BR112013033398A2 - placa de circuito e método para fabricar placa de circuito - Google Patents

placa de circuito e método para fabricar placa de circuito

Info

Publication number
BR112013033398A2
BR112013033398A2 BR112013033398A BR112013033398A BR112013033398A2 BR 112013033398 A2 BR112013033398 A2 BR 112013033398A2 BR 112013033398 A BR112013033398 A BR 112013033398A BR 112013033398 A BR112013033398 A BR 112013033398A BR 112013033398 A2 BR112013033398 A2 BR 112013033398A2
Authority
BR
Brazil
Prior art keywords
circuit board
metal plates
insulating core
core substrates
manufacturing
Prior art date
Application number
BR112013033398A
Other languages
English (en)
Inventor
Hiroaki Asano
Hitoshi Shimadu
Kiminori Ozaki
Masao Miyake
Ryou Yamauchi
Takahiro Hayakawa
Tetsuya Furuta
Tomoaki Asai
Yasuhiro Koike
Original Assignee
Toyota Jidoshokki Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Jidoshokki Kk filed Critical Toyota Jidoshokki Kk
Publication of BR112013033398A2 publication Critical patent/BR112013033398A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

resumo patente de invenção: "placa de circuito e método para fabricar placa de circuito". a presente invenção refere-se a uma placa de circuito (20), sobre a qual um componente eletrônico deve ser montado, que é provida com substratos de núcleo isolantes (40, 60) e placas metálicas modeladas (50, 70). as placas metálicas modeladas (50, 70) são coladas em pelo menos um lado dos substratos de núcleo isolantes (40, 60). os substratos de núcleo isolantes (40, 60) e placas metálicas (50, 70) formam um corpo laminado (s1), no qual é provido um furo de ventilação de gás. o furo de ventilação de gás é formado, de modo que, com o componente eletrônico (80) montado, o gás existente entre os substratos de núcleo isolantes (40, 60) e as placas metálicas (50, 70) se expande, e sendo liberado para um lado aberto, para a atmosfera, através de furo de ventilação de gás.
BR112013033398A 2011-07-06 2012-07-02 placa de circuito e método para fabricar placa de circuito BR112013033398A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011150265A JP5589979B2 (ja) 2011-07-06 2011-07-06 回路板
PCT/JP2012/066900 WO2013005720A1 (ja) 2011-07-06 2012-07-02 回路板、および回路板の製造方法

Publications (1)

Publication Number Publication Date
BR112013033398A2 true BR112013033398A2 (pt) 2017-01-24

Family

ID=47437069

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013033398A BR112013033398A2 (pt) 2011-07-06 2012-07-02 placa de circuito e método para fabricar placa de circuito

Country Status (9)

Country Link
US (1) US20140251659A1 (pt)
JP (1) JP5589979B2 (pt)
KR (1) KR101516531B1 (pt)
CN (1) CN103621190A (pt)
BR (1) BR112013033398A2 (pt)
DE (1) DE112012002850T5 (pt)
IN (1) IN2014CN00763A (pt)
TW (1) TWI448219B (pt)
WO (1) WO2013005720A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015026820A (ja) * 2013-06-18 2015-02-05 株式会社デンソー 電子装置
JP6309096B2 (ja) 2013-10-29 2018-04-11 キマ メディカル テクノロジーズ リミテッド アンテナシステムおよびデバイス、およびそれらの製造方法
US9980372B2 (en) * 2014-08-26 2018-05-22 Sharp Kabushiki Kaisha Camera module
WO2019030746A1 (en) 2017-08-10 2019-02-14 Zoll Medical Israel Ltd. SYSTEMS, DEVICES AND METHODS FOR PHYSIOLOGICAL MONITORING OF PATIENTS
WO2019146658A1 (ja) * 2018-01-24 2019-08-01 京セラ株式会社 配線基板、電子装置及び電子モジュール
WO2022108386A1 (ko) * 2020-11-20 2022-05-27 엘지이노텍 주식회사 회로 기판

