CN100488336C - 使用了焊料排气孔的电路板组件 - Google Patents
使用了焊料排气孔的电路板组件 Download PDFInfo
- Publication number
- CN100488336C CN100488336C CNB200480013988XA CN200480013988A CN100488336C CN 100488336 C CN100488336 C CN 100488336C CN B200480013988X A CNB200480013988X A CN B200480013988XA CN 200480013988 A CN200480013988 A CN 200480013988A CN 100488336 C CN100488336 C CN 100488336C
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- Prior art keywords
- circuit board
- printed circuit
- substrate
- hole
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US47271003P | 2003-05-22 | 2003-05-22 | |
US60/472,710 | 2003-05-22 | ||
US10/849,478 | 2004-05-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1792125A CN1792125A (zh) | 2006-06-21 |
CN100488336C true CN100488336C (zh) | 2009-05-13 |
Family
ID=36788847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200480013988XA Expired - Fee Related CN100488336C (zh) | 2003-05-22 | 2004-05-20 | 使用了焊料排气孔的电路板组件 |
Country Status (1)
Country | Link |
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CN (1) | CN100488336C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110958787A (zh) * | 2020-01-07 | 2020-04-03 | 珠海元盛电子科技股份有限公司 | 一种多层互联fpc预设锡膏的焊接方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101740675B (zh) * | 2008-11-25 | 2012-02-29 | 亿光电子工业股份有限公司 | 发光二极管电路板 |
JP5589979B2 (ja) * | 2011-07-06 | 2014-09-17 | 株式会社豊田自動織機 | 回路板 |
JP5681824B1 (ja) | 2013-10-01 | 2015-03-11 | 株式会社フジクラ | 配線板組立体及びその製造方法 |
US12041728B2 (en) | 2019-08-05 | 2024-07-16 | Apple Inc. | Selective soldering with photonic soldering technology |
TWI811784B (zh) * | 2019-08-05 | 2023-08-11 | 美商蘋果公司 | 使用光子焊接技術之電子總成及其組裝方法 |
CN110996556A (zh) * | 2020-01-07 | 2020-04-10 | 电子科技大学 | 一种多层互联fpc的焊接方法 |
CN111328213A (zh) * | 2020-03-27 | 2020-06-23 | 珠海元盛电子科技股份有限公司 | 一种限高的多层fpc焊接方法 |
CN111629511A (zh) * | 2020-06-03 | 2020-09-04 | 成都羿发向荣芯能量材料科技有限公司 | 一种互联的fpc板气泡鼓包处理方法及互联fpc板、电子设备 |
CN113064238B (zh) * | 2021-03-22 | 2022-05-06 | 长飞光纤光缆股份有限公司 | 一种实现与光器件连接的软板、连接方法及光模块 |
-
2004
- 2004-05-20 CN CNB200480013988XA patent/CN100488336C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110958787A (zh) * | 2020-01-07 | 2020-04-03 | 珠海元盛电子科技股份有限公司 | 一种多层互联fpc预设锡膏的焊接方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1792125A (zh) | 2006-06-21 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: P-WAVE HOLDING LLC Free format text: FORMER OWNER: POWERWAVE TCH INC. Effective date: 20150511 Owner name: INTEL CORP . Free format text: FORMER OWNER: POWERWAVE TECHNOLOGIES INC. Effective date: 20150511 Owner name: POWERWAVE TECHNOLOGIES INC. Free format text: FORMER OWNER: P-WAVE HOLDING LLC Effective date: 20150511 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150511 Address after: California, USA Patentee after: INTEL Corp. Address before: Luxemburg Luxemburg Patentee before: POWERWAVE TECHNOLOGIES, Inc. Effective date of registration: 20150511 Address after: Luxemburg Luxemburg Patentee after: POWERWAVE TECHNOLOGIES, Inc. Address before: California, USA Patentee before: P-wave holding LLC Effective date of registration: 20150511 Address after: California, USA Patentee after: P-wave holding LLC Address before: California Patentee before: POWERWAVE TECHNOLOGIES, Inc. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090513 Termination date: 20200520 |
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CF01 | Termination of patent right due to non-payment of annual fee |