US7646023B2 - TFT array panel, liquid crystal display including same, and method of manufacturing TFT array panel - Google Patents

TFT array panel, liquid crystal display including same, and method of manufacturing TFT array panel Download PDF

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US7646023B2
US7646023B2 US11/416,934 US41693406A US7646023B2 US 7646023 B2 US7646023 B2 US 7646023B2 US 41693406 A US41693406 A US 41693406A US 7646023 B2 US7646023 B2 US 7646023B2
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light blocking
electrode
blocking layer
gate
layer
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US20060243979A1 (en
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Yong-Han Park
Jin Jeon
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Samsung Display Co Ltd
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Samsung Electronics Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield

Definitions

  • the present invention relates to a thin film transistor (TFT) array panel and a liquid crystal display including the same, and a manufacturing method of the TFT array panel. More particularly, the present invention relates to a TFT array panel that can prevent the occurrence of light leakage current in a channel region, a liquid crystal display including the same, and a manufacturing method of the TFT array panel.
  • TFT thin film transistor
  • a liquid crystal display includes a color filter panel including a color filter and a thin film transistor (TFT) array panel including a TFT array.
  • the color filter panel and the TFT array panel face with each other and are assembled with a seal line interposed therebetween.
  • a liquid crystal layer is formed at an air gap defined between the color filter panel and the TFT array panel. That is, a liquid crystal display includes two panels (color filter panel and TFT array panel) including electrodes and a liquid crystal layer interposed between the two panels. When a voltage is applied to the electrodes, a liquid crystal display produces an image by adjusting the amount of light transmitted therethrough through the rearrangement of liquid crystal molecules of a liquid crystal layer. Since a liquid crystal display is a non-emissive device, a backlight unit can be positioned behind the TFT array panel as a light source. The transmittance of light emitted from the backlight is adjusted by controlling the orientation of liquid crystals.
  • Each pixel of a TFT array panel includes a switching device.
  • the switching device is a three-terminal device including a control terminal connected to a gate line, an input terminal connected to a data line, and an output terminal connected to a pixel electrode.
  • light leakage current may occur, when light is incident in a channel region of the switching device, thereby decreasing a contrast ratio or causing poor display quality such as image flickering.
  • the light leakage current may be caused by external light, or by light emitted from the backlight of the liquid crystal display.
  • the present invention provides embodiments of a thin film transistor (TFT) array panel capable of preventing light leakage current.
  • TFT thin film transistor
  • the present invention also provides embodiments of a liquid crystal display including the TFT array panel.
  • the present invention further provides embodiments of a manufacturing method of the TFT array panel.
  • a TFT array panel including: a transistor structure having a gate line and a data line intersecting the gate line, which structure includes a gate electrode formed on an insulating substrate from the gate line; a semiconductor layer formed on and insulated from the gate electrode; a light blocking layer formed around and overlapping at least a portion of the gate electrode; a source electrode formed from the data line and overlapping at least a portion of the semiconductor layer; a drain electrode opposing to the source electrode with respect to the gate electrode and overlapping at least a portion of the semiconductor layer; and the TFT array panel including a pixel electrode formed on and insulated from the transistor structure and electrically connected to the drain electrode.
  • a liquid crystal display including a TFT array panel comprising a gate electrode formed on an insulating substrate; a semiconductor layer formed on, insulated from, and completely overlapping the gate electrode; a light blocking layer formed on the same layer as the semiconductor layer and overlapping at least a portion of the gate electrode along an edge of the gate electrode; a source electrode overlapping at least a portion of the semiconductor layer; a drain electrode opposing to the source electrode with respect to the gate electrode and overlapping at least a portion of the semiconductor layer, wherein a transistor structure is formed from the gate electrode, semiconductor layer, light blocking layer, the source electrode, and the drain electrode; and a pixel electrode formed on and insulated from the transistor structure and electrically connected to the drain electrode, and a color filter panel comprising a color filter and a common electrode, the color filter panel formed opposite to and facing the TFT array panel on the insulating substrate.
