WO2016039139A1 - Resin multilayer substrate - Google Patents

Resin multilayer substrate Download PDF

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Publication number
WO2016039139A1
WO2016039139A1 PCT/JP2015/073975 JP2015073975W WO2016039139A1 WO 2016039139 A1 WO2016039139 A1 WO 2016039139A1 JP 2015073975 W JP2015073975 W JP 2015073975W WO 2016039139 A1 WO2016039139 A1 WO 2016039139A1
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WO
WIPO (PCT)
Prior art keywords
metal foil
wiring metal
foil pattern
resin layer
resin
Prior art date
Application number
PCT/JP2015/073975
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French (fr)
Japanese (ja)
Inventor
喜人 大坪
南　匡晃
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2016547346A priority Critical patent/JP6319447B2/en
Publication of WO2016039139A1 publication Critical patent/WO2016039139A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a resin multilayer substrate.
  • Patent Document 1 An example of a multilayer substrate is described in Japanese Patent Application Laid-Open No. 2005-166980 (Patent Document 1).
  • Patent Document 1 describes a configuration in which a ground electrode is formed thicker than surrounding surface electrodes in order to enhance the heat dissipation effect. According to Patent Document 1, by adopting such a configuration, the heat capacity of the ground electrode can be increased, and the heat dissipation effect of the electronic component can be enhanced.
  • a plurality of resin multilayer substrates are joined to form one resin multilayer substrate.
  • the conductive portion at the junction is usually connected via solder.
  • solder there is a possibility that the solder overflows to the periphery and causes a short circuit, so that it is difficult to narrow the gap of the terminal and the high-density wiring at the junction or its periphery.
  • the present invention can avoid a short circuit due to solder when joining the resin multilayer substrates, and can reduce the gap between terminals at the joint portion between the resin multilayer substrates and the periphery thereof, and enables high-density wiring.
  • An object is to provide a substrate.
  • a resin multilayer substrate is formed by laminating one resin layer or a plurality of resin layers of a first group, and has a first region on the outermost surface, The first resin layer portion in which the first wiring metal foil pattern is disposed in the region and one resin layer or a plurality of resin layers of the second group are laminated, and the second region is provided on the outermost surface.
  • a second non-wiring metal foil pattern that overlaps the pattern, the first non-wiring metal foil pattern And the second non-wiring metal foil pattern is bonded by ultrasonic bonding.
  • the first non-wiring metal foil pattern and the second non-wiring metal foil pattern are joined by ultrasonic bonding, the first region of the first resin layer portion and the second resin layer portion of the second non-wiring metal foil pattern are joined.
  • the junction with the two regions is reinforced. Further, since there is no need to use solder, there is no risk of short circuit due to solder. Therefore, it is possible to narrow the gap between terminals and the high density wiring at the joint portion between the resin multilayer substrates and the periphery thereof.
  • FIG. 11 is a cross-sectional view taken along line XII-XII in FIG. 10.
  • FIG. 11 is a cross-sectional view taken along the line XIII-XIII in FIG. 10.
  • FIG. 15 is a cross-sectional view taken along the line XV-XV in FIG. 14. It is arrow sectional drawing regarding the XVI-XVI line
  • FIG. 19 is a cross-sectional view taken along the line XX-XX in FIG. It is sectional drawing of the resin multilayer substrate in Embodiment 6 based on this invention. It is a top view of the state which took out only the 1st resin layer part contained in the resin multilayer substrate in Embodiment 7 based on this invention. It is a fragmentary sectional view of a general resin sheet with copper foil.
  • FIG. 1 A cross-sectional view of the resin multilayer substrate 101 in the present embodiment is shown in FIG.
  • the resin multilayer substrate 101 is obtained by bonding the first resin layer portion 31 and the second resin layer portion 32.
  • FIG. 2 is a plan view showing a state in which only the first resin layer portion 31 is taken out.
  • FIG. 3 shows a bottom view of the state where only the second resin layer portion 32 is taken out.
  • the resin multilayer substrate is a first resin in which a plurality of resin layers 2 of the first group are laminated, the first region 41 is provided on the outermost surface, and the first wiring metal foil pattern 51 is disposed in the first region 41.
  • a layer part 31 and a second resin layer part 32 having a second region 42 on the outermost surface are provided.
  • the 1st resin layer part 31 and the 2nd resin layer part 32 are arrange
  • the first resin layer portion 31 has a first non-wiring metal foil pattern 53 in the first region 41 separately from the first wiring metal foil pattern 51.
  • the second resin layer portion 32 has a second non-wiring metal foil pattern 54 that overlaps the first non-wiring metal foil pattern 53 in the second region 42.
  • the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are bonded by ultrasonic bonding.
  • the first resin layer portion 31 and the second resin layer portion 32 may each include an interlayer connection conductor 6 and / or a conductor pattern 7 therein.
  • the 1st resin layer part 31 shall have laminated
  • the 1st resin layer part 31 may be based on the one resin layer 2 which is not a laminated body.
  • the second resin layer portion 32 The same applies to the second resin layer portion 32.
  • the 1st resin layer part should just contain one or more resin layers. The same applies to the second resin layer portion 32.
  • the first non-wiring metal foil pattern 53 is disposed so as to completely surround the first wiring metal foil pattern 51.
  • the second non-wiring metal foil pattern 54 is disposed so as to completely surround the second wiring metal foil pattern 52.
  • the first region 41 and the second region 42 are indicated by thin solid lines, but these regions are conceptual.
  • the thin solid lines defined as the first area 41 and the second area 42 indicate areas. A boundary line corresponding to the thin solid line is not always drawn on the surface of the resin layer portion.
  • a method for manufacturing the resin multilayer substrate as described in this embodiment will be described later.
  • the bonding between the first region 41 and the second region 42 is reinforced.
  • the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are bonded by ultrasonic bonding rather than bonding using solder or the like, there is no possibility of short circuit due to solder. It is possible to avoid a short circuit due to solder when the resin multilayer substrates are joined together, and it is possible to narrow the gap between terminals at the joint portion between the resin multilayer substrates and the periphery thereof and to perform high-density wiring.
  • the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are arranged so as to surround the first wiring metal foil pattern 51 in plan view. It is preferable. If it is the structure surrounded in this way, the penetration
  • the second resin layer portion 32 has a second wiring metal foil pattern 52 arranged separately from the second non-wiring metal foil pattern 54 in the second region 42.
  • the first wiring metal foil pattern 51 and the second wiring metal foil pattern 52 are preferably electrically connected by being in contact with each other.
  • the first wiring metal foil pattern 51 and the second wiring metal foil pattern 52 are not simply brought into contact with each other but are ultrasonically bonded to each other.
  • the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are ultrasonically bonded, the first wiring metal foil pattern 51 and the second wiring metal foil pattern 52 are also ultrasonically bonded simultaneously. May be.
  • the resin layer has flexibility such as a thermoplastic resin, it is difficult to perform stable ultrasonic bonding as compared with the case where substrates having low flexibility are bonded to each other. Strong bonding is achieved by ultrasonic bonding between the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 in addition to between the metal foil pattern 51 and the second wiring metal foil pattern 52. Is easier to do.
  • first resin layer portion 31 and the second resin layer portion 32 are described as having substantially the same size and the same shape in plan view, but this is for convenience of description. It is a simplification. Both sizes and external shapes may be different when viewed in plan.
  • the first non-wiring metal foil pattern 53 is disposed so as to completely surround the first wiring metal foil pattern 51 in the first region 41. 4 may be used. That is, in the first region 41, the first non-wiring metal foil pattern 53 may intermittently surround the first wiring metal foil pattern 51. Not only the structure surrounding intermittently but the structure surrounding partially may be sufficient.
  • the effect of protecting the non-wiring metal foil pattern as a shield is expected by arranging the metal foil pattern to be the wiring so as to surround even if the non-wiring metal foil pattern is partially.
  • the thickness of the metal foil pattern is almost the same, so that the shield resistance is lowered and the shielding performance is improved.
  • FIG. 5 shows a cross-sectional view of the resin multilayer substrate 102 in the present embodiment.
  • the resin multilayer substrate 102 is obtained by joining the first resin layer portion 31 and the second resin layer portion 32.
  • FIG. 6 shows a plan view of the state in which only the first resin layer portion 31 is taken out.
  • FIG. 7 shows a bottom view of the state where only the second resin layer portion 32 is taken out.
  • the first non-wiring metal foil pattern 53 is composed of two parts, and these two parts are arranged to face each other with the first wiring metal foil pattern 51 interposed therebetween.
  • the first non-wiring metal foil pattern 53 is arranged so as to sandwich the first wiring metal foil pattern 51 from two directions.
  • the second non-wiring metal foil pattern 54 is composed of two parts, and is disposed so as to face each other with the second wiring metal foil pattern 52 interposed therebetween.
  • the first non-wiring metal foil pattern 53 has a longer linear shape than the first wiring metal foil pattern 51.
  • the second non-wiring metal foil pattern 54 also has a longer line shape than the second wiring metal foil pattern 52.
  • the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are arranged so as to separate the first wiring metal foil pattern 51 from the nearest substrate end in a plan view.
  • the non-wiring metal foil pattern does not surround the wiring metal foil pattern in a plan view. However, even in such an arrangement, the bonding is reinforced and moisture intrusion is prevented. A certain effect can be obtained. In the present embodiment, the area of the non-wiring metal foil pattern can be kept small.
  • the non-wiring metal foil pattern may not be linear when viewed in plan. Even with such a configuration, a certain effect can be obtained.
  • the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are preferably linear in plan view. This is because if the non-wiring metal foil pattern is linear, it is possible to efficiently prevent moisture from entering.
  • FIG. 3 shows a resin multilayer substrate according to Embodiment 3 of the present invention.
  • the appearance of the resin multilayer substrate 103 in this embodiment is shown in FIG.
  • a plan view of the resin multilayer substrate 103 is shown in FIG.
  • the resin multilayer substrate 103 has a built-in transmission line.
  • the resin multilayer substrate 103 includes a plurality of resin layers 2 stacked.
  • the resin multilayer substrate 103 has a shape in which the first resin layer portion 31 and the second resin layer portion 32 are bonded together.
  • a total of four resin layers 2 are laminated, of which the lower two layers are the first resin layer portions 31 and the upper two layers are the second resin layer portions 32. It has become.
  • FIG. 11 shows a plan view of the state in which the second resin layer portion 32 has been removed from the resin multilayer substrate 103.
  • FIG. 12 is a cross-sectional view taken along the line XII-XII in FIG.
  • FIG. 13 shows a cross-sectional view taken along line XIII-XIII in FIG.
  • the first resin layer portion 31 is formed by laminating a plurality of resin layers 2 of the first group, has a first region on the outermost surface, and a first wiring metal foil pattern 51 is disposed in the first region. It is what. The first region here is the entire upper surface of the first resin portion 31.
  • the first wiring metal foil pattern 51 is a linear conductor pattern serving as a transmission line. In the example shown in FIG. 11, three first wiring metal foil patterns 51 are arranged in parallel.
  • the second resin portion 32 is formed by laminating a plurality of resin layers 2 of the second group, and has a second region on the outermost surface. The second region is the entire lower surface of the second resin portion 32.
  • the first resin layer portion 31 and the second resin layer portion 32 are arranged so that the first region and the second region overlap. That is, the entire upper surface of the first resin layer portion 31 and the entire lower surface of the second resin layer portion 32 overlap each other.
  • the first resin layer portion 31 has a first non-wiring metal foil pattern 53 in addition to the first wiring metal foil pattern 51 in the first region, that is, the upper surface.
  • the second resin layer portion 32 has a second non-wiring metal foil pattern 54 that overlaps the first non-wiring metal foil pattern 53 in the second region, that is, the lower surface. As shown in FIG. 12, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are bonded by ultrasonic bonding.
  • the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are joined by ultrasonic bonding, the first resin layer portion 31 and the second resin layer portion 32 are The joint between them is reinforced. With this configuration, even when twisting or twisting is applied to the resin multilayer substrate including the transmission line, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are joined by ultrasonic bonding. Therefore, the probability of occurrence of peeling can be reduced.
  • the two first non-wiring metal foil patterns 53 are arranged in parallel so as to be sandwiched from the outside where the plurality of first wiring metal foil patterns 51 are arranged in parallel.
