JP2006165299A5 - - Google Patents

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Publication number
JP2006165299A5
JP2006165299A5 JP2004355203A JP2004355203A JP2006165299A5 JP 2006165299 A5 JP2006165299 A5 JP 2006165299A5 JP 2004355203 A JP2004355203 A JP 2004355203A JP 2004355203 A JP2004355203 A JP 2004355203A JP 2006165299 A5 JP2006165299 A5 JP 2006165299A5
Authority
JP
Japan
Prior art keywords
carbon
circuit board
printed circuit
insulating material
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004355203A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006165299A (ja
JP4316483B2 (ja
Filing date
Publication date
Priority claimed from JP2004355203A external-priority patent/JP4316483B2/ja
Priority to JP2004355203A priority Critical patent/JP4316483B2/ja
Application filed filed Critical
Priority to PCT/JP2005/003304 priority patent/WO2006061916A1/ja
Priority to EP05719632A priority patent/EP1821586B1/en
Priority to US11/792,611 priority patent/US7479013B2/en
Priority to CNA2005800423166A priority patent/CN101103654A/zh
Priority to DE602005017183T priority patent/DE602005017183D1/de
Publication of JP2006165299A publication Critical patent/JP2006165299A/ja
Priority to KR1020077012939A priority patent/KR100912051B1/ko
Priority to US12/157,455 priority patent/US20080282538A1/en
Publication of JP2006165299A5 publication Critical patent/JP2006165299A5/ja
Publication of JP4316483B2 publication Critical patent/JP4316483B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004355203A 2004-12-08 2004-12-08 プリント基板の製造方法及びプリント基板 Expired - Fee Related JP4316483B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2004355203A JP4316483B2 (ja) 2004-12-08 2004-12-08 プリント基板の製造方法及びプリント基板
PCT/JP2005/003304 WO2006061916A1 (ja) 2004-12-08 2005-02-28 プリント基板及びプリント基板の製造方法
EP05719632A EP1821586B1 (en) 2004-12-08 2005-02-28 Printed board and printed board manufacturing method
US11/792,611 US7479013B2 (en) 2004-12-08 2005-02-28 Printed board and manufacturing method thereof
CNA2005800423166A CN101103654A (zh) 2004-12-08 2005-02-28 印刷基板和印刷基板的制造方法
DE602005017183T DE602005017183D1 (de) 2004-12-08 2005-02-28 Leiterplatte und leiterplatten-herstellungsverfahren
KR1020077012939A KR100912051B1 (ko) 2004-12-08 2007-06-08 인쇄기판 및 인쇄기판의 제조방법
US12/157,455 US20080282538A1 (en) 2004-12-08 2008-06-11 Print board and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004355203A JP4316483B2 (ja) 2004-12-08 2004-12-08 プリント基板の製造方法及びプリント基板

Publications (3)

Publication Number Publication Date
JP2006165299A JP2006165299A (ja) 2006-06-22
JP2006165299A5 true JP2006165299A5 (https=) 2009-03-05
JP4316483B2 JP4316483B2 (ja) 2009-08-19

Family

ID=36577746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004355203A Expired - Fee Related JP4316483B2 (ja) 2004-12-08 2004-12-08 プリント基板の製造方法及びプリント基板

Country Status (7)