  • a method of manufacturing of a TFT array panel including: forming a gate line on an insulating substrate, the gate line comprising a gate electrode; forming a semiconductor layer on and insulated from the gate electrode; forming a light blocking layer around and overlapping at least a portion of the gate electrode; forming a data line intersecting the gate line, wherein the data line comprises a source electrode, wherein the source electrode is formed to overlap at least a portion of the semiconductor layer; forming a drain electrode opposing to the source electrode with respect to the gate electrode wherein the drain electrode is formed to overlap at least a portion of the semiconductor layer; wherein a transistor structure is formed from the gate electrode, the semiconductor layer, the light blocking layer, the source electrode, and the drain electrode, and forming a pixel electrode on and insulated from the transistor structure and electrically connected to the drain electrode.
  • FIG. 1A is a circuit view of a thin film transistor (TFT) array panel according to an embodiment of the present invention
  • FIG. 1B is a sectional view taken along line Ib-Ib′ of the TFT array panel of FIG. 1A ;
  • FIG. 1C is a sectional view taken along line Ic-Ic′ of the TFT array panel of FIG. 1A and having a color filter panel disposed thereon, illustrating a liquid crystal display, according to an embodiment of the present invention
  • FIG. 2 is a circuit view of a TFT array panel according to another embodiment of the present invention.
  • FIG. 3 is a circuit view of a TFT array panel according to still another embodiment of the present invention.
  • FIG. 4 is a circuit view of a TFT array panel according to yet another embodiment of the present invention.
  • FIG. 5 is a circuit view of a TFT array panel according to a further embodiment of the present invention.
  • FIG. 1A is a circuit view of a thin film transistor (TFT) array panel according to an embodiment of the present invention
  • FIG. 1B is a sectional view taken along a line Ib-Ib′ of FIG. 1A
  • FIG. 1C is a sectional view taken along a line Ic-Ic′ of FIG. 1A , illustrating a liquid crystal display in which a color filter panel is disposed on a TFT array panel.
  • a TFT array panel for a liquid crystal display according to an embodiment of the present invention will first be described with reference to FIGS. 1A and 1B . Then, a liquid crystal display including the TFT array panel will be described with reference to FIG. 1C .
  • gate lines 22 , 24 , and 26 are formed on insulating substrate 10 .
  • gate lines 22 , 24 , and 26 may be made of conductive metals, including without limitation, an aluminum (Al)-based metal, including aluminum and an aluminum alloy; a silver (Ag)-based metal, including silver and a silver alloy; a copper (Cu)-based metal, including copper and a copper alloy; a molybdenum (Mo)-based metal, including molybdenum and a molybdenum alloy; as well as conductive metals including, without limitation, chromium (Cr), titanium (Ti), or tantalum (Ta).
  • conductive metals including, without limitation, chromium (Cr), titanium (Ti), or tantalum (Ta).
  • the gate lines 22 , 24 , and 26 may have a multi-layer structure formed from two conductive layers (not shown) having different physical properties.
  • One of the two conductive layers may be made of a low resistivity metal, e.g., an aluminum-based metal, a silver-based metal, or a copper-based metal, to reduce signal delay or voltage drop of the gate lines 22 , 24 , and 26 .
  • the other conductive layer may be made of a material possessing excellent contact characteristics with ITO (indium tin oxide) and IZO (indium zinc oxide), e.g., a molybdenum-based metal, chromium, titanium, or tantalum.
  • the gate lines 22 , 24 , and 26 may have a composite structure including, for example, a lower chromium layer and an upper aluminum layer, or a lower aluminum layer and an upper molybdenum layer.
  • the present invention is not limited to the above-illustrated examples. That is, the gate lines 22 , 24 , and 26 may be made of any suitably conductive materials.
  • the gate lines 22 , 24 , and 26 includes a gate line 22 extending in a row direction; a gate line terminal 24 , connected to an end of the gate line 22 , receiving a gate signal from the outside and transmitting the received gate signal to the gate line 22 ; and a gate electrode 26 connected to the gate line 22 .
