JPWO2016039139A1 - Resin multilayer board - Google Patents

Abstract

The resin multilayer substrate (101) has a first resin layer portion (31) having a first region on the outermost surface, and a first wiring metal foil pattern (51) disposed in the first region, and an outermost surface. A second resin layer portion (32) having a second region, and the first resin layer portion (31) and the second resin layer portion (32) are arranged such that the first region and the second region overlap each other. The first resin layer portion (31) has a first non-wiring metal foil pattern (53) separately from the first wiring metal foil pattern (51) in the first region, The second resin layer portion (32) has a second non-wiring metal foil pattern (54) overlapping the first non-wiring metal foil pattern (53) in the second region, and the first non-wiring metal foil pattern (53). ) And the second non-wiring metal foil pattern (54) are joined by ultrasonic joining.

Description

  The present invention relates to a resin multilayer substrate.

  An example of a multilayer substrate is described in Japanese Patent Application Laid-Open No. 2005-166980 (Patent Document 1). Patent Document 1 describes a configuration in which a ground electrode is formed thicker than surrounding surface electrodes in order to enhance the heat dissipation effect. According to Patent Document 1, by adopting such a configuration, the heat capacity of the ground electrode can be increased, and the heat dissipation effect of the electronic component can be enhanced.

JP 2005-166980 A

  In some cases, a plurality of resin multilayer substrates are joined to form one resin multilayer substrate. In this case, the conductive portion at the junction is usually connected via solder. However, in the case of using solder, there is a possibility that the solder overflows to the periphery and causes a short circuit, so that it is difficult to narrow the gap of the terminal and the high-density wiring at the junction or its periphery.

  Therefore, the present invention can avoid a short circuit due to solder when joining the resin multilayer substrates, and can reduce the gap between terminals at the joint portion between the resin multilayer substrates and the periphery thereof, and enables high-density wiring. An object is to provide a substrate.

  In order to achieve the above object, a resin multilayer substrate according to the present invention is formed by laminating one resin layer or a plurality of resin layers of a first group, and has a first region on the outermost surface, The first resin layer portion in which the first wiring metal foil pattern is disposed in the region and one resin layer or a plurality of resin layers of the second group are laminated, and the second region is provided on the outermost surface. A second resin layer portion, wherein the first resin layer portion and the second resin layer portion are arranged such that the first region and the second region overlap with each other, and the first resin layer portion Has a first non-wiring metal foil pattern separately from the first wiring metal foil pattern in the first region, and the second resin layer portion has the first non-wiring metal foil in the second region. A second non-wiring metal foil pattern overlapping the pattern, and the first non-wiring metal foil pattern Serial and the second non-wiring metal foil pattern is bonded by ultrasonic bonding.

  According to the present invention, since the first non-wiring metal foil pattern and the second non-wiring metal foil pattern are joined by ultrasonic bonding, the first region of the first resin layer portion and the second resin layer portion of the second non-wiring metal foil pattern are joined. The junction with the two regions is reinforced. Further, since there is no need to use solder, there is no risk of short circuit due to solder. Therefore, it is possible to narrow the gap between terminals and the high density wiring at the joint portion between the resin multilayer substrates and the periphery thereof.

