US20140130940A1 - Solder Paste - Google Patents
Solder Paste Download PDFInfo
- Publication number
- US20140130940A1 US20140130940A1 US14/125,916 US201214125916A US2014130940A1 US 20140130940 A1 US20140130940 A1 US 20140130940A1 US 201214125916 A US201214125916 A US 201214125916A US 2014130940 A1 US2014130940 A1 US 2014130940A1
- Authority
- US
- United States
- Prior art keywords
- solder paste
- squeegee
- printing
- film
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
- Printing Methods (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011131465 | 2011-06-13 | ||
JP2011-131465 | 2011-06-13 | ||
PCT/JP2012/064801 WO2012173059A1 (ja) | 2011-06-13 | 2012-06-08 | ソルダペースト |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/064801 A-371-Of-International WO2012173059A1 (ja) | 2011-06-08 | 2012-06-08 | ソルダペースト |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/394,243 Division US10322462B2 (en) | 2011-06-08 | 2016-12-29 | Method of printing solder paste |
Publications (1)
Publication Number | Publication Date |
---|---|
US20140130940A1 true US20140130940A1 (en) | 2014-05-15 |
Family
ID=47357048
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/125,916 Abandoned US20140130940A1 (en) | 2011-06-08 | 2012-06-08 | Solder Paste |
US15/394,243 Expired - Fee Related US10322462B2 (en) | 2011-06-08 | 2016-12-29 | Method of printing solder paste |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/394,243 Expired - Fee Related US10322462B2 (en) | 2011-06-08 | 2016-12-29 | Method of printing solder paste |
Country Status (7)
Country | Link |
---|---|
US (2) | US20140130940A1 (zh) |
EP (1) | EP2719497B1 (zh) |
JP (4) | JPWO2012173059A1 (zh) |
KR (1) | KR101924669B1 (zh) |
CN (2) | CN103635285A (zh) |
TW (1) | TWI581891B (zh) |
WO (1) | WO2012173059A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150129640A1 (en) * | 2013-11-12 | 2015-05-14 | Panasonic Intellectual Property Management Co., Ltd. | Screen printing machine and electronic component mounting system |
US20150129641A1 (en) * | 2013-11-14 | 2015-05-14 | Panasonic Intellectual Property Management Co., Ltd. | Screen printing machine, electronic component mounting system, and screen printing method |
US20210313197A1 (en) * | 2018-07-26 | 2021-10-07 | Dic Corporation | Method for manufacturing conductive pillar using conductive paste |
US20220355422A1 (en) * | 2021-04-22 | 2022-11-10 | Infineon Technologies Ag | Lead-free solder material, layer structure, method of forming a solder material, and method of forming a layer structure |
US11858072B2 (en) | 2020-03-30 | 2024-01-02 | Senju Metal Industry Co., Ltd. | Flux, flux-cored solder using flux, flux-coated solder using flux and soldering method |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101924669B1 (ko) | 2011-06-13 | 2018-12-03 | 센주긴조쿠고교 가부시키가이샤 | 솔더 페이스트의 인쇄 방법 및 솔더 페이스트 |
