KR20200072375A - Printed circuit board - Google Patents

Abstract

A printed circuit board according to an aspect of the present invention includes: a circuit layer formed of a plurality of layers; a first structure formed between every circuit layers adjacent to each other up and down, and including a plurality of first unit vias arranged above and below each other; and a second structure including a plurality of second unit vias horizontally spaced apart from the respective first unit vias and disposed above and below each other. A horizontal separation distance between the first unit via and the second unit via is equal to or less than a set value.

Description

Printed circuit board {PRINTED CIRCUIT BOARD}

The present invention relates to a printed circuit board.

Electronic devices such as smartphones continue to be highly functional and slim, and electronic components mounted on electronic devices are also becoming more dense. Accordingly, the circuit of the PCB on which the electronic component is mounted can be designed to have a fine width and a fine pitch.

Published Patent Publication 2018-0017701 (Publication: 2018.02.21)

According to an aspect of the present invention, a circuit layer formed of a plurality of layers; A first structure formed between each of the circuit layers adjacent to each other vertically and including a plurality of first unit vias disposed vertically above each other; And a second structure including a plurality of second unit vias spaced apart from each other and horizontally spaced apart from each other, wherein a horizontal separation distance between the first unit vias and the second unit vias is: A printed circuit board is provided that is below the set value.

The first structure may further include a first pad connected to the circuit layer and connected up and down with each of the first unit vias, and the second structure may be upper and lower with each of the second unit vias. It may further include a second pad connected to. The first pad and the second pad may be electrically insulated from each other, and at least a portion of the second pad may be in contact with the first pad.

The set value may be 1 mm. Within the distance horizontally spaced by the set value from the first unit via, there may be no other via than the second unit via. The second structure may be formed in plural.

According to another aspect of the invention, the circuit layer formed of a plurality of layers; And a via structure electrically connected to the circuit layer, the via structure comprising: a plurality of unit vias formed between each of the circuit layers adjacent to each other vertically and disposed vertically above each other; And a via conductor formed around one of the plurality of unit vias, wherein a horizontal separation distance between the one unit via and the via conductor is less than or equal to a set value.

The via structure may further include a first pad connected to the circuit layer and vertically connected to each of the unit vias. The via conductor may contact the first pad. The via conductor may be vertically connected to the second pad, and the second pad may be insulated from the first pad.

The set value may be 1 mm. Within the distance horizontally spaced by the set value from the one unit via, there may be no other via other than the via conductor. The via conductor may be formed in plural.

1 is a view showing a via structure and a printed circuit board including the same.
2 and 3 are diagrams illustrating a via structure and a printed circuit board including the same according to the first embodiment of the present invention.
4 and 5 are diagrams showing a via structure and a printed circuit board including the same according to a second embodiment of the present invention.
6 and 7 are diagrams showing a via structure and a printed circuit board including the via structure according to a third embodiment of the present invention.
8 and 9 are diagrams showing a via structure according to a fourth embodiment of the present invention and a printed circuit board including the via structure.
10 and 11 are views showing a via structure according to a fifth embodiment of the present invention and a printed circuit board including the via structure.

An embodiment of a printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, identical or corresponding components are given the same reference numbers and overlapping descriptions thereof It will be omitted.

In addition, terms such as first and second used hereinafter are only identification symbols for distinguishing the same or corresponding components, and the same or corresponding components are limited by terms such as first and second. no.

In addition, the term "combination" means not only a case in which a physical contact is directly made between each component in a contact relationship between the components, but other components are interposed between the respective components, so that the components are in different components. Use it as a comprehensive concept until each contact is made.

Hereinafter, various embodiments of the printed circuit board will be described separately, but it is not excluded that the description of one embodiment may be applied to other embodiments. Descriptions of one embodiment may be applied to other embodiments as long as they are not compatible.

1 is a view showing a via structure and a printed circuit board including the same.

Referring to FIG. 1, a printed circuit board may include a plurality of insulating layers (L) and a via structure (10), and the via structures (10) are formed on each of the plurality of insulating layers (L) to be connected up and down. The unit vias 100 may be a “stack via structure” stacked up and down.

Each of the unit vias 100 may have the same shape. For example, each of the unit vias 100 may have an inverted trapezoid in the longitudinal section, as the cross section becomes smaller toward the lower side.

