US20140080951A1 - Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics - Google Patents

Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics Download PDF

Info

Publication number
US20140080951A1
US20140080951A1 US13/828,955 US201313828955A US2014080951A1 US 20140080951 A1 US20140080951 A1 US 20140080951A1 US 201313828955 A US201313828955 A US 201313828955A US 2014080951 A1 US2014080951 A1 US 2014080951A1
Authority
US
United States
Prior art keywords
composition
boron nitride
thermally conductive
filler
extruder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/828,955
Other languages
English (en)
Inventor
Chandrashekar Raman
Bei Xiang
Anand Murugaiah
Don Robert Roden, Jr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US13/828,955 priority Critical patent/US20140080951A1/en
Application filed by Individual filed Critical Individual
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. SECURITY AGREEMENT Assignors: MOMENTIVE PERFORMANCE MATERIALS INC.
Priority to PCT/US2013/060633 priority patent/WO2014047297A1/en
Publication of US20140080951A1 publication Critical patent/US20140080951A1/en
Assigned to JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT reassignment JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOMENTIVE PERFORMANCE MATERIALS INC.
Assigned to JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT reassignment JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOMENTIVE PERFORMANCE MATERIALS INC.
Assigned to BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT reassignment BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOMENTIVE PERFORMANCE MATERIALS INC.
Assigned to BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT reassignment BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOMENTIVE PERFORMANCE MATERIALS INC.
Assigned to THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT reassignment THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOMENTIVE PERFORMANCE MATERIALS INC.
Assigned to THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT reassignment THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOMENTIVE PERFORMANCE MATERIALS INC.
Assigned to MOMENTIVE PERFORMANCE MATERIALS INC. reassignment MOMENTIVE PERFORMANCE MATERIALS INC. TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Assignors: JPMORGAN CHASE BANK, N.A.
Assigned to BOKF, NA, AS SUCCESSOR COLLATERAL AGENT reassignment BOKF, NA, AS SUCCESSOR COLLATERAL AGENT NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Assignors: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT
Assigned to BOKF, NA, AS SUCCESSOR COLLATERAL AGENT reassignment BOKF, NA, AS SUCCESSOR COLLATERAL AGENT NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY - SECOND LIEN Assignors: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT
Assigned to MOMENTIVE PERFORMANCE MATERIALS INC. reassignment MOMENTIVE PERFORMANCE MATERIALS INC. BANKRUPTCY ORDER TO RELEASE SECURITY INTEREST AT REEL/FRAME NO. 032736/471 Assignors: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Assigned to MOMENTIVE PERFORMANCE MATERIALS INC. reassignment MOMENTIVE PERFORMANCE MATERIALS INC. BANKRUPTCY ORDER TO RELEASE SECURITY INTEREST AT REEL/FRAME NO. 032736/0457 Assignors: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Assigned to MOMENTIVE PERFORMANCE MATERIALS INC. reassignment MOMENTIVE PERFORMANCE MATERIALS INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: BOKF, NA
Assigned to MOMENTIVE PERFORMANCE MATERIALS INC. reassignment MOMENTIVE PERFORMANCE MATERIALS INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: BOKF, NA
Assigned to MOMENTIVE PERFORMANCE MATERIALS INC. reassignment MOMENTIVE PERFORMANCE MATERIALS INC. TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Assignors: JPMORGAN CHASE BANK, N.A.
Assigned to MOMENTIVE PERFORMANCE MATERIALS INC. reassignment MOMENTIVE PERFORMANCE MATERIALS INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Abandoned legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B29B7/30—Mixing; Kneading continuous, with mechanical mixing or kneading devices
    • B29B7/34—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices
    • B29B7/38—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary
    • B29B7/40—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with single shaft
    • B29B7/42—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with single shaft with screw or helix
    • B29B7/421—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with single shaft with screw or helix with screw and additionally other mixing elements on the same shaft, e.g. paddles, discs, bearings, rotor blades of the Banbury type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B29B7/30—Mixing; Kneading continuous, with mechanical mixing or kneading devices
    • B29B7/34—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices
    • B29B7/38—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary
    • B29B7/40—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with single shaft
    • B29B7/42—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with single shaft with screw or helix
    • B29B7/428—Parts or accessories, e.g. casings, feeding or discharging means
    • B29B7/429—Screws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B29B7/30—Mixing; Kneading continuous, with mechanical mixing or kneading devices
    • B29B7/34—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices
    • B29B7/38—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary
    • B29B7/46—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with more than one shaft
    • B29B7/48—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with more than one shaft with intermeshing devices, e.g. screws
    • B29B7/482—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with more than one shaft with intermeshing devices, e.g. screws provided with screw parts in addition to other mixing parts, e.g. paddles, gears, discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B29B7/30—Mixing; Kneading continuous, with mechanical mixing or kneading devices
    • B29B7/34—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices
    • B29B7/38—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary
    • B29B7/46—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with more than one shaft
    • B29B7/48—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with more than one shaft with intermeshing devices, e.g. screws
    • B29B7/482—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with more than one shaft with intermeshing devices, e.g. screws provided with screw parts in addition to other mixing parts, e.g. paddles, gears, discs
    • B29B7/483—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with more than one shaft with intermeshing devices, e.g. screws provided with screw parts in addition to other mixing parts, e.g. paddles, gears, discs the other mixing parts being discs perpendicular to the screw axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B29B7/30—Mixing; Kneading continuous, with mechanical mixing or kneading devices
    • B29B7/34—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices
    • B29B7/38—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary
    • B29B7/46—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with more than one shaft
    • B29B7/48—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with more than one shaft with intermeshing devices, e.g. screws
    • B29B7/488—Parts, e.g. casings, sealings; Accessories, e.g. flow controlling or throttling devices
    • B29B7/489—Screws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/285—Feeding the extrusion material to the extruder
    • B29C48/297—Feeding the extrusion material to the extruder at several locations, e.g. using several hoppers or using a separate additive feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
    • B29C48/395—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
    • B29C48/397—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders using a single screw
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
    • B29C48/395—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
    • B29C48/40—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders using two or more parallel screws or at least two parallel non-intermeshing screws, e.g. twin screw extruders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
    • B29C48/395—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
    • B29C48/40—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders using two or more parallel screws or at least two parallel non-intermeshing screws, e.g. twin screw extruders
    • B29C48/405—Intermeshing co-rotating screws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
    • B29C48/395—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
    • B29C48/40—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders using two or more parallel screws or at least two parallel non-intermeshing screws, e.g. twin screw extruders
    • B29C48/41—Intermeshing counter-rotating screws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
    • B29C48/50—Details of extruders
    • B29C48/505—Screws
    • B29C48/54—Screws with additional forward-feeding elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
    • B29C48/50—Details of extruders
    • B29C48/505—Screws
    • B29C48/565—Screws having projections other than the thread, e.g. pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
    • B29C48/50—Details of extruders
    • B29C48/505—Screws
    • B29C48/67—Screws having incorporated mixing devices not provided for in groups B29C48/52 - B29C48/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/203—Solid polymers with solid and/or liquid additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B29B7/80—Component parts, details or accessories; Auxiliary operations
    • B29B7/84—Venting or degassing ; Removing liquids, e.g. by evaporating components
    • B29B7/845—Venting, degassing or removing evaporated components in devices with rotary stirrers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B29B7/80—Component parts, details or accessories; Auxiliary operations
    • B29B7/88—Adding charges, i.e. additives
    • B29B7/90—Fillers or reinforcements, e.g. fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y10T428/2995—Silane, siloxane or silicone coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y10T428/2996—Glass particles or spheres