  • the two second non-wiring metal foil patterns 54 on the second resin layer portion 32 side are ultrasonically bonded to the two first non-wiring metal foil patterns 53.
  • the number of the first wiring metal foil patterns 51 mentioned here is merely an example, and the number may be other than three.
  • FIG. 15 is a cross-sectional view taken along line XV-XV in FIG.
  • FIG. 16 is a cross-sectional view taken along the line XVI-XVI in FIG.
  • the first resin layer portion 31 includes an interlayer connection conductor 6 a that is connected to the first non-wiring metal foil pattern 53 from the inside.
  • FIG. 17 is a partially enlarged view of the row of interlayer connection conductors 6a in FIG. 16 viewed from below.
  • Each of the interlayer connection conductors 6a is a conductor that penetrates through the resin layer 2 in the thickness direction.
  • the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are joined at least with respect to the first non-wiring metal foil pattern 53 at a location where they are joined by ultrasonic bonding. Since the interlayer connection conductor 6a is arranged so as to be connected from the inside of the resin layer portion 31, the bonding strength is increased, and even when twisting or twisting is applied to the transmission line, delamination does not easily occur. Further, since the interlayer connection conductor 6a is arranged in a wall shape, an effect of preventing moisture from entering from the outside can be expected.
  • interlayer connection conductors 6a are arranged side by side like a completely continuous wall, but even in a structure in which the interlayer connection conductors 6a are arranged intermittently or in the form of dots, a certain degree of reinforcement effect can be obtained. .
  • the second resin layer portion 32 includes an interlayer connection conductor 6 b that is connected to the second non-wiring metal foil pattern 54 from the inside.
  • the second resin layer portion 32 can be reinforced. If the interlayer connection conductor 6a is disposed in the first resin layer portion 31 and the interlayer connection conductor 6b is disposed in the second resin layer portion 32, the interlayer connection conductor 6b can be reinforced from above and below, and delamination Intrusion of water and moisture can be prevented more reliably.
  • FIG. 5 An appearance of the resin multilayer substrate 105 in the present embodiment is shown in FIG.
  • the resin multilayer substrate 105 has a plurality of conductive patterns extending in two dimensions.
  • the resin multilayer substrate 105 includes a plurality of resin layers 2 stacked.
  • the resin multilayer substrate 105 has a shape in which the first resin layer portion 31 and the second resin layer portion 32 are bonded together.
  • FIG. 19 shows a plan view of the resin multilayer substrate 105 with the second resin layer portion 32 removed. That is, FIG. 19 is also a top view of the first resin layer portion 31.
  • FIG. 20 is a sectional view taken along the line XX-XX in FIG.
  • the first region is the entire upper surface of the first resin layer portion 31.
  • the second region is the entire lower surface of the second resin portion 32.
  • the 1st resin layer part 31 and the 2nd resin layer part 32 are arrange
  • the first resin layer portion 31 has a first non-wiring metal foil pattern 53 in addition to the first wiring metal foil pattern 51 in the first region, that is, the upper surface. As shown in FIG. 19, the first non-wiring metal foil pattern 53 is provided so as to surround the outer edge portion of the upper surface of the first resin layer portion 31.
  • the first wiring metal foil pattern 51 is disposed inside the region surrounded by the first non-wiring metal foil pattern 53 on the upper surface of the first resin layer portion 31.
  • the second resin layer portion 32 has a second non-wiring metal foil pattern 54 that overlaps the first non-wiring metal foil pattern 53 in the second region, that is, the lower surface.
  • the first non-wiring metal foil pattern 53 surrounds the first wiring metal foil pattern 51 arranged so as to have a two-dimensional extension. Since the second non-wiring metal foil pattern 54 is ultrasonically bonded from the second resin layer portion 32 side, moisture intrusion and delamination progress to the region where the first wiring metal foil pattern 51 is arranged efficiently. Can be prevented.
  • the basic configuration of the resin multilayer substrate 106 in the present embodiment is the same as that of the resin multilayer substrate 105 described in the fifth embodiment.
  • the resin multilayer substrate in the present embodiment includes an interlayer connection conductor 6 a in which the first resin layer portion 31 is connected to the first non-wiring metal foil pattern 53 from the inside.
  • the second resin layer portion 32 may include an interlayer connection conductor 6 b that is connected to the second non-wiring metal foil pattern 54 from the inside. If the interlayer connection conductor 6a and / or the interlayer connection conductor 6b are provided as described above, the bonding strength between the first resin layer portion 31 and the second resin layer portion 32 is increased, and the shielding effect is enhanced.
  • the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 completely and continuously surround the outer edge portion of the upper surface of the first resin layer portion 31. However, it does not have to be a completely continuous ring.
  • FIG. 22 the resin multilayer substrate according to the seventh embodiment based on the present invention will be described.
  • the basic configuration of the resin multilayer substrate in the present embodiment is the same as that described in the fifth embodiment.
  • the resin multilayer substrate in the present embodiment is partially arranged along the outer edge as shown in FIG.
  • FIG. 22 is a view corresponding to FIG. 19 and is a plan view showing a state in which the second resin layer portion 32 is removed while leaving the first resin layer portion 31 in the resin multilayer substrate.
  • a non-wiring metal foil pattern may be selectively provided in a place where the wiring is close to the end face of the substrate.
  • the non-wiring metal foil pattern is preferably arranged so as to block the end face and the wiring. This is because the place where the wiring is close to the end face has a high importance of protecting the wiring because there is a concern about the peeling progress from the outside and moisture intrusion.
  • the first non-wiring metal foil pattern 53 is selectively disposed at a location where the first wiring metal foil pattern 51 is close to the end face of the substrate. That is, the first non-wiring metal foil pattern 53 is arranged along the outer edge of the substrate in the left half and the lower right part of FIG.
  • FIG. 23 shows an enlarged cross-sectional view of a part of the resin sheet 12 with copper foil.
  • a desired resin multilayer substrate is produced by forming a laminate using the resin sheet as a resin layer.
  • the copper foil 17 is attached to one surface of the resin layer 2.
  • the copper foil 17 attached to the resin sheet 12 with copper foil has a mat surface 28 and a shiny surface 29.
  • the mat surface 28 and the shiny surface 29 are in a front-back relationship.
  • FIG. 24 shows an example of a state in which the copper foil 17 of the resin sheet with copper foil 12 is patterned to form a conductor pattern 7. Since the shiny surface 29 originally has a small surface roughness, the bonding strength is low even when it is bonded to another resin sheet. Therefore, when a plurality of resin multilayer substrates are joined to each other, if there is a place where the shiny surface 29 of the conductor pattern 7 and the resin layer are joined, there is a risk of delamination or moisture intrusion. Some countermeasures were necessary for this.
  • each of the first non-wiring metal foil pattern and the second non-wiring metal foil pattern includes a mat surface having a first surface roughness and bonded to a resin layer, A first surface layer having a second surface roughness smaller than the first surface roughness and having a shiny surface that faces away from the mat surface, and the first resin layer portion and the second resin layer portion, are preferably joined so that the shiny surface of the first non-wiring metal foil pattern and the shiny surface of the second non-wiring metal foil pattern are in contact with each other. With this configuration, good ultrasonic bonding can be achieved between the shiny surfaces. In addition, since the number of points where the shiny surface and the resin layer are joined can be reduced, it is possible to reduce the factors that cause the delamination and moisture intrusion.
  • the shiny surface exposed on the surface where the first resin layer portion and the second resin layer portion are in contact with each other is all opposed to the opposite shiny surface.
  • the shiny surface 29 and the resin layer do not come into contact with each other, and the shiny surfaces 29 are always brought together as shown in FIG.
  • the shiny surface 29 is always in contact with the shiny surface 29, and the location where the shiny surface and the resin layer are joined can be eliminated. It is possible to prevent delamination and moisture intrusion that have occurred due to the joint.
  • the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are preferably formed of copper foil. If it is this structure, the resin sheet with a copper foil used as a material can be procured easily, and a process is also easy.
  • the resin layer portion included in the resin multilayer substrate can be manufactured as follows.
  • the resin sheet 12 with copper foil is used as an example of the resin sheet with conductor foil.
  • the resin sheet 12 with a copper foil is a sheet having a structure in which the copper foil 17 is attached to one surface of the resin layer 2.
  • the resin layer 2 is made of, for example, a thermoplastic resin.
  • the thermoplastic resin is, for example, LCP (liquid crystal polymer).
  • examples of the thermoplastic resin used as the material of the resin layer 2 include PEEK (polyether ether ketone), PEI (polyether imide), PPS (poniphenylene sulfide), and thermoplastic PI (polyimide) in addition to LCP. May be.
  • the copper foil 17 is a 18 ⁇ m thick foil made of Cu.
  • the copper foil 17 is used as an example of the conductive foil, but the conductive foil other than the copper foil may be Ag, Al, SUS, Ni, Au, and the conductive foil may be Cu, Ag, Al, SUS. It may be an alloy of two or more different metals selected from Ni, Au.
  • the copper foil 17 has a thickness of 18 ⁇ m, but the thickness of the copper foil 17 may be about 3 ⁇ m or more and 40 ⁇ m or less. The copper foil 17 should just be the thickness which can form a circuit.
  • a via hole 11 is formed in the resin layer 2 by a method such as irradiating a laser beam from the side opposite to the copper foil 17.
  • the laser beam may be, for example, a carbon dioxide laser beam.
  • the via hole 11 is for forming a via conductor later. The via hole 11 penetrates the resin layer 2 but does not penetrate the copper foil 17.
  • a resist pattern 13 is formed on the surface on which the copper foil 17 is present.
  • the resist pattern 13 can be formed, for example, by printing.
  • the copper foil 17 is etched using the resist pattern 13 as a mask to form the conductor pattern 7.
  • the etching of the copper foil 17 can be performed with an acid.
  • the resist pattern 13 is peeled off with an alkaline solution, and then neutralization is performed. In this way, the structure shown in FIG. 30 is obtained.
  • the conductor pattern 7 is formed after the via hole 11 is formed first, but the via hole 11 may be formed after the conductor pattern 7 is formed first.
  • the via hole 11 is filled with a conductive paste to form an interlayer connection conductor 6 as shown in FIG.
  • the other resin layer 2 is overlaid on the resin layer 2 as shown in FIG. As a result, it becomes as shown in FIG.
  • a laminate is obtained as shown in FIG.
  • all four layers are stacked, but the number of layers may be other numbers.
  • temporary pressing may be performed every time one layer is stacked.
  • the direction of the resin layer 2 is different between the first and second layers from the bottom and the third and fourth layers from the bottom. As a result, the widened surfaces of the interlayer connection conductor 6 are in contact with each other at the interface between the second layer and the third layer from the bottom.
  • the laminate may include a portion where the front and back directions of the resin layer 2 are switched in this way.
  • the laminated body may have a configuration in which all the resin layers 2 are laminated in the same direction.
  • the whole laminate is pressurized while being heated at a temperature not exceeding the glass transition temperature of the resin layer 2 (for example, 250 ° C. or more and 300 ° C. or less).
  • the resin layers 2 are pressed together to integrate the entire laminate.
  • the first resin layer portion 31 can be obtained as shown in FIG.
  • the conductor pattern 7 exposed on the lowermost surface is the external electrode 18.
  • a first wiring metal foil pattern 51 and a first non-wiring metal foil pattern 53 are formed as one form of the conductor pattern 7 on the upper surface of the uppermost resin layer 2.
  • the first resin layer portion 31 obtained in this way is combined with the separately prepared second resin layer portion 32 and installed in an ultrasonic bonding apparatus as shown in FIG.
  • ultrasonic bonding is performed between the first resin layer portion 31 and the second resin layer portion 32 in a partially overlapped state.
  • Concavities and convexities are formed on the upper surface of the base 61 to increase the frictional force and hold the object.
  • Concavities and convexities are formed on the lower surface of the tool 62 to increase the frictional force and hold the object.
  • pressure is applied as indicated by an arrow 91 and relatively ultrasonic vibration is applied as indicated by an arrow 92.
  • the resin multilayer substrate 101 as shown in FIG. 1 can be obtained.
  • ultrasonic bonding between the first non-wiring metal foil pattern and the second non-wiring metal foil pattern can be performed, for example, under the following conditions.
