M307931 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種軟性印刷電路板，尤指一種單層之 軟性印刷電路板，其隸屬於軟性印刷電路板設計之^技 術領域範疇。 “ 【先前技術】 目前軟性印刷電路板（Flexible Printed cireuit; fpc) 大多係藉由純銅或雙層的方式所製成，其中純銅之軟性電 路板（6 0 )係如第五圖所示’其係由一導體（6丄）及 兩覆蓋層（6 2)所組成，在製作時必須將兩覆蓋層（6 2 )之黏著層（6 2 !)分別與導體（6丄）#兩側相結 合後，再與其他電路板相結合以進行電力或訊號的傳輸使 用； 而雙層之軟性電路板（7〇)係如第六圖所示，其係 X基板（7D及兩覆蓋層（72)所組成，該基板（7 ) 首係由-絕緣基材（711)、兩黏著層（712)及 :體从（7 1 3 )所組成，其中絕緣基材（7工工）包覆 里：，者層（7 1 2 )之間，而兩導體（7工3 )分別與 =絕緣基材（7⑴的兩黏著層（712)相結合， ^蓋層（72)係由一黏著層（721)及一絕緣基 料^ 2 )所組成，在製作時係將各覆蓋層（7 2 )的 =(7川分別與基板（71)的兩導體（713) 厂’此種雙層軟性電路板（7〇)雖可藉由不同位置 -己置方法，而使其兩側可供使用，但其所需之技術及成 5 M307931 1 # 本較=且過程較為繁複，進而影響其產量。 然而’不論是純銅或雙層之軟性 料的限制無法作進一 + 取尽口材 V的大破，加上大多係在一點或 焊接斷面上勉強伸用， 6 、 用 口而各易產生應力集中、假性焊接 =的問題產生’進而影響產品之良率，再則其製作過程繁 複’相對會增加製造軟性印刷電路板所需之成本及時間， 對於其產量亦有影響。M307931 VIII. New description: [New technical field] This is a soft printed circuit board, especially a single-layer flexible printed circuit board, which belongs to the technical field of flexible printed circuit board design. [Prior Art] Currently, flexible printed circuit boards (fpc) are mostly made of pure copper or double-layer. The pure copper flexible circuit board (60) is as shown in the fifth figure. It consists of a conductor (6丄) and two cover layers (6 2). The adhesive layer (6 2 !) of the two cover layers (6 2 ) must be formed on both sides of the conductor (6丄)#. After combination, it is combined with other boards for power or signal transmission; and the double-layer flexible board (7〇) is shown in Figure 6, which is an X-substrate (7D and two overlays (72 The substrate (7) is composed of an insulating substrate (711), two adhesive layers (712), and a body (7 1 3 ), wherein the insulating substrate (7 workers) is covered. :, between the layers (7 1 2 ), and the two conductors (7 3) are respectively combined with the = insulating substrate (7 (1) of two adhesive layers (712), ^ the cover layer (72) is composed of an adhesive layer ( 721) and an insulating base material ^ 2 ), in the production process, the cover layer (7 2 ) = (7 Sichuan and the substrate (71) two conductors (713) factory's double-layer soft Although the circuit board (7〇) can be used on both sides by different positions--methods, the required technology and the 5 M307931 1 # this are more complicated, and the process is more complicated, which affects the output. However, 'there is no limit to the soft material of pure copper or double layer. It can't be done with a large break of the V. In addition, most of them are stretched at a point or welded section. 6. It is easy to generate stress with the mouth. The problem of concentrated and false soldering = 'and thus the yield of the product, and then the complicated production process' will increase the cost and time required to manufacture the flexible printed circuit board, and also affect its output.
【新型内容】 因此，本創作人有鑑於上述軟性印刷電路板之缺失盥 問題，特經過不斷的研究與試驗，終於發展出一種能改進 現有缺失之本創作，不僅可快速製作且增加焊接斷面的面 可有效改善應力集中及假性焊接等現象，㉟而提高產 口口良率及降低製造成本，有效提高軟性印刷電路板實用性 之特性者。 、 本創作之主要目的係在於提供一種單層軟性印刷電路 板，其包含一基板，該基板形成有一道以上的線路，且該 2路至少於一端連結至該基板之周緣，該基板對應該線路 °又有至少一凹槽，並該基板相鄰於該凹槽周緣分別設有一 連結部，且該基板朝該線路的一面設有一覆蓋層，且該覆 蓋層相對於该基板之連結部凹設形成有一缺口，以供該線 路之連結部裸露出該覆蓋層。 本創作單層軟性印刷電路板之優點及功效可歸納如 下： 一、避免假性焊接··本創作之單層軟性印刷電路板係 6 M307931 藉由基板伸設出覆蓋層的連結部進行刷焊，可有效避免因 覆蓋層與焊墊間的假性焊接之情形，使基板可穩固地與其 他電路板進行結合。 二、避免應力集中：本創作之單層軟性印刷電路板係 藉由基板連結部之弧槽結構，相對增加刷焊時所需之蟬接 " 斷面面積，不僅可使基板與其他電路板穩固結合，且可藉 由較大之焊接斷面，有效分散因刷焊後所產生之應力集中 之情形。 _ 三、節省成本：本創作之單層軟性印刷電路板僅需將 基板與覆蓋層相結合後即可使用，而不需繁複之製作流 程，可有效降低製程所需之時間與成本。 四、提高品質：本創作之單層軟性印刷電路板可有效 避免假性焊接、應力集中等情形，進而避免與其他電路板 產生分離之現象，可有效提高單層軟性印刷電路板結構之 品質者。 .五、增加產量·本創作之單層軟性印刷電路板之製作 流程簡便，且可避免假性焊接、應力集中等情形，因此相 對可提高生產量。 【實施方式】 本創作係一種單層軟性印刷電路板（1 〇 )，請表看 第一至三圖所示，該單層軟性印刷電路板（1 〇 )係包含 有一基板（20)及一覆蓋層（3〇)。 基板（2 0 )係為一板體，該基板（2 〇 )係由—絕 緣基材（2 0 1 )、一黏著層（2 〇 2 )及一導體（2 〇 7 M307931 f * 3 )所結合組成，該黏著層（2 Ο 2 )位於絕緣基材（2 〇 1 )及導體（2 0 3 )之間，使絕緣基材（2 〇 1 )與 導體、(2 0 3 )相結合，且該導體（2 〇 3 )係凹設有數 個流迢以分隔形成數條用以傳輸電力或資料之線路（2 〇 4 )’如圖面所不為四條，亦可為四條以上或以下，其中 各線路（2 0 4 )係呈對稱狀，且位於内側之各線路（2 0 4 )分別設呈l形，位於兩外側之兩線路（2 〇 4 )分 齡別設呈長條狀，以供各線路（2 〇 4 )之一端分別連結至 該基板（2 0 )之外侧’且基板（2 〇 )相對於各線路（2 〇 4 )連結至外側之一端至少設有一凹槽，該凹槽如圖面 所示設呈一弧槽（2 2 )，且於導體（2 〇 3 )之兩端角 及兩側分別設有該弧槽（2 2 )，而導體（2 〇 3 )相鄰 於各弧槽（2 2 )周緣分別形成有一連結部（2 1 )，使 位於内侧之兩線路（2 〇 4 )分別於該基板（2 〇 )之兩 端角設有該凹槽及該連結部（2 i )，而位於外側之兩線 • 路（2 〇 4 )分別於該基板（2 〇 )之兩側設有該凹槽及 該連結部（2 1 )，並該絕緣基材（2 〇 1 )係可為—聚 亞醯胺（Polymide ; PI)，而導體（2 〇 3 )係可為一鋼料 (Copper ; Cu)。 w亥後盍層（3 0 )結合於該基板（2 0 )朝線路（2 04)的一面，且覆蓋層（3〇)係由一黏著層（3〇ι) 及一絕緣基材（3 0 2 )所組成，該絕緣基材（3 Q 2 ) 係可為一聚亞醯胺（Polymide ; PI)，並黏著層（3 〇 1 ) 與基板（20)之導體（203)相結合，且該覆蓋層 8 M307931 〇 )相對於基板（2 Ο )之各連社邻 击古沾/ 逻、、°邛（2 1 )分別凹設形 缺口（31) ’以供基板（2㈧之各連結部（2 稞露狀，藉以使基板（2 〇)位於連結部（2工） 的各線路（2 0 4 ) -端裸露出覆蓋層（3 〇 )。[New content] Therefore, in view of the lack of the above-mentioned soft printed circuit board, the creator has finally developed a novel that can improve the existing defects through continuous research and experimentation, which not only can quickly produce and increase the welding section. The surface can effectively improve the phenomenon of stress concentration and false soldering, 35, and improve the yield of the mouth and the manufacturing cost, and effectively improve the practicality of the flexible printed circuit board. The main purpose of the present invention is to provide a single-layer flexible printed circuit board comprising a substrate formed with more than one line, and the two paths are connected to the periphery of the substrate at least at one end, the substrate corresponding to the line There is at least one groove, and the substrate is respectively provided with a connecting portion adjacent to the periphery of the groove, and the substrate is provided with a covering layer on one side of the line, and the covering layer is recessed relative to the connecting portion of the substrate A notch is formed for the connection portion of the line to expose the cover layer. The advantages and effects of the single-layer flexible printed circuit board can be summarized as follows: 1. Avoid false soldering. · The single-layer flexible printed circuit board of this creation is 6 M307931. Brushing is performed by connecting the connecting portion of the substrate to the cover layer. It can effectively avoid the false soldering between the cover layer and the solder pad, so that the substrate can be firmly combined with other circuit boards. Second, to avoid stress concentration: The single-layer flexible printed circuit board of the present invention uses the arc groove structure of the substrate joint portion to relatively increase the cross-sectional area required for brushing, which can not only make the substrate and other circuit boards It is firmly combined and can effectively disperse the stress concentration caused by brushing