WO1999046961A1 - Method of manufacturing organic el display - Google Patents

Method of manufacturing organic el display Download PDF

Info

Publication number
WO1999046961A1
WO1999046961A1 PCT/JP1999/001132 JP9901132W WO9946961A1 WO 1999046961 A1 WO1999046961 A1 WO 1999046961A1 JP 9901132 W JP9901132 W JP 9901132W WO 9946961 A1 WO9946961 A1 WO 9946961A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
film
organic
display device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1999/001132
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Hidekazu Kobayashi
Tatsuya Shimoda
Hiroshi Kiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
3M Co
Original Assignee
Seiko Epson Corp
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Minnesota Mining and Manufacturing Co filed Critical Seiko Epson Corp
Priority to EP99939247A priority Critical patent/EP1003354B1/en
Priority to DE69929155T priority patent/DE69929155T2/de
Priority to AT99939247T priority patent/ATE314802T1/de
Publication of WO1999046961A1 publication Critical patent/WO1999046961A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80521—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/114—Poly-phenylenevinylene; Derivatives thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/115—Polyfluorene; Derivatives thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/30—Coordination compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/30—Coordination compounds
    • H10K85/321—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/30—Coordination compounds
    • H10K85/321—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3]
    • H10K85/324—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3] comprising aluminium, e.g. Alq3
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/631—Amine compounds having at least two aryl rest on at least one amine-nitrogen atom, e.g. triphenylamine

Definitions

  • an object of the present invention is to provide a method for manufacturing an organic EL display device, in which a method for patterning an electrode and a light emitting layer is extremely simple, and a method for manufacturing the organic EL display device in which all light is emitted in the viewing direction without waste. It is in. Means for Solving the Problem 1.
  • the method for manufacturing an organic EL display device according to the present invention is the same as the method for manufacturing an organic EL display device used for simple matrix driving, except that a light-to-heat conversion layer After the propagation layer is formed, the cathode layer is formed, the light-emitting layer is formed next, the hole-injecting adhesive layer is formed next, and then the film on which the multi-layer is formed is stored.
  • FIG. 10 is a cross-sectional view illustrating a manufacturing process of the organic EL display device of Example 4.
  • a chlorofilm solution of PPP was set to 60 nm (FIG. 11).
  • the film thus produced was attached to a transparent glass substrate with a cathode made of aluminum and lithium alloy, which had been subjected to laser and laser polishing of 256 stripes (Fig. 12).
  • the film was patterned into 64 stripes by a YAG laser 9 so as to intersect the stripe pattern of IT0 (Fig. 13).
  • an organic EL substrate of 256 ⁇ 64 pixels having the structure shown in FIG. 14 was completed.
  • Fig. 11 a chlorofilm solution of PPP
  • a drive driver and a controller are connected to this organic EL substrate, and a transparent protective substrate is attached with an epoxy-based thermosetting sealant. It was cured and sealed.
  • a driving power supply and a signal were input to the display device thus manufactured, a moving image could be displayed.
  • the luminous efficiency was 31 m / W.
  • the materials and methods used in this example can be those shown in Example 1.
  • the xylene solution was applied to an ink jet in the form of a strip and dried.
  • PVV was dissolved in a solvent and coated and dried to a thickness of 60 nm (FIG. 22).
  • the film produced in this way was laser-coated into 256 stripes on a transparent glass substrate with an aluminum-lithium alloy cathode 4 with a light-emitting layer in the cathode direction. It was pasted according to the direction (Fig. 23).
  • a pattern of 64 stripes was formed from the film side with a YAG laser 17 so as to cross the stripe pattern of the cathode 2 (Fig. 24).

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PCT/JP1999/001132 1998-03-09 1999-03-09 Method of manufacturing organic el display Ceased WO1999046961A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP99939247A EP1003354B1 (en) 1998-03-09 1999-03-09 Method of manufacturing organic el display
DE69929155T DE69929155T2 (de) 1998-03-09 1999-03-09 Verfahren zur herstellung einer organischen elektrolumineszenzanzeige
AT99939247T ATE314802T1 (de) 1998-03-09 1999-03-09 Verfahren zur herstellung einer organischen elektrolumineszenzanzeige

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10/57214 1998-03-09
JP05721498A JP4547723B2 (ja) 1998-03-09 1998-03-09 有機ｅｌ表示装置の製造方法

Publications (1)

Publication Number Publication Date
WO1999046961A1 true WO1999046961A1 (en) 1999-09-16

Family

ID=13049286

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/001132 Ceased WO1999046961A1 (en) 1998-03-09 1999-03-09 Method of manufacturing organic el display

Country Status (5)