  • FIG. 35 two resin layer portions are partially overlapped.
  • pressure and ultrasonic vibration may be applied collectively using the base 61 and the tool 62 having an area that covers the entire surface.
  • ultrasonic bonding is performed for each portion while repeatedly moving relative to the resin layer portion using the base 61 and the tool 62 having a limited area. You may stick together the whole surface.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

This resin multilayer substrate (101) is provided with: a first resin layer part (31) which has a first region in the outermost surface, and wherein a first wiring metal foil pattern (51) is arranged in the first region; and a second resin layer part (32) which has a second region in the outermost surface. The first resin layer part (31) and the second resin layer part (32) are arranged such that the first region and the second region overlap each other. The first resin layer part (31) has a first non-wiring metal foil pattern (53), which is different from the first wiring metal foil pattern (51), in the first region. The second resin layer part (32) has a second non-wiring metal foil pattern (54) in the second region, and the second non-wiring metal foil pattern (54) overlaps the first non-wiring metal foil pattern (53). The first non-wiring metal foil pattern (53) and the second non-wiring metal foil pattern (54) are bonded with each other by ultrasonic bonding.

Description

樹脂多層基板Resin multilayer board
　本発明は、樹脂多層基板に関するものである。 The present invention relates to a resin multilayer substrate.
　多層基板の一例が、特開２００５－１６６９８０号公報（特許文献１）に記載されている。特許文献１では、放熱効果を高めるためにアース電極を周囲の表面電極より厚く形成した構成が記載されている。特許文献１によれば、このような構成を採用することで、アース電極の熱容量を大きくすることができ、電子部品の放熱効果を高めることができるとされている。 An example of a multilayer substrate is described in Japanese Patent Application Laid-Open No. 2005-166980 (Patent Document 1). Patent Document 1 describes a configuration in which a ground electrode is formed thicker than surrounding surface electrodes in order to enhance the heat dissipation effect. According to Patent Document 1, by adopting such a configuration, the heat capacity of the ground electrode can be increased, and the heat dissipation effect of the electronic component can be enhanced.
特開２００５－１６６９８０号公報JP 2005-166980 A
　複数の樹脂多層基板を接合して１つの樹脂多層基板とする場合がある。この場合、接合部にある導通部分は、通常、ハンダを介して接続される。しかし、ハンダを用いる場合には、ハンダが周辺にあふれて短絡を起こすおそれがあるので、接合部やその周辺における端子の狭ギャップ化や高密度配線が困難であった。 In some cases, a plurality of resin multilayer substrates are joined to form one resin multilayer substrate. In this case, the conductive portion at the junction is usually connected via solder. However, in the case of using solder, there is a possibility that the solder overflows to the periphery and causes a short circuit, so that it is difficult to narrow the gap of the terminal and the high-density wiring at the junction or its periphery.
　そこで、本発明は、樹脂多層基板同士の接合時のハンダによる短絡を回避することができ、樹脂多層基板同士の接合部やその周辺における端子の狭ギャップ化や高密度配線を可能とする樹脂多層基板を提供することを目的とする。 Therefore, the present invention can avoid a short circuit due to solder when joining the resin multilayer substrates, and can reduce the gap between terminals at the joint portion between the resin multilayer substrates and the periphery thereof, and enables high-density wiring. An object is to provide a substrate.
　上記目的を達成するため、本発明に基づく樹脂多層基板は、１つの樹脂層または第１群の複数の樹脂層が積層されたものであり、最外面に第１領域を有し、上記第１領域内に第１配線金属箔パターンが配置されている第１樹脂層部と、１つの樹脂層または第２群の複数の樹脂層が積層されたものであり、最外面に第２領域を有する第２樹脂層部とを備え、上記第１樹脂層部および上記第２樹脂層部は、上記第１領域と上記第２領域とが重なり合うようにして配置されており、上記第１樹脂層部は、上記第１領域内に上記第１配線金属箔パターンとは別に第１非配線金属箔パターンを有し、上記第２樹脂層部は、上記第２領域内に上記第１非配線金属箔パターンと重なり合う第２非配線金属箔パターンを有し、上記第１非配線金属箔パターンと上記第２非配線金属箔パターンとは超音波接合によって接合されている。 In order to achieve the above object, a resin multilayer substrate according to the present invention is formed by laminating one resin layer or a plurality of resin layers of a first group, and has a first region on the outermost surface, The first resin layer portion in which the first wiring metal foil pattern is disposed in the region and one resin layer or a plurality of resin layers of the second group are laminated, and the second region is provided on the outermost surface. A second resin layer portion, wherein the first resin layer portion and the second resin layer portion are arranged such that the first region and the second region overlap with each other, and the first resin layer portion Has a first non-wiring metal foil pattern separately from the first wiring metal foil pattern in the first region, and the second resin layer portion has the first non-wiring metal foil in the second region. A second non-wiring metal foil pattern that overlaps the pattern, the first non-wiring metal foil pattern And the second non-wiring metal foil pattern is bonded by ultrasonic bonding.
　本発明によれば、第１非配線金属箔パターンと第２非配線金属箔パターンとが超音波接合によって接合されているので、第１樹脂層部の第１領域と第２樹脂層部の第２領域との接合が補強される。また、ハンダを用いる必要がないので、ハンダによる短絡のおそれがなくすことができる。したがって、樹脂多層基板同士の接合部やその周辺における端子の狭ギャップ化や高密度配線が可能となる。 According to the present invention, since the first non-wiring metal foil pattern and the second non-wiring metal foil pattern are joined by ultrasonic bonding, the first region of the first resin layer portion and the second resin layer portion of the second non-wiring metal foil pattern are joined. The junction with the two regions is reinforced. Further, since there is no need to use solder, there is no risk of short circuit due to solder. Therefore, it is possible to narrow the gap between terminals and the high density wiring at the joint portion between the resin multilayer substrates and the periphery thereof.
本発明に基づく実施の形態１における樹脂多層基板の断面図である。It is sectional drawing of the resin multilayer substrate in Embodiment 1 based on this invention. 本発明に基づく実施の形態１における樹脂多層基板に含まれる第１樹脂層部のみを取り出した状態の平面図である。It is a top view of the state which took out only the 1st resin layer part contained in the resin multilayer substrate in Embodiment 1 based on this invention. 本発明に基づく実施の形態１における樹脂多層基板に含まれる第２樹脂層部のみを取り出した状態の下面図である。It is a bottom view of the state which took out only the 2nd resin layer part contained in the resin multilayer substrate in Embodiment 1 based on this invention. 本発明に基づく実施の形態１における樹脂多層基板の変形例に含まれる第１樹脂層部のみを取り出した状態の平面図である。It is a top view of the state which took out only the 1st resin layer part contained in the modification of the resin multilayer substrate in Embodiment 1 based on this invention. 本発明に基づく実施の形態２における樹脂多層基板の断面図である。It is sectional drawing of the resin multilayer substrate in Embodiment 2 based on this invention. 本発明に基づく実施の形態２における樹脂多層基板に含まれる第１樹脂層部のみを取り出した状態の平面図である。It is a top view of the state which took out only the 1st resin layer part contained in the resin multilayer substrate in Embodiment 2 based on this invention. 本発明に基づく実施の形態２における樹脂多層基板に含まれる第２樹脂層部のみを取り出した状態の下面図である。It is a bottom view of the state where only the 2nd resin layer part contained in the resin multilayer substrate in Embodiment 2 based on the present invention was taken out. 本発明に基づく実施の形態２における樹脂多層基板の変形例に含まれる第１樹脂層部のみを取り出した状態の平面図である。It is a top view of the state which took out only the 1st resin layer part contained in the modification of the resin multilayer substrate in Embodiment 2 based on this invention. 本発明に基づく実施の形態３における樹脂多層基板の斜視図である。It is a perspective view of the resin multilayer substrate in Embodiment 3 based on this invention. 本発明に基づく実施の形態３における樹脂多層基板の平面図である。It is a top view of the resin multilayer substrate in Embodiment 3 based on this invention. 本発明に基づく実施の形態３における樹脂多層基板に含まれる第１樹脂層部のみを取り出した状態の平面図である。It is a top view of the state which took out only the 1st resin layer part contained in the resin multilayer substrate in Embodiment 3 based on this invention. 図１０におけるＸＩＩ－ＸＩＩ線に関する矢視断面図である。FIG. 11 is a cross-sectional view taken along line XII-XII in FIG. 10. 図１０におけるＸＩＩＩ－ＸＩＩＩ線に関する矢視断面図である。FIG. 11 is a cross-sectional view taken along the line XIII-XIII in FIG. 10. 本発明に基づく実施の形態４における樹脂多層基板の平面図である。It is a top view of the resin multilayer substrate in Embodiment 4 based on this invention. 図１４におけるＸＶ－ＸＶ線に関する矢視断面図である。FIG. 15 is a cross-sectional view taken along the line XV-XV in FIG. 14. 図１４におけるＸＶＩ－ＸＶＩ線に関する矢視断面図である。It is arrow sectional drawing regarding the XVI-XVI line | wire in FIG. 層間接続導体の列を図１６における下から見た部分拡大図である。It is the elements on larger scale which looked at the row | line | column of the interlayer connection conductor from the bottom in FIG. 本発明に基づく実施の形態５における樹脂多層基板の斜視図である。It is a perspective view of the resin multilayer substrate in Embodiment 5 based on this invention. 本発明に基づく実施の形態５における樹脂多層基板に含まれる第１樹脂層部のみを取り出した状態の平面図である。It is a top view of the state which took out only the 1st resin layer part contained in the resin multilayer substrate in Embodiment 5 based on this invention. 図１８におけるＸＸ－ＸＸ線に関する矢視断面図である。FIG. 19 is a cross-sectional view taken along the line XX-XX in FIG. 本発明に基づく実施の形態６における樹脂多層基板の断面図である。It is sectional drawing of the resin multilayer substrate in Embodiment 6 based on this invention. 本発明に基づく実施の形態７における樹脂多層基板に含まれる第１樹脂層部のみを取り出した状態の平面図である。It is a top view of the state which took out only the 1st resin layer part contained in the resin multilayer substrate in Embodiment 7 based on this invention. 一般的な銅箔付き樹脂シートの部分断面図である。It is a fragmentary sectional view of a general resin sheet with copper foil. 銅箔付き樹脂シートの銅箔をパターニングした状態の部分断面図である。It is a fragmentary sectional view in the state where copper foil of a resin sheet with copper foil was patterned. 樹脂層を積層する際にシャイニー面同士を合わせるようにした例の説明図である。It is explanatory drawing of the example which matched the shiny surfaces when laminating | stacking a resin layer. 本発明に基づく樹脂多層基板の製造方法の第１の説明図である。It is 1st explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. 本発明に基づく樹脂多層基板の製造方法の第２の説明図である。It is 2nd explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. 本発明に基づく樹脂多層基板の製造方法の第３の説明図である。It is 3rd explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. 本発明に基づく樹脂多層基板の製造方法の第４の説明図である。It is 4th explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. 本発明に基づく樹脂多層基板の製造方法の第５の説明図である。It is 5th explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. 本発明に基づく樹脂多層基板の製造方法の第６の説明図である。It is 6th explanatory drawing of the manufacturing method of the resin multilayer substrate based on this invention. 本発明に基づく樹脂多層基板の製造方法の第７の説明図である。It is a 7th explanatory view of the manufacturing method of the resin multilayer substrate based on the present invention. 本発明に基づく樹脂多層基板の製造方法の第８の説明図である。It is the 8th explanatory view of the manufacturing method of the resin multilayer substrate based on the present invention. 本発明に基づく樹脂多層基板の製造方法の第９の説明図である。It is a 9th explanatory view of the manufacturing method of the resin multilayer substrate based on the present invention. 本発明に基づく樹脂多層基板の製造方法の第１０の説明図である。It is a 10th explanatory view of the manufacturing method of the resin multilayer substrate based on the present invention.