by a larger welded section. _ Third, cost savings: The single-layer flexible printed circuit board of this creation can be used only by combining the substrate and the cover layer, without complicated production process, which can effectively reduce the time and cost required for the process. Fourth, improve the quality: the single-layer flexible printed circuit board of this creation can effectively avoid the situation of false soldering, stress concentration, etc., thereby avoiding the phenomenon of separation from other circuit boards, and can effectively improve the quality of the single-layer flexible printed circuit board structure. . V. Increasing Production· The production of the single-layer flexible printed circuit board of this creation is simple and can avoid false welding and stress concentration, so the production can be increased relatively. [Embodiment] The present invention is a single-layer flexible printed circuit board (1 〇), as shown in the first to third figures, the single-layer flexible printed circuit board (1 〇) includes a substrate (20) and a Cover layer (3〇). The substrate (20) is a plate body, and the substrate (2 〇) is made of an insulating substrate (2 0 1 ), an adhesive layer (2 〇 2 ), and a conductor (2 〇 7 M307931 f * 3 ). The bonding layer (2 Ο 2 ) is located between the insulating substrate (2 〇 1 ) and the conductor (2 0 3 ) to bond the insulating substrate (2 〇 1 ) to the conductor and (2 0 3 ). And the conductor (2 〇 3 ) is recessed with a plurality of flow rafts to form a plurality of lines (2 〇 4 ) for transmitting power or data. The figure is not four, and may be four or more. Each of the lines (204) is symmetrical, and the lines (24) located on the inner side are respectively formed in an l shape, and the two lines (2 〇4) located on the outer sides are not long, One end of each line (2 〇 4 ) is respectively connected to the outer side of the substrate ( 2 0 ) and the substrate (2 〇) is connected to one end of the outer line (2 〇 4 ) at least one groove is provided. The groove is formed as an arc groove (2 2 ) as shown in the figure, and the arc groove (2 2 ) is respectively disposed at the opposite ends and both sides of the conductor (2 〇 3 ), and the conductor (2 〇 3 ) Adjacent to each arc (2 2) a connecting portion (2 1 ) is formed on the periphery, and the two lines (2 〇 4 ) on the inner side are respectively provided with the groove and the connecting portion at the opposite ends of the substrate (2 〇) (2 i And the two lines on the outer side (2 〇 4 ) are respectively provided on the two sides of the substrate (2 〇) and the connecting portion (2 1 ), and the insulating substrate (2 〇 1 ) The system can be - Polyimide (PI), and the conductor (2 〇 3) can be a steel (Copper; Cu). After the WD, the enamel layer (30) is bonded to one side of the substrate (20) toward the line (204), and the cover layer (3〇) is composed of an adhesive layer (3〇ι) and an insulating substrate (3). 0 2 ), the insulating substrate (3 Q 2 ) may be a polymethylene (Polymide; PI), and the adhesive layer (3 〇 1 ) is combined with the conductor (203) of the substrate (20). And the cover layer 8 M307931 〇) is opposite to the substrate (2 Ο ), each of which is adjacent to the smear/logo, and the 邛(2 1 ) is recessed with a notch (31)' for each connection of the substrate (2 (8)) The part (2 稞) is formed so that the substrate (2 〇) is located at each end of the connecting portion (2 )) (2 0 4 ) - the exposed layer (3 裸) is exposed.
