IN2014CN00763A - - Google Patents
Info
- Publication number
- IN2014CN00763A IN2014CN00763A IN763CHN2014A IN2014CN00763A IN 2014CN00763 A IN2014CN00763 A IN 2014CN00763A IN 763CHN2014 A IN763CHN2014 A IN 763CHN2014A IN 2014CN00763 A IN2014CN00763 A IN 2014CN00763A
- Authority
- IN
- India
- Prior art keywords
- metal sheets
- insulating core
- core substrates
- venting hole
- gas venting
- Prior art date
Links
- 239000002184 metal Substances 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 4
- 238000013022 venting Methods 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A circuit board (20) onto which an electronic component is to be mounted is provided with insulating core substrates (40 60) and patterned metal sheets. The metal sheets (50 70) are bonded to at least one surface of the insulating core substrates (40 60). The insulating core substrates (40 60) and the metal sheets (50 70) form a layered body (S1) in which a gas venting hole is provided. The gas venting hole is formed so that when the electronic component (80) is mounted the gas present between the insulating core substrates (40 60) and the metal sheets (50 70) expands and is released to the open air side via the gas venting hole.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011150265A JP5589979B2 (en) | 2011-07-06 | 2011-07-06 | Circuit board |
PCT/JP2012/066900 WO2013005720A1 (en) | 2011-07-06 | 2012-07-02 | Circuit board, and manufacturing method for circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014CN00763A true IN2014CN00763A (en) | 2015-04-03 |
Family
ID=47437069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN763CHN2014 IN2014CN00763A (en) | 2011-07-06 | 2012-07-02 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20140251659A1 (en) |
JP (1) | JP5589979B2 (en) |
KR (1) | KR101516531B1 (en) |
CN (1) | CN103621190A (en) |
BR (1) | BR112013033398A2 (en) |
DE (1) | DE112012002850T5 (en) |
IN (1) | IN2014CN00763A (en) |
TW (1) | TWI448219B (en) |
WO (1) | WO2013005720A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015026820A (en) * | 2013-06-18 | 2015-02-05 | 株式会社デンソー | Electronic apparatus |
JP6309096B2 (en) | 2013-10-29 | 2018-04-11 | キマ メディカル テクノロジーズ リミテッド | Antenna system and device, and manufacturing method thereof |
US9980372B2 (en) * | 2014-08-26 | 2018-05-22 | Sharp Kabushiki Kaisha | Camera module |
WO2019030746A1 (en) | 2017-08-10 | 2019-02-14 | Zoll Medical Israel Ltd. | Systems, devices and methods for physiological monitoring of patients |
WO2019146658A1 (en) * | 2018-01-24 | 2019-08-01 | 京セラ株式会社 | Wiring board, electronic device, and electronic module |
WO2022108386A1 (en) * | 2020-11-20 | 2022-05-27 | 엘지이노텍 주식회사 | Circuit board |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5789294A (en) * | 1980-11-25 | 1982-06-03 | Matsushita Electric Ind Co Ltd | Printed circuit board |
JPS61173157U (en) * | 1985-04-16 | 1986-10-28 | ||
JPS6377730A (en) * | 1986-09-22 | 1988-04-07 | Hitachi Ltd | Multilayer substrate |
JPH1131876A (en) * | 1997-07-10 | 1999-02-02 | Murata Mfg Co Ltd | Circuit board |
JP2001257437A (en) * | 2000-03-10 | 2001-09-21 | Denso Corp | Electronic circuit board and its manufacturing method |
JP4165045B2 (en) * | 2000-09-19 | 2008-10-15 | 松下電器産業株式会社 | Electronics |
JP2002111231A (en) * | 2000-10-03 | 2002-04-12 | Toppan Printing Co Ltd | Multilayer printed-wiring board |
CN100488336C (en) * | 2003-05-22 | 2009-05-13 | 电力波技术公司 | Circuit board assembly employing solder vent hole |
JP2005339518A (en) * | 2004-04-28 | 2005-12-08 | Dainippon Printing Co Ltd | Conductive member for contactless type data carrier and method and device for manufacturing the same |
KR100688768B1 (en) * | 2004-12-30 | 2007-03-02 | 삼성전기주식회사 | Embedded chip print circuit board and method for fabricating the same |
CN1921734A (en) * | 2005-08-25 | 2007-02-28 | 达迈科技股份有限公司 | Surface treated PI membrane and its application |
JP5073395B2 (en) * | 2007-07-19 | 2012-11-14 | 日本メクトロン株式会社 | Manufacturing method of multilayer printed wiring board |
CN201479463U (en) * | 2009-07-09 | 2010-05-19 | 佛山市顺德区顺达电脑厂有限公司 | Printed circuit board with bonding pad with air exhaust through holes |
-
2011
- 2011-07-06 JP JP2011150265A patent/JP5589979B2/en not_active Expired - Fee Related
-
2012
- 2012-07-02 CN CN201280031447.4A patent/CN103621190A/en active Pending
- 2012-07-02 IN IN763CHN2014 patent/IN2014CN00763A/en unknown
- 2012-07-02 WO PCT/JP2012/066900 patent/WO2013005720A1/en active Application Filing
- 2012-07-02 DE DE112012002850.3T patent/DE112012002850T5/en not_active Ceased
- 2012-07-02 US US14/129,408 patent/US20140251659A1/en not_active Abandoned
- 2012-07-02 BR BR112013033398A patent/BR112013033398A2/en not_active IP Right Cessation
- 2012-07-02 KR KR1020147000048A patent/KR101516531B1/en not_active IP Right Cessation
- 2012-07-03 TW TW101123865A patent/TWI448219B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2013005720A1 (en) | 2013-01-10 |
BR112013033398A2 (en) | 2017-01-24 |
TWI448219B (en) | 2014-08-01 |
TW201309119A (en) | 2013-02-16 |
JP5589979B2 (en) | 2014-09-17 |
KR20140017699A (en) | 2014-02-11 |
US20140251659A1 (en) | 2014-09-11 |
KR101516531B1 (en) | 2015-05-04 |
DE112012002850T5 (en) | 2014-04-10 |
JP2013016741A (en) | 2013-01-24 |
CN103621190A (en) | 2014-03-05 |
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