Definitions

  • the present invention provides thermally conductive plastic compositions, extruder screw configurations, and a method for extruding thermally plastic compositions.
  • the present invention provides compositions comprising a boron nitride filler material.
  • the thermally conductive plastic compositions and articles formed therefrom can exhibit excellent thermal conductivity in both the in-plane and through plane directions.
  • Thermal management of various electronic and opto-electronic devices is increasingly gaining attention due to the severe challenges faced in such devices.
  • the trend of shrinking sizes and increased functionality continues in personal hand-held electronic devices.
  • the power density, and hence the density of heat that needs to be dissipated have significantly increased, which poses significant challenges to providing good thermal management in those devices.
  • opto-electronic devices also known as light emitting diodes (LEDs)
  • the power consumption and lumen output is ever increasing.
  • Thermal management problems are also widely prevalent in other applications such as electronic components in automobiles, rechargeable battery systems and power inverters for hybrid vehicles, etc. Insufficient or ineffective thermal management can have a strong and deleterious effect on the performance and long-term reliability of devices.
  • LED-based bulbs are being used to replace older bulbs and are designed to fit into conventional “Edison” sockets. Fitting LED bulbs into Edison sockets only exacerbates the thermal management challenges since the heat dissipation is limited by natural convection. LED bulbs therefore require well-designed heat sinks to efficiently and adequately dissipate the waste heat. Inefficient thermal management leads to higher operating temperatures of the LEDs, which is indicated by the junction temperature (T j ) of the LED. The lifetime of an LED (defined as time taken to lose 30% light output i.e. reach B70) can potentially decrease from 80,000 hours to 20,000 hours when the junction temperature is increased from 115° C. to 135° C.
  • Aluminum heat sinks are a natural choice for LED applications based on similarities to heat sinks used for other electronic devices.
  • the use of aluminum heat sinks for LED bulbs presents several challenges.
  • One challenge is electrically insulating the heat sink from the Edison socket. Any electrical connectivity or leak between a metal heat sink and the socket can be extremely dangerous during installation.
  • Another challenge is providing heat sinks with complex shapes because die-casting heat fin shapes can be difficult and may require costly secondary machining operations.
  • Aluminum heat sinks can also be quite heavy and can add significantly to the weight, and hence cost of transportation, of the bulb.
  • aluminum heat sinks will need a finish step of painting to smooth surface finish and impart colors desired by the consumers.
  • Plastics can be an attractive alternative to aluminum for heat sinks Plastics are electrically insulating, more amenable to complex heat sink structures via injection molding, light in weight, and can be colored freely to meet aesthetic or branding requirements. Plastics also offer the possibility of integrating several parts, which can lead to a simpler overall assembly of the bulb. Plastics, however, have very poor thermal conductivity—generally only around 0.2 W/mK—which is nearly two orders of magnitude lower than that of typical die-cast aluminum alloys (which are around 200 W/mK). Therefore, plastics are generally not sufficient to meet thermal management challenges.
  • Fillers are often added to plastics to make unique composite materials. For example, reinforcing fillers like glass fibers are added to improve the mechanical properties of plastics. Similarly graphite, carbon black or other carbon forms, including even carbon nanotubes recently are added to plastics to make electrically conductive plastic-based materials. Graphite and metal powders are also used sometimes to enhance thermal conductivity, but this usually leads to increased electrical conductivity as well since these properties are usually concomitant. However, some ceramic materials such as silica, alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride (hexagonal or cubic forms), etc. present the opportunity to make thermally conductive yet electrically insulating formulations with plastics since they are good thermal conductors and electrical insulators.
  • ceramic materials such as silica, alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride (hexagonal or cubic forms), etc. present the opportunity to make thermally conductive yet electrically
  • boron nitride plastic composites have been proposed, boron nitride/plastic composites have several drawbacks.
  • Boron nitride is a relatively expensive material that can cost from 5 to 40 times more than the plastic resins that it is compounded with and as compared to aluminum alloys. From a performance standpoint, the in-plane thermal conductivity of the boron nitride/plastic composite is only around 2-10 W/mK even at high loadings of boron nitride, e.g., above 25-60 wt. % (15-45 vol %). Boron nitride is also very inert and not easily wet by resins.
  • thermal conductivity of thermally conductive plastics is not as high as aluminum metal, it is sufficient for thermal management applications in LED bulbs, and other convection limited applications.
  • the inherent anisotropy of boron nitride/plastics composites can also be an issue which may limit the applicability of boron nitride/plastic composites in some applications where the through-plane thermal conductivity is critical to the application.
  • the present invention provides thermally conductive plastic compositions.
  • the compositions comprise a polymer matrix and a thermally conductive filler.
  • the compositions have an in-plane thermal conductivity of about 5 W/mK or greater.
  • the composition has a through-plane thermal conductivity of about 1 W/mK or greater.
  • the composition has an in-plane thermal conductivity to through-plane conductivity ratio of about 3.5:1 or less.
  • the thermally conductive filler is a boron nitride.
  • the boron nitride can be chosen from platelet boron nitride, agglomerates of boron nitride, or a combination thereof.
  • a combination of fillers is employed to provide a composition exhibiting excellent thermal conductivity.
  • a composition comprises functionalization additives that provide increased thermal conductivity and allow for the concentration of thermally conductive fillers to be minimized.
  • the present invention provides a filler composition comprising a blend of a boron nitride, a metal oxide, and a silane.
  • the filler composition is a blend of a boron nitride, a metal oxide, a silane, and glass fiber.
  • the metal oxide is zinc oxide, magnesium oxide, titanium dioxide, zirconium dioxide or a combination of two or more thereof.
  • the present invention provides a filler composition comprising a blend of a boron nitride; a metal oxide; and a silane.
  • the boron nitride is present in the filler composition in an amount of from about 15 weight percent to about 75 weight percent; the metal oxide is present in an amount of from about 5 weight percent to about 80 weight percent; and the silane is present in an amount of from about 0.1 weight percent to about 6 weight percent. In one embodiment, the boron nitride is present in the filler composition in in an amount of from about 25 weight percent to about 70 weight percent; the metal oxide is present in an amount of from about 15 weight percent to about 75 weight percent; and the silane is present in an amount of from about 0.5 weight percent to about 5 weight percent.
  • the boron nitride is present in the filler composition in in an amount of from about 30 weight percent to about 70 weight percent; the metal oxide in is present an amount of from about 20 weight percent to about 50 weight percent; and the silane is present in an amount of from about 1 weight percent to about 3.5 weight percent.
  • the boron nitride is chosen from boron nitride particles, boron nitride agglomerates, or a mixture thereof.
  • the boron nitride comprises platelets having a particle size of 0.3 microns to about 200 microns.
  • the boron nitride comprises boron nitride agglomerates having a mean particle size of from about 5 microns to about 500 microns.
  • the composition can comprise nano-scale boron nitride materials including, but not limited to, nanotubes or nanosheets.
  • the metal oxide is chosen from zinc oxide, magnesium oxide, beryllium oxide, titanium dioxide, zirconium oxide, or a combination of two or more thereof.
  • the silane is chosen from an alkacryloxy silane, a vinyl silane, a halo silane, a mercapto silane, a thiocarboxylate silane, a blocked mercapto silane, or a combination of two or more thereof.
  • the silane is chosen from 3-octanoylthio-1-propyltriethoxy silane; vinyl tris(2-methoxy-ethoxy)silane; gamma-methacryloxypropyltreimethoxy silane, or a combination of two or more thereof.
  • the filler composition further comprises an additional filler component chosen from glass fibers, glass flake, clays, exfoliated clays, calcium carbonate, talc, mica, wollastonite, clays, exfoliated clays, silver, alumina, aluminum nitride, metal sulfides, e.b., zinc sulfide, graphite, metallic powders or flakes of aluminum, copper, bronze, or brass, or a combination of two or more thereof; fibers or whiskers of metals, ceramics, or carbon forms such as copper, aluminum, zinc oxide, titanium dioxide, carbon, graphite, or a combination of two or more thereof.
  • an additional filler component chosen from glass fibers, glass flake, clays, exfoliated clays, calcium carbonate, talc, mica, wollastonite, clays, exfoliated clays, silver, alumina, aluminum nitride, metal sulfides, e.b., zinc sulfide, graphite, metallic powders or
  • the filler composition further comprises one or more nano-scale filler such as carbon nanotubes, graphene, boron nitride nanotubes, boron nitride nanosheets, zinc oxide nanotubes, or a combination of two or more thereof.
  • the additional filler component is present in an amount of from about from about 0.1 weight percent to about 30 weight percent.
  • the filler composition comprises glass fiber or glass flake in an amount of from about 2 weight percent to about 20 weight percent.
  • the filler composition has a colored measured in the L*, a*, b* space with a D65 light source and a 2 degree or a 10 degree observer with an L* value of at least 85, an a* value between ⁇ 1.5 to 1.5; and a b* value between ⁇ 3.0. and 3.0.
  • the color of the filler is such that L* is greater than 90, a* is between ⁇ 1.3 and 1.3, and b* is between ⁇ 2.5 and 2.5.
  • the color of the filler is such that L* is greater than 92, a* is between ⁇ 1.0 and 1.0, and b* is between ⁇ 2.0 and 2.0.
  • the present invention provides a thermally conductive composition
  • a thermally conductive composition comprising a polymer material; and a thermally conductive filler composition dispersed in the polymer material, wherein the thermally conductive filler composition comprises a blend of a boron nitride, a metal oxide, and a silane, and the thermally conductive composition has an in-plane thermal conductivity of about 2 W/mK or greater, a through-plane thermal conductivity of about 0.9 W/mK or greater, or both.
  • the thermally conductive composition has an in-plane thermal conductivity of 3.5 W/mK or greater. In one embodiment, the thermally conductive composition has an in-plane thermal conductivity of 5 W/mK or greater.
  • the thermally conductive composition has a total thermally conductive filler concentration of about 58% by weight or less of the total weight of the composition.
  • the thermally conductive composition has a total thermally conductive filler content of about 40% or less by volume (v/v) of the composition.
  • the thermally conductive composition has a boron nitride concentration of about 41 wt. % or less of the composition; about 37 wt. % of less of the composition; about 31 wt. % or less of the composition; about 25 wt. % or less of the composition; even about 23 wt. % or less of the composition.
  • the thermally conductive composition has a total filler volume fraction is about 45 percent or less by volume of the total composition.