  • the gate line 22 mainly extending in a row direction transmits a gate signal to pixels.
  • the gate line terminal 24 may have a large area suitable for connecting to an external circuit.
  • the gate lines 22 , 24 , and 26 are covered with gate insulating layer 30 made of silicon nitride (SiNx), or similar insulating material.
  • Semiconductor layer 40 may completely overlap with gate electrode 26 to prevent the direct incidence of light emitted into semiconductor layer 40 from a backlight disposed at the back of a TFT array panel.
  • the shape of semiconductor layer 40 may be diversely changed.
  • a light blocking layer also is formed on gate insulating layer 30 to be positioned on the same layer as semiconductor layer 40 . After light emitted from a backlight is incident around gate electrode 26 at a predetermined incidence angle, it may be reflected from a common electrode (not shown) of a color filter panel (not shown) and then incident into semiconductor layer 40 .
  • the light blocking layer serves to prevent the light incidence into semiconductor layer 40 .
  • the light blocking layer may overlap with at least a portion of gate electrode 26 along the edge of gate electrode 26 . When the light blocking layer overlaps with gate electrode 26 along the edge of gate electrode 26 , light passed through the periphery of gate electrode 26 at a predetermined incidence angle can be efficiently prevented from being incident into semiconductor layer 40 .
  • the overlapping area between the light blocking layer and gate electrode 26 be small enough to minimize the parasitic capacitance.
  • the light blocking layer is aligned along the edge of gate electrode 26 to minimize the parasitic capacitance.
  • an overlapping width between the light blocking layer and gate electrode 26 may be about 3 ⁇ m or less.
  • the light blocking layer may be made of a material capable of efficiently absorbing light.
  • the light blocking layer may be made of substantially the same material as semiconductor layer 40 .
  • the light blocking layer may be composed of a plurality of light blocking sub-layers which are isolated from each other.
  • the light blocking sub-layers include first light blocking layer 91 , second light blocking layer 92 , third light blocking layer 93 , and fourth light blocking layer 94 , which are respectively positioned at upper, left, right and lower sides of gate electrode 26 .
  • Light blocking sub-layers 91 , 92 , 93 , and 94 are formed in island shapes and isolated from each other. This embodiment has been illustrated in terms of the four light blocking sub-layers 91 , 92 , 93 , and 94 to prevent the occurrence of light leakage current, however the present invention is not limited thereto.
  • one or more of light blocking sub-layers 91 , 92 , 93 , and 94 may be used.
  • light blocking sub-layers 91 , 92 , 93 , and 94 may be conductive, they may be disposed to avoid a short between a source electrode 65 and a drain electrode 66 . That is, light blocking sub-layers 91 , 92 , 93 , and 94 may overlap with either source electrode 65 or drain electrode 66 . It is desirable that first and fourth light blocking sub-layers 91 and 94 do not overlap with source electrode 65 and drain electrode 66 , in order to efficiently transmit a data signal to pixels.
  • the shapes of light blocking sub-layers 91 , 92 , 93 , and 94 are not limited to the above-illustrated examples, and may be diversely changed.
  • Ohmic contact layers 55 and 56 are formed together in a pair on semiconductor layer 40 and may be made of silicide or n+-hydrogenated amorphous silicon, doped with high concentration n-type impurity.
  • Data lines 62 , 65 , 66 , and 68 are formed on ohmic contact layers 55 and 56 and gate insulating layer 30 .
  • Data lines 62 , 65 , 66 , and 68 include data line 62 extending in a column direction and intersecting gate line 22 to define pixels; source electrode 65 connected to data line 62 and extending over ohmic contact layer 55 ; a data line terminal 68 connected to an end of data line 62 and receiving an image signal from the outside; and drain electrode 66 separated from source electrode 65 and formed on ohmic contact layer 56 to be opposite to source electrode 65 with respect to gate electrode 26 .
  • Data line terminal 68 which is an end of data line 62 may be formed sufficiently wide to be connected to an external circuit.
  • Data lines 62 , 65 , 66 , and 68 may be made of a refractory metal, for example, without limitation, chromium, molybdenum-based metal, tantalum, titanium.