Alternatively, one unit via of the plurality of unit vias 100 has a cross-sectional area that becomes smaller toward the lower side (eg, a longitudinal cross-section of an inverted trapezoid), and the other unit via 100 crosses a larger area toward the lower side (eg For example, it may have a tetragonal cross-section). In this case, the unit vias 100 located on the upper side and the unit vias 100 positioned on the lower side may have a symmetrical shape with respect to the center layer (for example, the core layer) of the printed circuit board. . That is, each of the unit vias 100 located on the upper side with respect to the center layer may have a cross-sectional area that decreases toward the lower side, and each of the unit vias 100 located on the lower side may have a cross-sectional area that increases toward the lower side. have.

Meanwhile, each of the unit vias 100 may have a circular cross section.

The plurality of unit vias 100 may be stacked up and down to have the same center line, but since the same center line means a center line placed at the same position within an error range, the unit vias 100 are stacked completely vertically. Or, they can be stacked slightly off the vertical.

The unit vias 100 may be stacked with the first pad 300 interposed therebetween. In this case, the first pad 300 is formed on at least one surface of each unit via 100, so that a repeated structure of'pad-unit via-pad-unit via-pad' may be implemented. The first pad 300 may be connected to the circuit layer C formed on the insulating layer L. Accordingly, the unit vias 100 may perform inter-layer signal connection.

Each of the unit vias 100 may be formed by processing a via hole in the insulating layer L and then metal plating in the via hole. Here, in the entire via structure 10, if the uniformity of the metal plating and the uniformity of the via hole size is high, the reliability of the via structure 10 may be increased. For example, in the via structure 10 including the unit vias 100 stacked up and down, when a contraction phenomenon occurs in one unit via, a crack may occur in the unit via, and accordingly The reliability of the via structure 10 may be weakened. Consequently, in order to secure the reliability of the via structure 10, a via structure 10 capable of preventing the reduction phenomenon or supplementing the reduction phenomenon is required.

Hereinafter, specific examples will be described.

2 and 3 are diagrams illustrating a via structure and a printed circuit board including the same according to the first embodiment of the present invention.

2 and 3, the via structure according to the first embodiment of the present invention includes a plurality of unit vias 100 and 110 arranged vertically, and one of the plurality of unit vias 100 and 110 The via conductor 200 may be formed to be spaced at a predetermined interval or less around the periphery of the. That is, the horizontal separation distance between one unit via 110 and the via conductor 200 may be less than or equal to a set value.

The unit vias 100 and 110 may be arranged vertically. The plurality of unit vias 100 and 110 may be stacked up and down to have the same center line, but since the same center line means a center line placed at the same location within an error range, the unit vias 100 and 110 are They can be either fully vertically stacked, or slightly offset vertically.

The unit vias 100 and 110 may be stacked to be connected to each other up and down with the first pad 300 interposed therebetween. The first pad 300 may be electrically connected to the via conductor 200 described above. The first pad 300 is connected to the circuit layer C, and accordingly, the unit vias 100 and 110 and the via conductor 200 may perform interlayer signal connection.

The unit vias 100 and 110 may be formed by forming a metal plate inside the via hole after the via hole is formed, respectively. The via conductor 200 may also be provided by forming a metal plating layer inside the via hole after the via hole is formed.

As described above, the via conductor 200 may be spaced apart from the unit via 110 horizontally below a set value. The single unit via 110 may be reduced when a via conductor is omitted from the via structure. That is, when it is expected that a reduction phenomenon occurs in the single unit via 110, a via structure may be implemented to include a via conductor 200 around the unit via 110. Here,'reducing the formation' may mean that the via hole of the unit via 110 is formed smaller than the design.

The method of specifying the unit via 110 that is expected to cause the reduction phenomenon is as follows. First, a via structure is implemented so as not to include the via conductor 200 described above, and the presence or absence of via cracks in each unit via is examined. When a via crack occurs, in particular, when a plurality of unit vias where a via crack occurs, a location commonality between a plurality of unit vias where a via crack occurs and a mechanism for generating a via crack (such as whether or not a reduction phenomenon occurs) are found. Accordingly, it is possible to specify the location of the unit vias where via cracks are likely to occur.

For example, if the unit via is isolated from the other via (via vias other than via structures) (V in FIG. 2) horizontally more than a certain value within the same layer, the isolated unit via It can be determined that cracking may occur, and the specific value may be 1 mm. This specific value can be referred to as the'set value' described above.

According to this, when the unit via is formed farther than 1 mm from other vias in the same layer, the via conductor 200 may be formed around the unit via to prepare for the shrinkage and cracking of the unit via.

As a specific example, in a laser facility for forming a via hole, the laser irradiation unit irradiates the laser while moving in correspondence with a predetermined position. When the movement distance is greater than a set value, energy provided by the laser may be reduced. That is, when processing a via hole of a unit via that is too far away, the via hole may be smaller than the design. Accordingly, the via hole of the via conductor is first processed before the via hole processing of the unit via that is too far away, and then the laser irradiation unit is moved shortly to process the via hole of the unit via, thereby securing energy provided by the laser.

The gap (pitch) between the unit via 110 and the via conductor 200 may be 1 mm or less. For example, as illustrated in FIG. 2, the cross section of each of the unit via 110 and the via conductor 200 is circular, and the distance D between the unit via 110 and the center of the via conductor 200 is 1 mm or less. Can be.

The arrangement of the unit via 110 and the via conductor 200 may vary. As illustrated in FIG. 2, the unit via 110 and the via conductor 200 may be arranged to have a plurality of rows and a plurality of columns as in a 2X2 structure, and as illustrated in FIG. 3, the unit via 110 ) And the via conductor 200 may be arranged in a line like the structure of 1X3.

On the other hand, the size of the via conductor 200 may be the same as the size of the unit via 110, but may be different, but is not limited thereto.

In this embodiment, the via conductor 200 may serve to transmit a signal. In this case, as shown in Figure 3, the unit via 110 is in contact with the first pad 300, the unit via 110 and the via conductor 200 may share the same first pad 300 have. The shared first pad 300 may be connected to the circuit layer C. When a plurality of via conductors 200 are provided, all of the via conductors 200 may be connected to the first pad 300 of the unit via 110.

In other words, a second pad 400 is formed above and below the via conductor 200, and the first pad 300 and the second pad 400 are in contact with each other, such that the unit via 110 and the via conductor 200 are formed. Can share one pad.

According to such a via structure, even if a shrinking phenomenon or crack occurs in the unit via 110 located in one layer, the signal transmission path is increased by the via conductor 200 to compensate for the signal transmission function. Therefore, the reliability of the entire via structure can be further secured.

The printed circuit board according to the first embodiment of the present invention includes a plurality of insulating layers (L) and a via structure, the plurality of insulating layers (L) are stacked up and down, and the via structure has a plurality of insulating layers (L ) It is formed inside. The via structure is formed over the plurality of insulating layers L and may be electrically connected to the circuit layer C formed on each of the plurality of insulating layers L.

The via structure includes unit vias 100 and 110 disposed vertically, and each of the unit vias 100 and 110 may be formed to penetrate one of the plurality of insulating layers L. Each of the unit vias 100 and 110 may include a via hole formed in the insulating layer L and a plating layer formed inside the via hole.

A via conductor 200 spaced apart from the unit via 110 may be formed on at least one of the plurality of insulating layers L. The unit via 110 and the via conductor 200 penetrate the same insulating layer L and may be horizontally spaced below a set value within the insulating layer L. The via conductor 200 may include a via hole formed in the insulating layer L and a plating layer formed inside the via hole.

As described above, the via hole of the via conductor 200 may be processed before the via hole of the unit via 110 to secure the size of the via hole of the unit via 110. Meanwhile, in the present embodiment, the via conductor 200 may perform interlayer signal transmission.

The insulating layer L may be formed of an organic material or an inorganic material, or may be formed of a material containing resin. The resin forming the insulating layer L may include at least one of a thermosetting resin and a thermoplastic resin. An epoxy resin or the like may be used as the thermosetting resin, and a polyimide or a liquid crystal polymer may be used as the thermoplastic resin.

The circuit layer C provides a path for transmitting electrical signals, and may be formed on each of the insulating layers L. The circuit layer C may be formed of copper (Cu), silver (Ag), platinum (Pt), aluminum (Al), palladium (Pd), or metals thereof.

Meanwhile, the printed circuit board according to the first embodiment of the present invention may be an antenna substrate, and in this case, a part of the circuit layer C may function as an antenna. Here, as illustrated in FIG. 2, a portion functioning as an antenna may be a plurality of patch antennas (antenna array) A.

4 and 5 are diagrams illustrating a via structure and a printed circuit board including the same according to a second embodiment of the present invention.

4 and 5, the via structure according to the second embodiment of the present invention includes a plurality of unit vias 100 and 110 arranged vertically, and one of the plurality of unit vias 100 and 110 The via conductor 200 may be formed to be spaced at a predetermined interval or less around the periphery of the. That is, the horizontal separation distance between one unit via 110 and the via conductor 200 may be less than or equal to a set value.

The unit vias 100 and 110 may be arranged vertically. The plurality of unit vias 100 and 110 may be stacked up and down to have the same center line, but since the same center line means a center line placed at the same location within an error range, the unit vias 100 and 110 are They can be either fully vertically stacked, or slightly offset vertically.

The unit vias 100 and 110 may be stacked to be connected to each other up and down with the first pad 300 interposed therebetween. The first pad 300 may be electrically insulated from the above-described via conductor 200. The first pad 300 is connected to the circuit layer C, and accordingly, the unit vias 100 and 110 may perform inter-layer signal connection. On the other hand, the via conductor may be a dummy via in which the via conductor 200 does not perform signal transmission.

Referring to FIG. 5, the first pad 300 connected to the unit via 110 is connected to the unit via 100 of another layer, but may not be connected to the via conductor 200. Although the via conductor 200 may have a separate second pad 400, the first pad 300 of the unit via 110 and the second pad 400 of the via conductor 200 are electrically connected. Can be insulated. The first pad 300 may be connected to the circuit layer C, and the second pad 400 of the via conductor 200 may not be connected to the circuit layer C.

The unit vias 100 and 110 may be formed by forming a metal plate inside the via hole after the via hole is formed, respectively. The via conductor 200 may also be provided by forming a metal plating layer inside the via hole after the via hole is formed.

As described above, the via conductor 200 may be spaced apart from the unit via 110 horizontally below a set value. The single unit via 110 may be reduced when a via conductor is omitted from the via structure. That is, when it is expected that a reduction phenomenon occurs in the single unit via 110, a via structure may be implemented to include a via conductor 200 around the unit via 110.

As a specific example, in a laser facility for forming a via hole, the laser irradiation unit irradiates the laser while moving in correspondence with a predetermined position. When the movement distance is greater than a set value, energy provided by the laser may be reduced. That is, when processing a via hole of a unit via that is too far away, the via hole may be smaller than the design. Accordingly, the via hole of the via conductor is first processed before the via hole processing of the unit via that is too far away, and then the laser irradiation unit is moved shortly to process the via hole of the unit via, thereby securing energy provided by the laser.

That is, the via conductor 200 may process the via hole of the unit via 110 to a sufficient size by first processing the via hole of the via conductor 200 even if it is a dummy via that does not serve as a signal transmission.

The gap (pitch) between the unit via 110 and the via conductor 200 may be 1 mm or less. For example, as illustrated in FIG. 4, the cross section of each of the unit via 110 and the via conductor 200 is circular, and the distance D between the unit via 110 and the center of the via conductor 200 is 1 mm or less. Can be.

The arrangement of the unit via 110 and the via conductor 200 may vary. 4, the via conductor 200 is composed of a plurality, the plurality of via conductors 200 is a unit via (100); And a circuit layer C connected to the unit via 110.

On the other hand, the size of the via conductor 200 may be the same as the size of the unit via 110, but may be different, but is not limited thereto. For example, as illustrated in FIG. 3, the size of the via conductor 200 may be smaller than the size of the unit via 110.

The printed circuit board according to the second embodiment of the present invention includes a plurality of insulating layers (L) and a via structure, a plurality of insulating layers (L) are stacked up and down, and a via structure has a plurality of insulating layers (L ) It is formed inside. The via structure is formed over the plurality of insulating layers L and may be connected to the circuit layer C formed on each of the plurality of insulating layers L.

The via structure includes unit vias 100 and 110 disposed vertically, and each of the unit vias 100 and 110 may be formed to penetrate one of the plurality of insulating layers L. Each of the unit vias 100 and 110 may include a via hole formed in the insulating layer L and a plating layer formed inside the via hole.

A via conductor 200 spaced apart from the unit via 110 may be formed on at least one of the plurality of insulating layers L. The unit via 110 and the via conductor 200 penetrate the same insulating layer L and may be horizontally spaced below a set value within the insulating layer L. The via conductor 200 may include a via hole formed in the insulating layer L and a plating layer formed inside the via hole.

As described above, the via hole of the via conductor 200 may be processed before the via hole of the unit via 110 to secure the size of the via hole of the unit via 110. Meanwhile, in the present embodiment, the via conductor 200 may be a dummy via that does not perform interlayer signal transmission.

The insulating layer L may be formed of an organic material or an inorganic material, or may be formed of a material containing resin. The resin forming the insulating layer L may include at least one of a thermosetting resin and a thermoplastic resin. An epoxy resin or the like may be used as the thermosetting resin, and a polyimide or a liquid crystal polymer may be used as the thermoplastic resin.

The circuit layer C provides a path for transmitting electrical signals, and may be formed on each of the insulating layers L. The circuit layer C may be formed of copper (Cu), silver (Ag), platinum (Pt), aluminum (Al), palladium (Pd), or metals thereof.

Meanwhile, the printed circuit board according to the second embodiment of the present invention may be an antenna substrate, and in this case, a part of the circuit layer C may function as an antenna. Here, as illustrated in FIG. 4, a portion functioning as an antenna may be a plurality of patch antennas (antenna array) A.

6 and 7 are diagrams illustrating a via structure and a printed circuit board including the same according to a third embodiment of the present invention.

Referring to FIG. 6, the via structure according to the third embodiment of the present invention may include a first structure 11 and a second structure 12.

The first structure 11 may include a first unit via 500 formed in plural. The plurality of first unit vias 500 are vertically connected to form a stack via structure. In particular, the first structure 11 may form a full-layer stacked via structure that connects all layers of the printed circuit board up and down.

The first unit via 500 is electrically connected to the circuit layer C of the printed circuit board, and may be responsible for conduction between the circuit layers C. In particular, the first unit vias 500 forming the entire layer stack via structure are formed between neighboring circuit layers C, and are responsible for up and down conduction of the entire circuit layer C.

The plurality of first unit vias 500 may be stacked up and down to have the same center line, but since the same center line means a center line placed at the same location within an error range, the first unit via 500 is completely vertical It can be stacked as, or it can be stacked slightly off the top.

Each of the first unit vias 500 may have the same shape. For example, each of the first unit vias 500 may have the same cross-section of a trapezoid or an inverted trapezoid. However, the present invention is not limited thereto, and the shapes of the plurality of first unit vias 500 may be different from each other.

The first structure 11 may further include a first pad 300. The first pad 300 is vertically connected to the first unit via 500, and the plurality of first unit vias 500 may be stacked with the first pad 300 interposed therebetween. In this case, a first pad 300 is formed on one surface of each first unit via 500, so that the first structure 11 is implemented as a repeating structure of'pad-unit via-pad-unit via-pad'. Can be.

The second structure 12 may include a second unit via 600 formed in plural. The plurality of second unit vias 600 are vertically connected to form a stack via structure. In particular, the second structure 12 may form a full-layer stack via structure that connects all layers of the printed circuit board up and down.

The plurality of second unit vias 600 may be stacked up and down to have the same center line, but since the same center line means a center line placed at the same position within an error range, the second unit via 600 is completely vertical It can be stacked as, or it can be stacked slightly off the top.

The second unit via 600 is formed to correspond to each first unit via 500. The first unit vias 500 and the second unit vias 600 corresponding to each other on the same layer are horizontally spaced apart. Here, horizontally spaced means that the side surfaces of the first unit via 500 and the second unit via 600 do not contact each other.

Each of the second unit vias 600 may have the same shape. For example, each of the second unit vias 600 may have the same cross-section of a trapezoid or an inverted trapezoid. However, the present invention is not limited thereto, and the shapes of the plurality of second unit vias 600 may be different from each other.

The second structure 12 may further include a second pad 400. The second pad 400 is vertically connected to the second unit via 600, and the plurality of second unit vias 600 may be stacked with the second pad 400 interposed therebetween. In this case, a second pad 400 is formed on one surface of each second unit via 600, so that the second structure 12 is implemented as a repeating structure of'pad-unit via-pad-unit via-pad'. Can be.

The second structure 12 may be formed in plural. Each second structure 12 may be implemented as a stacked via structure. The plurality of second structures 12 may be formed to surround the first structure 11.

The horizontal separation distance between the first structure 11 and the second structure 12 may be less than or equal to a set value. In particular, each of the first unit vias 500 is horizontally spaced from the second unit vias 600 formed on the same layer, and their horizontal separation distances may be less than or equal to a set value. Further, even when a plurality of second structures 12 are formed, a horizontal separation distance from the first structure 11 to each second structure 12 may be equal to or less than a set value.

Here, the horizontal separation distance can be said to be the distance between the center lines of the unit vias. In addition, the set value is a set value of a condition in which the via holes can be uniformly processed when the via holes of the unit vias are processed. For example, in a laser facility for processing via holes, when processing a plurality of via holes, via holes may be uniformly processed when the via holes are farther than a specific distance, where a set value becomes the specific distance. Specifically, the set value may be 1 mm.

The first unit via 500 and the second unit via 600 may be formed in the same number. Referring to FIG. 6, each of the first unit via 500 and the second unit via 600 consists of five, but this is exemplary. The horizontal separation distance between the first unit via 500 and the second unit via 600 formed on the same layer is equal to or less than the above-described set value. That is, in all five layers, the horizontal separation distances of the first unit vias 500 and the second unit vias 600 corresponding to each other are equal to or less than a set value.

Within a distance horizontally separated from the first unit via 500 by the set value, there may be no other vias other than the second unit via 600. That is, the first unit via 500 is a via far away from other vias on the same layer, and only the second unit via 600 exists within a distance horizontally spaced from the first unit via 500 by a set value. Can be.

On the other hand, in the manufacturing of the via structure, when the via hole is processed, when the via hole of the first unit via 500 and the second unit via 600 on the same layer is processed, the via unit is processed before the via hole processing of the second unit via 600. Via holes of one unit via 500 may be processed. In this case, due to limitations on the facility, even when the via hole that is post-processed is reduced when machining via holes farther than a set value, after processing the via hole of the second unit via 600, the first unit via ( By processing the via hole of 500), the limitations on the equipment can be compensated.

Referring to FIG. 6, a part of the first pad 300 and the second pad 400 may be in contact with each other. For example, in the six pairs of the first pad 300 and the second pad 400, as shown in FIG. 6, the two pairs of the first pad 300 and the second pad 400 are to be in contact with each other Can be. In addition, the remaining pair of the first pad 300 and the second pad 400 may be spaced apart from each other and insulated.

Referring to FIG. 7, the printed circuit board according to the third embodiment of the present invention includes a plurality of insulating layers (L), a plurality of circuit layers (C), and a via structure, and the via structure comprises a first structure (11 ) And the second structure 12.

The plurality of insulating layers L are stacked up and down, and insulate the circuit layers C located on different layers. The via structure is formed inside the plurality of insulating layers (L). The via structure is formed over the plurality of insulating layers L and may be electrically connected to the circuit layer C.

The insulating layer L may be formed of an organic material or an inorganic material, or may be formed of a material containing resin. The resin forming the insulating layer L may include at least one of a thermosetting resin and a thermoplastic resin. An epoxy resin or the like may be used as the thermosetting resin, and a polyimide or a liquid crystal polymer may be used as the thermoplastic resin.

The circuit layer C provides a path for transmitting electrical signals, and may be formed on each of the insulating layers L. The circuit layer C may be formed of copper (Cu), silver (Ag), platinum (Pt), aluminum (Al), palladium (Pd), or metals thereof.

The circuit layer C may be made of N layers, and the insulating layer L may be made of N-1 layers. In FIG. 7, the circuit layer C is composed of 6 layers, and the insulating layer L is composed of 5 layers, but is not limited thereto.

The first structure 11 is electrically connected to the circuit layer C. The first structure 11 includes a plurality of first unit vias 500. The first unit via 500 is formed between the circuit layers C neighboring up and down. That is, the first unit via 500 connects the adjacent circuit layers C vertically. The plurality of first unit vias 500 are arranged vertically to form a stack via structure. In particular, the first structure 11 may form a full-layer stack via structure that connects the entire circuit layer C up and down.

Since the first unit via 500 is formed between the upper and lower neighboring circuit layers C, when the circuit layer C is composed of N layers, the first unit via 500 may be composed of N-1 units. . In FIG. 7, the circuit layer C has six layers, and the first unit via 500 includes five layers, but is not limited thereto.

The plurality of first unit vias 500 may be stacked up and down to have the same center line, but since the same center line means a center line placed at the same location within an error range, the first unit via 500 is completely vertical It can be stacked as, or it can be stacked slightly off the top.

Each of the first unit vias 500 may have the same shape. For example, each of the first unit vias 500 may have the same cross-section of a trapezoid or an inverted trapezoid. However, the present invention is not limited thereto, and the shapes of the plurality of first unit vias 500 may be different from each other.

The first structure 11 may further include a first pad 300. The first pad 300 is vertically connected to the first unit via 500, and the plurality of first unit vias 500 may be stacked with the first pad 300 interposed therebetween. In this case, a first pad 300 is formed on one surface of each first unit via 500, so that the first structure 11 is implemented as a repeating structure of'pad-unit via-pad-unit via-pad'. Can be.