　（実施の形態１）
　図１～図３を参照して、本発明に基づく実施の形態１における樹脂多層基板について説明する。本実施の形態における樹脂多層基板１０１の断面図を図１に示す。樹脂多層基板１０１は、第１樹脂層部３１と第２樹脂層部３２とを接合したものであるが、このうち第１樹脂層部３１のみを取り出した状態の平面図を図２に示す。さらに第２樹脂層部３２のみを取り出した状態の下面図を図３に示す。 (Embodiment 1)
With reference to FIGS. 1 to 3, a resin multilayer substrate according to the first embodiment of the present invention will be described. A cross-sectional view of the resin multilayer substrate 101 in the present embodiment is shown in FIG. The resin multilayer substrate 101 is obtained by bonding the first resin layer portion 31 and the second resin layer portion 32. FIG. 2 is a plan view showing a state in which only the first resin layer portion 31 is taken out. Furthermore, FIG. 3 shows a bottom view of the state where only the second resin layer portion 32 is taken out.
　樹脂多層基板は、第１群の複数の樹脂層２が積層され、最外面に第１領域４１を有し、第１領域４１内に第１配線金属箔パターン５１が配置されている第１樹脂層部３１と、第２群の複数の樹脂層２が積層され、最外面に第２領域４２を有する第２樹脂層部３２とを備える。第１樹脂層部３１および第２樹脂層部３２は、第１領域４１と第２領域４２とが重なり合うようにして配置されている。第１樹脂層部３１は、第１領域４１内に第１配線金属箔パターン５１とは別に第１非配線金属箔パターン５３を有する。第２樹脂層部３２は、第２領域４２内に第１非配線金属箔パターン５３と重なり合う第２非配線金属箔パターン５４を有する。第１非配線金属箔パターン５３と第２非配線金属箔パターン５４とは超音波接合によって接合されている。 The resin multilayer substrate is a first resin in which a plurality of resin layers 2 of the first group are laminated, the first region 41 is provided on the outermost surface, and the first wiring metal foil pattern 51 is disposed in the first region 41. A layer part 31 and a second resin layer part 32 having a second region 42 on the outermost surface are provided. The 1st resin layer part 31 and the 2nd resin layer part 32 are arrange | positioned so that the 1st area | region 41 and the 2nd area | region 42 may overlap. The first resin layer portion 31 has a first non-wiring metal foil pattern 53 in the first region 41 separately from the first wiring metal foil pattern 51. The second resin layer portion 32 has a second non-wiring metal foil pattern 54 that overlaps the first non-wiring metal foil pattern 53 in the second region 42. The first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are bonded by ultrasonic bonding.
　図１に示すように、第１樹脂層部３１および第２樹脂層部３２は、それぞれ内部に層間接続導体６および／または導体パターン７を備えていてもよい。ここでは、第１樹脂層部３１は複数の樹脂層２が積層されたものとしたが、第１樹脂層部３１は積層体ではない１つの樹脂層２によるものであってもよい。第２樹脂層部３２についても同様である。要するに、第１樹脂層部は１以上の樹脂層を含んでいればよい。第２樹脂層部３２についても同様である。 As shown in FIG. 1, the first resin layer portion 31 and the second resin layer portion 32 may each include an interlayer connection conductor 6 and / or a conductor pattern 7 therein. Here, although the 1st resin layer part 31 shall have laminated | stacked the some resin layer 2, the 1st resin layer part 31 may be based on the one resin layer 2 which is not a laminated body. The same applies to the second resin layer portion 32. In short, the 1st resin layer part should just contain one or more resin layers. The same applies to the second resin layer portion 32.
　図２に示すように、第１領域４１において第１非配線金属箔パターン５３は第１配線金属箔パターン５１を完全に取り囲むように配置されている。図３に示すように、第２領域４２においても、第２非配線金属箔パターン５４は第２配線金属箔パターン５２を完全に取り囲むように配置されている。図２および図３において第１領域４１および第２領域４２は細実線で記載されているが、これらの領域は概念的なものである。第１領域４１および第２領域４２とされている細実線は領域を示すものである。この細実線に相当する境界線が樹脂層部の表面に実際に描かれているとは限らない。 As shown in FIG. 2, in the first region 41, the first non-wiring metal foil pattern 53 is disposed so as to completely surround the first wiring metal foil pattern 51. As shown in FIG. 3, also in the second region 42, the second non-wiring metal foil pattern 54 is disposed so as to completely surround the second wiring metal foil pattern 52. 2 and 3, the first region 41 and the second region 42 are indicated by thin solid lines, but these regions are conceptual. The thin solid lines defined as the first area 41 and the second area 42 indicate areas. A boundary line corresponding to the thin solid line is not always drawn on the surface of the resin layer portion.
　本実施の形態で説明したような樹脂多層基板の製造方法については、後述する。
　本実施の形態では、第１非配線金属箔パターン５３と第２非配線金属箔パターン５４とが超音波接合によって接合されているので、第１領域４１と第２領域４２との接合が補強される。特に、第１非配線金属箔パターン５３と第２非配線金属箔パターン５４との間は、ハンダなどを用いた接合ではなく超音波接合によって接合されているので、ハンダによる短絡のおそれがない。樹脂多層基板同士の接合時のハンダによる短絡を回避することができ、樹脂多層基板同士の接合部やその周辺における端子の狭ギャップ化や高密度配線が可能となる。 A method for manufacturing the resin multilayer substrate as described in this embodiment will be described later.
In the present embodiment, since the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are bonded by ultrasonic bonding, the bonding between the first region 41 and the second region 42 is reinforced. The In particular, since the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are bonded by ultrasonic bonding rather than bonding using solder or the like, there is no possibility of short circuit due to solder. It is possible to avoid a short circuit due to solder when the resin multilayer substrates are joined together, and it is possible to narrow the gap between terminals at the joint portion between the resin multilayer substrates and the periphery thereof and to perform high-density wiring.
　本実施の形態で示したように、第１非配線金属箔パターン５３および第２非配線金属箔パターン５４は、平面的に見て、第１配線金属箔パターン５１を囲むように配置されていることが好ましい。このように取り囲んだ構成となっていれば、第１配線金属箔パターン５１への外部からの水分の侵入を、第１非配線金属箔パターン５３と第２非配線金属箔パターン５４との間の接合によって遮断することができるからである。 As shown in the present embodiment, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are arranged so as to surround the first wiring metal foil pattern 51 in plan view. It is preferable. If it is the structure surrounded in this way, the penetration | invasion of the water | moisture content from the exterior to the 1st wiring metal foil pattern 51 is between the 1st non-wiring metal foil pattern 53 and the 2nd non-wiring metal foil pattern 54. It is because it can interrupt | block by joining.
　なお、本実施の形態で示したように、第２樹脂層部３２は、第２領域４２内に第２非配線金属箔パターン５４とは別に配置された第２配線金属箔パターン５２を有し、第１配線金属箔パターン５１と第２配線金属箔パターン５２とは互いに当接することによって電気的に接続されていることが好ましい。この構成を採用することにより、樹脂層部同士の間の電気的接続を確保しつつ、ハンダによる短絡のおそれなく、非配線金属箔パターン同士の超音波接合によって樹脂層部同士の接合強度を増すことができる。 As shown in the present embodiment, the second resin layer portion 32 has a second wiring metal foil pattern 52 arranged separately from the second non-wiring metal foil pattern 54 in the second region 42. The first wiring metal foil pattern 51 and the second wiring metal foil pattern 52 are preferably electrically connected by being in contact with each other. By adopting this configuration, it is possible to increase the bonding strength between the resin layer portions by ultrasonic bonding of the non-wiring metal foil patterns without fear of a short circuit due to solder while ensuring electrical connection between the resin layer portions. be able to.
　このとき、第１配線金属箔パターン５１と第２配線金属箔パターン５２とは、単に当接するだけでなく、互いに超音波接合されていることが好ましい。第１非配線金属箔パターン５３と第２非配線金属箔パターン５４とを超音波接合する際に、同時に第１配線金属箔パターン５１と第２配線金属箔パターン５２との間も超音波接合されてもよい。樹脂層が熱可塑性樹脂などのように可撓性を有する場合には、可撓性が低い基板同士を接合する場合に比べて安定的な超音波接合を実施することが難しいが、第１配線金属箔パターン５１と第２配線金属箔パターン５２との間に加えて、第１非配線金属箔パターン５３と第２非配線金属箔パターン５４との間も超音波接合することにより、強固な接合を行ないやすくなる。 At this time, it is preferable that the first wiring metal foil pattern 51 and the second wiring metal foil pattern 52 are not simply brought into contact with each other but are ultrasonically bonded to each other. When the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are ultrasonically bonded, the first wiring metal foil pattern 51 and the second wiring metal foil pattern 52 are also ultrasonically bonded simultaneously. May be. When the resin layer has flexibility such as a thermoplastic resin, it is difficult to perform stable ultrasonic bonding as compared with the case where substrates having low flexibility are bonded to each other. Strong bonding is achieved by ultrasonic bonding between the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 in addition to between the metal foil pattern 51 and the second wiring metal foil pattern 52. Is easier to do.
　本実施の形態では、第１樹脂層部３１と第２樹脂層部３２とは、平面的に見てほぼ同じサイズかつ同じ形状のものとして説明しているが、これは説明の便宜のために単純化したものである。平面的に見たときの両者のサイズおよび外形は異なっていてもよい。 In the present embodiment, the first resin layer portion 31 and the second resin layer portion 32 are described as having substantially the same size and the same shape in plan view, but this is for convenience of description. It is a simplification. Both sizes and external shapes may be different when viewed in plan.
　図２に示した例では、第１領域４１において第１非配線金属箔パターン５３は第１配線金属箔パターン５１を完全に取り囲むように配置されていたが、このような構成に限らず、図４に示すようなものであってもよい。すなわち、第１領域４１において第１非配線金属箔パターン５３は第１配線金属箔パターン５１を断続的に取り囲むものであってもよい。断続的に取り囲む構成だけでなく、部分的に取り囲む構成であってもよい。 In the example shown in FIG. 2, the first non-wiring metal foil pattern 53 is disposed so as to completely surround the first wiring metal foil pattern 51 in the first region 41. 4 may be used. That is, in the first region 41, the first non-wiring metal foil pattern 53 may intermittently surround the first wiring metal foil pattern 51. Not only the structure surrounding intermittently but the structure surrounding partially may be sufficient.
　配線となる金属箔パターンを非配線金属箔パターンがたとえ部分的にであっても取り囲むように配置されることにより、非配線金属箔パターンがシールドとして保護する効果が期待される。第１非配線金属箔パターンと第２非配線金属箔パターンとが重なっている部分においては金属箔パターンの厚みが大きくなるのと同然であるので、シールド抵抗が下がり、シールド性能が向上する。 The effect of protecting the non-wiring metal foil pattern as a shield is expected by arranging the metal foil pattern to be the wiring so as to surround even if the non-wiring metal foil pattern is partially. In the portion where the first non-wiring metal foil pattern and the second non-wiring metal foil pattern are overlapped, the thickness of the metal foil pattern is almost the same, so that the shield resistance is lowered and the shielding performance is improved.
　（実施の形態２）
　図５～図７を参照して、本発明に基づく実施の形態２における樹脂多層基板について説明する。本実施の形態における樹脂多層基板１０２の断面図を図５に示す。樹脂多層基板１０２は、第１樹脂層部３１と第２樹脂層部３２とを接合したものであるが、このうち第１樹脂層部３１のみを取り出した状態の平面図を図６に示す。さらに第２樹脂層部３２のみを取り出した状態の下面図を図７に示す。 (Embodiment 2)
With reference to FIGS. 5 to 7, a resin multilayer substrate according to the second embodiment of the present invention will be described. FIG. 5 shows a cross-sectional view of the resin multilayer substrate 102 in the present embodiment. The resin multilayer substrate 102 is obtained by joining the first resin layer portion 31 and the second resin layer portion 32. FIG. 6 shows a plan view of the state in which only the first resin layer portion 31 is taken out. Furthermore, FIG. 7 shows a bottom view of the state where only the second resin layer portion 32 is taken out.