It is sectional drawing of the resin multilayer substrate in Embodiment 1 based on this invention. It is a top view of the state which took out only the 1st resin layer part contained in the resin multilayer substrate in Embodiment 1 based on this invention. It is a bottom view of the state which took out only the 2nd resin layer part contained in the resin multilayer substrate in Embodiment 1 based on this invention. It is a top view of the state which took out only the 1st resin layer part contained in the modification of the resin multilayer substrate in Embodiment 1 based on this invention. It is sectional drawing of the resin multilayer substrate in Embodiment 2 based on this invention. It is a top view of the state which took out only the 1st resin layer part contained in the resin multilayer substrate in Embodiment 2 based on this invention. It is a bottom view of the state where only the 2nd resin layer part contained in the resin multilayer substrate in Embodiment 2 based on the present invention was taken out. It is a top view of the state which took out only the 1st resin layer part contained in the modification of the resin multilayer substrate in Embodiment 2 based on this invention. It is a perspective view of the resin multilayer substrate in Embodiment 3 based on this invention. It is a top view of the resin multilayer substrate in Embodiment 3 based on this invention. It is a top view of the state which took out only the 1st resin layer part contained in the resin multilayer substrate in Embodiment 3 based on this invention. It is arrow sectional drawing regarding the XII-XII line | wire in FIG. It is arrow sectional drawing regarding the XIII-XIII line | wire in FIG. It is a top view of the resin multilayer substrate in Embodiment 4 based on this invention. It is arrow sectional drawing regarding the XV-XV line | wire in FIG. It is arrow sectional drawing regarding the XVI-XVI line | wire in FIG. It is the elements on larger scale which looked at the row | line | column of the interlayer connection conductor from the bottom in FIG. It is a perspective view of the resin multilayer substrate in Embodiment 5 based on this invention. It is a top view of the state which took out only the 1st resin layer part contained in the resin multilayer substrate in Embodiment 5 based on this invention. It is arrow sectional drawing regarding the XX-XX line in FIG. It is sectional drawing of the resin multilayer substrate in Embodiment 6 based on this invention. It is a top view of the state which took out only the 1st resin layer part contained in the resin multilayer substrate in Embodiment 7 based on this invention. It is a fragmentary sectional view of a general resin sheet with copper foil. It is a fragmentary sectional view in the state where copper foil of a resin sheet with copper foil was patterned. It is explanatory drawing of the example which matched the shiny surfaces when laminating | stacking a resin layer. It is 1st explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. It is 2nd explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. It is 3rd explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. It is 4th explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. It is 5th explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. It is 6th explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. It is a 7th explanatory view of the manufacturing method of the resin multilayer substrate based on the present invention. It is the 8th explanatory view of the manufacturing method of the resin multilayer substrate based on the present invention. It is a 9th explanatory view of the manufacturing method of the resin multilayer substrate based on the present invention. It is a 10th explanatory view of the manufacturing method of the resin multilayer substrate based on the present invention.

(Embodiment 1)
With reference to FIGS. 1-3, the resin multilayer substrate in Embodiment 1 based on this invention is demonstrated. A cross-sectional view of the resin multilayer substrate 101 in the present embodiment is shown in FIG. The resin multilayer substrate 101 is obtained by bonding the first resin layer portion 31 and the second resin layer portion 32. FIG. 2 is a plan view showing a state in which only the first resin layer portion 31 is taken out. Furthermore, FIG. 3 shows a bottom view of the state where only the second resin layer portion 32 is taken out.

  The resin multilayer substrate is a first resin in which a plurality of resin layers 2 of the first group are laminated, the first region 41 is provided on the outermost surface, and the first wiring metal foil pattern 51 is disposed in the first region 41. A layer part 31 and a second resin layer part 32 having a second region 42 on the outermost surface are provided. The 1st resin layer part 31 and the 2nd resin layer part 32 are arrange | positioned so that the 1st area | region 41 and the 2nd area | region 42 may overlap. The first resin layer portion 31 has a first non-wiring metal foil pattern 53 in the first region 41 separately from the first wiring metal foil pattern 51. The second resin layer portion 32 has a second non-wiring metal foil pattern 54 that overlaps the first non-wiring metal foil pattern 53 in the second region 42. The first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are bonded by ultrasonic bonding.

  As shown in FIG. 1, the 1st resin layer part 31 and the 2nd resin layer part 32 may be provided with the interlayer connection conductor 6 and / or the conductor pattern 7, respectively inside. Here, although the 1st resin layer part 31 shall have laminated | stacked the some resin layer 2, the 1st resin layer part 31 may be based on the one resin layer 2 which is not a laminated body. The same applies to the second resin layer portion 32. In short, the 1st resin layer part should just contain one or more resin layers. The same applies to the second resin layer portion 32.

  As shown in FIG. 2, in the first region 41, the first non-wiring metal foil pattern 53 is disposed so as to completely surround the first wiring metal foil pattern 51. As shown in FIG. 3, also in the second region 42, the second non-wiring metal foil pattern 54 is disposed so as to completely surround the second wiring metal foil pattern 52. 2 and 3, the first region 41 and the second region 42 are indicated by thin solid lines, but these regions are conceptual. The thin solid lines defined as the first area 41 and the second area 42 indicate areas. A boundary line corresponding to the thin solid line is not always drawn on the surface of the resin layer portion.

A method for manufacturing the resin multilayer substrate as described in this embodiment will be described later.
In the present embodiment, since the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are bonded by ultrasonic bonding, the bonding between the first region 41 and the second region 42 is reinforced. The In particular, since the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are bonded by ultrasonic bonding rather than bonding using solder or the like, there is no possibility of short circuit due to solder. It is possible to avoid a short circuit due to solder when the resin multilayer substrates are joined together, and it is possible to narrow the gap between terminals at the joint portion between the resin multilayer substrates and the periphery thereof and to perform high-density wiring.

