US20140251659A1 - Circuit board, and manufacturing method for circuit board - Google Patents

Circuit board, and manufacturing method for circuit board Download PDF

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Publication number
US20140251659A1
US20140251659A1 US14/129,408 US201214129408A US2014251659A1 US 20140251659 A1 US20140251659 A1 US 20140251659A1 US 201214129408 A US201214129408 A US 201214129408A US 2014251659 A1 US2014251659 A1 US 2014251659A1
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United States
Prior art keywords
insulating core
core substrate
gas
circuit board
metal plate
Prior art date
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Abandoned
Application number
US14/129,408
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English (en)
Inventor
Hiroaki Asano
Yasuhiro Koike
Kiminori Ozaki
Hitoshi Shimadu
Tetsuya Furuta
Masao Miyake
Takahiro Hayakawa
Tomoaki Asai
Ryou Yamauchi
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Toyota Industries Corp
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Toyota Industries Corp
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Publication date
Application filed by Toyota Industries Corp filed Critical Toyota Industries Corp
Assigned to KABUSHIKI KAISHA TOYOTA JIDOSHOKKI reassignment KABUSHIKI KAISHA TOYOTA JIDOSHOKKI ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YAMAUCHI, RYOU, HAYAKAWA, TAKAHIRO, ASAI, TOMOAKI, MIYAKE, MASAO, ASANO, HIROAKI, FURUTA, TETSUYA, KOIKE, YASUHIRO, OZAKI, KIMINORI, SHIMADU, HITOSHI
Publication of US20140251659A1 publication Critical patent/US20140251659A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • the present invention relates to a circuit board and a method for manufacturing the circuit board.
  • Patent Document 1 discloses a method for manufacturing a metal-based multilayered circuit board. The method includes a step of forming a conductor circuit on a metal plate with an insulating adhesive layer in between and a step of bonding a circuit conductor layer to the conductor circuit with a second insulating adhesive layer in between.
  • Patent Document 1 Japanese Laid-Open Patent Publication No. 9-139580
  • a pattern forming copper plate may be bonded to an insulating core substrate before components are reflow-soldered to the pattern forming copper plate.
  • a gap which is a void, may be formed between the copper plate and the insulating core substrate as a gap resulting from insufficient adhesion between the copper plate and the insulating core substrate.
  • the gap expands and increases in volume as the gas in the gap expands at the time of reflow mounting of components, or, in other words, in a high temperature atmosphere.
  • the expanded gap may cause separation between the copper plate and the insulating core substrate.
  • circuit board that prevents separation of a metal plate caused by gap formation between an insulating core substrate and the metal plate. It is another objective of the invention to provide a method for manufacturing the circuit board.
  • a circuit board for mounting an electronic component includes an insulating core substrate and a patterned metal plate.
  • the metal plate is bonded to at least one side of the insulating core substrate.
  • a gas-vent hole is formed in a laminated body configured by the insulating core substrate and the metal plate. The gas-vent hole is formed to release gas from between the insulating core substrate and the metal plate to a side open to the atmosphere through the gas-vent hole when the gas expands at the time of mounting the electronic component.
  • the gas-vent hole includes a first through hole extending through both the insulating core substrate and the metal plate.
  • the gas-vent hole is a groove formed in at least one of bonded surfaces of the insulating core substrate and the metal plate.
  • a conductive pattern formed by the metal plate is bonded to each of opposite sides of the insulating core substrate.
  • the circuit board further includes a conductive material that is adapted to fill the first through hole to electrically connect the conductive patterns to each other.
  • the circuit board further includes a heat release member to which the laminated body is bonded.
  • the laminated body which is formed by the insulating core substrate and the metal plate, is bonded to the heat release member.
  • the heat generated by the electronic component is released from the heat release member.
  • the circuit board further includes a second gas-vent hole formed in the heat release member.
  • the second gas-vent hole is formed to release gas from between the heat release member and the laminated body to the side open to the atmosphere through the second gas-vent hole when the gas expands at the time of mounting the electronic component.
  • the insulating core substrate has a first side and a second side, and the metal plate is bonded to the first side.