  • Data lines 62 , 65 , 66 , and 68 may have a multi-layer structure composed of a lower layer (not shown) of refractory metal and an upper layer (not shown) of low resistance material formed on the lower layer.
  • data lines 62 , 65 , 66 , and 68 may have a bi-layer structure composed of a lower chromium layer and an upper aluminum layer, or a lower aluminum layer and an upper molybdenum layer as described above, or a tri-layer structure composed of a molybdenum layer, an aluminum layer, and a molybdenum layer.
  • Source electrode 65 overlaps with at least a portion of semiconductor layer 40 .
  • Drain electrode 66 is opposing to source electrode 65 with respect to gate electrode 26 , and overlaps with at least a portion of semiconductor layer 40 .
  • Ohmic contact layers 55 and 56 are interposed between underlying semiconductor layer 40 , and overlying source and drain electrodes 65 and 66 to reduce a contact resistance.
  • the light blocking sub-layers 91 , 92 , 93 , and 94 may overlap with source electrode 65 or drain electrode 66 . However, it is desirable that overlapping areas between light blocking sub-layers 91 , 92 , 93 , and 94 and source electrode 65 or drain electrode 66 are small enough to efficiently transmit a data signal applied to data lines 62 , 65 , 66 , and 68 and to reduce a parasitic capacitance. That is, first light blocking layer 91 and fourth light blocking layer 94 may not overlap with source electrode 65 and drain electrode 66 , whereas second light blocking layer 92 and third light blocking layer 93 may overlap with drain electrode 66 and source electrode 65 , respectively. Although simultaneous overlapping of each light blocking layer with source electrode 65 and drain electrode 66 may not be desirable, each light blocking layer may overlap with a predetermined portion of source electrode 65 or drain electrode 66 .
  • Passivation layer 70 is formed on data lines 62 , 65 , 66 , and 68 , and an exposed portion of semiconductor layer 40 therethrough.
  • Passivation layer 70 may be an inorganic layer made of silicon nitride (SiNx) or silicon oxide, a low dielectric chemical vapor deposition (CVD) layer such as an a-Si:C:O or a-Si:O:F layer deposited by plasma enhanced CVD (PECVD), or an acrylic organic insulating layer having excellent planarization characteristics and photosensitivity.
  • SiNx silicon nitride
  • CVD low dielectric chemical vapor deposition
  • PECVD plasma enhanced CVD
  • acrylic organic insulating layer having excellent planarization characteristics and photosensitivity.
  • the low dielectric CVD layer such as a-Si:C:O or a-Si:O:F layer deposited by PECVD typically has very low dielectric constant, i.e., about 4 or less, and desirably between about 2 to about 4. Therefore, parasitic capacitance can be minimized, even when the low dielectric CVD layer is formed as a thin layer. Furthermore, the low dielectric CVD layer may exhibit excellent adhesion along with another layer and step coverage. Moreover, because the low dielectric CVD layer is an inorganic CVD layer, it tends to exhibit excellent heat resistance, relative to an organic insulating layer.
  • Passivation layer 70 may have a bi-layer structure composed of a lower inorganic layer and an upper organic layer, for example, to protect an exposed portion of semiconductor layer 40 while maintaining desirable characteristics of an organic layer.
  • Contact holes 76 and 78 are formed in passivation layer 70 to expose drain electrode 66 and data line terminal 68 , respectively.
  • Passivation layer 70 together with gate insulating layer 30 , is formed with contact hole 74 to expose gate line terminal 24 .
  • contact holes 74 and 78 may be formed, thereby exposing gate line terminal 24 and data line terminal 68 .
  • Holes 74 and 78 can be provided in various shapes, such as square or circle. The width of contact holes 74 and 78 may be enlarged to be connected to an external circuit.
  • Pixel electrode 82 is formed on passivation layer 70 in such a way to be electrically connected to drain electrode 66 via contact hole 76 and positioned in a pixel area.
  • auxiliary gate line terminal 86 and auxiliary data line terminal 88 are formed on passivation layer 70 to connect to gate line terminal 24 and data line terminal 68 via contact holes 74 and 78 , respectively.
  • pixel electrode 82 , and auxiliary gate and data line terminals 86 and 88 may be made, for example, of a transparent conductor such as ITO or IZO, or of a reflective conductor such as aluminum.
  • pixel electrode 82 may form a sustain capacitor by overlapping gate line 22 .
  • an additional line for sustain capacitance may be formed on the same layer as gate lines 22 , 24 , and 26 .
  • Pixel electrode 82 also may overlap with data line 62 to maximize the aperture ratio of a pixel. Even when pixel electrode 82 overlaps with data line 62 to maximize the aperture ratio of a pixel, the parasitic capacitance formed between pixel electrode 82 and data line 62 can be sufficiently reduced due to the low dielectric constant of passivation layer 70 .
  • pixel electrode 82 may include a plurality of cutouts or protrusions formed in a tilt direction with respect to gate line 22 .
  • a method of manufacturing a TFT array panel for a liquid crystal display will be described with reference to FIGS. 1A and 1B .
  • a multi-layered metal film (not shown) for gate lines is deposited on a substrate 10 and patterned to form gate lines 22 , 24 , and 26 extending in a row direction, including gate line 22 , gate electrode 26 , and gate line terminal 24 .
  • gate insulating layer 30 an amorphous silicon layer (not shown) for a semiconductor layer, and a doped amorphous silicon layer are sequentially deposited on substrate 10 .
  • An exemplary layer 30 may be made of silicon nitride.
  • the amorphous silicon layer and the doped amorphous silicon layer are subjected to photolithography, whereby an island-shaped semiconductor layer 40 is formed on gate insulating layer 30 of gate electrode 26 , light blocking sub-layers 91 , 92 , 93 , and 94 are formed around gate electrode 26 to overlap with at least a portion of gate electrode 26 , and a doped amorphous silicon layer pattern (not shown) is formed on semiconductor layer 40 .
  • a data metal layer (not shown) is deposited on the resultant structure and patterned by photolithography using a mask to form data lines 62 , 65 , 66 , and 68 , such that data line 62 intersects gate line 22 ; source electrode 65 connects to data line 62 and extends over gate electrode 26 ; data line terminal 68 connects to an end of data line 62 ; and drain electrode 66 is separated from source electrode 65 , and opposing source electrode 65 , with respect to gate electrode 26 . Then, a portion of the amorphous silicon layer pattern exposed by data lines 62 , 65 , 66 , and 68 is etched to form ohmic contact layer patterns 55 and 56 , which are separated from each other with respect to gate electrode 26 .
  • Passivation layer 70 is formed by CVD growth of a silicon nitride layer, an a-Si:C:O layer, or an a-Si:O:F layer. Passivation layer 70 also may be formed by an organic insulating layer coating. Then, gate insulating layer 30 and passivation layer 70 are patterned by photolithography to form contact holes 74 , 76 , and 78 , exposing gate line terminal 24 , drain electrode 66 , and data line terminal 68 .
  • Contact holes 74 , 76 , and 78 may be formed, for example, in a square or a circular shape. Then, an ITO or IZO layer is deposited, followed by a photolithography step to form pixel electrode 82 connected to drain electrode 66 via contact hole 76 and an auxiliary gate line terminal 86 , and auxiliary data line terminal 88 connected to gate line terminal 24 and data line terminal 68 via contact holes 74 and 78 , respectively. Nitrogen gas preheating may be performed prior to the deposition of the ITO or IZO layer, to prevent the formation of a metal oxide layer through contact holes 74 , 76 , and 78 onto the exposed surfaces of gate line terminal 24 , drain electrode 66 , and data line terminal 68 , respectively.
  • a color filter panel is disposed opposite to a TFT array panel.
  • the color filter panel includes insulating substrate 110 made of transparent glass, etc., black matrix 120 formed on insulating substrate 110 to prevent light leakage, red-green-blue (RGB) color filter 130 , and common electrode 140 made of a transparent conductive material such as ITO or IZO.
  • black matrix 120 may be composed of black matrix portions corresponding to gate line (see 22 of FIG. 1A ), data line (see 62 of FIG. 1A ), and pixel electrode 82 .
  • Black matrix 120 may be formed in various shapes to prevent light leakage that may occur at or around pixel electrode 82 .
  • common electrode 140 may include a plurality of cutouts or protrusions formed in a tilt direction with respect to the gate line.
  • the liquid crystal display according to an embodiment of the present invention shown in FIG. 1C includes a color filter panel, a TFT array panel opposing to the color filter panel, and liquid crystal layer 200 interposed therebetween.
  • the liquid crystal display displays an image by adjusting the amount of light transmitted therethrough by rearranging the liquid crystal molecules of liquid crystal layer 200 .
  • the light leakage current of a liquid crystal display results from light emitted from a backlight (see A 1 and A 2 of FIG. 1C ) and light incident from the outside (see B 1 of FIG. 1C ).
  • light blocking sub-layers 91 , 92 , 93 , and 94 which overlap with gate electrode 26 along the edge of gate electrode 26 , can minimize light leakage current by absorbing the light beam A 1 .
  • light blocking sub-layers 91 , 92 , 93 , and 94 may overlap at least a portion of gate electrode 26 .
  • an overlapping width Wo between each of light blocking sub-layers 91 , 92 , 93 , and 94 and gate electrode 26 may be about 3 ⁇ m or less.
  • light blocking sub-layers 91 , 92 , 93 , and 94 increases, light leakage current can be minimized.
  • FIG. 2 is a circuit view of a TFT array panel according to another embodiment of the present invention.
  • the TFT array panel shown in FIG. 2 may have substantially the same structure as that in the embodiment shown in FIGS. 1A through 1C , but also may have an alternative structure as exemplified below. Referring to FIG.
  • FIG. 3 is a circuit view of a TFT array panel according to still another embodiment of the present invention.
  • the TFT array panel shown in FIG. 3 may have substantially the same structure as that in the embodiment shown in FIGS. 1A through 1C , but also may have an alternative structure as exemplified below.
  • light blocking layer 9134 extends along the upper, right, and lower sides of a gate electrode 26 , and light blocking layer 92 is disposed on the left side of gate electrode 26 .
  • FIG. 4 is a circuit view of a TFT array panel according to yet another embodiment of the present invention.
  • the TFT array panel shown in FIG. 4 may have substantially the same structure as that in the embodiment shown in FIGS. 1A through 1C , but also may have an alternative structure, as exemplified below.
  • light blocking layer 912 extends along the upper and left sides of gate electrode 26
  • light blocking layer 934 extends along the lower and right sides of gate electrode 26 .
  • FIG. 5 is a circuit view of a TFT array panel according to a further embodiment of the present invention.
  • the TFT array panel shown in FIG. 5 may have substantially the same structure as that in the embodiment shown in FIGS.
  • light blocking layer 913 extends along the upper and right sides of gate electrode 26
  • light blocking layer 924 extends along the lower and left sides of gate electrode 26 . That is, the above-described light blocking sub-layers 91 , 92 , 93 , 94 , 9124 , 9134 , 912 , 934 , 913 , and 924 may overlap at least a portion of gate electrode 26 , and may be formed in various shapes so long as a short between a source electrode and a drain electrode does not occur.
  • a liquid crystal display including the same and the manufacturing method of the TFT array panel according to the present invention, light leakage current can be effectively minimized, thereby improving a display characteristic, such as increasing a contrast ratio, or reducing image flickering.

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US11552108B2 (en) 2017-10-19 2023-01-10 Samsung Display Co., Ltd. Transistor display panel having an auxiliary layer overlapping portions of source and gate electrodes
US11954514B2 (en) 2019-04-30 2024-04-09 Automation Anywhere, Inc. Robotic process automation system with separate code loading

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CN1858911A (zh) 2006-11-08
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US20060243979A1 (en) 2006-11-02
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