KR20150018023A (ko) * | 2013-08-08 | 2015-02-23 | 삼성전기주식회사 | 페이스트 인쇄장치 및 페이스트 인쇄방법 |
JP5819026B1 (ja) * | 2014-02-24 | 2015-11-18 | 積水化学工業株式会社 | 接続構造体の製造方法 |
JP6160788B1 (ja) | 2017-01-13 | 2017-07-12 | 千住金属工業株式会社 | フラックス |
CN109530977B (zh) | 2017-09-21 | 2021-11-19 | 株式会社田村制作所 | 助焊剂及焊膏 |
KR102003251B1 (ko) * | 2019-02-28 | 2019-07-24 | 김건일 | 스크린 프린팅을 이용한 미끄럼 방지패드의 제조방법 및 이에 사용되는 스크린 프린팅 틀 |
CN111182740B (zh) * | 2019-12-23 | 2021-04-30 | 浙江近点电子股份有限公司 | 一种便于焊接的汽车电池采集fpc线排 |
CN113260162B (zh) * | 2021-04-29 | 2023-11-03 | 邹文华 | 一种组合印制电路板导电膏隔离薄膜剥离装置 |
KR20230034452A (ko) * | 2021-09-02 | 2023-03-10 | 주식회사 템네스트 | 반도체 웨이퍼 제조 장치 및 그 내식성 향상 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080000549A1 (en) * | 2006-06-30 | 2008-01-03 | Umicore Ag & Co. Kg | No-clean low-residue solder paste for semiconductor device applications |
JP2008055607A (ja) * | 2006-08-29 | 2008-03-13 | Hitachi Plant Technologies Ltd | スクリーン印刷装置とその印刷方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2500018B2 (ja) * | 1992-08-24 | 1996-05-29 | 千住金属工業株式会社 | 低残渣はんだペ―スト |
FR2781706B1 (fr) * | 1998-07-30 | 2000-08-25 | Air Liquide | Procede de brasage par refusion de composants electroniques et dispositif de brasage pour la mise en oeuvre d'un tel procede |
JP2001160684A (ja) | 1999-12-01 | 2001-06-12 | Matsushita Electric Ind Co Ltd | 多層配線基板の製造方法及び製造装置 |
KR100509058B1 (ko) * | 2000-04-11 | 2005-08-18 | 엘지전자 주식회사 | 인쇄회로기판의 제조방법 |
JP3685053B2 (ja) * | 2000-12-05 | 2005-08-17 | 松下電器産業株式会社 | スクリーン印刷装置 |
JP2003011322A (ja) * | 2001-07-04 | 2003-01-15 | Hitachi Industries Co Ltd | 印刷機 |
JP2003025089A (ja) * | 2001-07-13 | 2003-01-28 | Showa Denko Kk | ハンダペースト |
CN100333905C (zh) * | 2002-05-29 | 2007-08-29 | 谷电机工业株式会社 | 丝网印刷设备 |
JP4198972B2 (ja) | 2002-11-18 | 2008-12-17 | ニューロング精密工業株式会社 | 紗貼り版を用いたスクリーン印刷方法 |
JP2005088528A (ja) * | 2003-09-19 | 2005-04-07 | Sony Corp | スクリーン印刷装置 |
US7176152B2 (en) * | 2004-06-09 | 2007-02-13 | Ferro Corporation | Lead-free and cadmium-free conductive copper thick film pastes |
JP4934993B2 (ja) * | 2005-05-25 | 2012-05-23 | 住友電気工業株式会社 | 導電性ペーストおよびそれを用いた配線基板 |
JP4618427B2 (ja) * | 2005-06-29 | 2011-01-26 | 三菱マテリアル株式会社 | ソルダーペースト中のフラックス含有量の分析方法。 |
CN100349688C (zh) * | 2005-07-16 | 2007-11-21 | 李昕 | 用于配制焊锡膏的焊剂组合物 |
JP4322948B2 (ja) * | 2005-09-20 | 2009-09-02 | ニホンハンダ株式会社 | ハンダ付け用フラックス、クリームハンダ、ハンダ付け方法、食品用容器および電子部品 |
JP4697599B2 (ja) * | 2006-02-27 | 2011-06-08 | 荒川化学工業株式会社 | プリコート用鉛フリーソルダーペースト、プリコート用鉛フリーソルダーペーストに用いるフラックス |
CN100450700C (zh) * | 2006-04-30 | 2009-01-14 | 北京市航天焊接材料厂 | 无铅无卤素锡焊膏及其制备方法 |
JP4989994B2 (ja) * | 2007-03-12 | 2012-08-01 | パナソニック株式会社 | スクリーン印刷方法およびスクリーン印刷装置 |
JP5098434B2 (ja) * | 2007-05-21 | 2012-12-12 | 株式会社日立プラントテクノロジー | ハンダボール印刷装置 |