  • a component embedding insulating substrate is laminated on the second side with a spacer arranged in between.
  • the electronic component is embedded between the component embedding insulating substrate and the spacer.
  • the gas-vent hole includes a second through hole extending through the insulating core substrate.
  • the circuit board further includes a conductive material that is adapted to fill the second through hole to electrically connect the electronic component and the conductive pattern to each other.
  • the electronic component is electrically connected to the conductive pattern configured by the metal plate by filling the third through hole, which extends through the insulating core substrate, with the conductive material.
  • the circuit board is reduced in size.
  • the metal plate is a copper plate.
  • a method for manufacturing a circuit board includes: laminating an insulating core substrate and a metal plate together onto each other; pressing the insulating core substrate and the metal plate using a pressing member to bond the insulating core substrate to the metal plate and form a gas-vent hole; mounting an electronic component onto the metal plate; and allowing gas between the insulating core substrate and the metal plate to expand at the time of mounting the electronic component and to be released to a side open to the atmosphere through the gas-vent hole.
  • This method ensures release of the gas from between the insulating core substrate and the metal plate to the open atmospheric air side through the gas-vent hole when the gas expands at the time of mounting the electronic component. As a result, the metal plate is prevented from being separated by the gap between the insulating core substrate and the metal plate.
  • FIG. 1 is a longitudinal cross-sectional view showing an electronic device according to a first embodiment of the present invention
  • FIG. 2 is a longitudinal cross-sectional view illustrating a method for manufacturing the electronic device shown in FIG. 1 ;
  • FIG. 3 is a longitudinal cross-sectional view showing an electronic device according to a second embodiment of the present invention.
  • FIG. 4 is a longitudinal cross-sectional view illustrating a method for manufacturing the electronic device shown in FIG. 3 ;
  • FIG. 5 is a longitudinal cross-sectional view showing an electronic device according to a third embodiment of the present invention.
  • FIG. 6 is a longitudinal cross-sectional view illustrating a method for manufacturing the electronic device shown in FIG. 5 ;
  • FIG. 7 is a longitudinal cross-sectional view showing an electronic device of a modified example.
  • FIGS. 1 and 2 A first embodiment of the present invention will now be described with reference to FIGS. 1 and 2 .
  • an electronic device 10 has a circuit board 20 , which has a wiring board 30 .
  • An electronic component 80 which serves as a surface mounted component, is mounted on the wiring board 30 .
  • a copper plate 50 serving as a first metal plate, an insulating core substrate 60 , and a copper plate 70 serving as a second metal plate are sequentially laminated on an insulating core substrate 40 .
  • the copper plate 50 is patterned through punching in a desired shape to form a conductive pattern 51 .
  • the copper plate 70 is patterned through punching in a predetermined shape to form conductive patterns 71 , 72 .
  • the patterned copper plate 50 is bonded to the upper side, or, in other words, one side, of the insulating core substrate 40 .
  • the insulating core substrate 60 is bonded to the upper side, or one side, of the copper plate 50 .
  • the patterned copper plate 70 is bonded to the upper side, or one side, of the insulating core substrate 60 .
  • the insulating core substrate 40 , the copper plate 50 , the insulating core substrate 60 , and the copper plate 70 are bonded together through lamination pressing. In other words, as illustrated in FIG.
  • the insulating core substrate 40 , an adhesive sheet (not shown), the copper plate 50 , another adhesive sheet (not shown), the insulating core substrate 60 , another adhesive sheet (not shown), and the copper plate 70 are sequentially laminated on a table (not shown) carrying the electronic device 10 .
  • the insulating core substrate 40 , the corresponding adhesive sheet, the copper plate 50 , the corresponding adhesive sheet, the insulating core substrate 60 , the corresponding adhesive sheet, and the copper plate 70 are bonded together by lowering a pressing member onto the laminated components and pressing the components together.
  • the up-and-down and left-and-right directions in the drawings are defined only for illustrative purposes and the electronic device 10 does not necessarily have to be oriented in the illustrated posture.
  • An electronic component 80 is mounted on the patterned copper plate 70 .
