之聚對苯二甲酸乙二酯膜的單面並使其乾燥,而製作出形成有厚度30μm之黏著劑層的黏著帶。To 100 parts of the copolymer solution of Synthesis Example 1 obtained above, 5 parts of the copolymer solution of Synthesis Example 3 and 0.5 part of an isocyanate crosslinking agent in terms of solid content were added to obtain an adhesive solution, and the adhesive solution was adhered thereto. The solution solution was applied to one side of a polyethylene terephthalate film having a thickness of 100 μm and dried to prepare an adhesive tape having an adhesive layer having a thickness of 30 μm.

(實施例2)(Example 2)

除了分別使用合成例2之共聚物溶液以取代合成例1、使用合成例4之共聚物溶液以取代合成例3以外,與前述實施例1相同地製作出在厚度100μm之聚對苯二甲酸乙二酯膜的單面形成有厚度30μm之黏著劑層的黏著帶。A polyethylene terephthalate having a thickness of 100 μm was produced in the same manner as in Example 1 except that the copolymer solution of Synthesis Example 2 was used instead of Synthesis Example 1 and the copolymer solution of Synthesis Example 4 was used instead of Synthesis Example 3. An adhesive tape having an adhesive layer having a thickness of 30 μm was formed on one side of the diester film.

(實施例3)(Example 3)

在前述實施例1之黏著帶中的黏著劑層的表面形成非黏著層。形成條件如以下所示。The non-adhesive layer was formed on the surface of the adhesive layer in the adhesive tape of the foregoing Example 1. The formation conditions are as follows.

(非黏著層)(non-adhesive layer)

組成:氟樹脂(PTFE)Composition: fluororesin (PTFE)

形狀:點狀Shape: dot

厚度:500nmThickness: 500nm

形成方法:蒸鍍Forming method: evaporation

前述蒸鍍的條件如以下所示。The conditions of the vapor deposition described below are as follows.

(蒸鍍)(evaporation)

環境溫度:200℃Ambient temperature: 200 ° C

真空度:10-2 托(torr)Vacuum degree: 10 -2 Torr (torr)

[比較例1][Comparative Example 1]

相對於100份之丙烯酸系黏著劑(綜研化學公司製的「SK-1340」),添加以固形份換算下之2.4份的交聯劑(綜研化學公司製的「M-5A」)而得到黏著劑溶液,將此黏著劑溶液塗佈於厚度100μm之聚對苯二甲酸乙二酯膜的單面並使其乾燥,而製作出形成有厚度30μm之黏著劑層的黏著帶。Adhesive was obtained by adding 2.4 parts of a crosslinking agent ("M-5A" manufactured by Soken Chemical Co., Ltd.) in a solid content to 100 parts of an acrylic adhesive ("SK-1340" manufactured by Soken Chemical Co., Ltd.). In the solution solution, the adhesive solution was applied to one side of a polyethylene terephthalate film having a thickness of 100 μm and dried to prepare an adhesive tape having an adhesive layer having a thickness of 30 μm.

<評估><evaluation>

針對上述所得的各黏著帶,評估無機密封膜的取出性。評估方法如以下所示,且其結果係顯示於表2。The take-out property of the inorganic sealing film was evaluated for each of the adhesive tapes obtained above. The evaluation methods are as follows, and the results are shown in Table 2.

(無機密封膜的取出性)(Extraction of inorganic sealing film)

無機密封膜皆使用厚度50μm的鋁膜以及石英玻璃膜。於23℃的環境溫度中將該等各無機密封膜層積於前述黏著劑層的表面。其次,於各無機密封膜表面貼附丙烯酸系黏著帶(日東電工公司製的「No-535A」)。繼而,將環境溫度從23℃升溫至60℃後,以手指輕輕地拿起前述丙烯酸系黏著帶,藉此評估無機密封膜的取出性。評估基準係以下述方式設定。As the inorganic sealing film, an aluminum film having a thickness of 50 μm and a quartz glass film were used. These inorganic sealing films were laminated on the surface of the above-mentioned adhesive layer at an ambient temperature of 23 °C. Next, an acrylic pressure-sensitive adhesive tape ("No-535A" manufactured by Nitto Denko Corporation) was attached to the surface of each inorganic sealing film. Then, after raising the ambient temperature from 23 ° C to 60 ° C, the acrylic adhesive tape was gently picked up with a finger, thereby evaluating the take-out property of the inorganic sealing film. The evaluation criteria are set in the following manner.

○:能夠簡單地從黏著劑層取出無機密封膜而無破損。○: The inorganic sealing film can be easily taken out from the adhesive layer without damage.

△:雖然要施加若干負荷,但在實際使用上係在無問題的範圍內,能夠從黏著劑層取出無機密封膜而無破損。△: Although a certain load was applied, the inorganic sealing film was taken out from the adhesive layer without damage in the range of no problem in practical use.

╳:施加大的負荷,使無機密封膜變形或破損。╳: A large load is applied to deform or break the inorganic sealing film.

由表2可得知,相較於比較例1,實施例1至3於無機密封膜的取出性係較優異。特別是設有非黏著層的實施例3係顯示比實施例1更優異的取出性。此外,在實施例3中,剝離係發生於非黏著層與無機密封膜之間。As can be seen from Table 2, in Comparative Examples 1, Examples 1 to 3 were excellent in the extractability of the inorganic sealing film. In particular, Example 3 provided with a non-adhesive layer showed superior take-up property than Example 1. Further, in Example 3, the peeling occurred between the non-adhesive layer and the inorganic sealing film.