JP4356769B2 (ja) * | 2007-05-22 | 2009-11-04 | パナソニック株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
JP2009143110A (ja) * | 2007-12-14 | 2009-07-02 | Hitachi Plant Technologies Ltd | スクリーン印刷機 |
JP2010109041A (ja) * | 2008-10-29 | 2010-05-13 | Panasonic Corp | フローはんだ付け方法 |
JP2011083809A (ja) * | 2009-10-16 | 2011-04-28 | Jsr Corp | フラックス、はんだペースト及び接合部品 |
WO2012169076A1 (ja) * | 2011-06-10 | 2012-12-13 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いて作成された接合体 |
KR101924669B1 (ko) | 2011-06-13 | 2018-12-03 | 센주긴조쿠고교 가부시키가이샤 | 솔더 페이스트의 인쇄 방법 및 솔더 페이스트 |
KR20140006484A (ko) * | 2012-07-05 | 2014-01-16 | 삼성전자주식회사 | 반도체 발광소자의 제조방법 |
-
2012
- 2012-06-08 KR KR1020137033160A patent/KR101924669B1/ko active IP Right Grant
- 2012-06-08 CN CN201280029200.9A patent/CN103635285A/zh active Pending
- 2012-06-08 JP JP2013520529A patent/JPWO2012173059A1/ja active Pending
- 2012-06-08 US US14/125,916 patent/US20140130940A1/en not_active Abandoned
- 2012-06-08 CN CN201610832683.6A patent/CN106985564B/zh not_active Expired - Fee Related
- 2012-06-08 EP EP12799838.3A patent/EP2719497B1/en not_active Not-in-force
- 2012-06-08 WO PCT/JP2012/064801 patent/WO2012173059A1/ja active Application Filing
- 2012-06-13 TW TW101121055A patent/TWI581891B/zh not_active IP Right Cessation
-
2014
- 2014-08-13 JP JP2014164829A patent/JP6016857B2/ja not_active Expired - Fee Related
-
2015
- 2015-07-28 JP JP2015148794A patent/JP2016005913A/ja active Pending
- 2015-11-30 JP JP2015233203A patent/JP2016032838A/ja not_active Withdrawn
-
2016
- 2016-12-29 US US15/394,243 patent/US10322462B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080000549A1 (en) * | 2006-06-30 | 2008-01-03 | Umicore Ag & Co. Kg | No-clean low-residue solder paste for semiconductor device applications |
JP2008055607A (ja) * | 2006-08-29 | 2008-03-13 | Hitachi Plant Technologies Ltd | スクリーン印刷装置とその印刷方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150129640A1 (en) * | 2013-11-12 | 2015-05-14 | Panasonic Intellectual Property Management Co., Ltd. | Screen printing machine and electronic component mounting system |
US9352409B2 (en) * | 2013-11-12 | 2016-05-31 | Panasonic Intellectual Property Management Co., Ltd. | Screen printing machine and electronic component mounting system |
US20150129641A1 (en) * | 2013-11-14 | 2015-05-14 | Panasonic Intellectual Property Management Co., Ltd. | Screen printing machine, electronic component mounting system, and screen printing method |
US9796035B2 (en) * | 2013-11-14 | 2017-10-24 | Panasonic Intellectual Property Management Co., Ltd. | Screen printing machine, electronic component mounting system, and screen printing method |
US20210313197A1 (en) * | 2018-07-26 | 2021-10-07 | Dic Corporation | Method for manufacturing conductive pillar using conductive paste |