  • the electronic component 80 is bonded to the patterned copper plate 70 using solder bumps 81 , 82 .
  • the conductive pattern 71 which is a portion of the patterned copper plate 70 , and the electronic component 80 are electrically connected to each other through soldering.
  • the conductive pattern 72 which is another portion of the patterned copper plate 70 , and the electronic component 80 are electrically connected to each other through soldering.
  • a thick copper substrate is employed as the wiring board 30 in the above-described manner.
  • a laminated body S 1 is formed by the insulating core substrate 40 , the copper plate 50 , the insulating core substrate 60 , and the copper plate 70 .
  • Through holes 90 , 91 each serving as a gas-vent hole are formed in the laminated body S 1 and extend through the copper plate 50 , the insulating core substrate 60 , and the copper plate 70 .
  • the through holes 90 , 91 each serving as a first through hole function as gas-vent holes employed in a reflow soldering step.
  • the through holes 90 , 91 prevent expansion of the gap, or the void, between the insulating core substrate 40 and the copper plate 50 , the gap, or the void, between the copper plate 50 and the insulating core substrate 60 , and the gap, or the void, between the insulating core substrate 60 and the copper plate 70 .
  • the gas-vent holes of the first embodiment are the through holes 90 , 91 , which extend through the insulating core substrate 60 and the copper plates 50 , 70 .
  • a solder bump 92 serving as a conductive material fills the through hole 91 , which extends through the copper plate 50 , the insulating core substrate 60 , and the copper plate 70 .
  • the solder bump 92 ensures conduction between the conductive pattern 51 , which is a portion of the patterned copper plate 50 , and the conductive pattern 72 , which is a portion of the patterned copper plate 70 .
  • the insulating core substrate 40 , an adhesive sheet, the copper plate 50 , another adhesive sheet, the insulating core substrate 60 , another adhesive sheet, and the copper plate 70 are sequentially laminated at the time of lamination pressing in the manufacturing steps (in a lamination step). Subsequently, a pressing member is lowered onto and pressed against the laminated components at a high temperature to bond the insulating core substrate 40 to the copper plate 50 , the copper plate 50 to the insulating core substrate 60 , and the insulating core substrate 60 to the copper plate 70 and to form the through holes 90 , 91 each serving as the gas-vent hole (a substrate forming step).
  • the through holes 90 , 91 are formed by bonding the insulating core substrate 40 to the copper plate 50 , the copper plate 50 to the insulating core substrate 60 , and the insulating core substrate 60 to the copper plate 70 at a high temperature. Bonding between the insulating core substrate 40 and the copper plate 50 , bonding between the copper plate 50 and the insulating core substrate 60 , and bonding between the insulating core substrate 60 and the copper plate 70 are accomplished by lowering the pressing member onto the insulating core substrate 40 , the corresponding adhesive sheet, the copper plate 50 , the corresponding adhesive sheet, the insulating core substrate 60 , the corresponding adhesive sheet, and the copper plate 70 to press the laminated components.
  • a gap is formed between the insulating core substrate 40 and the copper plate 50 , between the copper plate 50 and the insulating core substrate 60 , and between the insulating core substrate 60 and the copper plate 70 . These gaps are caused by insufficient adhesion between the copper plates and the insulating core substrates.
  • solder paste applied onto the copper plate 70 is heated to a high temperature in a reflow oven.
  • the solder paste is heated to approximately 250° C.
  • Such heating would cause expansion of the gas in the gap between the insulating core substrate 40 and the copper plate 50 , the gas in the gap between the copper plate 50 and the insulating core substrate 60 , and the gas in the gap between the insulating core substrate 60 and the copper plate 70 .
  • the gas in each gap escapes through the through holes 90 , 91 each serving as the gas-vent hole (a gas releasing step). This prevents expansion of the gap between the insulating core substrate 40 and the copper plate 50 , the gap between the copper plate 50 and the insulating core substrate 60 , and the gap between the insulating core substrate 60 and the copper plate 70 .
  • a solder bump 92 fills the through hole 91 in a soldering step. This ensures conduction between the conductive pattern 51 configured by the copper plate 50 and the conductive pattern 72 configured by the copper plate 70 , which is conduction between layers.
