EP2656703A4 - Printed circuit board and method for manufacturing the same - Google Patents

Printed circuit board and method for manufacturing the same Download PDF

Info

Publication number
EP2656703A4
EP2656703A4 EP11851645.9A EP11851645A EP2656703A4 EP 2656703 A4 EP2656703 A4 EP 2656703A4 EP 11851645 A EP11851645 A EP 11851645A EP 2656703 A4 EP2656703 A4 EP 2656703A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
same
circuit board
printed circuit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11851645.9A
Other languages
German (de)
French (fr)
Other versions
EP2656703A2 (en
EP2656703B1 (en
Inventor
Sang Myung Lee
Sung Woon Yoon
Hyuk Soo Lee
Sung Won Lee
Ki Do Chun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100134488A external-priority patent/KR101251749B1/en
Priority claimed from KR1020100134489A external-priority patent/KR101231343B1/en
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of EP2656703A2 publication Critical patent/EP2656703A2/en
Publication of EP2656703A4 publication Critical patent/EP2656703A4/en
Application granted granted Critical
Publication of EP2656703B1 publication Critical patent/EP2656703B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0341—Intermediate metal, e.g. before reinforcing of conductors by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0361—Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
EP11851645.9A 2010-12-24 2011-12-23 Printed circuit board and method for manufacturing the same Active EP2656703B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020100134488A KR101251749B1 (en) 2010-12-24 2010-12-24 The printed circuit board and the method for manufacturing the same
KR1020100134489A KR101231343B1 (en) 2010-12-24 2010-12-24 The printed circuit board and the method for manufacturing the same
PCT/KR2011/010024 WO2012087058A2 (en) 2010-12-24 2011-12-23 Printed circuit board and method for manufacturing the same

Publications (3)

Publication Number Publication Date
EP2656703A2 EP2656703A2 (en) 2013-10-30
EP2656703A4 true EP2656703A4 (en) 2017-09-13
EP2656703B1 EP2656703B1 (en) 2021-08-25

Family

ID=46314659

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11851645.9A Active EP2656703B1 (en) 2010-12-24 2011-12-23 Printed circuit board and method for manufacturing the same

Country Status (6)

Country Link
US (1) US9572250B2 (en)
EP (1) EP2656703B1 (en)
JP (1) JP5992923B2 (en)
CN (1) CN103404243B (en)
TW (1) TWI617225B (en)
WO (1) WO2012087058A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104768325B (en) * 2014-01-08 2018-03-23 南亚电路板股份有限公司 Printed circuit board and manufacturing method thereof
KR102187695B1 (en) * 2014-01-28 2020-12-07 엘지이노텍 주식회사 Printed circuit substrate
KR102211741B1 (en) * 2014-07-21 2021-02-03 삼성전기주식회사 Printed circuit board and method of manufacturing the same
KR102185067B1 (en) * 2014-09-24 2020-12-01 삼성전기주식회사 Coil unit for thin film inductor, manufacturing method of coil unit for thin film inductor, thin film inductor and manufacturing method of thin film inductor
KR20160080526A (en) * 2014-12-29 2016-07-08 삼성전기주식회사 Printed circuit board and method of manufacturing the same
US10798821B2 (en) 2016-04-02 2020-10-06 Intel Corporation Circuit board having a passive device inside a via
DE102018102734A1 (en) * 2018-01-18 2019-07-18 Schreiner Group Gmbh & Co. Kg Flexible electrical circuit with connection between electrically conductive structural elements
KR20200072375A (en) * 2018-12-12 2020-06-22 삼성전기주식회사 Printed circuit board
KR20220098997A (en) * 2021-01-05 2022-07-12 삼성전기주식회사 Printed circuit board
TWI824303B (en) * 2021-09-23 2023-12-01 欣興電子股份有限公司 Method of improving wire structure of circuit board and improving wire structure of circuit board

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US5326643A (en) * 1991-10-07 1994-07-05 International Business Machines Corporation Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
JPH09116273A (en) * 1995-08-11 1997-05-02 Shinko Electric Ind Co Ltd Multilayered circuit board and its manufacture
JPH09181422A (en) * 1995-12-25 1997-07-11 Hitachi Aic Inc Printed circuit board manufacturing method
US6631558B2 (en) * 1996-06-05 2003-10-14 Laservia Corporation Blind via laser drilling system
DE69827851T2 (en) 1997-03-25 2005-11-24 Amitec-Advanced Multilayer Interconnect Technologies Ltd. Electronic wiring structure
JP4195162B2 (en) * 1999-12-21 2008-12-10 東洋鋼鈑株式会社 Multilayer printed wiring board and manufacturing method thereof
US6569543B2 (en) * 2001-02-15 2003-05-27 Olin Corporation Copper foil with low profile bond enahncement
US6931723B1 (en) * 2000-09-19 2005-08-23 International Business Machines Corporation Organic dielectric electronic interconnect structures and method for making
JP2002179772A (en) * 2000-12-08 2002-06-26 Mitsui Mining & Smelting Co Ltd Resin compound for composing insulating interlayer of print circuit board, resin sheet for forming insulating layer using the resin compound and copper-plated laminate using them
US6593534B2 (en) * 2001-03-19 2003-07-15 International Business Machines Corporation Printed wiring board structure with z-axis interconnections
JP2003133711A (en) * 2001-10-23 2003-05-09 Matsushita Electric Ind Co Ltd Printed-wiring board and manufacturing method thereof, and packaging method of electronic component
JP4045143B2 (en) * 2002-02-18 2008-02-13 テセラ・インターコネクト・マテリアルズ，インコーポレイテッド Manufacturing method of wiring film connecting member and manufacturing method of multilayer wiring board
CN100383278C (en) * 2002-02-28 2008-04-23 日本瑞翁株式会社 Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board
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JP2004165544A (en) 2002-11-15 2004-06-10 Matsushita Electric Ind Co Ltd Printed wiring board
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US7648770B2 (en) * 2003-05-21 2010-01-19 Hitachi Chemical Company, Ltd. Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet
JP3949676B2 (en) * 2003-07-22 2007-07-25 三井金属鉱業株式会社 Copper foil with ultrathin adhesive layer and method for producing the copper foil with ultrathin adhesive layer
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EP2114579B1 (en) * 2007-01-02 2019-09-11 Ormet Circuits, Inc. Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias
TW200847867A (en) * 2007-04-26 2008-12-01 Mitsui Mining & Smelting Co Printed wire board and manufacturing method thereof, and electrolytic copper foil for copper-clad lamination board used for manufacturing the same
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Non-Patent Citations (1)

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Title
No further relevant documents disclosed *

Also Published As

Publication number Publication date
WO2012087058A3 (en) 2012-10-04
US9572250B2 (en) 2017-02-14
JP2014501448A (en) 2014-01-20
CN103404243A (en) 2013-11-20
EP2656703A2 (en) 2013-10-30
US20140069705A1 (en) 2014-03-13
CN103404243B (en) 2017-04-26
TWI617225B (en) 2018-03-01
TW201247057A (en) 2012-11-16
JP5992923B2 (en) 2016-09-14
WO2012087058A2 (en) 2012-06-28
EP2656703B1 (en) 2021-08-25

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