US11858072B2 (en) | 2020-03-30 | 2024-01-02 | Senju Metal Industry Co., Ltd. | Flux, flux-cored solder using flux, flux-coated solder using flux and soldering method |
US20220355422A1 (en) * | 2021-04-22 | 2022-11-10 | Infineon Technologies Ag | Lead-free solder material, layer structure, method of forming a solder material, and method of forming a layer structure |
Also Published As
Publication number | Publication date |
---|---|
US20170157691A1 (en) | 2017-06-08 |
JP2014210291A (ja) | 2014-11-13 |
CN103635285A (zh) | 2014-03-12 |
KR20140028075A (ko) | 2014-03-07 |
TW201313375A (zh) | 2013-04-01 |
US10322462B2 (en) | 2019-06-18 |
CN106985564B (zh) | 2019-03-08 |
JPWO2012173059A1 (ja) | 2015-02-23 |
JP6016857B2 (ja) | 2016-10-26 |
CN106985564A (zh) | 2017-07-28 |
EP2719497A1 (en) | 2014-04-16 |
JP2016032838A (ja) | 2016-03-10 |
EP2719497A4 (en) | 2015-03-25 |
WO2012173059A1 (ja) | 2012-12-20 |
KR101924669B1 (ko) | 2018-12-03 |
JP2016005913A (ja) | 2016-01-14 |
EP2719497B1 (en) | 2017-07-26 |
TWI581891B (zh) | 2017-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10322462B2 (en) | Method of printing solder paste | |
KR102045186B1 (ko) | 납땜 방법 | |
EP3446337B1 (en) | Process for producing highly conductive, printable pastes from capillary suspensions | |
CN104246996A (zh) | 焊料凸块及其形成方法、以及具备有焊料凸块的基板及其制造方法 | |
JP2012187741A (ja) | スクリーン印刷装置およびスクリーン印刷方法 | |
US7905011B2 (en) | Bump forming method and bump forming apparatus | |
DE102011120100A1 (de) | Flussmittelzusammensetzung und Lötverfahren | |
JP2016115846A (ja) | ピラー形成用ペースト、ピラーの製造方法、バンプ構造体の製造方法、ピラー、及びバンプ構造体 | |
JP2006165336A (ja) | バンプ形成用ハンダペースト | |
KR102122631B1 (ko) | 유심 구조 땜납 범프 및 그 제조 방법 | |
JP2017024326A (ja) | ペースト印刷装置及びペースト印刷方法 | |
CN117121177A (zh) | 焊膏、焊料凸块的形成方法及带有焊料凸块的部件的制造方法 | |
Krammer et al. | Method for selective solder paste application for BGA rework | |
JP2002368401A (ja) | フラックス塗布方法およびそれに用いるフラックス塗布装置 | |
TW201629237A (zh) | Au-Sn合金焊膏、Au-Sn合金焊料層之製造方法及Au-Sn合金焊料層 | |
CN117121176A (zh) | 焊膏、焊料凸块的形成方法及带有焊料凸块的部件的制造方法 | |
JP2005340282A (ja) | バンプ形成装置及びバンプ形成方法 | |
JP6642186B2 (ja) | はんだバンプの製造方法 | |
KR101150395B1 (ko) | 솔더 범프 형성용 템플릿의 제조 방법 | |
KR20220099494A (ko) | 웨이퍼 표면에 솔더를 인쇄하는 방법 및 그 시스템 | |
JP2010177381A (ja) | 突起電極の形成方法及び形成装置 | |
JP2007311428A (ja) | 鍍金方法およびマスク板 | |
JP2012192434A (ja) | フラックス、はんだペースト及び実装基板の製造方法 | |
KR20100130427A (ko) | 소수성 코팅층을 갖는 마스크 및 이를 이용한 기판의 제조방법 | |
Czaplicki | Advanced Rework Technology and Processes for Next Generation Large Area Arrays, 01005, PoP and QFN Devices |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SENJU METAL INDUSTRY CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:OKADA, SAKIE;REEL/FRAME:031782/0212 Effective date: 20131212 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |