JP2003133711A - Printed-wiring board and manufacturing method thereof, and packaging method of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed-wiring board for preventing a component to be packaged from slipping from the electrode of a substrate in a manufacturing method of a printed-wiring board having a component packaging electrode with a narrow pitch. SOLUTION: By the printed-wiring board where a conductor pattern exists at a position that is lower than a smooth insulating resin surface formed on a substrate, and at the same time an insulating resin around the conductor pattern is inclined, the electrode of a component slips on the insulating resin with an incline for placing on a recessed conductor pattern even if misalignment occurs in the packaging of the component, thus achieving the excellent printed- wiring board for effectively inhibiting contact fail.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component, particularly a printed wiring board for mounting electronic components such as bare chips, a method for manufacturing the same, and a method for mounting electronic components.

[0002]

2. Description of the Related Art A conventional printed wiring board pattern forming method is roughly classified into a subtractive method and an additive method. The subtractive method has high mass productivity and can reduce manufacturing cost. It is widely used as a forming method.

Further, in recent years, the number of places where the additive method is used for fine pattern is increasing.

FIG. 8 shows a manufacturing process procedure of pattern formation by the subtractive method.

After forming an etching resist 34 by a photo process on the surface of a copper clad laminate 31 (see FIG. 8A) consisting of a base material 32 and a copper foil 33 (see FIG. 8B), a chlorinated chloride Unnecessary copper foil is removed by an etching solution such as dicopper to form a predetermined pattern 35 (see FIG. 8C), and then the etching resist is peeled off to complete the pattern formation (FIG. 8D). )reference).

Thereafter, a solder resist may be applied on the surface of the wiring board, leaving a component mounting portion, if necessary.

Finally, as a finishing treatment, an electroless nickel plating layer 36 is formed on a pattern to be a connection electrode when mounting a component, and an electroless gold plating layer 37 is further formed thereon (see FIG. 8E). ).

9 and 10 show a manufacturing process procedure of pattern formation by a semi-additive method which is often used among the additive methods.

A base material 32 to be the wiring board 31 (FIG. 9A)
After the electroless copper plating layer 41 is formed on the surface (see FIG. 9B) (see FIG. 9B), the plating resist 42 is formed by a photo process (see FIG. 9C).

Next, an electrolytic copper plating layer 43 is formed on the non-formed portion of the plating resist 42 (see FIG. 9D). Then, the plating resist 42 is stripped with a solution of sodium hydroxide or the like (see FIG. 10E).

Next, the electroless copper plating layer 4 in the portion where the electrolytic copper plating layer 43 is not formed by a solution containing sulfuric acid and hydrogen peroxide as main components or an etching solution such as cupric chloride.
1 is removed (see FIG. 10F). Thereafter, a solder resist may be applied on the surface of the wiring board, leaving the component mounting portion, if necessary.

Finally, as a finishing treatment, an electroless nickel plating layer 36 is formed on a pattern to be a connection electrode when mounting a component, and an electroless gold plating layer 37 is further formed thereon (see FIG. 10G). ).

[0013]

However, in the case of the subtractive method which is the conventional manufacturing method, the copper foil 33 is used.
When etching is performed not only in the thickness direction but also in the lateral direction, the cross-sectional shape of the pattern 35 has a narrow upper width,
It has a trapezoidal shape with a thick bottom width.

For this reason, as finer patterns are formed and the pattern width and the pattern gap become narrower, the upper width becomes narrower when trying to maintain a predetermined gap in the lower width between adjacent patterns.

When the upper width of the pattern is reduced as described above, when a component is mounted on the pattern, the component is displaced from the pattern due to a small tolerance regarding positional displacement when the electrodes arranged on the component are placed on the pattern. There was a problem that it dropped and electrical connection could not be made.

This will be specifically described with reference to FIG. 11 (A).
As shown in (B), the bump 45, which is a connection electrode for connecting to the substrate arranged on the bare chip 44, is displaced from the pattern 35 by the pressure during mounting, and the bare chip is tilted to cause a contact failure. It was

In the case of the semi-additive method, which is the conventional manufacturing method described above, when the electrolytic copper plating layer 43 is formed, the cross-sectional shape in the plating deposition state does not deposit flat, but
Precipitates in a rounded state.