  • the first embodiment has the advantages described below.
  • the circuit board 20 is configured by bonding the patterned copper plates 50 , 70 with the surfaces of the corresponding insulating core substrates 40 , 60 .
  • each of the patterned copper plates 50 , 70 is bonded to at least one side of the corresponding one of the insulating core substrates 40 , 60 and the electronic component 80 is mounted on this side.
  • the gas between each insulating core substrate 40 , 60 and the corresponding copper plate 50 , 70 would expand in the laminated body S 1 formed by the insulating core substrates 40 , 60 and the copper plates 50 , 70 .
  • the through holes 90 , 91 are employed.
  • the first embodiment has a gas-vent structure for a state in which the insulating core substrates 40 , 60 and the copper plates 50 , 70 are pressed in the laminated state. That is, the first embodiment has the gas-vent structure for a state in which the laminated body S 1 formed by the insulating core substrates 40 , 60 and the copper plates 50 , 70 is pressed.
  • the following advantage is achieved. That is, even if the gaps are heated at the time of mounting the electronic component 80 and the gas in each of the gaps would expand, the gas thus escapes through the through holes 90 , 91 to prevent separation of each copper plate 50 , 70 , which would be caused by the gap between the corresponding insulating core substrate 40 , 60 and the copper plate 50 , 70 .
  • the thick copper substrate obtains the gas-vent structure by forming the through holes 90 , 91 in the laminated body S 1 formed by the copper plates 50 , 70 and the insulating core substrates 40 , 60 .
  • the conductive patterns 51 , 72 which are the patterned copper plates 50 , 70 bonded to the opposite sides of the insulating core substrates 60 , are electrically connected to each other by filling the through hole 91 with the solder bump 92 serving as the conductive material. This makes it unnecessary to perform a plating process to electrically connect the conductive patterns 51 , 72 , which are the patterned copper plates 50 , 70 bonded to the opposite sides of the insulating core substrate 60 , to each other.
  • the method for manufacturing the circuit board includes the lamination step, the substrate forming step, the mounting step, and the gas releasing step.
  • the lamination step the insulating core substrates 40 , 60 and the copper plates 50 , 70 are laminated together.
  • the pressing member is pressed against the insulating core substrates 40 , 60 and the metal plates 50 , 70 . This bonds the insulating core substrates 40 , 60 to the corresponding copper plates 50 , 70 and thus forms the through holes 90 , 91 each serving as the gas-vent hole.
  • the electronic component 80 is mounted on the copper plate 70 .
  • the gas releasing step when the gas between each insulating core substrate 40 , 60 and the corresponding copper plate 50 , 70 expands at the time of mounting the electronic component 80 , the gas escapes through the through holes 90 , 91 each serving as the gas-vent hole to the side open to the atmosphere. As a result, the copper plates 50 , 70 are prevented from being separated from the corresponding insulating core substrates 40 , 60 by the gaps between the insulating core substrates 40 , 60 and the copper plates 50 , 70 .
  • a second embodiment of the present invention will now be described mainly on the difference between the first embodiment and the second embodiment.
  • the second embodiment is configured differently from the configuration of FIG. 1 , as illustrated in FIG. 3 .
  • an electronic device 11 has a heat release plate 100 formed of aluminum and a circuit board 20 mounted on the heat release plate 100 .
  • the heat produced by the electronic component 80 escapes from the heat release plate 100 through the laminated body S 1 , which is included in the circuit board 20 .
  • the insulating core substrate 40 is arranged on the upper side of the heat release plate 100 .
  • the heat release plate 100 , the insulating core substrate 40 , the copper plate 50 , the insulating core substrate 60 , and the copper plate 70 are bonded together through lamination pressing. That is, as illustrated in FIG. 4 , the heat release plate 100 , a first adhesive sheet (not shown), the insulating core substrate 40 , a second adhesive sheet (not shown), the copper plate 50 , a third adhesive sheet (not shown), the insulating core substrate 60 , an adhesive sheet, and the copper plate 70 are laminated sequentially on the table (not shown) carrying the electronic device 11 .
  • a pressing member is lowered onto and pressed against the heat release plate 100 , the corresponding adhesive sheet, the insulating core substrate 40 , the corresponding adhesive sheet, the copper plate 50 , the corresponding adhesive sheet, the insulating core substrate 60 , the corresponding adhesive sheet, and the copper plate 70 , thus bonding the laminated components together.
  • Through holes 101 , 102 each serving as a second gas-vent hole are formed in the heat release plate 100 serving as a heat release member, extending through the heat release plate 100 .
  • the heat release plate 100 , the corresponding adhesive sheet, the insulating core substrate 40 , the corresponding adhesive sheet, the copper plate 50 , the corresponding adhesive sheet, the insulating core substrate 60 , the corresponding adhesive sheet, and the copper plate 70 are laminated sequentially as illustrated in FIG. 4 .
  • a pressing member is lowered onto and pressed against the laminated components at a high temperature to bond the heat release plate 100 to the insulating core substrate 40 , the insulating core substrate 40 to the copper plate 50 , the copper plate 50 to the insulating core substrate 60 , and the insulating core substrate 60 to the copper plate 70 .
  • the through holes 101 , 102 serving as the gas-vent holes are formed.
  • the through holes 90 , 91 are formed by bonding the heat release plate 100 to the insulating core substrate 40 , the insulating core substrate 40 to the copper plate 50 , the copper plate 50 to the insulating core substrate 60 , and the insulating core substrate 60 to the copper plate 70 at a high temperature.
  • gaps as voids are formed between the heat release plate 100 and the insulating core substrate 40 , between the insulating core substrate 40 and the copper plate 50 , between the copper plate 50 and the insulating core substrate 60 , and between the insulating core substrate 60 and the copper plate 70 .
  • the solder paste applied on the copper plate 70 is heated to a high temperature in a reflow oven.
  • Such heating would expand the gas in the gap between the heat release plate 100 and the insulating core substrate 40 .
  • the gas escapes through the through holes 101 , 102 serving as the gas-vent holes.
  • the gas in the gap between the insulating core substrate 40 and the copper plate 50 the gas in the gap between the copper plate 50 and the insulating core substrate 60 , and the gas in the gap between the insulating core substrate 60 and the copper plate 70 would expand, the gas escapes through the through holes 90 , 91 serving as the gas-vent holes.
  • the gap between the heat release plate 100 and the insulating core substrate 40 , the gap between the insulating core substrate 40 and the copper plate 50 , the gap between the copper plate 50 and the insulating core substrate 60 , and the gap between the insulating core substrate 60 and the copper plate 70 are prevented from expanding. This prevents separation of the copper plates 50 , 70 and the heat release plate 100 from the corresponding insulating core substrates 40 , 60 .
  • the second embodiment has the advantages described below.
  • the laminated body S 1 configured by the insulating core substrates 40 , 60 and the copper plates 50 , 70 is bonded to the heat release plate 100 serving as the heat release member. As a result, when the electronic component 80 produces heat, the heat is released from the heat release plate 100 .
  • the through holes 101 , 102 are formed in the heat release plate 100 as the gas-vent holes for allowing the gas between the heat release plate 100 serving as the heat release member and the laminated body S 1 to escape to the side open to atmosphere when the gas is expanded at the time of mounting the electronic component 80 .
  • the gas escapes through the through holes 101 , 102 formed in the heat release plate 100 . This prevents separation of the heat release plate 100 from the laminated body S 1 and improves the adhesion performance between the heat release plate 100 and the laminated body S 1 .
  • a third embodiment of the present invention will hereafter be described mainly on the difference between the first embodiment and the third embodiment.
  • the third embodiment is configured differently from the configuration of FIG. 1 , as illustrated in FIG. 5 .
  • an electronic device 12 has an electronic component 110 mounted and incorporated between the insulating core substrate 40 and the insulating core substrate 60 .
  • a spacer 120 having a thickness greater than the thickness of the electronic component 110 is arranged between the insulating core substrate 40 and the insulating core substrate 60 at a position around the electronic component 110 .
  • a copper pattern may be employed as the spacer 120 .
  • a thin plate material 130 which serves as another spacer, is arranged between the upper side of the electronic component 110 and the lower side of the insulating core substrate 60 .
  • the thin plate material 130 is bonded to the lower side of the insulating core substrate 60 .
  • the electronic component 110 is embedded between the insulating core substrate 40 serving as a component embedding insulating substrate and the thin plate material 130 .
  • the thin plate material 130 is a component for ensuring electric insulation between the electronic component 110 and the electrodes at the left and right sides and may be, for example, an adhesive.
  • the electronic component 110 and the spacer 120 are bonded to the upper side of the insulating core substrate 40 .
  • the insulating core substrate 60 is bonded to the upper side of the spacer 120 .
  • the insulating core substrate 40 , the spacer 120 , the electronic component 110 , the thin plate material 130 , the insulating core substrate 60 , and the copper plate 70 are bonded together through lamination pressing.
  • the insulating core substrate 40 , an adhesive sheet, the spacer 120 , another adhesive sheet, the insulating core substrate 60 , another adhesive sheet, and the copper plate 70 are laminated sequentially on a table.
  • a pressing member is then lowered onto and pressed against the laminated components to bond the components together.
  • the insulating core substrate 40 an adhesive sheet, the electronic component 110 , the thin plate material 130 , another adhesive sheet, the insulating core substrate 60 , another adhesive sheet, and the copper plate 70 are laminated sequentially on a table.
  • a pressing member is then lowered onto and pressed against the laminated components to bond the components together.
  • Second through holes 140 , 141 are formed in a laminated body S 2 configured by the insulating core substrate 40 , the spacer 120 , the insulating core substrate 60 , and the copper plate 70 and serve as gas-vent holes extending through the spacer 120 , the insulating core substrate 60 , and the copper plate 70 .
  • the through hole 141 is filled with a solder bump 150 serving as a conductive material.
  • the solder bump 150 ensures conduction between a first electrode of the electronic component 110 and a conductive pattern 75 configured by the copper plate 70 .
  • a through hole 142 is formed in the laminated body S 2 configured by the insulating core substrate 40 , the spacer 120 , the insulating core substrate 60 , and the copper plate 70 , extending through the spacer 120 and the insulating core substrate 60 .
  • the through hole 142 is filled with a solder bump 151 serving as a conductive material.
  • the solder bump 151 extends and exposes a second electrode of the electronic component 110 on the upper side of the insulating core substrate 60 .
  • the insulating core substrate 40 , an adhesive sheet, the spacer 120 , another adhesive sheet, the insulating core substrate 60 , another adhesive sheet, and the copper plate 70 are laminated sequentially as illustrated in FIG. 6 .
  • the insulating core substrate 40 , an adhesive sheet, the electronic component 110 , the thin plate material 130 , another adhesive sheet, the insulating core substrate 60 , another adhesive sheet, and the copper plate 70 are laminated sequentially.
  • a pressing member is then lowered onto and pressed against the laminated components to bond the insulating core substrate 40 to the spacer 120 , the spacer 120 to the insulating core substrate 60 , and the insulating core substrate 60 to the copper plate 70 .
  • gaps are formed as voids between the insulating core substrate 40 and the spacer 120 , between the spacer 120 and the insulating core substrate 60 , and between the insulating core substrate 60 and the copper plate 70 .
  • the applied solder paste is heated to a high temperature in a reflow oven.
  • Such heating would expand the gas in the gap between the insulating core substrate 40 and the spacer 120 , the gas in the gap between the spacer 120 and the insulating core substrate 60 , and the gas in the gap between the insulating core substrate 60 and the copper plate 70 .
  • the gas escapes through the through holes 140 , 141 serving as the gas-vent holes. This prevents expansion of the gaps and thus separation of the components. Also, improved adhesion performance is ensured between the insulating core substrate 40 and the spacer 120 , the spacer 120 and the insulating core substrate 60 , and the insulating core substrate 60 and the copper plate 70 .
  • the third embodiment has the advantage described below.
