DE112012002850T5 - Leiterplatte und Herstellungsverfahren für eine Leiterplatte - Google Patents

Leiterplatte und Herstellungsverfahren für eine Leiterplatte Download PDF

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Publication number
DE112012002850T5
DE112012002850T5 DE112012002850.3T DE112012002850T DE112012002850T5 DE 112012002850 T5 DE112012002850 T5 DE 112012002850T5 DE 112012002850 T DE112012002850 T DE 112012002850T DE 112012002850 T5 DE112012002850 T5 DE 112012002850T5
Authority
DE
Germany
Prior art keywords
insulating core
core substrate
circuit board
gas
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112012002850.3T
Other languages
German (de)
English (en)
Inventor
Hiroaki Asano
Yasuhiro Koike
Kiminori Ozaki
Hitoshi Shimadu
Tetsuya Furuta
Masao Miyake
Tomoaki Asai
Takahiro Hayakawa
Ryou Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
Original Assignee
Toyota Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Industries Corp filed Critical Toyota Industries Corp
Publication of DE112012002850T5 publication Critical patent/DE112012002850T5/de
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
DE112012002850.3T 2011-07-06 2012-07-02 Leiterplatte und Herstellungsverfahren für eine Leiterplatte Ceased DE112012002850T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-2011-150265 2011-07-06
JP2011150265A JP5589979B2 (ja) 2011-07-06 2011-07-06 回路板
PCT/JP2012/066900 WO2013005720A1 (ja) 2011-07-06 2012-07-02 回路板、および回路板の製造方法

Publications (1)

Publication Number Publication Date
DE112012002850T5 true DE112012002850T5 (de) 2014-04-10

Family

ID=47437069

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112012002850.3T Ceased DE112012002850T5 (de) 2011-07-06 2012-07-02 Leiterplatte und Herstellungsverfahren für eine Leiterplatte

Country Status (9)

Country Link
US (1) US20140251659A1 (https=)
JP (1) JP5589979B2 (https=)
KR (1) KR101516531B1 (https=)
CN (1) CN103621190A (https=)
BR (1) BR112013033398A2 (https=)
DE (1) DE112012002850T5 (https=)
IN (1) IN2014CN00763A (https=)
TW (1) TWI448219B (https=)
WO (1) WO2013005720A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015026820A (ja) * 2013-06-18 2015-02-05 株式会社デンソー 電子装置
EP3063832B1 (en) 2013-10-29 2022-07-06 Zoll Medical Israel Ltd. Antenna systems and devices and methods of manufacture thereof
JP6416269B2 (ja) * 2014-08-26 2018-10-31 シャープ株式会社 カメラモジュール
WO2019030746A1 (en) 2017-08-10 2019-02-14 Zoll Medical Israel Ltd. SYSTEMS, DEVICES AND METHODS FOR PHYSIOLOGICAL MONITORING OF PATIENTS
CN111566808B (zh) * 2018-01-24 2023-08-22 京瓷株式会社 布线基板、电子装置以及电子模块
US20230413425A1 (en) * 2020-11-20 2023-12-21 Lg Innotek Co., Ltd. Circuit board
KR102900856B1 (ko) * 2020-11-20 2025-12-16 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5789294A (en) * 1980-11-25 1982-06-03 Matsushita Electric Industrial Co Ltd Printed circuit board
JPS61173157U (https=) * 1985-04-16 1986-10-28
JPS6377730A (ja) * 1986-09-22 1988-04-07 Hitachi Ltd 多層基板
JPH1131876A (ja) * 1997-07-10 1999-02-02 Murata Mfg Co Ltd 回路基板
JP2001257437A (ja) * 2000-03-10 2001-09-21 Denso Corp 電子回路基板及びその製造方法
JP4165045B2 (ja) * 2000-09-19 2008-10-15 松下電器産業株式会社 電子機器
JP2002111231A (ja) * 2000-10-03 2002-04-12 Toppan Printing Co Ltd 多層プリント配線板
CN100488336C (zh) * 2003-05-22 2009-05-13 电力波技术公司 使用了焊料排气孔的电路板组件
JP2005339518A (ja) * 2004-04-28 2005-12-08 Dainippon Printing Co Ltd 非接触型データキャリア用導電部材とその製造方法及び装置
KR100688768B1 (ko) * 2004-12-30 2007-03-02 삼성전기주식회사 칩 내장형 인쇄회로기판 및 그 제조 방법
CN1921734A (zh) * 2005-08-25 2007-02-28 达迈科技股份有限公司 表面经过处理的pi膜及此pi膜的应用
JP5073395B2 (ja) * 2007-07-19 2012-11-14 日本メクトロン株式会社 多層プリント配線板の製造方法
CN201479463U (zh) * 2009-07-09 2010-05-19 佛山市顺德区顺达电脑厂有限公司 焊盘具有排气通孔的印刷电路板

Also Published As

Publication number Publication date
IN2014CN00763A (https=) 2015-04-03
US20140251659A1 (en) 2014-09-11
BR112013033398A2 (pt) 2017-01-24
TW201309119A (zh) 2013-02-16
JP2013016741A (ja) 2013-01-24
TWI448219B (zh) 2014-08-01
WO2013005720A1 (ja) 2013-01-10
CN103621190A (zh) 2014-03-05
KR20140017699A (ko) 2014-02-11
JP5589979B2 (ja) 2014-09-17
KR101516531B1 (ko) 2015-05-04

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R012 Request for examination validly filed
R082 Change of representative

Representative=s name: WINTER, BRANDL, FUERNISS, HUEBNER, ROESS, KAIS, DE

R082 Change of representative

Representative=s name: WINTER, BRANDL, FUERNISS, HUEBNER, ROESS, KAIS, DE

R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final