The degree of roundness becomes more remarkable when the current density of the plating is high and the hydrophobicity of the plating resist is stronger, but the plating is originally deposited in a rounded state.

In addition to this, when the electroless copper plating layer 41 is removed by an etching solution in the subsequent step, the etching solution is also applied to the electrolytic copper plating layer 43, so that the pattern has a further enhanced roundness.

When the upper width of the pattern has a rounded shape in this way, when the component is mounted on the pattern, even if the electrode arranged on the component is placed on the pattern with high precision, the electrode will be rounded due to the roundness of the pattern. There is a problem that parts are slipped off from the pattern and electrical connection cannot be made because the parts are easily slipped on the pattern.

This will be specifically described with reference to FIG. 12 (A).
As shown in (B), the bump 45, which is a connection electrode with the substrate arranged on the bare chip 44, slides off the pattern 35 due to the pressure during mounting, and the bare chip is tilted, causing a contact failure. It was

[0022]

In order to solve the above-mentioned conventional problems, the present invention provides a step of forming an insulating resin layer on the entire surface of an insulating substrate having a conductor pattern, and the step of forming the insulating resin layer on the surface of the conductor pattern. The opening formed in the insulating resin layer is formed by using a method for manufacturing a printed wiring board including a step of polishing the surface of the exposed conductive pattern to a predetermined depth by polishing the surface until it is exposed. And a connection terminal pattern is exposed on a lower side of the opening, and an upper surface of the connection terminal pattern is formed at a position lower than a surface of the insulating resin layer. To do.

Further, the connection terminal pattern of the printed wiring board of the present invention is brought into contact with the connection electrode of an electronic component having a convex connection electrode, and the electronic component is pressed to form the connection terminal pattern and the connection electrode. An object of the present invention is to provide a method for mounting an electronic component that is electrically joined, and to eliminate a problem at the time of mounting.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION To achieve the above object, the present invention has the following constitution.

The invention according to claim 1, claim 2, and claim 7 of the present invention comprises a step of forming an insulating resin layer on the entire surface of an insulating substrate having a conductor pattern, and the step of forming the insulating resin layer in the conductor pattern. Using a method for manufacturing a printed wiring board, which comprises a step of polishing the surface of the conductor to form an opening by smoothing the exposed surface and a step of etching the exposed upper surface of the conductor pattern to a predetermined depth, the connection terminal is provided directly below the opening. The pattern is partially exposed, and the upper surface of the connection terminal pattern provides a printed wiring board formed at a position lower than the surface of the insulating resin layer.

As a result, in mounting electronic components, when the convex electrodes arranged on the electronic components are placed on the pattern of the board, the convex electrodes are formed on the printed wiring board in a recessed connection terminal pattern. It is positioned so that it fits in.

Even when pressure is applied to the electronic component during mounting, the convex electrodes of the electronic component do not move laterally,
It has an effect of maintaining a normal connection state.

Further, since the connection terminal pattern is partially exposed, that is, the side edge of the connection terminal pattern is covered with the insulating resin layer, the peel strength and the pull strength are significantly improved. I have.

According to the third, fourth and tenth aspects of the present invention, after the exposed upper surface of the conductor pattern is etched to a predetermined depth, the edge of the opening of the insulating resin layer is inclined. (EN) A printed wiring board provided with an inverted conical slope at the edge of an opening, that is, a shape in which the upper side of the opening is wide and the lower side of the opening is narrow by using the step of providing.

As a result, in mounting an electronic component, when the convex electrodes arranged on the electronic component are placed on the pattern of the substrate, even if the mounting position of the electronic component is deviated, the insulating resin directly above the connection terminal pattern is formed. Since the edge of the opening of the layer is inclined, the electrode slides over the insulating resin layer due to the pressure from above the electronic component during mounting, and the convex electrode is formed in the depressed state of the printed wiring board. It has an effect of being easily positioned by being fitted to the connection terminal pattern.