Country Link
EP (2) EP1624485B1 (https=)
JP (1) JP4547723B2 (https=)
AT (1) ATE314802T1 (https=)
DE (2) DE69929155T2 (https=)
WO (1) WO1999046961A1 (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6194119B1 (en) 1999-01-15 2001-02-27 3M Innovative Properties Company Thermal transfer element and process for forming organic electroluminescent devices
WO2001024585A1 (fr) * 1999-09-30 2001-04-05 Seiko Epson Corporation Grands panneaux el et leur procede de production
US6228555B1 (en) 1999-12-28 2001-05-08 3M Innovative Properties Company Thermal mass transfer donor element
US6284425B1 (en) 1999-12-28 2001-09-04 3M Innovative Properties Thermal transfer donor element having a heat management underlayer
US6291126B2 (en) 1999-01-15 2001-09-18 3M Innovative Properties Company Thermal transfer element and process for forming organic electroluminescent devices
US6358664B1 (en) 2000-09-15 2002-03-19 3M Innovative Properties Company Electronically active primer layers for thermal patterning of materials for electronic devices
US6855384B1 (en) 2000-09-15 2005-02-15 3M Innovative Properties Company Selective thermal transfer of light emitting polymer blends
US7670450B2 (en) 2006-07-31 2010-03-02 3M Innovative Properties Company Patterning and treatment methods for organic light emitting diode devices
CN114055970A (zh) * 2020-08-03 2022-02-18 湖南鼎一致远科技发展有限公司 可热转印的器件层结构和色带结构及其制备方法