Country Link
US (2) US7479013B2 (https=)
EP (1) EP1821586B1 (https=)
JP (1) JP4316483B2 (https=)
KR (1) KR100912051B1 (https=)
CN (1) CN101103654A (https=)
DE (1) DE602005017183D1 (https=)
WO (1) WO2006061916A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6869664B2 (en) 2000-12-12 2005-03-22 Thermalworks, Inc. Lightweight circuit board with conductive constraining cores
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
CN103298243B (zh) 2006-07-14 2016-05-11 斯塔布科尔技术公司 具有构成电路一部分的核心层的增层印刷线路板衬底
US7738249B2 (en) * 2007-10-25 2010-06-15 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal cooling structure and electrical assembly utilizing same
JP5076196B2 (ja) * 2007-10-29 2012-11-21 三菱電機株式会社 プリント配線板およびその製造方法
JP5262188B2 (ja) * 2008-02-29 2013-08-14 富士通株式会社 基板
WO2010074121A1 (ja) * 2008-12-25 2010-07-01 三菱電機株式会社 プリント配線板の製造方法
US7787249B2 (en) * 2009-02-03 2010-08-31 Honeywell International Inc. Systems and methods for printed board assembly isolated heat exchange
JP2011166029A (ja) * 2010-02-12 2011-08-25 Panasonic Corp 配線基板、それを用いた電子装置、及び配線基板の製造方法
CN102036472A (zh) * 2011-01-05 2011-04-27 倪新军 一种微波高频金属基电路板
US8569631B2 (en) * 2011-05-05 2013-10-29 Tangitek, Llc Noise dampening energy efficient circuit board and method for constructing and using same
US8491315B1 (en) * 2011-11-29 2013-07-23 Plastronics Socket Partners, Ltd. Micro via adapter socket
JP5440650B2 (ja) * 2012-05-07 2014-03-12 富士通株式会社 基板の製造方法
KR101399980B1 (ko) * 2012-12-28 2014-05-29 하이쎌(주) 탄소 섬유 기판을 이용한 led용 방열 플렉서블 모듈 및 이의 제조 방법
KR101391187B1 (ko) * 2013-01-24 2014-05-07 하이쎌(주) 방열특성이 향상된 플렉서블 모듈 및 이의 제조 방법
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
KR102253473B1 (ko) * 2014-09-30 2021-05-18 삼성전기주식회사 회로기판
KR102374256B1 (ko) 2015-02-23 2022-03-15 삼성전기주식회사 회로기판 및 회로기판 제조방법
JP6039867B1 (ja) * 2015-03-06 2016-12-07 京セラ株式会社 巻回体および基板用シート
KR102411999B1 (ko) * 2015-04-08 2022-06-22 삼성전기주식회사 회로기판
KR102538908B1 (ko) * 2015-09-25 2023-06-01 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN109417855A (zh) 2016-06-29 2019-03-01 奥特斯奥地利科技与系统技术有限公司 通过介电壳体内的碳结构冷却部件承载件材料
KR102149794B1 (ko) * 2018-11-26 2020-08-31 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812792A (en) * 1983-12-22 1989-03-14 Trw Inc. High-frequency multilayer printed circuit board
US4859189A (en) * 1987-09-25 1989-08-22 Minnesota Mining And Manufacturing Company Multipurpose socket
US5261155A (en) * 1991-08-12 1993-11-16 International Business Machines Corporation Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
GB9225260D0 (en) 1992-12-03 1993-01-27 Int Computers Ltd Cooling electronic circuit assemblies
JPH07235781A (ja) 1994-02-23 1995-09-05 Matsushita Electric Ind Co Ltd プリント基板取付け装置
JPH0823183A (ja) * 1994-07-06 1996-01-23 Matsushita Electric Ind Co Ltd 部材の冷却構造
US5929375A (en) * 1996-05-10 1999-07-27 Ford Motor Company EMI protection and CTE control of three-dimensional circuitized substrates
JPH1140902A (ja) 1997-07-18 1999-02-12 Cmk Corp プリント配線板及びその製造方法
US6257329B1 (en) * 1998-08-17 2001-07-10 Alfiero Balzano Thermal management system
EP1111971A4 (en) * 1999-06-21 2006-03-22 Mitsubishi Electric Corp PROCESS FOR PRODUCING CIRCUIT FORMING CARD, CIRCUIT FORMING CARD, AND CARBON SHEET
JP2003008186A (ja) * 2001-06-21 2003-01-10 Sony Corp 半導体装置
JP2004179257A (ja) 2002-11-25 2004-06-24 Alps Electric Co Ltd 放熱構造を備えた半導体装置
JP2004228410A (ja) * 2003-01-24 2004-08-12 Kyocera Corp 配線基板
JP2004289006A (ja) * 2003-03-24 2004-10-14 Mitsubishi Electric Corp カーボンアルミ芯基板

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