The step of providing the inclination is buffing, as described in claim 11 of the present invention, in which aluminum oxide or silicon carbide is used as the abrasive, and the abrasive grain size of the abrasive is # 400. ~ # 2500 is desirable.

As a result, the flat surface portion of the insulating resin layer is not affected by polishing as much as possible, and only the edge portion can be rounded to provide the inclination.

According to the fifth, eighth and ninth aspects of the present invention, the exposed upper surface of the conductor pattern is etched to a predetermined depth, and then a nickel plating layer and a gold plating layer are formed on the surface of the conductor pattern. In the step of forming, using a manufacturing method characterized in that the predetermined depth is greater than the sum of the thickness of the nickel plating layer and the gold plating layer,
The present invention provides a printed wiring board in which a nickel and gold plating layer is formed on the surface of a conductor pattern for a connection terminal.

As a result, in mounting an electronic component, when the convex electrode arranged on the electronic component is placed on the pattern of the substrate, the convex electrode is formed on the connection terminal pattern formed in the depressed state of the printed wiring board. It is positioned so that it fits in.

Further, since the surface layer of the conductor pattern for the connection terminal is a gold plating layer, it has an effect that the connection resistance with the convex electrode of the electronic component can be kept low and the normal connection state can be maintained.

The invention described in claims 6 and 12 of the present invention provides a printed wiring board having the features of claim 1 of the present invention using an additive method.

As a result, the plating resist used when the conductor pattern is formed by electroless copper plating also has a role as an insulating resin layer, and a photosensitive resist is used to form a thin wire and a high-density conductor pattern. It is possible to efficiently manufacture the printed wiring board having the same.

In mounting an electronic component having a large number of electrodes, when the convex electrode arranged on the electronic component is placed on the pattern of the substrate, the convex electrode is formed in a depressed state of the printed wiring board. It has the effect of being positioned in a form fitted to the connection terminal pattern.

According to a thirteenth aspect of the present invention, the connection terminal pattern of the printed wiring board according to the first aspect is brought into contact with the connection electrode of an electronic component having a convex connection electrode to form the electronic component. It is a method of mounting an electronic component, characterized in that the connection terminal pattern and the connection electrode are electrically joined by applying pressure.
In mounting components, when the convex connecting electrodes placed on the component are placed on the connecting terminal pattern of the board, the convex connecting electrodes of the component are dropped onto the recessed connecting terminal pattern, so that further mounting Even if pressure is applied, the electrodes do not move, and the effect that the normal connection is maintained is obtained.

According to a fourteenth aspect of the present invention, the connection terminal pattern of the printed wiring board according to the first aspect and the convex connection electrode of the electronic component are electrically joined to each other to form the printed wiring board and the electronic component. It is a method of mounting an electronic component in which a sealing resin is interposed in the gap between, and thus, it was difficult to suppress the occurrence of voids in the conventional substrate, but in the substrate of the present invention, the insulating resin Since the substrate surface is formed to be substantially smooth, it is possible to obtain the effect that the sealing resin can be injected at high speed while suppressing the inclusion of voids.

According to a fifteenth aspect of the present invention, a curable resin is disposed on or near the connection terminal pattern of the printed wiring board according to the first aspect, and the connection terminal pattern has
The convex connecting electrodes of the electronic component are brought into contact with each other, and the mounting method of the electronic component is such that the curable resin is cured. Therefore, it is difficult to suppress the occurrence of voids in the conventional substrate. In the substrate of the present invention, due to the insulating resin,
Since the substrate surface is formed to be substantially smooth, it is possible to obtain a working effect that a mounting method with high connection reliability without voids can be realized.

According to a sixteenth aspect of the present invention, the connection terminal pattern of the printed wiring board according to the first aspect is electrically connected to the connection electrode of the electronic component by melting solder or solder balls. This is a method of mounting an electronic component, which allows a solder or solder ball to be mounted with high connection reliability without being displaced from the recessed connection terminal pattern. In addition, since the side surface of the connection terminal pattern is covered with the insulating resin and is recessed, it is possible to reduce the amount of solder used for joining and to reduce the short circuit due to the solder.

(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings.

1 and 2 are manufacturing process diagrams of the printed wiring board according to Embodiment 1 of the present invention.

In FIGS. 1 and 2, as the wiring substrate 1 in the present embodiment, a substrate having a connection terminal pattern 5 formed on both surfaces of an insulating substrate 2 which is, for example, a glass epoxy resin laminated plate is used. There is. As a method of forming this conductor pattern, any method such as a subtractive method or a semi-additive method may be used (see FIG. 1A).

An insulating resin layer 3 is formed on the surface of the wiring board 1. As the material for this insulating resin layer, a thermosetting epoxy resin is used, which is applied with a screen printing machine, curtain coater, slot coater, etc., and then dried in a heat curing oven, and then the wiring. Similarly, an insulating resin material is applied to the back surface of the substrate 1 and both surfaces are simultaneously cured in a heat curing furnace (see FIG. 1B).

Next, the cured insulating resin layer 3 is polished.
As a polishing device, for example, a belt sander or a buffing machine is used, and the surface is smoothed until the connection terminal pattern 5 is exposed (see FIG. 1C). As a result, the opening 4 appears in the insulating resin layer 3.

Next, the wiring board 1 having a flat surface
On the other hand, the connection terminal pattern 5 is formed by using a solution containing sulfuric acid and hydrogen peroxide as main components or an etching solution such as cupric chloride.
Is soft-etched to a position where the upper surface of the connection terminal pattern 5 is lower than the surrounding insulating resin layer 3, that is, a depressed state. As a result, the connection terminal pattern 5 is exposed below the opening 4 of the insulating resin layer 3.

The soft etching amount is larger than the sum of the thicknesses of the electroless nickel plating layer and the electroless gold plating layer (usually 3 to 8 μm) which is the finishing treatment to be performed thereafter, that is, 10 to 30 μm. Is set to a predetermined depth (see FIG. 1D). This depth has a value of 30 to 60% of the height of the bump which is the electrode of the electronic component, which is preferable also from the viewpoint of enhancing the mounting efficiency.

Next, the edge portion 7 at the edge of the insulating resin layer 3 formed on the surface of the wiring board 1 is rounded by polishing with a polishing device such as buffing. Aluminum oxide or silicon carbide is used as the abrasive, and the size of the abrasive grains is # 400 to # 2500.
The flat portion of the insulating resin layer 3 is not polished as much as possible, and the edge portion 7
Roll only the chisel and make an inclination (see FIG. 2 (E)). As shown in the figure, the inclined shape is a shape in which the upper side of the opening is wide and the lower side of the opening is narrow, that is, an inverted conical shape.

As a result, even if the mounting position of the electronic component is deviated, the edge of the opening of the insulating resin layer immediately above the connection terminal pattern is inclined, so that the electrode is not attached due to the pressure from above the electronic component during mounting. Slide over the insulating resin layer,
The convex electrode is easily positioned by being fitted to the connection terminal pattern formed in the depressed state of the printed wiring board.

Thereafter, a solder resist may be applied to the surface of the wiring board 1 leaving the component mounting portion as needed (see FIG. 4B).

Finally, as a finishing treatment, an electroless nickel plating layer 16 is formed on a pattern which will be a connection electrode when mounting a component, and an electroless gold plating layer 17 is further formed thereon (see FIG. 2 (F)). ).

As a result, the connection resistance with the electrode of the electronic component can be kept low.

<Advantages of this Embodiment> As described above, according to the configuration and manufacturing method of the printed wiring board of this embodiment, the following effects can be obtained.

(1) When mounting the electronic component, when the convex electrode 15 arranged on the electronic component is placed on the connection terminal pattern of the wiring board, a positional deviation occurs as shown in FIGS. 3 (A) and 3 (B). Even if there is, since the edge portion 7 at the edge of the insulating resin layer around the pattern is inclined by polishing, the electrode was formed by sliding down on the resin due to pressure from the top during mounting and recessed from the surroundings. Mount on the connection terminal pattern.

After that, even if pressure is further applied, since the convex electrodes of the electronic component are temporarily fixed on the recessed connection terminal pattern, they do not move laterally and normal connection is maintained. .

(2) Even when the solder resist 18 is formed, as shown in FIG. 4A, in the case of the conventional substrate, the non-attachment 19 of the solder resist 18 and the void 20 occur due to the print gap in the pattern gap. In particular, it will become remarkable as the pattern becomes finer and the gap between the patterns becomes narrower in the future.

In this embodiment, since the substrate is flattened by the insulating resin layer 3 as shown in FIG.
No voids or voids 20 are formed, and it is thin and can be applied uniformly.

(3) When the bare chip is flip-chip mounted on the substrate, the underfill material can be easily injected and voids are not generated.

As shown in FIG. 5, in flip chip mounting, a sealing resin 28 is often injected into the gap between the bare chip 14 and the substrate 1 in order to improve connection reliability. In this implantation step, how to eliminate void entrapment and to perform rapid implantation is a major issue as the pattern pitch becomes narrower.

In the conventional substrate, it was difficult to suppress the generation of the voids 20 as shown in FIG. 5A, but in the present embodiment, the insulating resin layer 3 is used for the substrate as shown in FIG. 5B. Since the surface is flattened, the generation of voids is significantly reduced and the implantation time is greatly shortened.

Incidentally, in the case of the pressure welding method for maintaining the electrical connection between the bare chip and the substrate by utilizing the curing shrinkage of the resin instead of the sealing resin, the resin is in the form of film other than paste, or the resin is conductive particles. The same effect is obtained when using the one containing or not containing.

(4) Since the build-up wiring board, which is generally used as a high-density board or bare chip board, has the wiring pattern and the component mounting pattern formed by the copper plating layer deposited on the insulating resin, Due to the low peel strength and pull strength, detachment of parts from the substrate has become a problem.

In the wiring board 1 according to the present embodiment, the connection terminal pattern 5 is partially exposed, that is, the side edge of the connection terminal pattern 5 is covered with the insulating resin layer 3, so that the peel strength and the pull strength are obtained. Is greatly improved.

As a result, the quality as a printed wiring board can be maintained even when mounting an electronic component having a large number of electrodes, which have been required to have heat resistance as compared with the prior art.

(Second Embodiment) FIGS. 6 and 7 are manufacturing process diagrams of a printed wiring board according to a second embodiment of the present invention.
The conductor pattern is formed by the full additive method.

6 and 7, in the present embodiment, as the wiring board 21, the surface of the wiring board 21 (see FIG. 6A), which is composed of the insulating substrate 22 of the glass epoxy resin laminated plate containing the catalyst and the adhesive layer 23. Then, a plating resist 25 is formed by a photo process.

The plating resist 25 does not peel off even after the pattern formation is completed and is used as a permanent mask (see FIG. 6B).

Next, an electroless copper-plated layer 26 is formed in the opening 24 which will be the non-formed portion of the plating resist 25 (FIG. 6).
(See (C)).

Next, the plating resist 25 is polished. For example, a belt sander or a buffing machine is used as the polishing device, and the polishing is performed until the electroless copper plating layer and the plating resist are at the same height and the upper width of the electroless copper plating layer that is the conductor pattern is flat. (See FIG. 6D).

Next, the wiring board 2 having a flat surface
1 to 1 is soft-etched with a solution containing sulfuric acid and hydrogen peroxide as a main component or an etching solution such as cupric chloride to soft-etch the electroless copper plating layer to be the connection terminal pattern 5 and connected to the surrounding plating resist 25. The upper surface of the terminal pattern 5 is in a low position, that is, in a depressed state. As a result, the opening 24 of the plating resist 25 serves as an insulating resin layer.
The connection terminal pattern 5 is exposed on the lower side.

The soft etching amount is set to be larger than the sum of the thicknesses of the electroless nickel plating layer and the electroless gold plating layer, which is the finishing treatment to be performed thereafter (see FIG. 7E).