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US6165543A (en) * 1998-06-17 2000-12-26 Nec Corporation Method of making organic EL device and organic EL transfer base plate
US6436222B1 (en) * 2000-05-12 2002-08-20 Eastman Kodak Company Forming preformed images in organic electroluminescent devices
JP2002083691A (ja) 2000-09-06 2002-03-22 Sharp Corp アクティブマトリックス駆動型有機ｌｅｄ表示装置及びその製造方法
JP2002108250A (ja) 2000-09-29 2002-04-10 Sharp Corp アクティブマトリックス駆動型自発光表示装置及びその製造方法
JP2002190386A (ja) * 2000-12-20 2002-07-05 Daicel Chem Ind Ltd 有機エレクトロルミネッセンス素子用材料およびその製造方法
EP1347670A4 (en) 2000-12-20 2009-01-14 Daicel Chem MATERIAL FOR ORGANIC ELECTROLUMINESCENCE DEVICE AND METHOD FOR MANUFACTURING SAME
JP2002222694A (ja) 2001-01-25 2002-08-09 Sharp Corp レーザー加工装置及びそれを用いた有機エレクトロルミネッセンス表示パネル
JP2002240437A (ja) 2001-02-19 2002-08-28 Sharp Corp 薄膜形成用ドナーシートの製造方法、薄膜形成用ドナーシート及び有機エレクトロルミネッセンス素子
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JP2002343565A (ja) 2001-05-18 2002-11-29 Sharp Corp 有機ｌｅｄ表示パネルの製造方法、その方法により製造された有機ｌｅｄ表示パネル、並びに、その方法に用いられるベースフィルム及び基板
JP2002343564A (ja) 2001-05-18 2002-11-29 Sharp Corp 転写用フィルムおよびそれを用いた有機エレクトロルミネッセンス素子の製造方法
US6699597B2 (en) 2001-08-16 2004-03-02 3M Innovative Properties Company Method and materials for patterning of an amorphous, non-polymeric, organic matrix with electrically active material disposed therein
SG135973A1 (en) * 2001-08-16 2007-10-29 3M Innovative Properties Co Method and materials for patterning of a polymerizable, amorphous matrix with electrically active material disposed therein
US6953735B2 (en) 2001-12-28 2005-10-11 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating a semiconductor device by transferring a layer to a support with curvature
TWI258317B (en) 2002-01-25 2006-07-11 Semiconductor Energy Lab A display device and method for manufacturing thereof
US7241512B2 (en) 2002-04-19 2007-07-10 3M Innovative Properties Company Electroluminescent materials and methods of manufacture and use
GB0306409D0 (en) 2003-03-20 2003-04-23 Cambridge Display Tech Ltd Electroluminescent device
JP2005032917A (ja) * 2003-07-10 2005-02-03 Dainippon Printing Co Ltd 有機薄膜太陽電池の製造方法および転写シート
US7897303B2 (en) 2004-03-20 2011-03-01 Hewlett-Packard Development Company, L.P. Applying color elements and busbars to a display substrate
GB2412223B (en) * 2004-03-20 2008-10-22 Hewlett Packard Development Co Method of applying light filters and busbars to a display substrate
JP4548153B2 (ja) * 2005-03-07 2010-09-22 セイコーエプソン株式会社 有機ｅｌ表示装置の製造方法
DE102006013834A1 (de) * 2006-03-23 2007-09-27 Tesa Ag Elektrolumineszierende Haftklebemassen
JP4450006B2 (ja) 2007-04-02 2010-04-14 ソニー株式会社 転写用基板および有機電界発光素子の製造方法
JP2009048811A (ja) 2007-08-16 2009-03-05 Sony Corp 転写用基板および有機電界発光素子の製造方法
US8080811B2 (en) 2007-12-28 2011-12-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing evaporation donor substrate and light-emitting device
JP4502224B2 (ja) * 2008-01-15 2010-07-14 大日本印刷株式会社 パターン転写層を設けた有機ｅｌ転写体、有機ｅｌ被転写体および有機ｅｌ素子の製造方法
WO2009107548A1 (en) 2008-02-29 2009-09-03 Semiconductor Energy Laboratory Co., Ltd. Deposition method and manufacturing method of light-emitting device
US8182863B2 (en) 2008-03-17 2012-05-22 Semiconductor Energy Laboratory Co., Ltd. Deposition method and manufacturing method of light-emitting device
KR101629637B1 (ko) 2008-05-29 2016-06-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 성막방법 및 발광장치의 제조방법
CN104952702B (zh) * 2015-05-15 2017-11-28 张家港康得新光电材料有限公司 半导体器件及其制作方法
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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6410201B2 (en) 1999-01-15 2002-06-25 3M Innovative Properties Company Thermal transfer element and process for forming organic electroluminescent devices
US6194119B1 (en) 1999-01-15 2001-02-27 3M Innovative Properties Company Thermal transfer element and process for forming organic electroluminescent devices
US6586153B2 (en) 1999-01-15 2003-07-01 3M Innovative Properties Company Multilayer devices formed by multilayer thermal transfer
US6582876B2 (en) 1999-01-15 2003-06-24 3M Innovative Properties Company Thermal transfer element and process for forming organic electroluminescent devices
US6291126B2 (en) 1999-01-15 2001-09-18 3M Innovative Properties Company Thermal transfer element and process for forming organic electroluminescent devices
US6291116B1 (en) 1999-01-15 2001-09-18 3M Innovative Properties Thermal transfer element and process for forming organic electroluminescent devices
US6642542B1 (en) 1999-09-30 2003-11-04 Seiko Epson Corporation Large EL panel and manufacturing method therefor
WO2001024585A1 (fr) * 1999-09-30 2001-04-05 Seiko Epson Corporation Grands panneaux el et leur procede de production
US6967114B2 (en) 1999-09-30 2005-11-22 Seiko Epson Corporation Large EL panel and manufacturing method therefor
US6468715B2 (en) 1999-12-28 2002-10-22 3M Innovative Properties Company Thermal mass transfer donor element
US6284425B1 (en) 1999-12-28 2001-09-04 3M Innovative Properties Thermal transfer donor element having a heat management underlayer
US6228555B1 (en) 1999-12-28 2001-05-08 3M Innovative Properties Company Thermal mass transfer donor element
US6689538B2 (en) 1999-12-28 2004-02-10 3M Innovative Properties Company Thermal mass transfer donor element
US6358664B1 (en) 2000-09-15 2002-03-19 3M Innovative Properties Company Electronically active primer layers for thermal patterning of materials for electronic devices
US6482564B2 (en) 2000-09-15 2002-11-19 3M Innovative Properties Company Electronically active primer layers for thermal patterning of materials for electronic devices
US6667143B2 (en) 2000-09-15 2003-12-23 3M Innovative Properties Company Electronically active primer layers for thermal patterning of materials for electronic devices
US6855384B1 (en) 2000-09-15 2005-02-15 3M Innovative Properties Company Selective thermal transfer of light emitting polymer blends
US7670450B2 (en) 2006-07-31 2010-03-02 3M Innovative Properties Company Patterning and treatment methods for organic light emitting diode devices
CN114055970A (zh) * 2020-08-03 2022-02-18 湖南鼎一致远科技发展有限公司 可热转印的器件层结构和色带结构及其制备方法

Also Published As

Publication number Publication date
DE69929155D1 (de) 2006-02-02
DE69929155T2 (de) 2006-08-24
EP1003354A4 (en) 2004-05-19
DE69938800D1 (de) 2008-07-03
JPH11260549A (ja) 1999-09-24
JP4547723B2 (ja) 2010-09-22
ATE314802T1 (de) 2006-01-15
EP1003354A1 (en) 2000-05-24
EP1624485A2 (en) 2006-02-08
EP1003354B1 (en) 2005-12-28
EP1624485A3 (en) 2006-11-29
EP1624485B1 (en) 2008-05-21

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