  • the thermally conductive composition has an in-plane thermal conductivity is at least 10 W/mK.
  • the thermally conductive composition has a notched Izod impact value of 20 J/m or greater; 25 J/m or greater; 30 J/m or greater; even 35 J/m or greater.
  • the thermally conductive composition has a tensile strength value of 7000 psi or greater; 8000 psi or greater; even 9000 psi or greater.
  • the thermally conductive composition has a strain at break value of 0.8% or greater; 1.0% or greater; even 1.3% or greater.
  • the present invention provides shaped articles from the thermally conductive compositions.
  • the present invention provides a thermal management assembly comprising a shaped article formed from the thermally conductive compositions.
  • the present compositions can exhibit good thermal conductivity in the in-plane direction, the through-plane direction or both, even at relatively low loadings of an expensive thermally conductive filler such as boron nitride. This allows for production of thermally conductive compositions at significantly reduced costs.
  • the present compositions also exhibit good electrical resistivity and dielectric strength.
  • the volume resistivity is at least 10 12 Ohm-cm and the surface resistivity is at least 10 12 Ohm/sq.
  • the present invention provides a method of extruding a thermally conductive plastic composition.
  • the invention provides in one aspect, a system and method that overcomes problems associated with producing boron nitride/plastic compositions.
  • boron nitride can be difficult to compound with plastics and may not disperse well in the plastic matrix. This can lead to material backing up in the feed throat of the extruder and blocking of the die exits by slugs of undispersed boron nitride powder.
  • the present invention provides extruder screw configurations and methods of using the same that can avoid these problems.
  • the present extruder screw configurations can also allow for the processing of boron nitride agglomerates into plastic compositions.
  • boron nitride agglomerates can be employed as fillers and provide plastic compositions that exhibit isotropic behavior (i.e., good in-plane and through-plane conductivity).
  • the present invention comprises introducing the boron nitride particles into an extruder screw via a screw comprising shovel elements.
  • the present invention provides a method of manufacturing a thermally conductive composition comprising introducing a polymeric material into an extruder; introducing a thermally conductive filler material into the extruder; forming a melt blend comprising the polymeric material and the thermally conductive filler material, wherein the extruder comprises an inlet for introducing material into the extruder and an extruder screw, the extruder screw comprising a section of kneading elements downstream of the inlet and a section of fractional mixing elements downstream of the kneading elements.
  • the present invention provides a method of manufacturing a thermally conductive composition
  • a method of manufacturing a thermally conductive composition comprising introducing a polymeric material into an extruder; introducing a thermally conductive filler material into the extruder; forming a melt blend comprising the polymeric material and the thermally conductive filler material; and extruding the melt to form an extrudate
  • the extruder comprises an inlet for introducing material into the extruder and an extruder screw, the extruder screw comprising a section of kneading elements located downstream of the inlet, and a section of fractional mixing elements, screw mixing elements, turbine mixing elements, stirrer elements, or a combination of two or more thereof downstream of the kneading elements.
  • the present invention provides a thermally conductive composition
  • a thermally conductive composition comprising a polymer material; and a thermally conductive filler dispersed in the polymer material, wherein the composition has an in-plane thermal conductivity of about 2 W/mK or greater, a through-plane thermal conductivity of about 0.5 W/mK or greater, or both.
  • FIG. 1 is a schematic side view of an extruder suitable for processing a thermally conductive plastic material in accordance with embodiments of the invention
  • FIG. 2 illustrates one embodiment of an extruder screw that can be used in a process in accordance with an embodiment of the invention
  • FIG. 3 illustrates one embodiment of an extruder screw that can be used in a process in accordance with another embodiment of the invention
  • FIG. 4 illustrates one embodiment of an extruder screw that can be used in a process in accordance with one embodiment of the invention
  • FIG. 5 is a schematic top view of an extruder system suitable for processing a thermally conductive plastic material in accordance with embodiments of the invention.
  • FIG. 6 is a schematic of a conventional extruder screw for processing plastic compositions.
  • a thermally conductive plastic composition comprises a polymer matrix and a thermally conductive filler.
  • the thermally conductive plastic composition comprises a polymer matrix and a boron nitride material.
  • the composition comprises multiple thermally conductive fillers.
  • functionalization additives are used along with the thermally conductive fillers.
  • the polymer matrix material can include any polymer or resin material as desired for a particular purpose or intended application.
  • the polymer/resin material can be a thermoplastic material.
  • the polymer/resin material can be a thermoset material.
  • suitable polymer materials include, but are not limited to, polycarbonate; acrylonitrile butadiene styrene (ABS) (C 8 H 8 C 4 H 6 C 3 H 3 N); polycarbonate/acrylonitrile butadiene styrene alloys (PC-ABS); polybutylene terephthalate (PBT); polyethylene therephthalate (PET); polyphenylene oxide (PPO); polyphenylene sulfide (PPS); polyphenylene ether; modified polyphenylene ether containing polystyrene; liquid crystal polymers; polystyrene; styrene-acrylonitrile copolymer; rubber-reinforced polystyrene; poly ether ketone (PEEK); acrylic resins such as polymers and copolymers of alkyl esters of acrylic and methacrylic acid styrene-methyl methacrylate copolymer; styrene-methyl methacrylate-buta
  • polymer matrix material may depend on the particular requirements of the application for which the thermally-conductive plastic is to be used. For example, properties such as impact resistance, tensile strength, operating temperature, heat distortion temperature, barrier characteristics, and the like are all affected by the choice of polymer matrix material.
  • the polymer matrix material can include one or more polyamide thermoplastic polymer matrices.
  • a polyamide polymer is a polymer containing an amide bond (—NHCO—) in the main chain and capable of being heat-melted at temperatures less than about 300 degrees Celsius.
  • polyamide resins include, but are not limited to, polycaproamide (nylon 6), polytetramethylene adipamide (nylon 46), polyhexamethylene adipamide (nylon 66), polyhexamethylene sebacamide (nylon 610), polyhexamethylene dodecamide (nylon 612), polyundecamethylene adipamide (nylon 116), polyundecanamide (nylon 11), polydodecanamide (nylon 12), polytrimethylhexamethylene terephthalamide (nylon TMHT), polyhexamethylene isophthalamide (nylon 61), polyhexamethylene terephthal/isophthalamide (nylon 6T/61), polynonamethylene terephthalamide (nylon 9T), polybis(4-aminocyclohexyl)methane dodecamide (nylon PACM12), polybis(3-methyl-4-aminocyclohexyl)methane dodecamide (nylon dimethyl PACM12),
  • the base polymer resins can be modified or provided with other fillers or additives, other than the thermally conductive fillers or silane additives, to modify other properties such as impact resistance, UV stability, fire retardancy, etc.
  • thermoset resins including, but not limited to, silicones, epoxies, acrylics, phenolics, novolacs, etc.
  • the thermally conductive plastic compositions comprise a thermally conductive filler. It will be appreciated that the compositions can comprise a plurality of thermally conductive fillers. In one embodiment, the thermally conductive filler can be chosen as desired for a particular purpose or application.
  • the thermally conductive filler is chosen from boron nitride, silica, glass fibers, a metal oxide such as, zinc oxide, magnesium oxide, beryllium oxide, titanium oxide, zirconium oxide, yttrium oxide, etc., calcium carbonate, talc, mica, wollastonite, clays, exfoliated clays, alumina, aluminum nitride, graphite, metallic powders, e.g., aluminum, copper, bronze, brass, etc., or a combination of two or more thereof.
  • the thermally conductive filler has a low electrical conductivity or is electrically insulating.
  • the thermally conductive plastic composition comprises boron nitride.
  • suitable boron nitride materials include boron nitride particles, boron nitride agglomerates, or a mixture thereof.
  • Boron nitride particles generally exhibit a platelet form.
  • the boron nitride particles can be platelets having a particle size of 0.3 to about 200 microns and a surface area of from about 0.25 to about 100 m 2 /gram.
  • the platelet boron nitride particles have a particle size of about 0.5 to 150 microns; about 1 to about 100 microns, about 10 to 90 microns; about 20 to 75 microns; even about 40 to 60 microns.
  • the thermally conductive plastic composition comprises boron nitride agglomerates.
  • the agglomerates can have a mean particle size of from about 5 to about 500 microns and a surface area of about 0.25 to about 50 m 2 /gram.
  • the platelet boron nitride particles have a particle size of about 10 to 400 microns; about 20 to about 300 microns, about 30 to 200 microns; about 40 to 150 microns; even about 50 to 100 microns.
  • Particle size can be measured using a Horiba LA300 particle size distribution analyzer where the particle to be analyzed (e.g., BN) is introduced in an amount adjusted to meet the required transmission. A few drops of 2% Rhodapex CO-436 can be added to improve the dispersion of the powder, and the particle size can be measured using laser diffraction after a 3 second sonication. The particle size distribution resulting from the measurement can be plotted on a volume basis and the D90 represents the 90 th percentile of the distribution.
  • the boron nitride platelet filler has an aspect ratio (which is defined as the ratio of the largest to smallest dimension of the particle) of at least 20:1; at least 30:1; at least 40:1; at least 50:1; even at least 100:1.
  • the boron nitride agglomerate filler has an aspect ratio of no more than 5:1, 3:1, or even 2:1.
  • Suitable boron nitride materials include platelet boron nitride and boron nitride agglomerates available from Momentive Performance Materials.
  • the boron nitride comprises a majority of the thermally conductive fillers added in the composition.
  • the present composition can exhibit excellent through-plane composition without the addition of additional additives such as expanded or carbon fiber graphite as required by U.S. Pat. No. 7,723,419.
  • the composition can consist essentially of boron nitride fillers.
  • the composition is substantially free of expanded graphite or other carbon-based fillers.
  • the filler material has a tap density of about 35% or less of the materials theoretical density; about 33% or less of the materials theoretical density; even about 30% or less of the materials theoretical density.
  • the filler material comprises boron nitride agglomerates having a powder tap density ranges from about 0.3 g/cc to about 0.8 g/cc; from about 0.4 g/cc to about 0.7 g/cc; even from 0.45 g/cc to 0.7 g/cc.
  • the filler material comprises boron nitride platelets with a powder tap density of 0.2 g/cc to 0.7 g/cc.
  • the compositions comprise one or more of glass fibers, glass flake, clays, exfoliated clays, or other high aspect ratio fibers, rods, or flakes as a thermally conductive filler component.
  • the glass fiber has an aspect ratio of at least 20; at least 30; at least 40; at least 50; even at least 100.
  • the glass flake has an aspect ratio of at least 40; at least 50; at least 60.
  • the thermally conductive compositions comprise a functionalization additive such as, for example, a silane additive.
  • the silane additive can be chosen from an alkacryloxy silane, a vinyl silane, a halo silane (e.g., a chlorosilane), a mercapto silane, a blocked mercaptosilane, a thiocarboxylate silane, or a combination of two or more thereof.
