JPS6452129A - Thin film transistor - Google Patents

Thin film transistor

Info

Publication number
JPS6452129A
JPS6452129A JP62208168A JP20816887A JPS6452129A JP S6452129 A JPS6452129 A JP S6452129A JP 62208168 A JP62208168 A JP 62208168A JP 20816887 A JP20816887 A JP 20816887A JP S6452129 A JPS6452129 A JP S6452129A
Authority
JP
Japan
Prior art keywords
amorphous silicon
light shielding
silicon layer
shielding layer
drain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62208168A
Other languages
Japanese (ja)
Inventor
Hiroshi Otaguro
Koji Suzuki
Masahiko Akiyama
Hisao Toeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62208168A priority Critical patent/JPS6452129A/en
Publication of JPS6452129A publication Critical patent/JPS6452129A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78633Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield

Abstract

PURPOSE:To decrease the leak current between drain and source by providing a light shielding layer in such a manner that the direct fall of the incident light from a gate side to an amorphous silicon layer is prevented. CONSTITUTION:The amorphous silicon layer 12 is provided on the gate electrode 13 made of a molybdenum-tuntalum alloy (MT) and a drain electrode 15 and a source electrode 16 made of aluminum, etc., are provided thereon. The light shielding layer 11 consisting of metal such as molybdenum, black org. material and dye is disposed on the side of the gate electrode 13 opposite to the amorphous silicon layer 12 side to prevent the direct fall of the incident light from the gate side to the amorphous silicon layer 12; in addition, the flat overlap of the light shielding layer 11 and the gate electrode 13 is confined to <=3mum to constitute a thin film transistor. Since the fall of the light to the amorphous silicon layer is prevented by providing the light shielding layer, the leak current between the drain and source is decreased and the increase in the parasitic capacity by provision of the light shielding layer is lessened.
JP62208168A 1987-08-24 1987-08-24 Thin film transistor Pending JPS6452129A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62208168A JPS6452129A (en) 1987-08-24 1987-08-24 Thin film transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62208168A JPS6452129A (en) 1987-08-24 1987-08-24 Thin film transistor

Publications (1)

Publication Number Publication Date
JPS6452129A true JPS6452129A (en) 1989-02-28

Family

ID=16551782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62208168A Pending JPS6452129A (en) 1987-08-24 1987-08-24 Thin film transistor

Country Status (1)

Country Link
JP (1) JPS6452129A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100471771B1 (en) * 1996-12-23 2005-07-07 삼성전자주식회사 Data-open free thin film transistor liquid crystal display device using light shielding film
JP2006313906A (en) * 2005-05-02 2006-11-16 Samsung Electronics Co Ltd Thin film transistor substrate, liquid crystal display including the same, and method for manufacturing the substrate
CN103489786A (en) * 2013-09-18 2014-01-01 京东方科技集团股份有限公司 Method for manufacturing array substrate
CN105529301A (en) * 2016-01-04 2016-04-27 京东方科技集团股份有限公司 Manufacturing method for array substrate, array substrate and display apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100471771B1 (en) * 1996-12-23 2005-07-07 삼성전자주식회사 Data-open free thin film transistor liquid crystal display device using light shielding film
JP2006313906A (en) * 2005-05-02 2006-11-16 Samsung Electronics Co Ltd Thin film transistor substrate, liquid crystal display including the same, and method for manufacturing the substrate
CN103489786A (en) * 2013-09-18 2014-01-01 京东方科技集团股份有限公司 Method for manufacturing array substrate
CN105529301A (en) * 2016-01-04 2016-04-27 京东方科技集团股份有限公司 Manufacturing method for array substrate, array substrate and display apparatus

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