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5789294A (en) * 1980-11-25 1982-06-03 Matsushita Electric Ind Co Ltd Printed circuit board
JPS61173157U (pt) * 1985-04-16 1986-10-28
JPS6377730A (ja) * 1986-09-22 1988-04-07 Hitachi Ltd 多層基板
JPH1131876A (ja) * 1997-07-10 1999-02-02 Murata Mfg Co Ltd 回路基板
JP2001257437A (ja) * 2000-03-10 2001-09-21 Denso Corp 電子回路基板及びその製造方法
JP4165045B2 (ja) * 2000-09-19 2008-10-15 松下電器産業株式会社 電子機器
JP2002111231A (ja) * 2000-10-03 2002-04-12 Toppan Printing Co Ltd 多層プリント配線板
CN100488336C (zh) * 2003-05-22 2009-05-13 电力波技术公司 使用了焊料排气孔的电路板组件
JP2005339518A (ja) * 2004-04-28 2005-12-08 Dainippon Printing Co Ltd 非接触型データキャリア用導電部材とその製造方法及び装置
KR100688768B1 (ko) * 2004-12-30 2007-03-02 삼성전기주식회사 칩 내장형 인쇄회로기판 및 그 제조 방법
CN1921734A (zh) * 2005-08-25 2007-02-28 达迈科技股份有限公司 表面经过处理的pi膜及此pi膜的应用
JP5073395B2 (ja) * 2007-07-19 2012-11-14 日本メクトロン株式会社 多層プリント配線板の製造方法
CN201479463U (zh) * 2009-07-09 2010-05-19 佛山市顺德区顺达电脑厂有限公司 焊盘具有排气通孔的印刷电路板

Also Published As

Publication number Publication date
WO2013005720A1 (ja) 2013-01-10
TWI448219B (zh) 2014-08-01
TW201309119A (zh) 2013-02-16
JP5589979B2 (ja) 2014-09-17
IN2014CN00763A (pt) 2015-04-03
KR20140017699A (ko) 2014-02-11
US20140251659A1 (en) 2014-09-11
KR101516531B1 (ko) 2015-05-04
DE112012002850T5 (de) 2014-04-10
JP2013016741A (ja) 2013-01-24
CN103621190A (zh) 2014-03-05

Similar Documents

Publication Publication Date Title
BR112013033398A2 (pt) placa de circuito e método para fabricar placa de circuito
WO2016133571A3 (en) Laser induced graphene hybrid materials for electronic devices
BR112017004537B8 (pt) Filme intermediário de vidro laminado, vidro laminado e método de produção de filme intermediário de vidro laminado
BR112014006761A2 (pt) alojamento de proteção com caminho de amplificação de som de alto-falante
BR112015008741A2 (pt) vidraça de janela de veículo polimérica com unidade de led
TW201130172A (en) Light emitting device
BR112016007577A2 (pt) estrutura de proteção de bateria
BR112014019550A8 (pt) Dispositivo suplementar para ser acoplado a dispositivo de injeção manualmente operável e kit
BR112013010500A2 (pt) conjunto de bateria recarregável incluindo interconexão de conjunto de bateria de baixa resistência
MY164637A (en) Flap score venting of can end
DE502007005892D1 (de) N klappenwirbel beeinflussenden vorrichtung
WO2015028886A3 (en) Nano-gap electrode and methods for manufacturing same
WO2013138169A3 (en) Mcm-48 templated carbon compositions, electrodes, cells, methods for making and methods for using
PH12015502076A1 (en) Pressure sensitive adhesive sheet and method of manufacturing processed device-related member
IN2014DN07967A (pt)
BR112013000154A2 (pt) painel acústico compreendedo pelo menos um núcleo celular disposto entre pelo menos uma película interna e uma película externa.
BR112015026810A2 (pt) método para fornecer um sistema óptico montado à cabeça
BR112015018792A2 (pt) reforço de orifício de vidraça
MY186890A (en) Adhesive sheet and usage method therefor
BR112015014699A2 (pt) película de silicone
BR112014013126A2 (pt) roda em duas partes
BR112017016513A2 (pt) contêiner de acondicionamento refechável e método para fabricar o laminado flexível de contêiner de acondicionamento
WO2015069818A3 (en) Raft assembly components and methods
WO2012067444A3 (ko) 산화막이 형성된 도전성 필름 및 그 제조방법
IN2014KN01124A (en) Cutting insert having hole orientation indicia and method for making thereof

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]