Next, the edge portion 27 of the plating resist formed on the surface of the wiring board 10 is rounded by polishing with a polishing device such as buffing. Aluminum oxide or silicon carbide is used as the abrasive, and the size of the abrasive grains is # 400 to # 2500.
The flat portion of the plating resist 25 is not polished as much as possible, and only the edge portion 27 is rounded to form an inverted conical inclination (FIG. 7).
(See (F)).

After that, a solder resist may be applied on the surface of the wiring board, leaving the component mounting portion, if necessary.

Finally, as a finishing treatment, an electroless nickel plating layer 16 is formed on a pattern which will be a connecting electrode when mounting a component, and an electroless gold plating layer 17 is further formed thereon (see FIG. 7G). ).

<Advantages of this Embodiment> In the structure of the printed wiring board in this embodiment, the insulating resin layer 16 in Embodiment 1 is replaced with the plating resist 25 serving as a permanent mask. In addition to obtaining the same effect as above, by adopting a photosensitive resist for the plating resist 25, it is possible to efficiently manufacture a printed wiring board having fine lines and a high-density conductor pattern.

[0078]

As described above, according to the present invention, a printed wiring having a conductor pattern at a position lower than a smooth insulating resin surface formed on a substrate and inclining the insulating resin around the conductor pattern. With the plate, even if misalignment occurs when mounting the component, the electrode of the component slides down on the sloping insulating resin and is placed on the recessed conductor pattern, which is effective in suppressing contact failure. It is possible to realize an excellent printed wiring board.

[Brief description of drawings]

FIG. 1 is a process sectional view showing a method of manufacturing a printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a process cross-sectional view showing the method for manufacturing a printed wiring board according to the first embodiment.

FIG. 3 is a sectional view showing a mounted state of the electronic component according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view for comparing the formation states of the solder resist according to the first embodiment of the present invention.

FIG. 5 is a sectional view for comparing mounting states of electronic components according to the first embodiment of the present invention.

FIG. 6 is a process sectional view showing a method of manufacturing a printed wiring board according to a second embodiment of the present invention.

FIG. 7 is a process sectional view showing the method of manufacturing the printed wiring board in the second embodiment.

FIG. 8 is a process sectional view showing a conventional method for manufacturing a printed wiring board.

FIG. 9 is a process sectional view showing a conventional method for manufacturing a printed wiring board.

FIG. 10 is a process cross-sectional view showing the conventional method for manufacturing a printed wiring board.

FIG. 11 is a sectional view showing a mounting state of electronic components on a conventional printed wiring board.

FIG. 12 is a cross-sectional view showing a mounting state of electronic components on a conventional printed wiring board.

[Explanation of symbols] 1,21 Wiring board 2.22 insulating substrate 3 Insulating resin layer 4, 24 openings 5 connection terminal pattern 7 Edge part 14 bare chips 15 electrodes 16 Electroless nickel plating layer 17 Electroless gold plating layer 18 Solder resist 20 voids 23 Adhesive layer 25 Plating resist 26 Electroless copper plating layer

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[Procedure amendment]

[Submission date] September 18, 2002 (2002.9.1)
8)

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0077

[Correction method] Change

[Correction content]

<Advantages of this Embodiment> In the structure of the printed wiring board in this embodiment, the insulating resin layer 3 in Embodiment 1 is replaced with the plating resist 25 serving as a permanent mask. In addition to obtaining the same effect as above, by adopting a photosensitive resist for the plating resist 25, it is possible to efficiently manufacture a printed wiring board having fine lines and a high-density conductor pattern.

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 6

[Correction method] Change

[Correction content]

[Figure 6]

[Procedure 3]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 7

[Correction method] Change

[Correction content]

[Figure 7]

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 1/02 H05K 1/09 C 1/09 3/22 B 3/22 3/24 D 3/24 3 / 32 C 3/32 H01L 23/12 QF term (reference) 4E351 AA01 BB01 BB23 BB24 BB26 BB33 BB35 CC06 DD04 DD06 DD19 GG13 GG15 5E319 AA03 AB05 AC01 AC18 AC20 BB01 BB04 CC12 CC22 CD04 CD25 GG09 5E338 A16AA02 A03 A16 AA02 BB63 BB75 CC01 CD03 CD33 EE22 EE32 EE51 5E343 AA02 AA12 BB03 BB09 BB17 BB23 BB24 BB44 BB61 BB71 CC61 DD43 DD75 EE33 EE52 ER11 ER49 GG18 GG20 5F044 KK02 KK17 KK19 LL01

Claims (16)

[Claims] 1. A smooth insulating resin layer having a conductor pattern on an insulating substrate and formed on the insulating substrate and the conductor pattern, and an opening formed in the insulating resin layer. A printed wiring board, wherein the connection terminal pattern is exposed on the lower side, and the upper surface of the connection terminal pattern is formed at a position lower than the surface of the insulating resin layer. 2. The printed wiring board according to claim 1, wherein the connection terminal pattern is partially exposed. 3. The printed wiring board according to claim 1, wherein an inclination is provided at an edge of the opening. 4. The printed wiring board according to claim 3, wherein the slope has an inverted conical shape. 5. The printed wiring board according to claim 1, wherein a nickel and gold plating layer is formed on the surface of the conductor pattern for the connection terminal. 6. The print according to claim 1, wherein the insulating substrate is a substrate containing a catalyst, the conductor pattern is formed by electroless copper plating, and the insulating resin layer is used as a plating resist. Wiring board. 7. A step of forming an insulating resin layer on the entire surface of an insulating substrate having a conductor pattern, a step of smoothly polishing the insulating resin layer until the surface of the conductor pattern is exposed, and forming an opening. Of manufacturing the printed wiring board having a step of etching the upper surface of the conductor pattern to a predetermined depth. 8. The method of manufacturing a printed wiring board according to claim 7, further comprising a step of forming a nickel plating layer and a gold plating layer on the surface of the conductor pattern after etching the exposed upper surface of the conductor pattern to a predetermined depth. . 9. The method of manufacturing a printed wiring board according to claim 8, wherein the predetermined depth is larger than the sum of the thicknesses of the nickel plating layer and the gold plating layer. 10. The printed wiring board according to claim 7, further comprising a step of forming a slope on the edge of the opening of the insulating resin layer after etching the exposed upper surface of the conductor pattern to a predetermined depth. Manufacturing method. 11. The step of providing an inclination is buffing, wherein aluminum oxide or silicon carbide is used as an abrasive, and the abrasive grains have a size of # 400 to # 25.
The method for manufacturing a printed wiring board according to claim 10, wherein the method is 00. 12. A step of forming a plating resist on an insulating substrate containing a catalyst, a step of forming a conductive pattern by electroless copper plating on a portion where the plating resist is not formed, and an upper surface of the conductive pattern is exposed and flat. A step of polishing the plating resist and the conductor pattern to a depth of
A method of manufacturing a printed wiring board, comprising a step of etching the exposed upper surface of a conductor pattern to a predetermined depth. 13. The connection terminal pattern of the printed wiring board according to claim 1, the connection electrode of an electronic component having a convex connection electrode is brought into contact with the connection terminal pattern, and the electronic component is pressed to connect to the connection terminal pattern. A method for mounting an electronic component, which comprises electrically connecting electrodes. 14. A step of electrically connecting the connection terminal pattern of the printed wiring board according to claim 1 and the connection electrode of an electronic component having a convex connection electrode, the printed wiring board and the electronic component. An electronic component mounting method including a step of interposing a sealing resin in the gap. 15. A step of disposing a curable resin on or in the vicinity of the connection terminal pattern on the printed wiring board having the connection terminal pattern according to claim 1, and a convex connection electrode on the connection terminal pattern. A method of mounting an electronic component, comprising: a step of bringing the connecting electrode of the electronic component into contact; and a step of curing the curable resin. 16. A method of mounting an electronic component, which comprises electrically connecting a connecting terminal pattern of the printed wiring board according to claim 1 and a connecting electrode of an electronic component by soldering or melting a solder ball.