  As shown in the present embodiment, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are arranged so as to surround the first wiring metal foil pattern 51 in plan view. It is preferable. If it is the structure surrounded in this way, the penetration | invasion of the water | moisture content from the exterior to the 1st wiring metal foil pattern 51 is between the 1st non-wiring metal foil pattern 53 and the 2nd non-wiring metal foil pattern 54. It is because it can interrupt | block by joining.

  As shown in the present embodiment, the second resin layer portion 32 has a second wiring metal foil pattern 52 arranged separately from the second non-wiring metal foil pattern 54 in the second region 42. The first wiring metal foil pattern 51 and the second wiring metal foil pattern 52 are preferably electrically connected by being in contact with each other. By adopting this configuration, it is possible to increase the bonding strength between the resin layer portions by ultrasonic bonding of the non-wiring metal foil patterns without fear of a short circuit due to solder while ensuring electrical connection between the resin layer portions. be able to.

  At this time, it is preferable that the 1st wiring metal foil pattern 51 and the 2nd wiring metal foil pattern 52 are not only contact | abutted but ultrasonically joined mutually. When the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are ultrasonically bonded, the first wiring metal foil pattern 51 and the second wiring metal foil pattern 52 are also ultrasonically bonded simultaneously. May be. When the resin layer has flexibility such as a thermoplastic resin, it is difficult to perform stable ultrasonic bonding as compared with the case where substrates having low flexibility are bonded to each other. Strong bonding is achieved by ultrasonic bonding between the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 in addition to between the metal foil pattern 51 and the second wiring metal foil pattern 52. Is easier to do.

  In the present embodiment, the first resin layer portion 31 and the second resin layer portion 32 are described as having substantially the same size and the same shape in plan view, but this is for convenience of description. It is a simplification. Both sizes and external shapes may be different when viewed in plan.

  In the example shown in FIG. 2, the first non-wiring metal foil pattern 53 is disposed so as to completely surround the first wiring metal foil pattern 51 in the first region 41. 4 may be used. That is, in the first region 41, the first non-wiring metal foil pattern 53 may intermittently surround the first wiring metal foil pattern 51. Not only the structure surrounding intermittently but the structure surrounding partially may be sufficient.

  By arranging the metal foil pattern to be a wiring so as to surround even if the non-wiring metal foil pattern is partially, an effect of protecting the non-wiring metal foil pattern as a shield is expected. In the portion where the first non-wiring metal foil pattern and the second non-wiring metal foil pattern are overlapped, the thickness of the metal foil pattern is almost the same, so that the shield resistance is lowered and the shielding performance is improved.

(Embodiment 2)
With reference to FIG. 5 to FIG. 7, a resin multilayer substrate in accordance with the second embodiment of the present invention will be described. FIG. 5 shows a cross-sectional view of the resin multilayer substrate 102 in the present embodiment. The resin multilayer substrate 102 is obtained by joining the first resin layer portion 31 and the second resin layer portion 32. FIG. 6 shows a plan view of the state in which only the first resin layer portion 31 is taken out. Furthermore, FIG. 7 shows a bottom view of the state where only the second resin layer portion 32 is taken out.

  In the first region 41, the first non-wiring metal foil pattern 53 is composed of two parts, and these two parts are arranged so as to face each other with the first wiring metal foil pattern 51 interposed therebetween. In other words, the first non-wiring metal foil pattern 53 is arranged so as to sandwich the first wiring metal foil pattern 51 from two directions. The same applies to the second region 42. That is, the second non-wiring metal foil pattern 54 is composed of two parts, and is disposed so as to face each other with the second wiring metal foil pattern 52 interposed therebetween.

  As shown in FIG. 6, the first non-wiring metal foil pattern 53 is longer than the first wiring metal foil pattern 51. As shown in FIG. 7, the second non-wiring metal foil pattern 54 also has a longer line shape than the second wiring metal foil pattern 52.

  The first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are disposed so as to separate the first wiring metal foil pattern 51 from the nearest substrate end in plan view.

  In the present embodiment, the non-wiring metal foil pattern does not surround the wiring metal foil pattern in a plan view. However, even in such an arrangement, the bonding is reinforced and moisture intrusion is prevented. A certain effect can be obtained. In the present embodiment, the area of the non-wiring metal foil pattern can be kept small.

  As shown in FIG. 8, the non-wiring metal foil pattern may not be linear when viewed in plan. Even with such a configuration, a certain effect can be obtained. However, as shown in FIGS. 2, 4, and 6, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are preferably linear in plan view. This is because if the non-wiring metal foil pattern is linear, it is possible to efficiently prevent moisture from entering.

(Embodiment 3)
With reference to FIGS. 9-13, the resin multilayer substrate in Embodiment 3 based on this invention is demonstrated. The appearance of the resin multilayer substrate 103 in this embodiment is shown in FIG. A plan view of the resin multilayer substrate 103 is shown in FIG. The resin multilayer substrate 103 has a built-in transmission line. As shown in FIG. 9, the resin multilayer substrate 103 includes a plurality of resin layers 2 stacked. The resin multilayer substrate 103 has a shape in which the first resin layer portion 31 and the second resin layer portion 32 are bonded together. In the example shown in FIG. 9, a total of four resin layers 2 are laminated, of which the lower two layers are the first resin layer portions 31 and the upper two layers are the second resin layer portions 32. It has become. FIG. 11 shows a plan view of the state in which the second resin layer portion 32 has been removed from the resin multilayer substrate 103.

  FIG. 12 is a cross-sectional view taken along the line XII-XII in FIG. FIG. 13 shows a cross-sectional view taken along the line XIII-XIII in FIG. The first resin layer portion 31 is formed by laminating a plurality of resin layers 2 of the first group, has a first region on the outermost surface, and a first wiring metal foil pattern 51 is disposed in the first region. It is what. The first region here is the entire upper surface of the first resin portion 31. The first wiring metal foil pattern 51 is a linear conductor pattern serving as a transmission line. In the example shown in FIG. 11, three first wiring metal foil patterns 51 are arranged in parallel. On the other hand, the second resin portion 32 is formed by laminating a plurality of resin layers 2 of the second group, and has a second region on the outermost surface. The second region is the entire lower surface of the second resin portion 32.

  The 1st resin layer part 31 and the 2nd resin layer part 32 are arrange | positioned so that a 1st area | region and a 2nd area | region may overlap. That is, the entire upper surface of the first resin layer portion 31 and the entire lower surface of the second resin layer portion 32 overlap each other. The first resin layer portion 31 has a first non-wiring metal foil pattern 53 in addition to the first wiring metal foil pattern 51 in the first region, that is, the upper surface.

  The second resin layer portion 32 has a second non-wiring metal foil pattern 54 that overlaps the first non-wiring metal foil pattern 53 in the second region, that is, the lower surface. As shown in FIG. 12, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are bonded by ultrasonic bonding.

  In the present embodiment, since the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are joined by ultrasonic bonding, the first resin layer portion 31 and the second resin layer portion 32 are The joint between them is reinforced. With this configuration, even when twisting or twisting is applied to the resin multilayer substrate including the transmission line, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are joined by ultrasonic bonding. Therefore, the probability of occurrence of peeling can be reduced.

  In the present embodiment, preferably, the two first non-wiring metal foil patterns 53 are arranged in parallel so as to be sandwiched from the outside where the plurality of first wiring metal foil patterns 51 are arranged in parallel. . The two second non-wiring metal foil patterns 54 on the second resin layer portion 32 side are ultrasonically bonded to the two first non-wiring metal foil patterns 53. With such an arrangement, the entry of moisture from the outside into the first wiring metal foil pattern 51 serving as a transmission line is protected from both sides.

  The number of the 1st wiring metal foil patterns 51 mentioned here is an example to the last, and the number other than 3 may be sufficient.

(Embodiment 4)
With reference to FIGS. 14-17, the resin multilayer substrate in Embodiment 4 based on this invention is demonstrated. A plan view of the resin multilayer substrate 104 is shown in FIG. FIG. 15 is a cross-sectional view taken along the line XV-XV in FIG. FIG. 16 shows a cross-sectional view taken along the line XVI-XVI in FIG.

  In the present embodiment, as shown in FIG. 15, the first resin layer portion 31 includes an interlayer connection conductor 6 a that is connected to the first non-wiring metal foil pattern 53 from the inside. FIG. 17 is a partially enlarged view of the row of interlayer connection conductors 6a in FIG. 16 viewed from below. Each of the interlayer connection conductors 6a is a conductor that penetrates through the resin layer 2 in the thickness direction. On the resin multilayer substrate 104, as shown in FIGS. 16 and 17, a large number of interlayer connection conductors 6a are arranged. It is provided as follows. A structure like a conductor wall is formed by a large number of interlayer connection conductors 6a.

  In the present embodiment, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are joined at least with respect to the first non-wiring metal foil pattern 53 at a location where they are joined by ultrasonic bonding. Since the interlayer connection conductor 6a is arranged so as to be connected from the inside of the resin layer portion 31, the bonding strength is increased, and even when twisting or twisting is applied to the transmission line, delamination does not easily occur. Further, since the interlayer connection conductor 6a is arranged in a wall shape, an effect of preventing moisture from entering from the outside can be expected.