  • the patterned copper plate 70 is bonded to a first side, which is, for example, the upper side, of the insulating core substrate 60 .
  • the insulating core substrate 40 serving as the component embedding insulating substrate is formed on a second side, which is, for example, the lower side, of the insulating core substrate 60 with the spacer 120 arranged between the insulating core substrate 40 and the insulating core substrate 60 .
  • the electronic component 110 is embedded between the insulating core substrate 40 and the insulating core substrate 60 .
  • the through hole 141 which extends through the insulating core substrate 60 , functions as a gas-vent hole.
  • the through hole 141 is filled with the solder bump 150 serving as the conductive material, which electrically connects the electronic component 110 to the conductive pattern 75 configured by the copper plate 70 . That is, electrical connection between the electronic component 110 and the conductive pattern 75 , which is configured by the copper plate 70 , is accomplished by filling the through hole 141 , which extends through the insulating core substrate 60 , with the solder bump 150 , or the conductive material. This configuration reduces the size of the circuit board.
  • the circuit board 20 is deployed only on one side, which is the upper side, of the heat release plate 100 .
  • the invention may be embodied with the circuit boards deployed on the opposite sides, which are the upper side and the lower side, of the heat release plate 100 .
  • the gas-vent through holes which include the through holes 90 , 91 illustrated in FIG. 1 , for example, may be replaced by grooves 160 , 161 , 162 .
  • a recessed groove 160 may be formed in the upper side of the insulating core substrate 40 to release gas through the recessed groove 160 .
  • a recessed groove 161 may be formed in the lower side of the insulating core substrate 60 to release gas from the recessed groove 161 .
  • a recessed groove 162 may be formed in the upper side of the insulating core substrate 60 to release gas from the recessed groove 162 .
  • each one of the grooves 160 , 161 , 162 serving as a gas-vent hole may be formed in a bonding surface between the corresponding one of the insulating core substrates 40 , 60 and the associated one of the copper plates 50 , 70 .
  • gas communication is ensured between the bonding surface between each insulating core substrate 40 , 60 and the corresponding copper plate 50 , 70 and the gap corresponding to the open atmospheric air side.
  • the gas-vent holes may be formed by the grooves 160 , 161 , 162 , which are formed in the corresponding bonding surfaces between the insulating core substrates 40 , 60 and the copper plates 50 , 70 .
  • the grooves 160 , 161 , 162 may be formed in the corresponding copper plates 50 , 70 instead of the insulating core substrates 40 , 60 .
  • the grooves 160 , 161 , 162 may be arranged in both the insulating core substrates 40 , 60 and the copper plates 50 , 70 .
  • the copper plates 50 , 70 are employed as the metal plates, the invention may be embodied with any other suitable metal plates, such as aluminum plates, as the metal plates.
  • the copper plates are patterned through punching before being bonded to the corresponding insulating core substrates.
  • a non-patterned thin copper plate may be bonded to an insulating core substrate and then patterned through etching.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
US14/129,408 2011-07-06 2012-07-02 Circuit board, and manufacturing method for circuit board Abandoned US20140251659A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-150265 2011-07-06
JP2011150265A JP5589979B2 (ja) 2011-07-06 2011-07-06 回路板
PCT/JP2012/066900 WO2013005720A1 (ja) 2011-07-06 2012-07-02 回路板、および回路板の製造方法

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Publication Number Publication Date