　第１領域４１において第１非配線金属箔パターン５３は２つの部分からなり、これらの２つの部分は、第１配線金属箔パターン５１を挟んで互いに対向するように配置されている。言い換えれば、第１非配線金属箔パターン５３は２方から第１配線金属箔パターン５１を挟むように配置されている。第２領域４２においても同様である。すなわち、第２非配線金属箔パターン５４は２つの部分からなり、第２配線金属箔パターン５２を挟んで互いに対向するように配置されている。 In the first region 41, the first non-wiring metal foil pattern 53 is composed of two parts, and these two parts are arranged to face each other with the first wiring metal foil pattern 51 interposed therebetween. In other words, the first non-wiring metal foil pattern 53 is arranged so as to sandwich the first wiring metal foil pattern 51 from two directions. The same applies to the second region 42. That is, the second non-wiring metal foil pattern 54 is composed of two parts, and is disposed so as to face each other with the second wiring metal foil pattern 52 interposed therebetween.
　図６に示すように、第１非配線金属箔パターン５３は第１配線金属箔パターン５１に比べて長い線状となっている。図７に示すように、第２非配線金属箔パターン５４も第２配線金属箔パターン５２に比べて長い線状となっている。 As shown in FIG. 6, the first non-wiring metal foil pattern 53 has a longer linear shape than the first wiring metal foil pattern 51. As shown in FIG. 7, the second non-wiring metal foil pattern 54 also has a longer line shape than the second wiring metal foil pattern 52.
　第１非配線金属箔パターン５３および第２非配線金属箔パターン５４は、平面的に見て、第１配線金属箔パターン５１を最も近い基板端から隔てるように配置されている。 The first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are arranged so as to separate the first wiring metal foil pattern 51 from the nearest substrate end in a plan view.
　本実施の形態では、平面的に見て、非配線金属箔パターンが配線金属箔パターンを取り囲んでいるわけではないが、このような配置であっても、接合を補強し、水分の侵入を防ぐためには一定の効果を得ることができる。本実施の形態では、非配線金属箔パターンの面積を小さく抑えることができる。 In the present embodiment, the non-wiring metal foil pattern does not surround the wiring metal foil pattern in a plan view. However, even in such an arrangement, the bonding is reinforced and moisture intrusion is prevented. A certain effect can be obtained. In the present embodiment, the area of the non-wiring metal foil pattern can be kept small.
　図８に示すように、平面的に見て、非配線金属箔パターンが線状ではない構成であってもよい。このような構成であっても一定の効果を得ることはできる。ただし、図２、図４、図６で示したように、第１非配線金属箔パターン５３および第２非配線金属箔パターン５４は、平面的に見て線状であることが好ましい。非配線金属箔パターンは線状であった方が水分の侵入を効率良く防止することができるからである。 As shown in FIG. 8, the non-wiring metal foil pattern may not be linear when viewed in plan. Even with such a configuration, a certain effect can be obtained. However, as shown in FIGS. 2, 4, and 6, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are preferably linear in plan view. This is because if the non-wiring metal foil pattern is linear, it is possible to efficiently prevent moisture from entering.
　（実施の形態３）
　図９～図１３を参照して、本発明に基づく実施の形態３における樹脂多層基板について説明する。本実施の形態における樹脂多層基板１０３の外観を図９に示す。樹脂多層基板１０３の平面図を図１０に示す。樹脂多層基板１０３は、伝送線路を内蔵したものである。図９に示したように、樹脂多層基板１０３は、積層された複数の樹脂層２を含む。樹脂多層基板１０３は、第１樹脂層部３１と第２樹脂層部３２とを張り合わせた形となっている。図９に示した例では、全部で４層の樹脂層２が積層されており、そのうち下側の２層が第１樹脂層部３１であり、上側の２層が第２樹脂層部３２となっている。樹脂多層基板１０３から第２樹脂層部３２を取り去った状態の平面図を図１１に示す。 (Embodiment 3)
With reference to FIGS. 9 to 13, a resin multilayer substrate according to Embodiment 3 of the present invention will be described. The appearance of the resin multilayer substrate 103 in this embodiment is shown in FIG. A plan view of the resin multilayer substrate 103 is shown in FIG. The resin multilayer substrate 103 has a built-in transmission line. As shown in FIG. 9, the resin multilayer substrate 103 includes a plurality of resin layers 2 stacked. The resin multilayer substrate 103 has a shape in which the first resin layer portion 31 and the second resin layer portion 32 are bonded together. In the example shown in FIG. 9, a total of four resin layers 2 are laminated, of which the lower two layers are the first resin layer portions 31 and the upper two layers are the second resin layer portions 32. It has become. FIG. 11 shows a plan view of the state in which the second resin layer portion 32 has been removed from the resin multilayer substrate 103.
　図１０におけるＸＩＩ－ＸＩＩ線に関する矢視断面図を図１２に示す。図１０におけるＸＩＩＩ－ＸＩＩＩ線に関する矢視断面図を図１３に示す。第１樹脂層部３１は、第１群の複数の樹脂層２が積層されたものであり、最外面に第１領域を有し、第１領域内に第１配線金属箔パターン５１が配置されているものである。ここでいう第１領域は、第１樹脂部３１の上面の全体である。第１配線金属箔パターン５１は伝送線路の役割を果たす線状の導体パターンである。図１１に示した例では、３本の第１配線金属箔パターン５１が平行に配置されている。一方、第２樹脂部３２は、第２群の複数の樹脂層２が積層されたものであり、最外面に第２領域を有する。第２領域は、第２樹脂部３２の下面の全体である。 FIG. 12 is a cross-sectional view taken along the line XII-XII in FIG. FIG. 13 shows a cross-sectional view taken along line XIII-XIII in FIG. The first resin layer portion 31 is formed by laminating a plurality of resin layers 2 of the first group, has a first region on the outermost surface, and a first wiring metal foil pattern 51 is disposed in the first region. It is what. The first region here is the entire upper surface of the first resin portion 31. The first wiring metal foil pattern 51 is a linear conductor pattern serving as a transmission line. In the example shown in FIG. 11, three first wiring metal foil patterns 51 are arranged in parallel. On the other hand, the second resin portion 32 is formed by laminating a plurality of resin layers 2 of the second group, and has a second region on the outermost surface. The second region is the entire lower surface of the second resin portion 32.
　第１樹脂層部３１および第２樹脂層部３２は、第１領域と第２領域とが重なり合うようにして配置されている。すなわち、第１樹脂層部３１の上面の全体と第２樹脂層部３２の下面の全体とは重なり合っている。第１樹脂層部３１は、第１領域内すなわち上面内に第１配線金属箔パターン５１とは別に第１非配線金属箔パターン５３を有する。 The first resin layer portion 31 and the second resin layer portion 32 are arranged so that the first region and the second region overlap. That is, the entire upper surface of the first resin layer portion 31 and the entire lower surface of the second resin layer portion 32 overlap each other. The first resin layer portion 31 has a first non-wiring metal foil pattern 53 in addition to the first wiring metal foil pattern 51 in the first region, that is, the upper surface.
　第２樹脂層部３２は、第２領域内すなわち下面内に第１非配線金属箔パターン５３と重なり合う第２非配線金属箔パターン５４を有する。図１２に示すように、第１非配線金属箔パターン５３と第２非配線金属箔パターン５４とは超音波接合によって接合されている。 The second resin layer portion 32 has a second non-wiring metal foil pattern 54 that overlaps the first non-wiring metal foil pattern 53 in the second region, that is, the lower surface. As shown in FIG. 12, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are bonded by ultrasonic bonding.
　本実施の形態では、第１非配線金属箔パターン５３と第２非配線金属箔パターン５４とが超音波接合によって接合されているので、第１樹脂層部３１と第２樹脂層部３２との間の接合が補強される。この構成であれば、伝送線路を含む樹脂多層基板に対してねじりやひねりが加わった場合でも、第１非配線金属箔パターン５３と第２非配線金属箔パターン５４とが超音波接合によって接合された箇所があるので、剥離が生じる確率を低減することができる。 In the present embodiment, since the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are joined by ultrasonic bonding, the first resin layer portion 31 and the second resin layer portion 32 are The joint between them is reinforced. With this configuration, even when twisting or twisting is applied to the resin multilayer substrate including the transmission line, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are joined by ultrasonic bonding. Therefore, the probability of occurrence of peeling can be reduced.
　本実施の形態では、好ましいことに、複数の第１配線金属箔パターン５１が平行に配置されたさらに外側から挟むように同じく平行に２本の第１非配線金属箔パターン５３が配置されている。この２本の第１非配線金属箔パターン５３に対して第２樹脂層部３２側の２本の第２非配線金属箔パターン５４が重なって超音波接合されている。このような配置であることにより、伝送線の役割を果たす第１配線金属箔パターン５１への外部からの水分の侵入は、両側から防御されることとなる。 In the present embodiment, preferably, the two first non-wiring metal foil patterns 53 are arranged in parallel so as to be sandwiched from the outside where the plurality of first wiring metal foil patterns 51 are arranged in parallel. . The two second non-wiring metal foil patterns 54 on the second resin layer portion 32 side are ultrasonically bonded to the two first non-wiring metal foil patterns 53. With such an arrangement, the entry of moisture from the outside into the first wiring metal foil pattern 51 serving as a transmission line is protected from both sides.
　ここで挙げた、第１配線金属箔パターン５１の本数はあくまで一例であり、３以外の本数であってもよい。 The number of the first wiring metal foil patterns 51 mentioned here is merely an example, and the number may be other than three.
　（実施の形態４）
　図１４～図１７を参照して、本発明に基づく実施の形態４における樹脂多層基板について説明する。樹脂多層基板１０４の平面図を図１４に示す。図１４におけるＸＶ－ＸＶ線に関する矢視断面図を図１５に示す。図１４におけるＸＶＩ－ＸＶＩ線に関する矢視断面図を図１６に示す。 (Embodiment 4)
With reference to FIGS. 14 to 17, a resin multilayer substrate according to the fourth embodiment of the present invention will be described. A plan view of the resin multilayer substrate 104 is shown in FIG. FIG. 15 is a cross-sectional view taken along line XV-XV in FIG. FIG. 16 is a cross-sectional view taken along the line XVI-XVI in FIG.
　本実施の形態では、図１５に示すように、第１樹脂層部３１は、第１非配線金属箔パターン５３に対して内部から接続する層間接続導体６ａを備える。図１６における層間接続導体６ａの列を下から見た部分拡大図を図１７に示す。層間接続導体６ａの１つ１つは樹脂層２を厚み方向に貫通する導体であるが、樹脂多層基板１０４においては、図１６および図１７に示すように、多数の層間接続導体６ａが並べたように設けられている。多数の層間接続導体６ａによって導体の壁のような構造が形成されている。 In the present embodiment, as shown in FIG. 15, the first resin layer portion 31 includes an interlayer connection conductor 6 a that is connected to the first non-wiring metal foil pattern 53 from the inside. FIG. 17 is a partially enlarged view of the row of interlayer connection conductors 6a in FIG. 16 viewed from below. Each of the interlayer connection conductors 6a is a conductor that penetrates through the resin layer 2 in the thickness direction. On the resin multilayer substrate 104, as shown in FIGS. 16 and 17, a large number of interlayer connection conductors 6a are arranged. It is provided as follows. A structure like a conductor wall is formed by a large number of interlayer connection conductors 6a.
　本実施の形態では、第１非配線金属箔パターン５３と第２非配線金属箔パターン５４とが超音波接合によって接合されている箇所において、少なくとも第１非配線金属箔パターン５３に対して第１樹脂層部３１の内部から接続するように層間接続導体６ａが配置されていることにより、接合強度が増しており、伝送線路に対してねじりやひねりが加わった場合でも、層間剥離が生じにくい。また、層間接続導体６ａが壁状に配置されていることにより、外部からの水分の侵入を防止する効果も期待できる。 In the present embodiment, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are joined at least with respect to the first non-wiring metal foil pattern 53 at a location where they are joined by ultrasonic bonding. Since the interlayer connection conductor 6a is arranged so as to be connected from the inside of the resin layer portion 31, the bonding strength is increased, and even when twisting or twisting is applied to the transmission line, delamination does not easily occur. Further, since the interlayer connection conductor 6a is arranged in a wall shape, an effect of preventing moisture from entering from the outside can be expected.
　層間接続導体６ａが完全に連続した壁のように並べて配置されている構造に限らず、たとえ断続的または点状に配置されている構造であっても、ある程度の補強の効果は得ることができる。 Not only the structure in which the interlayer connection conductors 6a are arranged side by side like a completely continuous wall, but even in a structure in which the interlayer connection conductors 6a are arranged intermittently or in the form of dots, a certain degree of reinforcement effect can be obtained. .