  Not only the structure in which the interlayer connection conductors 6a are arranged side by side like a completely continuous wall, but even in a structure in which the interlayer connection conductors 6a are arranged intermittently or in the form of dots, a certain degree of reinforcement effect can be obtained. .

  More preferably, in the present embodiment, the second resin layer portion 32 includes an interlayer connection conductor 6 b that is connected to the second non-wiring metal foil pattern 54 from the inside. By adopting this configuration, the second resin layer portion 32 can be reinforced. If the interlayer connection conductor 6a is disposed in the first resin layer portion 31 and the interlayer connection conductor 6b is disposed in the second resin layer portion 32, the interlayer connection conductor 6b can be reinforced from above and below, and delamination Intrusion of water and moisture can be prevented more reliably.

  Moreover, if the member by the conductor with such a large dimension of the thickness direction is arrange | positioned by the side of a transmission line, a shield effect can be anticipated more largely.

(Embodiment 5)
With reference to FIGS. 18-20, the resin multilayer substrate in Embodiment 5 based on this invention is demonstrated. An appearance of the resin multilayer substrate 105 in the present embodiment is shown in FIG. The resin multilayer substrate 105 has a plurality of conductive patterns extending in two dimensions. As shown in FIG. 18, the resin multilayer substrate 105 includes a plurality of resin layers 2 stacked. The resin multilayer substrate 105 has a shape in which the first resin layer portion 31 and the second resin layer portion 32 are bonded together. FIG. 19 shows a plan view of the resin multilayer substrate 105 with the second resin layer portion 32 removed. That is, FIG. 19 is also a top view of the first resin layer portion 31. FIG. 20 shows a cross-sectional view taken along the line XX-XX in FIG.

  The first region here is the entire upper surface of the first resin layer portion 31. The second region is the entire lower surface of the second resin portion 32. The 1st resin layer part 31 and the 2nd resin layer part 32 are arrange | positioned so that a 1st area | region and a 2nd area | region may overlap. The first resin layer portion 31 has a first non-wiring metal foil pattern 53 in addition to the first wiring metal foil pattern 51 in the first region, that is, the upper surface. As shown in FIG. 19, the first non-wiring metal foil pattern 53 is provided so as to surround the outer edge portion of the upper surface of the first resin layer portion 31. The first wiring metal foil pattern 51 is disposed inside the region surrounded by the first non-wiring metal foil pattern 53 on the upper surface of the first resin layer portion 31. The second resin layer portion 32 has a second non-wiring metal foil pattern 54 that overlaps the first non-wiring metal foil pattern 53 in the second region, that is, the lower surface.

  In the present embodiment, the first non-wiring metal foil pattern 53 surrounds the first wiring metal foil pattern 51 arranged so as to have a two-dimensional extension. Since the second non-wiring metal foil pattern 54 is ultrasonically bonded from the second resin layer portion 32 side, moisture intrusion and delamination progress to the region where the first wiring metal foil pattern 51 is arranged efficiently. Can be prevented.

(Embodiment 6)
With reference to FIG. 21, a resin multilayer substrate according to the sixth embodiment of the present invention will be described.

  The basic configuration of the resin multilayer substrate 106 in the present embodiment is the same as that of the resin multilayer substrate 105 described in the fifth embodiment. However, as shown in FIG. 21, the resin multilayer substrate in the present embodiment includes an interlayer connection conductor 6 a in which the first resin layer portion 31 is connected to the first non-wiring metal foil pattern 53 from the inside. Further, the second resin layer portion 32 may include an interlayer connection conductor 6 b that is connected to the second non-wiring metal foil pattern 54 from the inside. If the interlayer connection conductor 6a and / or the interlayer connection conductor 6b are provided as described above, the bonding strength between the first resin layer portion 31 and the second resin layer portion 32 is increased, and the shielding effect is enhanced.

(Embodiment 7)
In the fifth and sixth embodiments, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 completely and continuously surround the outer edge portion of the upper surface of the first resin layer portion 31. However, it does not have to be a completely continuous ring.

  With reference to FIG. 22, a resin multilayer substrate according to the seventh embodiment of the present invention will be described. The basic configuration of the resin multilayer substrate in the present embodiment is the same as that described in the fifth embodiment. However, the resin multilayer substrate in the present embodiment is partially arranged along the outer edge as shown in FIG. FIG. 22 is a view corresponding to FIG. 19 and is a plan view showing a state in which the second resin layer portion 32 is removed while leaving the first resin layer portion 31 in the resin multilayer substrate. By adopting this configuration, the effects of the present invention can be obtained to some extent while increasing the degree of freedom of wiring.