2第四圖所示，當本創作之單層軟性印刷電路板q 〇與一主電路板（4〇)相結合時，係可藉由__焊塾（5 〇)=於基板（20)裸露出覆蓋|(3〇)的連結部 (21)進行刷焊’使基板（2〇)與主電路板（4〇) 相結合…於連結部（21)各弧槽（22)之面積較 大’因此可有效增加焊接斷面之面積，使單層軟性印刷電 路板（1 0 )㉟穩固地與主電路板（4 〇 )結合，以避免 產生:段性焊接及應力集中之情形，進而提高產品之良率。 藉由上述技術手段，本創作之單層軟性印刷電路板不 僅製程簡冑，且焊接斷面之面積大，可免除兩電路板間產 生假性焊接、應力集中等現象，可有效降低製程所需之時 間與成本，且可提高產品之良率及產量者。 【圖式簡單說明】 第一圖係本創作單層軟性印刷電路板之立體外觀圖。 第二圖係本創作單層軟性印刷電路板之立體外觀分解 第二圖係本創作單層軟性印刷電路板之側視剖面分解 示意圖。 第四圖係本創作軟性印刷電路板之實施例立體外觀示 意圖。 9 M3 07931 圖 圖 第五圖係現有純銅軟性印刷電路板之側視剖 第六圖係現有雙層軟性印刷電路板之侧視刮 面分解 面分解 主 2 4 5 6 ( ( ( ( ( ( 7 7 7 7 7 7 要元件符號說明】 0 )單層軟性印刷電路板 〇 )基板 〇1)絕緣基材 〇 3 )導體 1 )連結部 〇 )覆蓋層 〇 1 )黏著層 1 )缺口 0)主電路板 0 )焊墊 〇)純鋼軟性電路板 1 } ( 6 2 )覆蓋層 21)黏著層 〇 )雙層軟性電路板 1 )基板 1 1 )絕緣基材 （7 1 2 )黏著層 1 3 )導體 2 )覆蓋層 2 1 )勸著層 （7 2 2 )絕緣基材 (2 0 2 )黏著層 (2 0 4 )線路 (2 2 )弧槽 (3 0 2 )絕緣基材2 In the fourth figure, when the single-layer flexible printed circuit board q 本 of the present invention is combined with a main circuit board (4〇), it can be replaced by a __weld (5 〇)=substrate (20) The bare joint cover|(3〇) joint portion (21) is brushed 'to make the substrate (2〇) combined with the main circuit board (4〇)...the area of each arc groove (22) of the joint portion (21) is The large size can therefore effectively increase the area of the welded section, so that the single-layer flexible printed circuit board (10) 35 is firmly combined with the main circuit board (4 〇) to avoid the occurrence of segmental welding and stress concentration. Improve product yield. By the above technical means, the single-layer flexible printed circuit board of the present invention is not only simple in process, but also has a large welding section area, which can eliminate false soldering and stress concentration between the two circuit boards, and can effectively reduce the process required. Time and cost, and can increase the yield and output of the product. [Simple description of the drawing] The first picture is a three-dimensional appearance of the single-layer flexible printed circuit board. The second figure is a three-dimensional appearance decomposition of the single-layer flexible printed circuit board of the present invention. The second figure is a side view exploded view of the single-layer flexible printed circuit board. The fourth figure is a three-dimensional appearance of an embodiment of the present flexible printed circuit board. 9 M3 07931 Figure 5 is a side view of the existing pure copper flexible printed circuit board. The sixth picture shows the side-view scraping surface of the existing double-layer flexible printed circuit board. 2 4 5 6 ( ( ( ( ( 7 7 7 7 7 Description of the required components] 0) Single-layer flexible printed circuit board 〇) Substrate 〇 1) Insulation substrate 〇 3) Conductor 1) Connection 〇) Cover layer 〇 1) Adhesive layer 1) Notch 0) Main Circuit board 0) Solder pad 〇) Pure steel flexible circuit board 1 } ( 6 2 ) Cover layer 21) Adhesive layer 〇) Double-layer flexible circuit board 1) Substrate 1 1) Insulating substrate (7 1 2 ) Adhesive layer 1 3 ) conductor 2) cover layer 2 1 ) persuade layer (7 2 2 ) insulating substrate (2 0 2 ) adhesive layer (2 0 4 ) line (2 2 ) arc groove (3 0 2 ) insulating substrate