　さらに好ましいことに、本実施の形態では、第２樹脂層部３２は、第２非配線金属箔パターン５４に対して内部から接続する層間接続導体６ｂを備える。この構成を採用することにより、第２樹脂層部３２の側からも補強することができる。第１樹脂層部３１の内部に層間接続導体６ａが配置され、かつ、第２樹脂層部３２の内部に層間接続導体６ｂが配置されていれば、上下両方から補強することができ、層間剥離や水分の侵入をより確実に防止することができる。 More preferably, in the present embodiment, the second resin layer portion 32 includes an interlayer connection conductor 6 b that is connected to the second non-wiring metal foil pattern 54 from the inside. By adopting this configuration, the second resin layer portion 32 can be reinforced. If the interlayer connection conductor 6a is disposed in the first resin layer portion 31 and the interlayer connection conductor 6b is disposed in the second resin layer portion 32, the interlayer connection conductor 6b can be reinforced from above and below, and delamination Intrusion of water and moisture can be prevented more reliably.
　また、このような厚み方向の寸法が大きい導体による部材が伝送線の脇に配置されることとなれば、シールド効果もより大きく期待できる。 Also, if a member made of a conductor having such a large dimension in the thickness direction is arranged beside the transmission line, a greater shielding effect can be expected.
　（実施の形態５）
　図１８～図２０を参照して、本発明に基づく実施の形態５における樹脂多層基板について説明する。本実施の形態における樹脂多層基板１０５の外観を図１８に示す。樹脂多層基板１０５は、２次元に広がる複数の導体パターンを内蔵したものである。図１８に示したように、樹脂多層基板１０５は、積層された複数の樹脂層２を含む。樹脂多層基板１０５は、第１樹脂層部３１と第２樹脂層部３２とを張り合わせた形となっている。樹脂多層基板１０５から第２樹脂層部３２を取り去った状態の平面図を図１９に示す。すなわち、図１９は第１樹脂層部３１の上面図でもある。図１８におけるＸＸ－ＸＸ線に関する矢視断面図を図２０に示す。 (Embodiment 5)
With reference to FIGS. 18 to 20, a resin multilayer substrate according to the fifth embodiment of the present invention will be described. An appearance of the resin multilayer substrate 105 in the present embodiment is shown in FIG. The resin multilayer substrate 105 has a plurality of conductive patterns extending in two dimensions. As shown in FIG. 18, the resin multilayer substrate 105 includes a plurality of resin layers 2 stacked. The resin multilayer substrate 105 has a shape in which the first resin layer portion 31 and the second resin layer portion 32 are bonded together. FIG. 19 shows a plan view of the resin multilayer substrate 105 with the second resin layer portion 32 removed. That is, FIG. 19 is also a top view of the first resin layer portion 31. FIG. 20 is a sectional view taken along the line XX-XX in FIG.
　ここでいう第１領域は、第１樹脂層部３１の上面の全体である。第２領域は、第２樹脂部３２の下面の全体である。第１樹脂層部３１および第２樹脂層部３２は、第１領域と第２領域とが重なり合うようにして配置されている。第１樹脂層部３１は、第１領域内すなわち上面内に第１配線金属箔パターン５１とは別に第１非配線金属箔パターン５３を有する。第１非配線金属箔パターン５３は、図１９に示すように、第１樹脂層部３１の上面の外縁部を取り囲むように設けられている。第１配線金属箔パターン５１は、第１樹脂層部３１の上面において、第１非配線金属箔パターン５３に取り囲まれた領域の内部に配置されている。第２樹脂層部３２は、第２領域内すなわち下面内に第１非配線金属箔パターン５３と重なり合う第２非配線金属箔パターン５４を有する。 Here, the first region is the entire upper surface of the first resin layer portion 31. The second region is the entire lower surface of the second resin portion 32. The 1st resin layer part 31 and the 2nd resin layer part 32 are arrange | positioned so that a 1st area | region and a 2nd area | region may overlap. The first resin layer portion 31 has a first non-wiring metal foil pattern 53 in addition to the first wiring metal foil pattern 51 in the first region, that is, the upper surface. As shown in FIG. 19, the first non-wiring metal foil pattern 53 is provided so as to surround the outer edge portion of the upper surface of the first resin layer portion 31. The first wiring metal foil pattern 51 is disposed inside the region surrounded by the first non-wiring metal foil pattern 53 on the upper surface of the first resin layer portion 31. The second resin layer portion 32 has a second non-wiring metal foil pattern 54 that overlaps the first non-wiring metal foil pattern 53 in the second region, that is, the lower surface.
　本実施の形態では、２次元的広がりを有するように配置された第１配線金属箔パターン５１の周囲を第１非配線金属箔パターン５３が取り囲み、この第１非配線金属箔パターン５３に対して第２樹脂層部３２の側から第２非配線金属箔パターン５４が超音波接合されているので、第１配線金属箔パターン５１が配置されている領域への水分侵入や層間剥離進行を効率良く防止することができる。 In the present embodiment, the first non-wiring metal foil pattern 53 surrounds the first wiring metal foil pattern 51 arranged so as to have a two-dimensional extension. Since the second non-wiring metal foil pattern 54 is ultrasonically bonded from the second resin layer portion 32 side, moisture intrusion and delamination progress to the region where the first wiring metal foil pattern 51 is arranged efficiently. Can be prevented.
　（実施の形態６）
　図２１を参照して、本発明に基づく実施の形態６における樹脂多層基板について説明する。 (Embodiment 6)
With reference to FIG. 21, a resin multilayer substrate according to the sixth embodiment of the present invention will be described.
　本実施の形態における樹脂多層基板１０６の基本的構成は、実施の形態５で説明した樹脂多層基板１０５と同じである。ただし、本実施の形態における樹脂多層基板は、図２１に示すように、第１樹脂層部３１が第１非配線金属箔パターン５３に対して内部から接続する層間接続導体６ａを備える。さらに第２樹脂層部３２が第２非配線金属箔パターン５４に対して内部から接続する層間接続導体６ｂを備える構成であってもよい。このように層間接続導体６ａまたは層間接続導体６ｂあるいはその両方を備えることとすれば、第１樹脂層部３１と第２樹脂層部３２との間の接合強度が増し、シールド効果も高くなる。 The basic configuration of the resin multilayer substrate 106 in the present embodiment is the same as that of the resin multilayer substrate 105 described in the fifth embodiment. However, as shown in FIG. 21, the resin multilayer substrate in the present embodiment includes an interlayer connection conductor 6 a in which the first resin layer portion 31 is connected to the first non-wiring metal foil pattern 53 from the inside. Further, the second resin layer portion 32 may include an interlayer connection conductor 6 b that is connected to the second non-wiring metal foil pattern 54 from the inside. If the interlayer connection conductor 6a and / or the interlayer connection conductor 6b are provided as described above, the bonding strength between the first resin layer portion 31 and the second resin layer portion 32 is increased, and the shielding effect is enhanced.
　（実施の形態７）
　実施の形態５，６では、第１非配線金属箔パターン５３および第２非配線金属箔パターン５４が第１樹脂層部３１の上面の外縁部を完全に連続して環状に取り囲んでいる構成となっていたが、完全に連続した環状でなくてもよい。 (Embodiment 7)
In the fifth and sixth embodiments, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 completely and continuously surround the outer edge portion of the upper surface of the first resin layer portion 31. However, it does not have to be a completely continuous ring.
　図２２を参照して、本発明に基づく実施の形態７における樹脂多層基板について説明する。本実施の形態における樹脂多層基板の基本的構成は実施の形態５で説明したものと同じである。ただし、本実施の形態における樹脂多層基板は、図２２に示すように、部分的に外縁部に沿った配置となっている。図２２は図１９に対応した図であり、樹脂多層基板のうちの第１樹脂層部３１を残して第２樹脂層部３２を取り去った状態の平面図である。この構成を採用することにより、配線の自由度を高めつつ、本発明の効果をある程度得ることができる。 Referring to FIG. 22, the resin multilayer substrate according to the seventh embodiment based on the present invention will be described. The basic configuration of the resin multilayer substrate in the present embodiment is the same as that described in the fifth embodiment. However, the resin multilayer substrate in the present embodiment is partially arranged along the outer edge as shown in FIG. FIG. 22 is a view corresponding to FIG. 19 and is a plan view showing a state in which the second resin layer portion 32 is removed while leaving the first resin layer portion 31 in the resin multilayer substrate. By adopting this configuration, the effects of the present invention can be obtained to some extent while increasing the degree of freedom of wiring.
　特に配線が基板の端面に接近している箇所において、選択的に非配線金属箔パターンを設けることとしてもよい。非配線金属箔パターンは、好ましくは端面と配線とを遮るように配置される。そのように配線が端面に接近している箇所は、外部からの剥離進展や水分侵入が危惧され、配線を保護する重要性が高いからである。 Particularly, a non-wiring metal foil pattern may be selectively provided in a place where the wiring is close to the end face of the substrate. The non-wiring metal foil pattern is preferably arranged so as to block the end face and the wiring. This is because the place where the wiring is close to the end face has a high importance of protecting the wiring because there is a concern about the peeling progress from the outside and moisture intrusion.
　図２２に示した例では、第１配線金属箔パターン５１が基板の端面に接近している箇所に、選択的に第１非配線金属箔パターン５３が配置されている。すなわち、図２２における左半分および右下の一部において第１非配線金属箔パターン５３が基板の外縁に沿うように配置されている。 In the example shown in FIG. 22, the first non-wiring metal foil pattern 53 is selectively disposed at a location where the first wiring metal foil pattern 51 is close to the end face of the substrate. That is, the first non-wiring metal foil pattern 53 is arranged along the outer edge of the substrate in the left half and the lower right part of FIG.
　（マット面およびシャイニー面）
　一般的に、樹脂多層基板を作製する際には、金属箔として銅箔が採用され、銅箔付き樹脂シート１２が用いられる。図２３に、銅箔付き樹脂シート１２の一部分を拡大した断面図を示す。銅箔付き樹脂シート１２の銅箔に必要なパターニングを施した後で、この樹脂シートを樹脂層として積層体をなすことによって所望の樹脂多層基板を作製する。図２３では、樹脂層２の一方の面に銅箔１７が付着している。銅箔付き樹脂シート１２に付着している銅箔１７は、マット面２８とシャイニー面２９とを有する。マット面２８とシャイニー面２９とは互いに表裏の関係にある。銅箔のうち、銅箔付き樹脂シート１２の時点から露出している側の面は表面粗さが小さく光沢のあるシャイニー面２９であり、逆に樹脂シート１２に接合されている側は表面粗さが大きいマット面２８となっている。銅箔付き樹脂シート１２の銅箔１７をパターニングして導体パターン７とした状態の一例を図２４に示す。シャイニー面２９は元々表面粗さが小さいため、他の樹脂シートに接合された場合であっても接合強度が低い。したがって、複数の樹脂多層基板を互いに接合した際に、導体パターン７のシャイニー面２９と樹脂層とが接合する箇所があると、層間剥離や水分侵入の起点となるおそれがあった。このことに対する何らかの対策が必要であった。 (Matte surface and shiny surface)
Generally, when producing a resin multilayer substrate, a copper foil is employed as a metal foil, and a resin sheet 12 with a copper foil is used. FIG. 23 shows an enlarged cross-sectional view of a part of the resin sheet 12 with copper foil. After performing necessary patterning on the copper foil of the resin sheet 12 with copper foil, a desired resin multilayer substrate is produced by forming a laminate using the resin sheet as a resin layer. In FIG. 23, the copper foil 17 is attached to one surface of the resin layer 2. The copper foil 17 attached to the resin sheet 12 with copper foil has a mat surface 28 and a shiny surface 29. The mat surface 28 and the shiny surface 29 are in a front-back relationship. Of the copper foil, the surface exposed from the time of the resin sheet 12 with the copper foil is a shiny surface 29 having a small surface roughness and gloss, and conversely, the surface bonded to the resin sheet 12 is the surface rough. The mat surface 28 is large. FIG. 24 shows an example of a state in which the copper foil 17 of the resin sheet with copper foil 12 is patterned to form a conductor pattern 7. Since the shiny surface 29 originally has a small surface roughness, the bonding strength is low even when it is bonded to another resin sheet. Therefore, when a plurality of resin multilayer substrates are joined to each other, if there is a place where the shiny surface 29 of the conductor pattern 7 and the resin layer are joined, there is a risk of delamination or moisture intrusion. Some countermeasures were necessary for this.