  • the thermally conductive compositions can comprise from about 1 to about 5 wt. % of a silane; from about 1.5 to about 4 wt. %; even from about 2.7 to about 3.7 wt. % of the fillers.
  • the silane can be represented by Y—R 1 —Si(R 2 ) n (R 3 ) 3-n , wherein Y represents R 4 R 5 N—, R 7 R 8 N—R 6 —NR 4 —, or R 11 R 10 N—R 9 —R 7 N—R 6 —NR 4 —; or Y and R 1 (Y—R 1 ) conjointly represent a vinyl group, an alkyl group, a phenyl group, a 3,4-epoxycyclohexyl group, a halogen atom, a mercapto group, an isocyanate group, a thiocarboxylate group, an optionally substituted glycidyl group, a glycidoxy group, an optionally substituted vinyl group, a methacryloxy group (CH 2 ⁇ C(CH 3 )COO—), an acryloxy group (CH 2 ⁇ CHCOO—), a ureido group (NH 2 CONH—), an
  • Suitable vinyl silanes include are those having the formula: R 12 SiR 13 n Y (3-n) , where R 12 is an ethylenically unsaturated hydrocarbyl, hydrocarbyloxy, or (meth)acryloxy hydrocarbyl group, R 13 is an aliphatic saturated hydrocarbyl group, Y is independently a hydrolysable organic group, and n is 0, 1 or 2.
  • Y is an alkoxy group of an alkyl having from 1 to 6 carbon atoms, such as methoxy, ethoxy, propoxy and butoxy.
  • R 12 can be chosen from vinyl, allyl, isoprenyl, butenyl, cyclohexyl or ⁇ -(meth)acryloxy propyl;
  • Y can be chosen from methoxy, ethoxy, formyloxy, acetoxy, propionyloxy, or an alkylamino or arylamino group; and
  • R 13 if present, can be chosen from a methyl, ethyl, propyl, decyl or phenyl group.
  • the silane is a compound of the formula CH 2 ⁇ CHSi(OA) 3 (2) where A is a hydrocarbyl group having 1 to 8 carbon atoms, and in one embodiment 1 to 4 carbon atoms.
  • the silane is chosen from octanoylthio-1-propyltriethoxy silane; vinyl tris(2-methoxy-ethoxy)silane; vinyl trimethoxy silane, vinyl triethoxysilane gamma-methacryloxypropyltreimethoxy silane, vinyl triacetoxy silane, or a combination of two or more thereof.
  • suitable silanes include, but are not limited to, those available from Momentive Performance Materials and sold under the tradename NXT.
  • NXT is a thiocarboxylate silane and an example of the broader class of blocked mercaptosilanes.
  • Suitable silanes also include those described in U.S. Pat. Nos. 6,608,125; 7,078,551; 7,074,876; and 7,301,042.
  • the silane additive can be added at any point in processing of the composition.
  • the silane additive can be added in-site during the extrusion process at any point in the extrusion process.
  • the silane is added to a filler or filler composition prior to introduction into an extruder or other processing equipment.
  • various other classes of functionalization additives can be added to improve the interface between the fillers and the resin matrix.
  • functionalization additives include organometallic compounds such as titanates & zirconates (Ken-react by Kenrich), aluminates, hyperdispersants (Solsperse by Lubrizol), maleated oligomers such as maleated polybutadiene resin or styrene maleic anhydride copolymer (Cray Valley), fatty acids or waxes and their derivatives, and ionic or non-ionic surfactants.
  • These functionalization additives may be used at 1 wt % to about 15 wt % of fillers; or from about 3-12 wt %; even from about 5 to 10 wt % of the fillers.
  • the filler materials such as the boron nitride and the metal oxide, and the silane additive can be added as separate components when compounding into a resin composition.
  • the amounts of each component that can be included in the thermally conductive composition are described further herein.
  • the filler components can be added as part of a filler composition comprising one or more of the respective filler components.
  • the filler material is provided as a blend of boron nitride, a silane, and optionally one or more other filler materials.
  • the filler is provided as a blend of a boron nitride material and a silane.
  • the boron nitride and the silane can be any of those described above.
  • the boron nitride can be treated with the silane by mixing the silane with the boron nitride material.
  • the concentration of the silane can be about 0.1 weight percent to about 6 weight percent by weight of the boron nitride; about 0.5 weight percent to about 5 weight percent; about 1 weight percent to about 4 weight percent; even about 2 weight percent to about 3 weight percent.
  • the thermally conductive filler is provided as a blend or composite of boron nitride, a metal oxide, a silane additive, and optionally other filler materials.
  • the thermally conductive filler composition comprises a blended composition comprising boron nitride in an amount of from about 20 weight percent to about 70 weight percent; a metal oxide in an amount of from about 5 weight percent to about 75 weight percent; and a silane additive in an amount of from about 0.1 weight percent to about 6 weight percent.
  • the thermally conductive filler composition comprises a blended composition comprising boron nitride in an amount of from about 5 weight percent to about 60 weight percent; a metal oxide in an amount of from about 15 weight percent to about 60 weight percent; and a silane additive in an amount of from about 0.5 weight percent to about 5 weight percent.
  • the thermally conductive filler composition comprises a blended composition comprising boron nitride in an amount of from about 30 weight percent to about 50 weight percent; a metal oxide in an amount of from about 20 weight percent to about 50 weight percent; and a silane additive in an amount of from about 1 weight percent to about 3.5 weight percent.
  • the thermally conductive filler composition comprises a blended composition comprising boron nitride in an amount of from about 35 weight percent to about 45 weight percent; a metal oxide in an amount of from about 30 weight percent to about 40 weight percent; and a silane additive in an amount of from about 1.5 weight percent to about 2.5 weight percent.
  • the thermally conductive filler comprises a blended composition comprising boron nitride in an amount of from about 5 weight percent to about 40 weight percent; a metal oxide in an amount of from about 5 weight percent to about 50 weight percent; and a silane additive in an amount of from about 1 weight percent to about 4 weight percent.
  • the blended filler composition can optionally include other filler components including, but not limited to, glass fibers, glass flake, clays, exfoliated clays, or other high aspect ratio fibers, rods, or flakes, calcium carbonate, zinc oxide, yttrium oxide, magnesia, titania, calcium carbonate, talc, mica, wollastonite, alumina, aluminum nitride, graphite, metallic powders, e.g., aluminum, copper, bronze, brass, etc., fibers or whiskers of carbon, graphite, silicon carbide, silicon nitride, alumina, aluminum nitride, zinc oxide, nano-scale fibers such as carbon nanotubes, graphene, boron nitride nanotubes, boron nitride nanosheets, zinc oxide nanotubes, etc., or a combination of two or more thereof.
  • other filler components including, but not limited to, glass fibers, glass flake, clays, exfoliated clays, or
  • the additional filler components can be present in the blended filler in an amount of from about 0 to about 30 weight percent; from about 0.1 weight percent to about 30 weight percent; from about 1 weight percent to about 25 weight percent; from about 5 weight percent to about 20 weight percent; even from about 10 to about 15 weight percent.
  • the blended filler composition comprises boron nitride, a metal oxide, a silane additive, and glass fiber or glass flake.
  • glass fiber can also refer to and will encompass glass flake.
  • the composite or blended filler compositions can be prepared by any suitable method to mix the various components in the filler composition.
  • the boron nitride, metal oxide, and optional additional filler are mixed together in a blender and the silane additive is introduced into the blender.
  • the composite or blended filler composition can be a substantially homogeneous mixture or blend of the component materials.
  • these blends can be carried out in a v-blender with a provision to introduce a liquid into the blender.
  • intensifier bars can be chosen for the v-blender for optimal mixing of the various fillers.
  • the blender can be operated as a simple tumbler without the intensifier bar operated for the whole or part of the blend cycle to preserve the integrity of fragile filler such as boron nitride agglomerates, ceramic or glass fibers etc.
  • Other suitable examples may be ribbon blenders, paddle blenders, tumblers etc.
  • the blend of the boron nitride and the silane (and the optional other filler materials, e.g., a metal oxide) can be treated prior to introduction into the resin composition to covalently bind the silane to the filler material. This can be accomplished by subjecting the blend of the boron nitride and the silane to conditions to hydrolyze the silane and allow the hydrolyzed silane to react with the filler surface.
  • treating the blended filler can be carries out by exposing the material to moisture and heat.
  • heat treating the filler comprising the blend of the boron nitride and the silane can cause condensation of the silane on the filler and chemically react and bind the silane to the filler surface.
  • the inventors have found that heat treating the blended filler compositions prior to use in the resin composition can improve the thermal conductivity of the composition. While the blended filler can be exposed to temperatures during processing of the resin composition that are capable of binding the silane to the filler materials, silane material that is not bonded to the filler material can potentially evaporate at the high processing temperatures.
  • the blend of the boron nitride and the silane can be treated by heating at 50° C. for seventy two hours in a convection oven.
  • the filler blend comprising boron nitride, a metal oxide and an optional glass fiber and the silane can be heat treated at 60° C. for four hours.
  • the heat treatment is at 80° C. for two hours.
  • the heat treatment is carried out under controlled moisture conditions.
  • the heat treatment is carried out at 50° C. and 50% relative humidity for twenty four hours.
  • the filler compositions can have a color as desired for a particular purpose or intended application.
  • the filler composition is white in appearance.
  • the filler composition is considered to be “white” when it has a color measured in the L*, a*, b* space with a D65 light source and a 2 degree or a 10 degree observer where L* is greater than 90, a* is between ⁇ 1.3 and 1.3, and b* is between ⁇ 2.5 and 2.5.
  • the color of the filler is such that L* is greater than 92, a* is between ⁇ 1.0 and 1.0, and b* is between ⁇ 2.0 and 2.0. Other colors may provided depending on the application of the final resin product.
  • the filler composition has an L* value of at least 85, an a* value between ⁇ 1.5 to 1.5; and a b* value between ⁇ 3.0. and 3.0.
  • the color can be measured by any suitable method. In one embodiment, the color is measured with a Minolta Spectrophotometer Model CM2002. The powders are placed in a clean quartz beaker sufficiently large to cover the source and detector and placed over the instrument for the measurement. The instrument uses a standard D65 light source and the measurements are made with either a 2° or a 10° observer.
  • the thermally conductive plastic compositions can comprise from about 20 to about 80 wt. % of the polymer matrix; from about 30 to about 70 wt. % of the polymer matrix; from about 35 to about 65 wt. % of the polymer matrix; even from about from about 42 to about 58 wt. % of the polymer matrix, and from about 20 to about 80 wt. % of thermally conductive filler; from about 25 to about 65 wt. % of thermally conductive filler; from about 30 to about 58 wt. % of thermally conductive filler; even from about 35 to about 55 wt. % of thermally conductive filler.
  • the total concentration of thermally conductive filler material is about 60 wt.
  • the volume of polymer matrix in the composition by percent volume (v/v) can range from 20% to about 90%; from 30% to about 80%; from 40% to about 70%; even from 35% to about 65%, and the volume of the thermally conductive filler can range from 10% to about 80%; from 15% to about 65%; from 20% to about 50%; even from 25% to about 45%.