1...基材膜1. . . Substrate film

2...黏著劑層2. . . Adhesive layer

3...無機密封膜3. . . Inorganic sealing film

3a...無機密封膜的表面3a. . . Surface of inorganic sealing film

4...離型層4. . . Release layer

10、10a...黏著帶10, 10a. . . Adhesive tape

20...轉印構件20. . . Transfer member

21...接著層twenty one. . . Next layer

第1圖為顯示關於本發明之一實施形態的附有功能膜之黏著帶的截面圖。Fig. 1 is a cross-sectional view showing an adhesive tape with a functional film according to an embodiment of the present invention.

第2圖之(a)至(e)為顯示第1圖所示附有功能膜之黏著帶中的功能膜之轉印方法的示意說明圖。Fig. 2(a) to (e) are schematic explanatory views showing a transfer method of a functional film in an adhesive tape with a functional film shown in Fig. 1.

1...基材膜1. . . Substrate film

2...黏著劑層2. . . Adhesive layer

3...無機密封膜3. . . Inorganic sealing film

4...離型層4. . . Release layer

10...黏著帶10. . . Adhesive tape

Claims (7)

一種附有功能膜之黏著帶,具備:基材膜;層積於該基材膜的單面之黏著劑層;層積於該黏著劑層的表面之功能膜;及非黏著層,其係介置於前述黏著劑層與功能膜之間,並使前述黏著劑層的表面呈部分性地露出;其中,前述黏著劑層含有感壓性接著劑及側鏈結晶性聚合物,並且在該側鏈結晶性聚合物的熔點以上之溫度下,接著力會下降;前述功能膜為無機密封膜,構成前述無機密封膜的材料係由石英玻璃、鹼性玻璃、鈉鈣玻璃、鉛玻璃、硼矽酸玻璃、鋁矽酸玻璃及氧化矽玻璃中選出之玻璃;前述非黏著層係由氟樹脂所構成,且藉由蒸鍍而形成。 An adhesive tape with a functional film, comprising: a base film; an adhesive layer laminated on one side of the base film; a functional film laminated on a surface of the adhesive layer; and a non-adhesive layer Interposed between the adhesive layer and the functional film, and partially exposing the surface of the adhesive layer; wherein the adhesive layer contains a pressure-sensitive adhesive and a side chain crystalline polymer, and At a temperature higher than the melting point of the side chain crystalline polymer, the force is lowered; the functional film is an inorganic sealing film, and the material constituting the inorganic sealing film is made of quartz glass, alkali glass, soda lime glass, lead glass, boron A glass selected from the group consisting of phthalic acid glass, aluminosilicate glass, and bismuth oxide glass; the non-adhesive layer is composed of a fluororesin and formed by vapor deposition. 如申請專利範圍第1項的附有功能膜之黏著帶,其中,前述側鏈結晶性聚合物係在未達前述熔點之溫度結晶化,且在前述熔點以上的溫度顯示流動性。 The adhesive film with a functional film according to the first aspect of the invention, wherein the side chain crystalline polymer is crystallized at a temperature not exceeding the melting point, and exhibits fluidity at a temperature equal to or higher than the melting point. 如申請專利範圍第1項的附有功能膜之黏著帶,其中,前述側鏈結晶性聚合物係藉由使20至100重量份之具有碳數16以上的直鏈狀烷基之(甲基)丙烯酸酯、0至70重量份之具有碳數1至6的烷基之(甲基)丙烯酸酯、及0至10重量份之極性單體聚合而得之聚合物。 The functional film-attached adhesive tape according to the first aspect of the invention, wherein the side chain crystalline polymer is obtained by using 20 to 100 parts by weight of a linear alkyl group having a carbon number of 16 or more. An acrylate, a polymer obtained by polymerizing 0 to 70 parts by weight of a (meth) acrylate having an alkyl group having 1 to 6 carbon atoms, and 0 to 10 parts by weight of a polar monomer. 如申請專利範圍第1項的附有功能膜之黏著帶,其中,前述非黏著層的厚度為1μm以下。 An adhesive tape with a functional film according to claim 1, wherein the non-adhesive layer has a thickness of 1 μm or less. 如申請專利範圍第1項的附有功能膜之黏著帶,其中,前述功能膜的厚度為0.01至100μm。 An adhesive tape with a functional film as claimed in claim 1, wherein the functional film has a thickness of 0.01 to 100 μm. 如申請專利範圍第1項的附有功能膜之黏著帶,其中,在前述功能膜的表面設有離型層。 An adhesive tape with a functional film according to the first aspect of the invention, wherein a release layer is provided on a surface of the functional film. 一種功能膜的轉印方法,係將申請專利範圍第1項的附有功能膜之黏著帶中的功能膜轉印至轉印構件的方法,係包含下述步驟:經由接著層而將轉印構件接著至前述功能膜之表面的步驟;及繼而,將前述黏著劑層的溫度設成前述側鏈結晶性聚合物的熔點以上之溫度而使黏著力下降,並自前述黏著劑層將功能膜取出,而將功能膜自黏著劑層轉印至轉印構件的步驟。A method for transferring a functional film, which is a method for transferring a functional film in a functional film-attached adhesive tape of the first application of the patent application to a transfer member, comprising the steps of: transferring a layer via an adhesive layer a step of bringing the member to the surface of the functional film; and then, setting the temperature of the adhesive layer to a temperature higher than a melting point of the side chain crystalline polymer to lower the adhesive force, and applying a functional film from the adhesive layer The step of transferring the functional film from the adhesive layer to the transfer member is taken out.
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