　この問題についても考慮した場合、これまでの実施の形態で述べた樹脂多層基板としては、以下のことがいえる。樹脂多層基板としては、前記第１非配線金属箔パターンおよび前記第２非配線金属箔パターンの各々は、第１の表面粗さを有して樹脂層に接合しているマット面と、前記第１の表面粗さより小さい第２の表面粗さを有して前記マット面とは反対の側を向く面であるシャイニー面とを有し、前記第１樹脂層部と前記第２樹脂層部とは、前記第１非配線金属箔パターンの前記シャイニー面と前記第２非配線金属箔パターンの前記シャイニー面とが互いに当接するように接合されていることが好ましい。この構成となっていることにより、シャイニー面同士の間で良好な超音波接合をなすことができる。また、シャイニー面と樹脂層とが接合する箇所を減らすことができるので、層間剥離や水分侵入の起点となる要因を減らすことができる。 In consideration of this problem, the following can be said as the resin multilayer substrate described in the above embodiments. As the resin multilayer substrate, each of the first non-wiring metal foil pattern and the second non-wiring metal foil pattern includes a mat surface having a first surface roughness and bonded to a resin layer, A first surface layer having a second surface roughness smaller than the first surface roughness and having a shiny surface that faces away from the mat surface, and the first resin layer portion and the second resin layer portion, Are preferably joined so that the shiny surface of the first non-wiring metal foil pattern and the shiny surface of the second non-wiring metal foil pattern are in contact with each other. With this configuration, good ultrasonic bonding can be achieved between the shiny surfaces. In addition, since the number of points where the shiny surface and the resin layer are joined can be reduced, it is possible to reduce the factors that cause the delamination and moisture intrusion.
　前記第１樹脂層部および前記第２樹脂層部の各々において、前記第１樹脂層部と前記第２樹脂層部とが互いに接する面に露出するシャイニー面は、全て相手側のシャイニー面と対向して接していることが好ましい。この場合、樹脂シート１２を積層する際には、シャイニー面２９と樹脂層とが当接することはなく、図２５に示すように必ずシャイニー面２９同士が合わさることとなる。この構成を採用することにより、シャイニー面２９は必ずシャイニー面２９との間で接することとなり、シャイニー面と樹脂層とが接合する箇所を無くすことができるので、従来はシャイニー面と樹脂層との接合部に起因して発生していた層間剥離や水分侵入を防止することができる。 In each of the first resin layer portion and the second resin layer portion, the shiny surface exposed on the surface where the first resin layer portion and the second resin layer portion are in contact with each other is all opposed to the opposite shiny surface. Are preferably in contact with each other. In this case, when the resin sheets 12 are laminated, the shiny surface 29 and the resin layer do not come into contact with each other, and the shiny surfaces 29 are always brought together as shown in FIG. By adopting this configuration, the shiny surface 29 is always in contact with the shiny surface 29, and the location where the shiny surface and the resin layer are joined can be eliminated. It is possible to prevent delamination and moisture intrusion that have occurred due to the joint.
　なお、これまで説明したいずれの実施の形態においてもいえることであるが、第１非配線金属箔パターン５３および第２非配線金属箔パターン５４は、銅箔によって形成されていることが好ましい。この構成であれば、材料となる銅箔付き樹脂シートが容易に調達可能であり、加工も容易である。 In addition, as can be said in any of the embodiments described so far, the first non-wiring metal foil pattern 53 and the second non-wiring metal foil pattern 54 are preferably formed of copper foil. If it is this structure, the resin sheet with a copper foil used as a material can be procured easily, and a process is also easy.
　（製造方法）
　なお、これまで説明したいずれの実施の形態に関しても、樹脂多層基板に含まれる樹脂層部は以下のように作製することができる。ここでは、導体箔付き樹脂シートの一例として銅箔付き樹脂シート１２を用いる。 (Production method)
In any of the embodiments described so far, the resin layer portion included in the resin multilayer substrate can be manufactured as follows. Here, the resin sheet 12 with copper foil is used as an example of the resin sheet with conductor foil.
　まず、図２６に示すような銅箔付き樹脂シート１２を用意する。銅箔付き樹脂シート１２は、樹脂層２の片面に銅箔１７が付着した構造のシートである。樹脂層２は、たとえば熱可塑性樹脂からなる。熱可塑性樹脂は、たとえばＬＣＰ（液晶ポリマー）である。樹脂層２の材料となる熱可塑性樹脂としては、ＬＣＰの他に、ＰＥＥＫ（ポリエーテルエーテルケトン）、ＰＥＩ（ポリエーテルイミド）、ＰＰＳ（ポニフェニレンスルファイド）、熱可塑性ＰＩ（ポリイミド）などであってもよい。銅箔１７は、Ｃｕからなる厚さ１８μｍの箔である。なお、ここでは導体箔の一例として銅箔１７としたが、銅箔以外の導体箔として、Ａｇ、Ａｌ、ＳＵＳ、Ｎｉ、Ａｕであってもよく、導体箔は、Ｃｕ、Ａｇ、Ａｌ、ＳＵＳ、Ｎｉ、Ａｕのうちから選択された２以上の異なる金属の合金であってもよい。ここでは、銅箔１７は厚さ１８μｍとしたが、銅箔１７の厚みは３μｍ以上４０μｍ以下程度であってよい。銅箔１７は、回路形成が可能な厚みであればよい。 First, a resin sheet 12 with a copper foil as shown in FIG. 26 is prepared. The resin sheet 12 with copper foil is a sheet having a structure in which the copper foil 17 is attached to one surface of the resin layer 2. The resin layer 2 is made of, for example, a thermoplastic resin. The thermoplastic resin is, for example, LCP (liquid crystal polymer). Examples of the thermoplastic resin used as the material of the resin layer 2 include PEEK (polyether ether ketone), PEI (polyether imide), PPS (poniphenylene sulfide), and thermoplastic PI (polyimide) in addition to LCP. May be. The copper foil 17 is a 18 μm thick foil made of Cu. Here, the copper foil 17 is used as an example of the conductive foil, but the conductive foil other than the copper foil may be Ag, Al, SUS, Ni, Au, and the conductive foil may be Cu, Ag, Al, SUS. It may be an alloy of two or more different metals selected from Ni, Au. Here, the copper foil 17 has a thickness of 18 μm, but the thickness of the copper foil 17 may be about 3 μm or more and 40 μm or less. The copper foil 17 should just be the thickness which can form a circuit.
　図２７に示すように、銅箔１７と反対の側からレーザ光を照射するなどの方法によって、樹脂層２にビア孔１１をあける。レーザ光はたとえば炭酸ガスレーザ光であってよい。ビア孔１１はのちにビア導体を形成するためのものである。ビア孔１１は、樹脂層２を貫通しているが銅箔１７を貫通していない。 As shown in FIG. 27, a via hole 11 is formed in the resin layer 2 by a method such as irradiating a laser beam from the side opposite to the copper foil 17. The laser beam may be, for example, a carbon dioxide laser beam. The via hole 11 is for forming a via conductor later. The via hole 11 penetrates the resin layer 2 but does not penetrate the copper foil 17.
　図２８に示すように、銅箔１７がある側の面にレジストパターン１３を形成する。レジストパターン１３の形成はたとえば印刷によって行なうことができる。図２９に示すようにレジストパターン１３をマスクとして銅箔１７のエッチングを行ない、導体パターン７を形成する。銅箔１７のエッチングは酸により行なうことができる。銅箔１７のエッチングが完了した後にアルカリ液によりレジストパターン１３を剥離させ、その後に中和処理を行なう。こうして図３０に示す構造を得る。ここでは、ビア孔１１を先に形成してから導体パターン７を形成したが、導体パターン７を先に形成してからビア孔１１を形成してもよい。ビア孔１１に導体ペーストを充填し、図３１に示すように層間接続導体６を形成する。 28, a resist pattern 13 is formed on the surface on which the copper foil 17 is present. The resist pattern 13 can be formed, for example, by printing. As shown in FIG. 29, the copper foil 17 is etched using the resist pattern 13 as a mask to form the conductor pattern 7. The etching of the copper foil 17 can be performed with an acid. After the etching of the copper foil 17 is completed, the resist pattern 13 is peeled off with an alkaline solution, and then neutralization is performed. In this way, the structure shown in FIG. 30 is obtained. Here, the conductor pattern 7 is formed after the via hole 11 is formed first, but the via hole 11 may be formed after the conductor pattern 7 is formed first. The via hole 11 is filled with a conductive paste to form an interlayer connection conductor 6 as shown in FIG.
　この樹脂層２に対して、図３２に示すように他の樹脂層２を上から重ねる。その結果、図３３に示すようになる。所望の導体パターンを有する樹脂層２を必要な数だけ積層することによって、図３４に示すように積層体を得る。図３４に示した例では、全４層を積層しているが、層数は他の数であってもよい。積層する際には、１層重ねるごとに仮圧着を行なってもよい。図３４に示した例では、下から１～２層目と下から３～４層目とで樹脂層２の向きを違えている。これにより、下から２層目と３層目との間の界面では層間接続導体６の広くなった面同士が当接する構造となっている。これはあくまで一例であって、このような重ね方に限るものではない。積層体はこのように樹脂層２の表裏の向きが切り替わる箇所を途中に含んでいてもよい。積層体は全ての樹脂層２が同じ向きで積層された構成であってもよい。 The other resin layer 2 is overlaid on the resin layer 2 as shown in FIG. As a result, it becomes as shown in FIG. By laminating a required number of resin layers 2 having a desired conductor pattern, a laminate is obtained as shown in FIG. In the example shown in FIG. 34, all four layers are stacked, but the number of layers may be other numbers. When stacking, temporary pressing may be performed every time one layer is stacked. In the example shown in FIG. 34, the direction of the resin layer 2 is different between the first and second layers from the bottom and the third and fourth layers from the bottom. As a result, the widened surfaces of the interlayer connection conductor 6 are in contact with each other at the interface between the second layer and the third layer from the bottom. This is merely an example, and is not limited to such an overlapping method. The laminate may include a portion where the front and back directions of the resin layer 2 are switched in this way. The laminated body may have a configuration in which all the resin layers 2 are laminated in the same direction.
　必要な数だけ積層した後で、この積層体の全体を樹脂層２のガラス転移温度を超えない温度（たとえば２５０℃以上３００℃以下）で加熱しつつ加圧する。この作業によって樹脂層２同士を圧着させ、積層体の全体を一体化する。このようにして、図３４に示すように第１樹脂層部３１を得ることができる。図３４に示した例では、最下面に露出する導体パターン７は外部電極１８となっている。最上面の樹脂層２の上面には、導体パターン７の一形態として、第１配線金属箔パターン５１および第１非配線金属箔パターン５３が形成されている。このようにして得た第１樹脂層部３１を別途作製した第２樹脂層部３２と組み合わせて図３５に示すように超音波接合装置に設置する。図３５では、第１樹脂層部３１と第２樹脂層部３２と部分的に重ねた状態で両者の間の超音波接合を行なっている。ベース６１の上面には摩擦力を増して対象物を保持するための凹凸が形成されている。ツール６２の下面にも摩擦力を増して対象物を保持するための凹凸が形成されている。第１樹脂層部３１と第２樹脂層部３２とを部分的に重ねた状態で、矢印９１に示すように加圧し、矢印９２に示すように相対的に超音波振動を加える。こうすることによって、第１非配線金属箔パターンと第２非配線金属箔パターンとの間で超音波接合がなされる。こうして、所望の樹脂多層基板が得られる。ここで示した例では、図１に示したような樹脂多層基板１０１を得ることができる。 After the necessary number of layers are laminated, the whole laminate is pressurized while being heated at a temperature not exceeding the glass transition temperature of the resin layer 2 (for example, 250 ° C. or more and 300 ° C. or less). By this operation, the resin layers 2 are pressed together to integrate the entire laminate. In this way, the first resin layer portion 31 can be obtained as shown in FIG. In the example shown in FIG. 34, the conductor pattern 7 exposed on the lowermost surface is the external electrode 18. A first wiring metal foil pattern 51 and a first non-wiring metal foil pattern 53 are formed as one form of the conductor pattern 7 on the upper surface of the uppermost resin layer 2. The first resin layer portion 31 obtained in this way is combined with the separately prepared second resin layer portion 32 and installed in an ultrasonic bonding apparatus as shown in FIG. In FIG. 35, ultrasonic bonding is performed between the first resin layer portion 31 and the second resin layer portion 32 in a partially overlapped state. Concavities and convexities are formed on the upper surface of the base 61 to increase the frictional force and hold the object. Concavities and convexities are formed on the lower surface of the tool 62 to increase the frictional force and hold the object. In a state where the first resin layer portion 31 and the second resin layer portion 32 are partially overlapped, pressure is applied as indicated by an arrow 91 and relatively ultrasonic vibration is applied as indicated by an arrow 92. By doing so, ultrasonic bonding is performed between the first non-wiring metal foil pattern and the second non-wiring metal foil pattern. In this way, a desired resin multilayer substrate is obtained. In the example shown here, the resin multilayer substrate 101 as shown in FIG. 1 can be obtained.