  • the through-plane thermal conductivity is measured at the center of the tab portion of an ASTM standard dog-bone away from the molding gate using the laser flash method (ASTM E1461) utilizing the theoretical specific heat capacity (C p ) values based on the composition.
  • the in-plane thermal conductivity is measured by constructing a laminate sample from the same location as the through-plane measurement method where the laminate sample is constructed in such a way that the thermal conductivity in the plane of the dog-bone sample can be measured either in the flow direction or perpendicular to the flow direction.
  • Tensile properties are measured on an Instron UTM and impact strength on a TMI Impact Tester according to ASTM standards D638 and D256, respectively.
  • the compounding is carried out in a Brabender Plasticorder batch mixer.
  • the compounded sample is compression molded to ⁇ 0.4 mm and the in-plane thermal conductivity is measured using a modified laser flash method using a special sample holder and an in-plane mask (Netzsch Instruments). For a given composition, both methods of measuring the in-plane thermal conductivity yield comparable results.
  • the composition comprises boron nitride in an amount of from about 20 wt. % to about 60 wt. %; from about 25 wt. % to about 50 wt. %; even from about 30 wt. % to about 42 wt. %.
  • the thermally conductive composition comprises from about 30 to about 40 wt. % of a boron nitride.
  • the boron nitride filler comprises boron nitride agglomerate.
  • the boron nitride filler comprises boron nitride platelets.
  • the composition comprises 26.2 wt.
  • the composition comprises 20 wt. % BN and 30 wt. % glass fiber. In one embodiment, the composition comprises 24 wt. % BN and 30 wt. % glass fiber. In one embodiment, the composition comprises 35 wt. % BN and 20 wt. % glass fiber. In one embodiment, the composition comprises 31.2 wt. % BN, 19.4 wt. % ZnO, and 2.3 wt. % GF. In one embodiment, the composition comprises 20 wt. % BN and 50 wt. % ZnO.
  • numerical values can be combined to form new and non-disclosed ranges
  • a thermally conductive plastic composition comprises boron nitride, a metal oxide, such as, zinc oxide, etc., a silane, magnesium oxide, and optionally glass fiber or glass flake as thermally conductive fillers.
  • the composition comprises from about 30 to about 40 wt. % of boron nitride, from about 5 to about 20 wt. % of a metal oxide, zinc oxide, from about 0.1 wt. % to about 5 wt. % of a silane and from 0 to about 10 wt. % of glass fibers or glass flakes.
  • the amount of the filler components e.g., boron nitride, metal oxide, silane, glass fiber, etc., in the thermally conductive plastic composition refers to the amount of the final plastic composition irrespective of whether the filler components are added individually or as part of a blended filler composition.
  • the thermally conductive compositions can exhibit excellent thermal conductivity.
  • the thermally conductive compositions have an in-plane thermal conductivity of about 2 W/mK or greater; about 3.5 W/mK or greater; about 5 W/mK or greater; even about 10 W/mK or greater.
  • the thermally conductive compositions comprise boron nitride agglomerates and have a through-plane thermal conductivity of about 0.8 W/mK or greater; about 0.9 W/mK or greater; about 1.0 W/mK or greater; 1.3 W/mK or greater; even about 1.5 W/mK or greater.
  • the thermally conductive compositions have an in-plane thermal conductivity to through-plane thermal conductivity of about 3.5:1 or lower; about 3.25:1 or lower; about 3:1 or lower; even about 2.5:1 or lower.
  • the density of the composition can be adjusted as desire for a particular purpose or intended use. In one embodiment, the composition has a density of about 1.7 g/cm 3 or less.
  • Thermally conductive compositions and articles formed from such compositions can be produced using mixing, blending, and compounding techniques such as, for example, an extrusion compounding process.
  • Extrusion compounding of plastic materials generally employs an extruder screw to blend the polymer composition and convey the material toward a die.
  • the screw can include, but is not limited to a single screw or twin screw.
  • Twin screws can comprise co-rotating twin screws, counter rotating twin screws, co-rotating intermeshing twin screws, etc.
  • the extrusion compounding process can use a twin screw compounding extruder.
  • FIG. 1 is a schematic illustration of an extruder system 100 suitable for use in accordance with aspects of the invention.
  • the extruder 100 includes a housing 110 defining a cavity 112 in which the polymeric material and filler are introduced, compounded or blended into a melt, and conveyed.
  • the extruder includes a hopper 120 positioned above an inlet port or feed throat 122 .
  • the polymeric material is generally introduced into the extruder via hopper 120 .
  • the filler material including the boron nitride can be introduced into the extruder through hopper 120 .
  • the extruder includes a screw 130 for conveying and blending the polymeric material. Aspects of the screw are further described in greater detail herein.
  • the extruder can include other components including vents such as atmospheric vent 140 and vacuum vent 150 to release pressure that builds up in the extruder cavity during processing or to re-pressurize the system prior to introduction of the material into a mold or die like a strand die or a profile.
  • the extruder can also include other entry ports or side feeders as desired to introduce material into the extruder at locations downstream of the hopper 120 .
  • the screw conveys the polymeric material through the extruder to outlet port 160 where the polymeric material exits the extruder and is introduced into a mold cavity 170 to form a plastic article of a desired shape.
  • the compounded plastic material exits the extruder through a strand die to make continuous strands, e.g., about 1 mm to about 5 mm in diameter, which is then fed into a pelletizer to make pellets.
  • a pelletizer to make pellets.
  • the pellets can then be formed into the final desired shape.
  • a screw configuration for compounding a thermally conductive plastic composition comprising boron nitride comprises shovel elements in a location where the boron nitride particles are introduced into the extruder.
  • the boron nitride filler can be introduced into the extruder with the polymeric material, and the extruder screw is configured such that it comprises shovel elements adjacent to or near the inlet (e.g., in the vicinity of hopper 120 and feed throat 122 of the extruder of FIG. 1 ).
  • the extruder can comprise a side feeder with a separate screw in the side feeder for conveying material into the main extruder body.
  • the side feeder screw comprises shovel elements for conveying the boron nitride material into the polymer mix in the main extruder.
  • a screw configuration further comprises a pair of fractional lobe mixing elements (FMEs), stirrer elements, screw mixing elements, turbine mixing elements, or a combination of two or more thereof to facilitate dispersion of the filler material into the polymer mix.
  • the screw comprises one or more pairs of forward and reverse FMEs.
  • the screw comprises stirrer elements. Suitable screw elements are available from Steer America.
  • FIG. 2 illustrates one embodiment of a screw configuration for use in compounding a thermally conductive plastic composition comprising boron nitride filler.
  • the boron nitride filler is introduced into the extruder through the inlet 122 .
  • the screw 200 comprises shovel elements 210 in a location at or near the inlet 122 , and the shovel element section extends downstream of the inlet.
  • the screw comprises a section of conveying elements 212 downstream of the shovel elements to convey the material along the extruder.
  • a section of kneading elements 214 is provided to melt and knead the plastic material.
  • the screw further comprises a section of fractional lobe mixing elements 216 . As shown in FIG.
  • the fractional lobe mixing elements 216 includes a section 216 a having a forward fractional mixing element and a section 216 b comprising a reverse fractional mixing element. While the kneading elements 214 are suitable for melting the plastic, the kneading section may not sufficiently disperse the filler throughout the polymer melt. The fractional mixing elements 216 have been found to help aid dispersion of the boron nitride particles in the polymer melt.
  • the screw in FIG. 2 further includes a section of neutral kneading blocks 218 adjacent the FMEs 216 . The neutral kneading blocks may further facilitate dispersion and can increase the residence time of the melt at the FME block to ensure good dispersion of the material.
  • the kneading element section of the screw can be from about 10% to about 20% of the length of the screw element; from about 12% to about 18% of the length of the screw; even from about 13% to about 16% of the length of the screw.
  • FIGS. 3-5 illustrate other embodiments of an extruder system for use in processing thermally conductive plastic compositions.
  • the system includes a screw configuration 300 .
  • the system and screw configuration are suitable for methods of manufacturing the material where the filler material is introduced separately from and downstream of the location where the polymer material is introduced into the extruder.
  • the screw 300 comprises a section of kneading elements 312 located downstream of the inlet 122 , and a section of fractional mixing elements 316 located downstream of the kneading elements.
  • the fractional mixing element section comprises a section 316 a with forward fractional mixing elements and a section 316 b of reverse fractional mixing elements.
  • the screw 300 comprises screw mixing elements 318 and turbine mixing elements 320 adjacent to and downstream of the fractional mixing elements 316 .
  • the extruder system comprises a side feeder 180 ( FIG. 5 ) for introducing the thermally conductive filler into the extruder.
  • FIG. 4 illustrates another embodiment of a screw configuration for use with aspects of the invention.
  • the screw 350 includes conveying elements 352 , 356 , and 358 , and kneading elements 356 .
  • the screw in FIG. 4 comprises stirrer elements 360 instead of the fractional mixing elements that are included in screw 300 of FIG. 3 .
  • the stirrer elements can provide good mixing of the filler material with the polymer material to allow for good dispersion of the filler material within the polymer matrix without degrading boron nitride agglomerates.
  • the screw 350 further includes screw mixing elements 362 and turbine elements 364 .
  • suitable screws are not limited to the embodiments of FIGS. 2-4 , and that various screw elements could be switched.
  • a screw may be provided, similar to FIG. 2 , but the fractional mixing elements can be replaced with stirrer elements.
  • the shovel elements used in these configurations may have a single lobe or may be bi-lobed.
  • the FMEs can be replaced by other equivalent elements that minimize the peak shear at the element and provide relatively uniform shear across the element.
  • the FMEs can have four lobes, but can possibly have three lobes, or five or more lobes.
  • the dispersion can be further improved by adding Fractional Kneading Blocks (FKBs) either upstream or downstream of the FMEs.
  • FKBs Fractional Kneading Blocks
  • the dispersion can also be improved by adding multiple FMEs, or multiple sets of FMEs, SMEs, and TMEs.
  • the side feeder is positioned downstream of hopper 120 and inlet 122 and downstream of the kneading elements 312 .
  • the side feeder comprises a feeder port 184 for introducing the material in to the extruder housing 112 .
  • the side feeder can include a screw element 182 for conveying the filler material into the extruder through the feeder port 184 .
  • the side feeder screw 182 comprises shovel elements for conveying the thermally conductive filler material into the main extruder body.
  • an extruder system such as that illustrated in FIGS. 3-5 is employed for processing a composition comprising boron nitride agglomerates. It has been found that subjecting boron nitride agglomerates to kneading elements employed for melting and kneading the polymer can cause the agglomerates to break down, which can reduce or destroy the isotropric behavior of these materials. In certain applications, it may be desirable for the molded article to exhibit good thermal conductivity in both the in-plane and through-plane directions.