US20140251659A1 true US20140251659A1 (en) 2014-09-11

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US14/129,408 Abandoned US20140251659A1 (en) 2011-07-06 2012-07-02 Circuit board, and manufacturing method for circuit board

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US (1) US20140251659A1 (https=)
JP (1) JP5589979B2 (https=)
KR (1) KR101516531B1 (https=)
CN (1) CN103621190A (https=)
BR (1) BR112013033398A2 (https=)
DE (1) DE112012002850T5 (https=)
IN (1) IN2014CN00763A (https=)
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WO (1) WO2013005720A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160150655A1 (en) * 2013-06-18 2016-05-26 Denso Corporation Electronic apparatus
US20170280558A1 (en) * 2014-08-26 2017-09-28 Sharp Kabushiki Kaisha Camera module
US11116077B2 (en) * 2018-01-24 2021-09-07 Kyocera Corporation Wiring board, electronic device, and electronic module
EP4075597A1 (en) * 2013-10-29 2022-10-19 Zoll Medical Israel Ltd. Antenna systems and devices and methods of manufacture thereof
US20230413425A1 (en) * 2020-11-20 2023-12-21 Lg Innotek Co., Ltd. Circuit board
US11872012B2 (en) 2017-08-10 2024-01-16 Zoll Medical Israel Ltd. Systems, devices and methods for physiological monitoring of patients

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102900856B1 (ko) * 2020-11-20 2025-12-16 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009026912A (ja) * 2007-07-19 2009-02-05 Nippon Mektron Ltd 多層プリント配線板の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5789294A (en) * 1980-11-25 1982-06-03 Matsushita Electric Industrial Co Ltd Printed circuit board
JPS61173157U (https=) * 1985-04-16 1986-10-28
JPS6377730A (ja) * 1986-09-22 1988-04-07 Hitachi Ltd 多層基板
JPH1131876A (ja) * 1997-07-10 1999-02-02 Murata Mfg Co Ltd 回路基板
JP2001257437A (ja) * 2000-03-10 2001-09-21 Denso Corp 電子回路基板及びその製造方法
JP4165045B2 (ja) * 2000-09-19 2008-10-15 松下電器産業株式会社 電子機器
JP2002111231A (ja) * 2000-10-03 2002-04-12 Toppan Printing Co Ltd 多層プリント配線板
CN100488336C (zh) * 2003-05-22 2009-05-13 电力波技术公司 使用了焊料排气孔的电路板组件
JP2005339518A (ja) * 2004-04-28 2005-12-08 Dainippon Printing Co Ltd 非接触型データキャリア用導電部材とその製造方法及び装置
KR100688768B1 (ko) * 2004-12-30 2007-03-02 삼성전기주식회사 칩 내장형 인쇄회로기판 및 그 제조 방법
CN1921734A (zh) * 2005-08-25 2007-02-28 达迈科技股份有限公司 表面经过处理的pi膜及此pi膜的应用
CN201479463U (zh) * 2009-07-09 2010-05-19 佛山市顺德区顺达电脑厂有限公司 焊盘具有排气通孔的印刷电路板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009026912A (ja) * 2007-07-19 2009-02-05 Nippon Mektron Ltd 多層プリント配線板の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160150655A1 (en) * 2013-06-18 2016-05-26 Denso Corporation Electronic apparatus
EP4075597A1 (en) * 2013-10-29 2022-10-19 Zoll Medical Israel Ltd. Antenna systems and devices and methods of manufacture thereof
US11539125B2 (en) 2013-10-29 2022-12-27 Zoll Medical Israel Ltd. Antenna systems and devices, and methods of manufacture thereof
US20170280558A1 (en) * 2014-08-26 2017-09-28 Sharp Kabushiki Kaisha Camera module
US9980372B2 (en) * 2014-08-26 2018-05-22 Sharp Kabushiki Kaisha Camera module
US11872012B2 (en) 2017-08-10 2024-01-16 Zoll Medical Israel Ltd. Systems, devices and methods for physiological monitoring of patients
US11116077B2 (en) * 2018-01-24 2021-09-07 Kyocera Corporation Wiring board, electronic device, and electronic module
US20230413425A1 (en) * 2020-11-20 2023-12-21 Lg Innotek Co., Ltd. Circuit board

Also Published As

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IN2014CN00763A (https=) 2015-04-03
BR112013033398A2 (pt) 2017-01-24
TW201309119A (zh) 2013-02-16
JP2013016741A (ja) 2013-01-24
TWI448219B (zh) 2014-08-01
WO2013005720A1 (ja) 2013-01-10
DE112012002850T5 (de) 2014-04-10
CN103621190A (zh) 2014-03-05
KR20140017699A (ko) 2014-02-11
JP5589979B2 (ja) 2014-09-17
KR101516531B1 (ko) 2015-05-04

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