　なお、第１非配線金属箔パターンと第２非配線金属箔パターンとの間での超音波接合は、たとえば以下の条件で行なうことができる。 Note that the ultrasonic bonding between the first non-wiring metal foil pattern and the second non-wiring metal foil pattern can be performed, for example, under the following conditions.
　荷重：１００～２００Ｎ
　ホーン振幅：３０～３５μｍｐ－ｐ
　接合時間：０．１５～０．３秒
　基板加熱：なし（常温）
　他の実施の形態で示した樹脂多層基板についても、同様の考え方を適用して作製することができる。すなわち、樹脂層を積み重ねて一体化することによって必要な複数の樹脂層部をまずそれぞれ別箇に作製し、これらの樹脂層部同士を組み合わせて超音波接合をすることによって樹脂多層基板として完成させることができる。第１樹脂層部３１と第２樹脂層部３２との間で、非配線金属箔パターン同士の他に、配線金属箔パターン同士も互いに対向して当接する場合には、非配線金属箔パターン同士の超音波接合の際に配線金属箔パターン同士の超音波接合も同時に行なわれてもよい。 Load: 100-200N
Horn amplitude: 30-35μmp-p
Bonding time: 0.15 to 0.3 seconds Substrate heating: None (room temperature)
The same concept can be applied to the resin multilayer substrates described in other embodiments. That is, a plurality of necessary resin layer portions are first prepared separately by stacking and integrating resin layers, and a resin multilayer substrate is completed by combining these resin layer portions and performing ultrasonic bonding. be able to. When the wiring metal foil patterns are in contact with each other in addition to the non-wiring metal foil patterns between the first resin layer portion 31 and the second resin layer portion 32, the non-wiring metal foil patterns are in contact with each other. In the ultrasonic bonding, ultrasonic bonding of the wiring metal foil patterns may be performed at the same time.
　図３５においては、２つの樹脂層部を部分的に重ねていたが、図９に示した樹脂多層基板１０３や、図１８に示した樹脂多層基板１０５のようなものを得ようとする場合には、２つの樹脂層部の全面同士を張り合わせることが求められる。この場合、全面を一括して覆うような面積のベース６１およびツール６２を用いて一括して圧力および超音波振動を加えてもよい。２つの樹脂層部の全面同士を張り合わせる場合であっても、限られた面積のベース６１およびツール６２を用いて樹脂層部に対して相対移動を繰返しながら部分ごとに超音波接合を行なうことによって全面同士を張り合わせてもよい。ただし、樹脂層部の内部で超音波接合という現象が実際に生じるのは、金属同士が当接している箇所であるので、接合すべき非配線金属箔パターンが位置する部分を狙って選択的に圧力および超音波振動を加えてもよい。 In FIG. 35, two resin layer portions are partially overlapped. However, when trying to obtain the resin multilayer substrate 103 shown in FIG. 9 or the resin multilayer substrate 105 shown in FIG. Is required to bond the entire surfaces of the two resin layer portions together. In this case, pressure and ultrasonic vibration may be applied collectively using the base 61 and the tool 62 having an area that covers the entire surface. Even when the entire surfaces of two resin layer portions are bonded together, ultrasonic bonding is performed for each portion while repeatedly moving relative to the resin layer portion using the base 61 and the tool 62 having a limited area. You may stick together the whole surface. However, since the phenomenon of ultrasonic bonding actually occurs inside the resin layer part is a place where the metals are in contact with each other, selectively aiming at the part where the non-wiring metal foil pattern to be bonded is located Pressure and ultrasonic vibration may be applied.
　なお、今回開示した上記実施の形態はすべての点で例示であって制限的なものではない。本発明の範囲は上記した説明ではなくて請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更を含むものである。 It should be noted that the above-described embodiment disclosed herein is illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　２　樹脂層、６，６ａ，６ｂ　層間接続導体、７　導体パターン、１１　ビア孔、１２　銅箔付き樹脂シート、１３　レジストパターン、１７　銅箔、１８　外部電極、２８　マット面、２９　シャイニー面、３１　第１樹脂層部、３２　第２樹脂層部、４１　第１領域、４２　第２領域、５１　第１配線金属箔パターン、５２　第２配線金属箔パターン、５３　第１非配線金属箔パターン、５４　第２非配線金属箔パターン、６１　ベース、６２　ツール、９１，９２　矢印、１０１，１０２，１０３，１０４，１０５，１０６　樹脂多層基板。 2 resin layer, 6, 6a, 6b, interlayer connection conductor, 7 conductor pattern, 11 via hole, 12 resin sheet with copper foil, 13 resist pattern, 17 copper foil, 18 external electrode, 28 mat surface, 29 shiny surface, 31st 1 resin layer part, 32 second resin layer part, 41 first region, 42 second region, 51 first wiring metal foil pattern, 52 second wiring metal foil pattern, 53 first non-wiring metal foil pattern, 54 second Non-wiring metal foil pattern, 61 base, 62 tools, 91, 92 arrows, 101, 102, 103, 104, 105, 106 resin multilayer substrate.

Claims (10)

  1. 　１つの樹脂層または第１群の複数の樹脂層が積層されたものであり、最外面に第１領域を有し、前記第１領域内に第１配線金属箔パターンが配置されている第１樹脂層部と、
    　１つの樹脂層または第２群の複数の樹脂層が積層されたものであり、最外面に第２領域を有する第２樹脂層部とを備え、
    　前記第１樹脂層部および前記第２樹脂層部は、前記第１領域と前記第２領域とが重なり合うようにして配置されており、
    　前記第１樹脂層部は、前記第１領域内に前記第１配線金属箔パターンとは別に第１非配線金属箔パターンを有し、
    　前記第２樹脂層部は、前記第２領域内に前記第１非配線金属箔パターンと重なり合う第２非配線金属箔パターンを有し、
    　前記第１非配線金属箔パターンと前記第２非配線金属箔パターンとは超音波接合によって接合されている、樹脂多層基板。     A first resin layer or a plurality of resin layers of a first group is laminated, has a first region on the outermost surface, and a first wiring metal foil pattern is disposed in the first region. A resin layer,
    One resin layer or a plurality of resin layers of the second group are laminated, and includes a second resin layer portion having a second region on the outermost surface,
    The first resin layer portion and the second resin layer portion are arranged such that the first region and the second region overlap,
    The first resin layer portion has a first non-wiring metal foil pattern separately from the first wiring metal foil pattern in the first region,
    The second resin layer portion has a second non-wiring metal foil pattern overlapping the first non-wiring metal foil pattern in the second region,
    A resin multilayer substrate in which the first non-wiring metal foil pattern and the second non-wiring metal foil pattern are bonded by ultrasonic bonding.
  2. 　前記第１非配線金属箔パターンおよび前記第２非配線金属箔パターンは、平面的に見て、前記第１配線金属箔パターンを最も近い基板端から隔てるように配置されている、請求項１に記載の樹脂多層基板。 The first non-wiring metal foil pattern and the second non-wiring metal foil pattern are disposed so as to separate the first wiring metal foil pattern from the nearest substrate end in a plan view. The resin multilayer substrate described.
  3. 　前記第１非配線金属箔パターンおよび前記第２非配線金属箔パターンは、平面的に見て線状である、請求項２に記載の樹脂多層基板。 3. The resin multilayer substrate according to claim 2, wherein the first non-wiring metal foil pattern and the second non-wiring metal foil pattern are linear in plan view.
  4. 　前記第１非配線金属箔パターンおよび前記第２非配線金属箔パターンは、平面的に見て、前記第１配線金属箔パターンを囲むように配置されている、請求項１から３のいずれかに記載の樹脂多層基板。 The first non-wiring metal foil pattern and the second non-wiring metal foil pattern are arranged so as to surround the first wiring metal foil pattern in a plan view. The resin multilayer substrate described.
  5. 　前記第２樹脂層部は、前記第２領域内に前記第２非配線金属箔パターンとは別に配置された第２配線金属箔パターンを有し、前記第１配線金属箔パターンと前記第２配線金属箔パターンとは互いに当接することによって電気的に接続されている、請求項１から４のいずれかに記載の樹脂多層基板。 The second resin layer portion has a second wiring metal foil pattern arranged separately from the second non-wiring metal foil pattern in the second region, and the first wiring metal foil pattern and the second wiring The resin multilayer substrate according to any one of claims 1 to 4, which is electrically connected to the metal foil pattern by being in contact with each other.
  6. 　前記第１配線金属箔パターンと前記第２配線金属箔パターンとは、互いに超音波接合されている、請求項５に記載の樹脂多層基板。 The resin multilayer substrate according to claim 5, wherein the first wiring metal foil pattern and the second wiring metal foil pattern are ultrasonically bonded to each other.
  7. 　前記第１樹脂層部は、前記第１非配線金属箔パターンに対して内部から接続する層間接続導体を備える、請求項１から６のいずれかに記載の樹脂多層基板。 The resin multilayer substrate according to any one of claims 1 to 6, wherein the first resin layer portion includes an interlayer connection conductor connected from the inside to the first non-wiring metal foil pattern.
  8. 　前記第２樹脂層部は、前記第２非配線金属箔パターンに対して内部から接続する層間接続導体を備える、請求項１から７のいずれかに記載の樹脂多層基板。 The resin multilayer substrate according to any one of claims 1 to 7, wherein the second resin layer portion includes an interlayer connection conductor connected from the inside to the second non-wiring metal foil pattern.
  9. 　前記第１非配線金属箔パターンおよび前記第２非配線金属箔パターンの各々は、第１の表面粗さを有して樹脂層に接合しているマット面と、前記第１の表面粗さより小さい第２の表面粗さを有して前記マット面とは反対の側を向く面であるシャイニー面とを有し、前記第１樹脂層部と前記第２樹脂層部とは、前記第１非配線金属箔パターンの前記シャイニー面と前記第２非配線金属箔パターンの前記シャイニー面とが互いに当接するように接合されている、請求項１から８のいずれかに記載の樹脂多層基板。 Each of the first non-wiring metal foil pattern and the second non-wiring metal foil pattern has a mat surface that has a first surface roughness and is bonded to the resin layer, and is smaller than the first surface roughness. A first surface layer having a second surface roughness and a shiny surface facing away from the mat surface, wherein the first resin layer portion and the second resin layer portion are the first The resin multilayer substrate according to any one of claims 1 to 8, wherein the shiny surface of the wiring metal foil pattern and the shiny surface of the second non-wiring metal foil pattern are joined so as to contact each other.
  10. 　前記第１樹脂層部および前記第２樹脂層部の各々において、前記第１樹脂層部と前記第２樹脂層部とが互いに接する面に露出するシャイニー面は、全て相手側のシャイニー面と対向して接している、請求項９に記載の樹脂多層基板。 In each of the first resin layer portion and the second resin layer portion, the shiny surface exposed on the surface where the first resin layer portion and the second resin layer portion are in contact with each other is all opposed to the opposite shiny surface. The resin multilayer substrate according to claim 9, which is in contact with each other.
PCT/JP2015/073975 2014-09-09 2015-08-26 Resin multilayer substrate WO2016039139A1 (en)

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