  In particular, a non-wiring metal foil pattern may be selectively provided at a location where the wiring is close to the end face of the substrate. The non-wiring metal foil pattern is preferably arranged so as to block the end face and the wiring. This is because the place where the wiring is close to the end face has a high importance of protecting the wiring because there is a concern about the peeling progress from the outside and moisture intrusion.

  In the example shown in FIG. 22, the first non-wiring metal foil pattern 53 is selectively arranged at a location where the first wiring metal foil pattern 51 is close to the end face of the substrate. That is, the first non-wiring metal foil pattern 53 is arranged along the outer edge of the substrate in the left half and the lower right part of FIG.

(Matte surface and shiny surface)
Generally, when producing a resin multilayer substrate, a copper foil is employed as a metal foil, and a resin sheet 12 with a copper foil is used. FIG. 23 shows an enlarged cross-sectional view of a part of the resin sheet 12 with copper foil. After performing necessary patterning on the copper foil of the resin sheet 12 with copper foil, a desired resin multilayer substrate is produced by forming a laminate using the resin sheet as a resin layer. In FIG. 23, the copper foil 17 is attached to one surface of the resin layer 2. The copper foil 17 attached to the resin sheet 12 with copper foil has a mat surface 28 and a shiny surface 29. The mat surface 28 and the shiny surface 29 are in a front-back relationship. Of the copper foil, the surface exposed from the time of the resin sheet 12 with the copper foil is a shiny surface 29 having a small surface roughness and gloss, and conversely, the surface bonded to the resin sheet 12 is the surface rough. The mat surface 28 is large. FIG. 24 shows an example of a state in which the copper foil 17 of the resin sheet with copper foil 12 is patterned to form a conductor pattern 7. Since the shiny surface 29 originally has a small surface roughness, the bonding strength is low even when it is bonded to another resin sheet. Therefore, when a plurality of resin multilayer substrates are joined to each other, if there is a place where the shiny surface 29 of the conductor pattern 7 and the resin layer are joined, there is a risk of delamination or moisture intrusion. Some countermeasures were necessary for this.

  In consideration of this problem, the following can be said as the resin multilayer substrate described in the above embodiments. As the resin multilayer substrate, each of the first non-wiring metal foil pattern and the second non-wiring metal foil pattern includes a mat surface having a first surface roughness and bonded to a resin layer, A first surface layer having a second surface roughness smaller than the first surface roughness and having a shiny surface that faces away from the mat surface, and the first resin layer portion and the second resin layer portion, Are preferably joined so that the shiny surface of the first non-wiring metal foil pattern and the shiny surface of the second non-wiring metal foil pattern are in contact with each other. With this configuration, good ultrasonic bonding can be achieved between the shiny surfaces. In addition, since the number of points where the shiny surface and the resin layer are joined can be reduced, it is possible to reduce the factors that cause the delamination and moisture intrusion.

  In each of the first resin layer portion and the second resin layer portion, the shiny surface exposed on the surface where the first resin layer portion and the second resin layer portion are in contact with each other is all opposed to the opposite shiny surface. Are preferably in contact with each other. In this case, when the resin sheets 12 are laminated, the shiny surface 29 and the resin layer do not come into contact with each other, and the shiny surfaces 29 are always brought together as shown in FIG. By adopting this configuration, the shiny surface 29 is always in contact with the shiny surface 29, and the location where the shiny surface and the resin layer are joined can be eliminated. It is possible to prevent delamination and moisture intrusion that have occurred due to the joint.

  As can be said in any of the embodiments described so far, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are preferably formed of copper foil. If it is this structure, the resin sheet with a copper foil used as a material can be procured easily, and a process is also easy.

(Production method)
In any of the embodiments described so far, the resin layer portion included in the resin multilayer substrate can be manufactured as follows. Here, the resin sheet 12 with copper foil is used as an example of the resin sheet with conductor foil.

  First, a resin sheet 12 with a copper foil as shown in FIG. 26 is prepared. The resin sheet 12 with copper foil is a sheet having a structure in which the copper foil 17 is attached to one surface of the resin layer 2. The resin layer 2 is made of, for example, a thermoplastic resin. The thermoplastic resin is, for example, LCP (liquid crystal polymer). Examples of the thermoplastic resin used as the material of the resin layer 2 include PEEK (polyether ether ketone), PEI (polyether imide), PPS (poniphenylene sulfide), and thermoplastic PI (polyimide) in addition to LCP. May be. The copper foil 17 is a 18 μm thick foil made of Cu. Here, the copper foil 17 is used as an example of the conductive foil, but the conductive foil other than the copper foil may be Ag, Al, SUS, Ni, Au, and the conductive foil may be Cu, Ag, Al, SUS. It may be an alloy of two or more different metals selected from Ni, Au. Here, the copper foil 17 has a thickness of 18 μm, but the thickness of the copper foil 17 may be about 3 μm or more and 40 μm or less. The copper foil 17 should just be the thickness which can form a circuit.

  As shown in FIG. 27, via holes 11 are formed in the resin layer 2 by a method such as irradiating laser light from the side opposite to the copper foil 17. The laser beam may be, for example, a carbon dioxide laser beam. The via hole 11 is for forming a via conductor later. The via hole 11 penetrates the resin layer 2 but does not penetrate the copper foil 17.

  As shown in FIG. 28, a resist pattern 13 is formed on the surface on which the copper foil 17 is present. The resist pattern 13 can be formed, for example, by printing. As shown in FIG. 29, the copper foil 17 is etched using the resist pattern 13 as a mask to form the conductor pattern 7. The etching of the copper foil 17 can be performed with an acid. After the etching of the copper foil 17 is completed, the resist pattern 13 is peeled off with an alkaline solution, and then neutralization is performed. In this way, the structure shown in FIG. 30 is obtained. Here, the conductor pattern 7 is formed after the via hole 11 is formed first, but the via hole 11 may be formed after the conductor pattern 7 is formed first. The via hole 11 is filled with a conductive paste to form an interlayer connection conductor 6 as shown in FIG.

  As shown in FIG. 32, another resin layer 2 is overlaid on the resin layer 2 from above. As a result, it becomes as shown in FIG. By laminating a required number of resin layers 2 having a desired conductor pattern, a laminate is obtained as shown in FIG. In the example shown in FIG. 34, all four layers are stacked, but the number of layers may be other numbers. When stacking, temporary pressing may be performed every time one layer is stacked. In the example shown in FIG. 34, the directions of the resin layer 2 are different between the first and second layers from the bottom and the third to fourth layers from the bottom. As a result, the widened surfaces of the interlayer connection conductor 6 are in contact with each other at the interface between the second layer and the third layer from the bottom. This is merely an example, and is not limited to such an overlapping method. The laminate may include a portion where the front and back directions of the resin layer 2 are switched in this way. The laminated body may have a configuration in which all the resin layers 2 are laminated in the same direction.

  After the necessary number of layers are laminated, the whole laminate is pressed while being heated at a temperature not exceeding the glass transition temperature of the resin layer 2 (for example, 250 ° C. or more and 300 ° C. or less). By this operation, the resin layers 2 are pressed together to integrate the entire laminate. In this way, the first resin layer portion 31 can be obtained as shown in FIG. In the example shown in FIG. 34, the conductor pattern 7 exposed on the lowermost surface is the external electrode 18. A first wiring metal foil pattern 51 and a first non-wiring metal foil pattern 53 are formed as one form of the conductor pattern 7 on the upper surface of the uppermost resin layer 2. The first resin layer portion 31 obtained in this way is combined with the separately prepared second resin layer portion 32 and installed in an ultrasonic bonding apparatus as shown in FIG. In FIG. 35, ultrasonic bonding is performed between the first resin layer portion 31 and the second resin layer portion 32 in a partially overlapped state. Concavities and convexities are formed on the upper surface of the base 61 to increase the frictional force and hold the object. Concavities and convexities are formed on the lower surface of the tool 62 to increase the frictional force and hold the object. In a state where the first resin layer portion 31 and the second resin layer portion 32 are partially overlapped, pressure is applied as indicated by an arrow 91 and relatively ultrasonic vibration is applied as indicated by an arrow 92. By doing so, ultrasonic bonding is performed between the first non-wiring metal foil pattern and the second non-wiring metal foil pattern. In this way, a desired resin multilayer substrate is obtained. In the example shown here, the resin multilayer substrate 101 as shown in FIG. 1 can be obtained.

  Note that the ultrasonic bonding between the first non-wiring metal foil pattern and the second non-wiring metal foil pattern can be performed, for example, under the following conditions.

Load: 100-200N
Horn amplitude: 30 to 35 μmp-p
Bonding time: 0.15 to 0.3 seconds Substrate heating: None (room temperature)
The same concept can be applied to the resin multilayer substrates described in other embodiments. That is, a plurality of necessary resin layer portions are first prepared separately by stacking and integrating resin layers, and a resin multilayer substrate is completed by combining these resin layer portions and performing ultrasonic bonding. be able to. When the wiring metal foil patterns are in contact with each other in addition to the non-wiring metal foil patterns between the first resin layer portion 31 and the second resin layer portion 32, the non-wiring metal foil patterns are in contact with each other. In the ultrasonic bonding, ultrasonic bonding of the wiring metal foil patterns may be performed at the same time.