The second structure 12 may include a second unit via 600 formed in plural. The plurality of second unit vias 600 are arranged vertically to form a stack via structure. The second structure 12 may form a full-layer stack via structure that connects all layers of the printed circuit board up and down.

The plurality of second unit vias 600 may be stacked up and down to have the same center line, but since the same center line means a center line placed at the same position within an error range, the second unit via 600 is completely vertical It can be stacked as, or it can be stacked slightly off the top.

The second unit via 600 is formed to correspond to each first unit via 500. The first unit vias 500 and the second unit vias 600 corresponding to each other on the same layer are horizontally spaced apart. Here, horizontally spaced means that the side surfaces of the first unit via 500 and the second unit via 600 do not contact each other.

Each of the second unit vias 600 may have the same shape. For example, each of the second unit vias 600 may have the same cross-section of a trapezoid or an inverted trapezoid. However, the present invention is not limited thereto, and the shapes of the plurality of second unit vias 600 may be different from each other.

The second structure 12 may further include a second pad 400. The second pad 400 is vertically connected to the second unit via 600, and the plurality of second unit vias 600 may be stacked with the second pad 400 interposed therebetween. In this case, a second pad 400 is formed on one surface of each second unit via 600, so that the second structure 12 is implemented as a repeating structure of'pad-unit via-pad-unit via-pad'. Can be.

The second structure 12 may be formed in plural. Each second structure 12 may be implemented as a stacked via structure. The plurality of second structures 12 may be arranged to surround the first structure 11.

The horizontal separation distance between the first structure 11 and the second structure 12 may be less than or equal to a set value. In particular, the horizontal separation distance between the first unit via 500 and the second unit via 600 formed on the same layer may be less than or equal to a set value. Further, even when a plurality of second structures 12 are formed, a horizontal separation distance from the first structure 11 to each second structure 12 may be equal to or less than a set value.

Here, the horizontal separation distance can be said to be the distance between the center lines of the unit vias. In addition, the set value is a set value of a condition in which the via holes can be uniformly processed when the via holes of the unit vias are processed. For example, in a laser facility for processing via holes, when processing a plurality of via holes, via holes may be uniformly processed when the via holes are farther than a specific distance, where a set value becomes the specific distance. Specifically, the set value may be 1 mm.

The first unit via 500 and the second unit via 600 may be formed in the same number. Referring to FIG. 7, each of the first unit via 500 and the second unit via 600 consists of five, but this is only exemplary. The horizontal separation distance between the first unit via 500 and the second unit via 600 formed on the same layer is equal to or less than a set value. That is, in all five layers, the horizontal separation distances of the first unit vias 500 and the second unit vias 600 corresponding to each other are equal to or less than a set value.

In FIG. 7, the horizontal separation distance D11 of the first unit via 500 passing through the insulating layer L1 to connect the circuit layers C1 and C2 and the second unit via 600 formed on the same layer is a set value. Is below. The horizontal separation distance D12 between the first unit via 500 passing through the insulating layer L2 and the second unit via 600 formed on the same layer to connect the circuit layers C2 and C3 is equal to or less than the set value. The horizontal separation distances D13, D14, and D15 calculated in the same manner are all less than or equal to the set value. However, the values of D11 to D15 may be different.

Within a distance horizontally separated from the first unit via 500 by the set value, there may be no other vias other than the second unit via 600. That is, the first unit via 500 is a via far away from other vias V of the same layer, and the second unit via 600 is within a distance horizontally spaced from the first unit via 500 by a set value. ) Can only exist.

In FIG. 7, other vias V may exist between the circuit layers C1 and C2 in addition to the first unit via 500, but the distance D21 between the first unit via 500 and the via is greater than the above-described set value. Big. Likewise, D22, D23, D24, and D25 are all greater than the set value.

On the other hand, in the manufacturing of the via structure, when the via hole is processed, when the via hole of the first unit via 500 and the second unit via 600 on the same layer is processed, the via unit is processed before the via hole processing of the second unit via 600. A via hole of one unit via 500 may be processed. In this case, due to limitations on the facility, even when the via holes that are post-processed are reduced when machining via holes farther than a set value, after processing the via holes of the second unit via 600, the first unit via ( If the via hole of 500) is processed, the limitation on the equipment can be compensated.