  In FIG. 35, two resin layer portions are partially overlapped. However, when trying to obtain the resin multilayer substrate 103 shown in FIG. 9 or the resin multilayer substrate 105 shown in FIG. Is required to bond the entire surfaces of the two resin layer portions together. In this case, pressure and ultrasonic vibration may be applied collectively using the base 61 and the tool 62 having an area that covers the entire surface. Even when the entire surfaces of two resin layer portions are bonded together, ultrasonic bonding is performed for each portion while repeatedly moving relative to the resin layer portion using the base 61 and the tool 62 having a limited area. You may stick together the whole surface. However, since the phenomenon of ultrasonic bonding actually occurs inside the resin layer part is a place where the metals are in contact with each other, selectively aiming at the part where the non-wiring metal foil pattern to be bonded is located Pressure and ultrasonic vibration may be applied.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  2 Resin layer, 6, 6a, 6b Interlayer connection conductor, 7 Conductor pattern, 11 Via hole, 12 Resin sheet with copper foil, 13 Resist pattern, 17 Copper foil, 18 External electrode, 28 Matt surface, 29 Shiny surface, 31 1 resin layer portion, 32 second resin layer portion, 41 first region, 42 second region, 51 first wiring metal foil pattern, 52 second wiring metal foil pattern, 53 first non-wiring metal foil pattern, 54 second Non-wiring metal foil pattern, 61 base, 62 tools, 91, 92 arrows, 101, 102, 103, 104, 105, 106 Resin multilayer substrate.

Claims (10)

A first resin layer or a plurality of resin layers of a first group is laminated, has a first region on the outermost surface, and a first wiring metal foil pattern is disposed in the first region. A resin layer,
One resin layer or a plurality of resin layers of the second group are laminated, and includes a second resin layer portion having a second region on the outermost surface,
The first resin layer portion and the second resin layer portion are arranged such that the first region and the second region overlap,
The first resin layer portion has a first non-wiring metal foil pattern separately from the first wiring metal foil pattern in the first region,
The second resin layer portion has a second non-wiring metal foil pattern overlapping the first non-wiring metal foil pattern in the second region,
A resin multilayer substrate in which the first non-wiring metal foil pattern and the second non-wiring metal foil pattern are bonded by ultrasonic bonding.   The first non-wiring metal foil pattern and the second non-wiring metal foil pattern are disposed so as to separate the first wiring metal foil pattern from the nearest substrate end in a plan view. The resin multilayer substrate described.   3. The resin multilayer substrate according to claim 2, wherein the first non-wiring metal foil pattern and the second non-wiring metal foil pattern are linear when viewed in a plan view.   The first non-wiring metal foil pattern and the second non-wiring metal foil pattern are arranged so as to surround the first wiring metal foil pattern in a plan view. The resin multilayer substrate described.   The second resin layer portion has a second wiring metal foil pattern arranged separately from the second non-wiring metal foil pattern in the second region, and the first wiring metal foil pattern and the second wiring The resin multilayer substrate according to any one of claims 1 to 4, which is electrically connected to the metal foil pattern by being in contact with each other.   The resin multilayer substrate according to claim 5, wherein the first wiring metal foil pattern and the second wiring metal foil pattern are ultrasonically bonded to each other.   The said 1st resin layer part is a resin multilayer substrate in any one of Claim 1 to 6 provided with the interlayer connection conductor connected from the inside with respect to a said 1st non-wiring metal foil pattern.   The resin multilayer substrate according to any one of claims 1 to 7, wherein the second resin layer portion includes an interlayer connection conductor that is connected to the second non-wiring metal foil pattern from the inside.   Each of the first non-wiring metal foil pattern and the second non-wiring metal foil pattern has a mat surface that has a first surface roughness and is bonded to the resin layer, and is smaller than the first surface roughness. A first surface layer having a second surface roughness and a shiny surface facing away from the mat surface, wherein the first resin layer portion and the second resin layer portion are the first The resin multilayer substrate according to any one of claims 1 to 8, wherein the shiny surface of the wiring metal foil pattern and the shiny surface of the second non-wiring metal foil pattern are joined so as to contact each other.   In each of the first resin layer portion and the second resin layer portion, the shiny surface exposed on the surface where the first resin layer portion and the second resin layer portion are in contact with each other is all opposed to the opposite shiny surface. The resin multilayer substrate according to claim 9, which is in contact with each other.

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