In FIG. 7, when the relationship between the vias (V), the first unit vias 500 and the second unit vias 600 present between the circuit layers C1 and C2 is examined, after forming the via hole of the via V, the The via hole of the second unit via 600 is processed immediately before the via hole of the first unit via 500 that is farther than the set value from the via V is processed. After processing the via hole of the second unit via 600, the via hole of the first unit via 500 is processed. According to this, limitations on the above-described facilities can be compensated. This description can also be applied to all other layers, including the layer between circuit layers C2 and C3.

In other words, if all of the first unit vias 500 of the first structure 11 are farther from the normal via V than the set value, the second unit vias 600 of the same number as the first unit vias 500 A second structure 12 made of is required, and in the via hole process, in the same layer, as the via hole of the first unit via 500 is processed after the via hole processing of the second unit via 600 is processed, the first unit via An unnecessary reduction phenomenon of 500 may be prevented, and further, the reliability of the first structure 11 may be secured.

Meanwhile, referring to FIG. 7, a part of the first pad 300 and the second pad 400 may be in contact with each other. For example, in the six pairs of the first pad 300 and the second pad 400, as shown in FIG. 6, the two pairs of the first pad 300 and the second pad 400 are to be in contact with each other Can be. In addition, the remaining pair of the first pad 300 and the second pad 400 may be spaced apart from each other and insulated.

8 and 9 are diagrams illustrating a via structure and a printed circuit board including the same according to a fourth embodiment of the present invention.

8 and 9, in the via structure according to the fourth embodiment and the printed circuit board including the same, all pairs of the first pad 300 and the second pad 400 are electrically connected. That is, all pairs of the first pad 300 and the second pad 400 are in contact with each other, and the first unit via 500 and the second unit via 600 share the pad.

10 and 11 are diagrams showing a via structure according to a fifth embodiment of the present invention and a printed circuit board including the via structure.

10 and 11, in the via structure according to the fifth embodiment and a printed circuit board including the same, all pairs of the first pad 300 and the second pad 400 are electrically insulated. That is, all pairs of the first pad 300 and the second pad 400 are horizontally spaced from each other, and the second unit via 600 (the second structure 12) is also insulated from the circuit layer C. It does not participate in the interlayer conduction of the circuit layer C, and exists as a dummy via.

As described above, one embodiment of the present invention has been described, but those skilled in the art can add, change, delete, or add elements within the scope of the present invention described in the claims. It will be said that the present invention can be variously modified and changed by the like, and this is also included within the scope of the present invention.

100, 110: unit via
200: Via conductor
300: first pad
400: second pad
L: insulating layer
C: Circuit layer
500: first unit via
600: second unit via
10: Via structure
11: First structure
12: second structure

Claims (15)

A circuit layer formed of a plurality of layers;
A first structure formed between each of the circuit layers adjacent to each other vertically and including a plurality of first unit vias disposed vertically above each other; And
And a second structure horizontally spaced from each of the first unit vias, and including a plurality of second unit vias disposed above and below each other,
The horizontal separation distance between the first unit via and the second unit via is equal to or less than a set value.
According to claim 1,
The first structure,
The printed circuit board further comprises a first pad connected to the circuit layer and connected to each of the first unit vias vertically.
According to claim 2,
The second structure, the printed circuit board further comprises a second pad connected to each of the second unit via up and down.
According to claim 3,
The first pad and the second pad are electrically insulated from each other, a printed circuit board.
According to claim 3,
At least a portion of the second pad is in contact with the first pad, a printed circuit board.
According to claim 1,
The set value is 1mm printed circuit board.
According to claim 1,
There is no other via other than the second unit via within a distance horizontally separated from the first unit via by the set value.
According to claim 1,
The second structure is formed of a plurality, a printed circuit board.
A circuit layer formed of a plurality of layers; And
And a via structure electrically connected to the circuit layer,
The via structure,
A plurality of unit vias formed between the circuit layers adjacent to each other vertically and disposed vertically above each other; And
It includes a via conductor formed around any one of the plurality of unit vias,
The horizontal separation distance between the one unit via and the via conductor is less than or equal to a set value.
The method of claim 9,
The via structure,
A printed circuit board further comprising a first pad connected to the circuit layer and connected to each of the unit vias vertically.
The method of claim 10,
The via conductor is a printed circuit board in contact with the first pad.
The method of claim 10,
The via conductor is vertically connected to the second pad,
The second pad is a printed circuit board insulated from the first pad.
The method of claim 9,
The set value is 1mm printed circuit board.
The method of claim 9,
A printed circuit board having no other vias other than the via conductor within a distance horizontally separated from the unit via by the set value.
The method of claim 9,
The via conductor is formed in plural, printed circuit board.

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