  • the extruder system of FIGS. 3 and 4 allow for the formation of a polymer melt through the action of the kneading elements.
  • the boron nitride agglomerates can then be introduced and dispersed into the polymer melt without being subjected to the forces required to form the melt in the kneading section. This allows the boron nitride agglomerates to be maintained as agglomerates to provide a composition with good in-plane and through-plane thermal conductivity.
  • the speed of the extruder screw can be selected as desired for a particular purpose or intended use.
  • the screw speed can be used to control the speed through which the material is conveyed through the extruder, the extent of shear rates and shear stresses witnessed by the plastic and the fillers, and can affect the mixing of the materials. It has been found that plastic compositions with high through-plane thermal conductivity can be obtained even at high screw speeds by processing boron nitride agglomerates using screw configuration in accordance with aspects and embodiments of the present invention.
  • the screw speed on a 40 mm twin screw extruder can be from about 100 RPM to about 1,000 RPM; from about 150 RPM to about 800 RPM; from about 200 RPM to about 600 RPM; even from about 300 RPM to about 500 RPM.
  • the screw speed is from about 100 RPM to about 500 RPM.
  • the screw speed is from about 100 RPM to about 450 RPM.
  • the screw speed is about 100 RPM, about 150 RPM, about 400 RPM, about 500 RPM, even about 800 RPM.
  • the screw speed can be scaled accordingly to other extruder sizes based on the tip speed at the edge of the screw.
  • ranges can be combined to form new and non-disclosed ranges.
  • the above embodiments also enable good dispersion and high in-plane thermal conductivity when platelet boron nitride grades are used.
  • the above embodiments enable retention of the shape of friable fillers such as ceramic or glass fibers.
  • the diameter ratio is the ratio of the outer diameter to the inner diameter of the screw and determines the free volume available to process material in the extruder.
  • the higher the diameter ratio the more the free volume available in the extruder, which translates to higher throughput from the equipment.
  • High throughput minimizes the processing cost, which is important to make a cost-effective commercial product.
  • the screw-to-barrel tolerance determines the fraction of material that sees a high shear environment in the extruder. The tighter (smaller) the tolerance, the lower the fraction of material that sees the high-shear in the process.
  • extrusion is carried out in a Steer OMega series 40 mm extruder.
  • the OMega series has a D o /D i ratio of 1.71, which is significantly higher than the 1.49 or 1.55 ratios commonly used in the industry.
  • the 1.71 ratio enables faster processing and higher throughput than similar size equipment with 1.49 or 1.55 ratios.
  • the OMega series also has very tight tolerances between the screw and the barrel. On a 40 mm barrel, the screw outer diameter is 39.7 mm, which represents a gap of 0.15 mm on each side between the barrel and the screw, significantly tighter than the commonly used 0.3-0.5 mm tolerances. This tight tolerance ensures that only a negligible fraction, if any, of the material sees the highest shear rate zone in the extruder which is the gap between the screw and the barrel.
  • the temperature of the extrusion process can be selected based on the polymer material and the filler materials being processed.
  • the thermally plastic compositions and methods of making such compositions can be used to form molded articles that can be used in a variety of applications.
  • the articles can be shaped to various forms as desired for a particular purpose or intended use.
  • the articles can form part of a heat sink structure for thermal management in a variety of applications including lighting assemblies, battery systems, sensors and electronic components, portable electronic devices such as smart phones, MP3 players, mobile phones, computers, televisions, etc.
  • Plastic compositions comprising Momentive BN powder grades and a plastic material such as polycarbonate (PC—Sabic Lexan HF1110) or nylon (PA6—Chemlon 212 or 212H, PA66—Chemlon 100 from Teknor Apex) are compounded on 20 mm and 40 mm twin screw extruders with L/D of about 40-50 on Steer extruders at Steer America's Application Development Center in Uniontown, Ohio. Samples are injection molded on a Van Dorn 55-ton injection molding equipment to make ASTM standard dog-bones (1 ⁇ 8′′ thick) to test thermal conductivity and tensile properties, and bars to evaluate for impact strength of the materials.
  • a plastic material such as polycarbonate (PC—Sabic Lexan HF1110) or nylon (PA6—Chemlon 212 or 212H, PA66—Chemlon 100 from Teknor Apex) are compounded on 20 mm and 40 mm twin screw extruders with L/D of about 40-50 on
  • Thermally conductive compositions comprising a thermoplastic resin and various thermally conductive fillers are compounded in twin screw extruders (20 mm or 40 mm diameter) and ASTM standard dog-bones are injection molded using a tab gate at 1 inch/s.
  • the through-plane thermal conductivity is measured at the center of the tab portion of an ASTM standard dog-bone away from the molding gate using the laser flash method (ASTM E1461) utilizing the theoretical specific heat capacity (C p ) values based on the composition.
  • the in-plane thermal conductivity is measured by constructing a laminate sample from the same location as the through-plane measurement method where the laminate sample is constructed in such a way that the thermal conductivity in the plane of the dog-bone sample can be measured either in the flow direction or perpendicular to the flow direction.
  • Tensile properties are measured on an Instron UTM and impact strength on a TMI Impact Tester according to ASTM standards D638 and D256, respectively.
  • the compounding is carried out in a Brabender Plasticorder batch mixer.
  • the compounded sample is compression molded to ⁇ 0.4 mm and the in-plane thermal conductivity is measured using a modified laser flash method using a special sample holder and an in-plane mask (Netzsch Instruments).
  • the injected molded dog bone samples are prepared using the extruder screws of FIGS. 2-4 and 6 .
  • the screw configurations of FIGS. 2-4 illustrate embodiments of the invention and have been described.
  • the screw configuration 400 of FIG. 6 represents a conventional screw configuration for extruding plastic materials and comprises a plurality of conveying elements 410 and kneading block sections 420 to provide a polymer melt.
  • Samples prepared using the screws of FIGS. 2 and 5 introduce the polymer material and the boron nitride filler at inlet 122 .
  • the side feeder used to introduce the fillers into the extruder at 184 in FIGS. 3 and 4 includes a screw comprising shovel elements.
  • Comparative examples 1-5 are prepared using the screw C 1 .
  • Examples 1-17 are examples illustrating non-limiting embodiments in accordance with aspects and embodiments of the present invention.
  • Thermally conductive polycarbonate compositions comprising boron nitride agglomerates are prepared using the screw configurations and conditions shown in Table 1.
  • Thermally conductive compositions comprising nylon resins and boron nitride filler materials are prepared according to the compositions illustrated in Table 2.
  • Table 3 illustrates the in-plane thermal conductivity, through-plane conductivity, and ratio of in-plane to through-plane conductivity for Comparative Examples 3-5 and Examples 3-5.
  • compositions formed using an extruder screw in accordance with aspects of the present technology exhibit in-plane thermal conductivities comparable to those made using the conventional extruder screw but have higher through-plane thermal conductivities and a lower ratio of in-plane to through-plane thermal conductivity.
  • Examples 7-16 in Table 4 below are made are compounded into a Nylon 5 resin using a Brabender Plasti-corder Batch Mixer.
  • the compounded samples were compression molded to thin films (about 0.3 mm thick) and the in-plane thermal conductivity was measured using a modified laser flash method using an in-plane sample mask (Netzsch Instruments).
  • the plastic compositions are formed from a polycarbonate resin with a boron nitride filler.
  • the composition are compounded using a twin screw extruder using a screw configuration as described in FIG. 3 .
  • the boron nitride concentrations and silane additive concentrations are shown in Table 5.
  • the present method also provides compositions with excellent mechanical properties.
  • boron nitride is compounded into PA6 resin using the screw illustrated in FIG. 3 with NXT silane loading at 3 weight percent (if indicated) of the filler composition and injected molded as described earlier. Table 6 illustrates various properties of the compositions.
  • the CF600 and HCPL boron nitride powder grades are similar to one another, and Table 6 illustrates that the addition of the silane and use of the glass fibers can significantly improve the mechanical properties of the composition including, for example, impact strength and tensile strength of the compositions.
  • Examples 25-26 are prepared by adding HCPL boron nitride, zinc oxide, titania, and a silane to a nylon resin and mixing in a Brabender Plasti-corder mixing bowl. Table 7 shows the thermal “7” conductivity data for the resins.
  • Examples 1-24 are prepared by separately adding the filler components and silane to the resin composition at the time of mixing or compounding.
  • Examples 25-33 employ blended filler compositions comprising boron nitride, zinc oxide or titanium dioxide, optionally glass fiber, and a silane.
  • the boron nitride is CF600 boron nitride, except for Examples 26 and 29 where the boron nitride is PT110.
  • the silane is NXT.
  • the filler composition is prepared by blending the boron nitride, zinc oxide, optional glass fiber, and silane with a V-blender having a liquid dispensing intensifier bar to blend the filler components and the silane. The blended filler is then added to a resin composition and molded.
  • the molded resins of Examples 25-30 are prepared by using a Brabender Plasti-corder Batch Mixer.
  • Example 31-33 are compounded using a twin screw extruder employing a screw configuration in accordance with FIG. 3 , and then injected molded. Table 8 illustrates properties of the compositions.
  • a boron nitride filler treated with a silane is added to one of a polycarbonate resin, a nylon resin, or a polypropylene resin and mixed using a Brabender Plasti-corder mixing bowl.
  • the boron nitride is HCPL grade.
  • the boron nitride is loaded at 40 weight percent of the composition, and the silane concentration is varied. Tables 9-11 show the thermal conductivities of the compositions.
  • Blended filler compositions are prepared with boron nitride, zinc oxide, an optional glass fiber, and a silane.
  • the silane is NXT.
  • the blended fillers are prepared and introduced into a Nylon 6 resin.
  • the fillers introduced into the resins are either introduced with or without prior heat treatment of the blended filler.
  • Filler compositions that are heat treated prior to introduction into the resin are heat treated at 50° C. for 72 hours in a convection oven.
  • Table 12 shows the thermal conductivities of the compositions.
  • the compositions in Table 12 are compounded with a Brabender Plasti-corder.
  • heat treating the blended filler composition prior to use can improve the thermal conductivity of the resin composition.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
US13/828,955 2012-09-19 2013-03-14 Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics Abandoned US20140080951A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/828,955 US20140080951A1 (en) 2012-09-19 2013-03-14 Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
PCT/US2013/060633 WO2014047297A1 (en) 2012-09-19 2013-09-19 Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261702787P 2012-09-19 2012-09-19
US13/828,955 US20140080951A1 (en) 2012-09-19 2013-03-14 Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics

Publications (1)

Publication Number Publication Date
US20140080951A1 true US20140080951A1 (en) 2014-03-20

Family

ID=50275116

Family Applications (2)

Application Number Title Priority Date Filing Date
US13/828,955 Abandoned US20140080951A1 (en) 2012-09-19 2013-03-14 Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US13/829,225 Active US8946333B2 (en) 2012-09-19 2013-03-14 Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics

Family Applications After (1)

Application Number Title Priority Date Filing Date
US13/829,225 Active US8946333B2 (en) 2012-09-19 2013-03-14 Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics

Country Status (5)

Country Link
US (2) US20140080951A1 (enrdf_load_stackoverflow)
EP (1) EP2898003B8 (enrdf_load_stackoverflow)
JP (1) JP6406549B2 (enrdf_load_stackoverflow)
CN (1) CN104981503B (enrdf_load_stackoverflow)
WO (2) WO2014047298A1 (enrdf_load_stackoverflow)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8946333B2 (en) 2012-09-19 2015-02-03 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US20150111796A1 (en) * 2013-10-21 2015-04-23 Ticona Gmbh Intrinsic Low Friction Polyoxymethylene
JP2015183100A (ja) * 2014-03-25 2015-10-22 トヨタ自動車株式会社 熱伝導材の製造方法
US20160021704A1 (en) * 2014-07-18 2016-01-21 Kim Edward Elverud Resistive heater
US20160200957A1 (en) * 2013-08-23 2016-07-14 Samsung Sdi Co., Ltd. Thermally-Conductive Polycarbonate Resin Composition and Molded Product Formed Therefrom
EP3059068A1 (en) * 2015-02-20 2016-08-24 Steer Engineering Private Limited Process and apparatus for producing a blend of styrene resin and polyphenylene ether
US9434870B2 (en) 2012-09-19 2016-09-06 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
WO2017022181A1 (ja) * 2015-07-31 2017-02-09 日本板硝子株式会社 フレーク状ガラス及び樹脂組成物
CN106459405A (zh) * 2014-06-19 2017-02-22 普立万公司 导热和导电尼龙混配物
JP2017052915A (ja) * 2015-09-11 2017-03-16 株式会社豊田中央研究所 樹脂複合材料及びその製造方法
WO2017054957A1 (de) * 2015-10-01 2017-04-06 Technip Zimmer Gmbh Verfahren und vorrichtung zur kontinuierlichen modifikation einer polymerschmelze aus unextrahiertem polyamid 6 mit einem oder mehreren additiven
CN107077917A (zh) * 2014-09-26 2017-08-18 莫门蒂夫性能材料股份有限公司 用于变压器绝缘的纸张中的氮化硼的层压复合材料
WO2017183007A1 (en) 2016-04-22 2017-10-26 Steerlife India Private Limited A fractional lobe processor
US20180056253A1 (en) * 2015-03-24 2018-03-01 South Dakota Board Of Regents High Shear Thin Film Machine For Dispersion and Simultaneous Orientation-Distribution Of Nanoparticles Within Polymer Matrix
WO2018148116A1 (en) * 2017-02-09 2018-08-16 Polyone Corporation Thermally conductive polyvinyl halide
WO2018235009A1 (en) 2017-06-22 2018-12-27 Steer Engineering Private Limited PROCESS FOR THE PRODUCTION OF POLY (VINYL CHLORIDE) NON-PLASTICATED FELT ARTICLES
US10196577B2 (en) 2015-09-30 2019-02-05 Celanese Sales Germany Gmbh Low friction squeak free assembly
WO2019051382A1 (en) * 2017-09-11 2019-03-14 Rogers Corporation NANOFEUILLE AND METHOD OF MANUFACTURING
EP3420024A4 (en) * 2016-02-23 2020-02-19 Advanced Environmental Recycling Technologies, Inc COMPOSITIONS AND METHODS FOR REDUCING THE SURFACE TEMPERATURE OF COMPOSITE ARTICLES
US11725105B2 (en) 2018-02-20 2023-08-15 Ticona Llc Thermally conductive polymer composition
US11827760B2 (en) 2017-03-10 2023-11-28 Celanese Sales Germany Gmbh Polyester polymer compositions
US20250033262A1 (en) * 2023-07-28 2025-01-30 Richard Sofia Systems and methods for reprocessing polymeric material during a molding process

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9922749B2 (en) * 2011-09-27 2018-03-20 Rhodia Operations Polyamide composition having high thermal conductivity
EP2816082B1 (de) * 2013-06-19 2018-09-19 3M Innovative Properties Company Durch thermoplastische Verarbeitung von Polymer-Bornitrid-Compounds hergestellte Bauteile, Polymer-Bornitrid-Compounds zur Herstellung solcher Bauteile sowie deren Verwendung
EP2816083B1 (de) * 2013-06-19 2019-02-20 3M Innovative Properties Company Bauteil hergestellt aus einem Polymer-Bornitrid-Compound, Polymer-Bornitrid-Compound zur Herstellung eines solchen Bauteils sowie dessen Verwendung
KR102233540B1 (ko) * 2013-09-25 2021-03-29 린텍 가부시키가이샤 열 전도성 접착 시트, 그의 제조 방법 및 그것을 사용한 전자 디바이스
US20150221578A1 (en) * 2014-02-05 2015-08-06 Infineon Technologies Ag Semiconductor package and method for producing a semiconductor
CN106414021B (zh) * 2014-05-30 2019-05-21 宇菱塑胶科技有限公司 注塑成形方法、螺杆以及注塑成形机
KR101940567B1 (ko) * 2014-08-26 2019-01-21 반도 카가쿠 가부시키가이샤 열전도성 수지 성형품
CN107257825B (zh) * 2014-12-24 2021-02-02 莫门蒂夫性能材料股份有限公司 导热塑料组合物、用于制造导热塑料的挤出装置和方法
KR102318231B1 (ko) 2015-01-29 2021-10-27 엘지이노텍 주식회사 무기충전재, 이를 포함하는 수지 조성물, 그리고 이를 이용한 방열 기판
US10407605B2 (en) 2015-07-31 2019-09-10 Ticona Llc Thermally conductive polymer composition
US9862809B2 (en) 2015-07-31 2018-01-09 Ticona Llc Camera module
TWI708806B (zh) 2015-08-17 2020-11-01 美商堤康那責任有限公司 用於相機模組之液晶聚合物組合物
KR102606624B1 (ko) * 2015-11-19 2023-11-27 세키스이가가쿠 고교가부시키가이샤 열경화성 재료 및 경화물
JP6581517B2 (ja) * 2016-01-28 2019-09-25 積水化学工業株式会社 窒化ホウ素ナノチューブ材料、熱硬化性材料、硬化物、硬化物の製造方法及び積層体
JP6838042B2 (ja) * 2016-02-18 2021-03-03 日本板硝子株式会社 フレーク状ガラス及び樹脂組成物
ES2904866T3 (es) * 2016-04-22 2022-04-06 Steerlife India Private Ltd Procesador de lóbulos fraccionarios y proceso relacionado para la granulación húmeda de material en polvo
US10385250B2 (en) 2016-06-14 2019-08-20 Nano And Advanced Materials Institute Limited Thermally conductive composites and method of preparing same
US10246623B2 (en) * 2016-09-21 2019-04-02 NAiEEL Technology Resin composition, article prepared by using the same, and method of preparing the same
CN106634047B (zh) * 2016-12-16 2018-11-13 中南民族大学 一种含石墨烯的复合电子导热散热材料及其制备方法和应用
US10633535B2 (en) 2017-02-06 2020-04-28 Ticona Llc Polyester polymer compositions
CN107828479B (zh) * 2017-10-24 2020-09-22 华南理工大学 一种改性纳米添加剂及其在润滑油中的应用
US11384238B2 (en) 2018-02-08 2022-07-12 Celanese Sales Germany Gmbh Polymer composite containing recycled carbon fibers
EP3546509B1 (en) 2018-03-26 2021-04-21 SHPP Global Technologies B.V. Thermally conductive thermoplastic compositions with good dielectric property and the shaped article therefore
WO2020019312A1 (zh) * 2018-07-27 2020-01-30 无锡艾克柏国际微电子科技有限公司 多层复合半导体基板结构及其制备方法
CN109337167B (zh) * 2018-09-27 2021-02-09 江苏宝源高新电工有限公司 一种高导热阻燃聚乙烯基复合材料及其制备方法
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
WO2021035383A1 (en) * 2019-08-23 2021-03-04 Evonik Specialty Chemicals (Shanghai) Co., Ltd. Thermal conductive filler and preparation method thereof
US12209164B2 (en) 2019-09-10 2025-01-28 Ticona Llc Polymer composition and film for use in 5G applications
US12294185B2 (en) 2019-09-10 2025-05-06 Ticona Llc Electrical connector formed from a polymer composition having a low dielectric constant and dissipation factor
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US12142820B2 (en) 2019-09-10 2024-11-12 Ticona Llc 5G system containing a polymer composition
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
CN110577726B (zh) * 2019-09-27 2021-10-26 东华大学 无机颗粒与热塑性树脂粉末混合铺层热熔压铸复合树脂片及其制备方法与应用
US11721888B2 (en) 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
WO2021173412A1 (en) 2020-02-26 2021-09-02 Ticona Llc Circuit structure
JP7468172B2 (ja) * 2020-06-12 2024-04-16 三菱ケミカル株式会社 粒子配合ポリエステル樹脂組成物の製造方法
CN111825890A (zh) * 2020-07-21 2020-10-27 诺博橡胶制品有限公司 导热减震胶料及其制备方法
KR102303031B1 (ko) * 2020-10-27 2021-09-23 주식회사 삼양사 외관, 표면 특성 및 내충격성이 우수한 유리 섬유-강화 폴리카보네이트 수지 조성물의 제조방법
US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system
WO2022177560A1 (en) * 2021-02-18 2022-08-25 Ticona Llc Polymer composition for use in an antenna system
FR3121601B1 (fr) * 2021-04-09 2024-05-31 Sensient Cosmetic Tech Composition blanchissante utile pour la préparation de formulations cosmétiques
CN114410097A (zh) * 2021-12-28 2022-04-29 王素贞 一种可回收利用工程塑料及其制备方法
WO2024014397A1 (ja) * 2022-07-15 2024-01-18 株式会社ユポ・コーポレーション 熱可塑性樹脂組成物の製造方法、及び混練機
CN116082858B (zh) * 2022-12-29 2024-11-22 雅安百图高新材料股份有限公司 一种氮化硼改性方法及产品和应用
CN116731428B (zh) * 2023-05-30 2024-02-02 服务型制造研究院(杭州)有限公司 一种废旧塑料微改性纳米复合材料及其制备方法
CN117024115B (zh) * 2023-07-24 2025-06-24 广东欧文莱陶瓷有限公司 一种高逼真度的仿金属光感的岩板及其制备方法

Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3608868A (en) * 1967-12-16 1971-09-28 Werner & Pfleiderer Continually mixing and kneading device with two or more screws for a plasticizable material
US5318358A (en) * 1991-10-15 1994-06-07 Werner & Pfleiderer Gmbh Screw kneader for plastic material having a controlling mixing section
US20040068037A1 (en) * 2002-10-03 2004-04-08 Jun Mitadera Process for production of polyamide composite material
US20040252502A1 (en) * 2003-06-11 2004-12-16 Mccullough Kevin Light-Emitting diode reflector assembly having a heat pipe
US20070259993A1 (en) * 2005-03-29 2007-11-08 Asahi Kasei Chemicals Corporation Process for producing polyphenylene ether composition
US20080153960A1 (en) * 2006-10-07 2008-06-26 Paulo Meneghetti Mixed boron nitride composition and method for making thereof
US20080153959A1 (en) * 2006-12-20 2008-06-26 General Electric Company Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof
US20090023851A1 (en) * 2007-06-23 2009-01-22 Bayer Materialscience Ag Process for the production of an electrically conducting polymer composite material
US20090226711A1 (en) * 2008-03-06 2009-09-10 General Electric Company Biaxially Oriented Nanocomposite Film, Method of Manufacture, and Articles Thereof
US20100020559A1 (en) * 2006-07-11 2010-01-28 Janssen Robert H C Lamp sockets
US20100060134A1 (en) * 2008-09-11 2010-03-11 Sumitomo Chemical Company, Limited Method for producing liquid-crystalline polyester resin composition
US20100159213A1 (en) * 2008-12-19 2010-06-24 Przybylinski James P Wood-Plastic Composites Utilizing Ionomer Capstocks and Methods of Manufacture
US20100279091A1 (en) * 2005-12-22 2010-11-04 Mitsubishi Plastics, Inc. Reflective film
US20100305253A1 (en) * 2007-09-28 2010-12-02 Basf Se Methods For Producing Flameproofed Thermoplastic Moulding Compounds
US7897083B2 (en) * 2004-07-28 2011-03-01 Polyplastics Co., Ltd. Method for manufacturing liquid crystalline resin composition of reduced density
US20110063940A1 (en) * 2009-09-14 2011-03-17 Steer Engineering Private Limited Method of extruder operation
US20120217434A1 (en) * 2011-02-25 2012-08-30 L Abee Roy Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
US20120292578A1 (en) * 2009-11-18 2012-11-22 Alexander Bacher METHOD FOR PRODUCING COMPOSITE MATERIALS BASED ON POLYMERS AND CARBON NANOTUBES (CNTs), COMPOSITE MATERIALS PRODUCED IN THIS WAY AND USE THEREOF
US20120319031A1 (en) * 2011-06-15 2012-12-20 Thermal Solution Resources, Llc Thermally conductive thermoplastic compositions
US20130018137A1 (en) * 2010-12-23 2013-01-17 Bayer Materialscience Ag Process for improving carbon black dispersion
US20130099424A1 (en) * 2011-10-25 2013-04-25 Chevron Phillips Chemical Company Lp System and method for blending polymers

Family Cites Families (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU771138A1 (ru) 1978-06-29 1980-10-15 Предприятие П/Я Г-4236 Композици на основе низкомолекул рного силоксанового каучука
US4826896A (en) 1987-03-19 1989-05-02 The Dexter Corporation Encapsulating electronic components
US4904560A (en) 1987-06-29 1990-02-27 Bando Chemical Industries, Ltd. Suspension polymerization process for producing electrophotographic toners
EP0302648A3 (en) 1987-08-03 1989-08-09 Polyplastics Co. Ltd. Weld-containing polyarylene sulfide resin molded article
KR900003290A (ko) 1988-08-04 1990-03-26 고니시 히꼬이찌 전자부품봉지용(封止用) 수지 조성물과 전자 부품
JPH02110125A (ja) * 1988-10-19 1990-04-23 Mitsubishi Plastics Ind Ltd 高熱伝導性樹脂組成物
US5232970A (en) 1990-08-31 1993-08-03 The Dow Chemical Company Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications
US5530050A (en) 1994-04-06 1996-06-25 Sulzer Plasma Technik, Inc. Thermal spray abradable powder for very high temperature applications
JP3232226B2 (ja) * 1995-10-20 2001-11-26 信越化学工業株式会社 硬化性シリコーンゴム組成物、その硬化物及びそれにより封止された樹脂封止型半導体装置
US5898009A (en) 1996-03-19 1999-04-27 Advanced Ceramics Corporation High density agglomerated boron nitride particles
US5900447A (en) 1997-05-01 1999-05-04 Edison Polymer Innovation Corporation Composition for forming high thermal conductivity polybenzoxazine-based material and method
JPH1145965A (ja) 1997-07-28 1999-02-16 Kyocera Corp 伝熱性化合物およびこれを用いた半導体装置
BR9806096B1 (pt) 1997-08-21 2009-01-13 mercaptosilano bloqueado; processo para a manufatura de uma borracha com carga; processo para a manufatura de um mercaptosilano bloqueado; composiÇço de borracha; e silano.
US6069201A (en) 1997-09-12 2000-05-30 Shin-Etsu Chemical Co., Ltd. Zinc oxide-filled addition-curable silicone rubber compositions
JPH1192624A (ja) * 1997-09-18 1999-04-06 Toshiba Corp エポキシ樹脂組成物および樹脂封止型半導体装置
JP3948642B2 (ja) 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP2000109373A (ja) 1998-10-02 2000-04-18 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物及びそれを使用した半導体装置
US6162849A (en) 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
US6649684B1 (en) * 1999-08-19 2003-11-18 Ppg Industries Ohio, Inc. Chemically treated fillers and polymeric compositions containing same
US6713088B2 (en) 1999-08-31 2004-03-30 General Electric Company Low viscosity filler composition of boron nitride particles of spherical geometry and process
US6660241B2 (en) 2000-05-01 2003-12-09 Saint-Gobain Ceramics & Plastics, Inc. Highly delaminated hexagonal boron nitride powders, process for making, and uses thereof
US6794435B2 (en) 2000-05-18 2004-09-21 Saint Gobain Ceramics & Plastics, Inc. Agglomerated hexagonal boron nitride powders, method of making, and uses thereof
US6764975B1 (en) 2000-11-28 2004-07-20 Saint-Gobain Ceramics & Plastics, Inc. Method for making high thermal diffusivity boron nitride powders
US6635700B2 (en) * 2000-12-15 2003-10-21 Crompton Corporation Mineral-filled elastomer compositions
US6652822B2 (en) 2001-05-17 2003-11-25 The Regents Of The University Of California Spherical boron nitride particles and method for preparing them
US20030139510A1 (en) 2001-11-13 2003-07-24 Sagal E. Mikhail Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefrom
US7301042B2 (en) 2002-04-23 2007-11-27 Cruse Richard W Blocked mercaptosilane hydrolyzates as coupling agents for mineral-filled elastomer compositions
NZ537861A (en) 2002-07-09 2008-09-26 Momentive Performance Mat Inc Silica-rubber mixtures having improved hardness
US8097743B2 (en) 2002-11-04 2012-01-17 Momentive Performance Materials Inc. Process for manufacture of blocked mercaptosilane coupling agents
US6777569B1 (en) 2003-03-03 2004-08-17 General Electric Company Process for the manufacture of blocked mercaptosilanes
US20040180209A1 (en) 2003-03-12 2004-09-16 Chih-Min Cheng Thermal interface material
US6776226B1 (en) 2003-03-12 2004-08-17 National Starch And Chemical Investment Holding Corporation Electronic device containing thermal interface material
US8008520B2 (en) 2003-07-03 2011-08-30 Momentive Performance Materials Inc. Process for the preparation of thiocarboxylate silane
US7494635B2 (en) 2003-08-21 2009-02-24 Saint-Gobain Ceramics & Plastics, Inc. Boron nitride agglomerated powder
US7584795B2 (en) * 2004-01-29 2009-09-08 Halliburton Energy Services, Inc. Sealed branch wellbore transition joint
BRPI0418816A (pt) * 2004-05-20 2007-11-13 Gen Electric matrizes orgánicas contendo nanomateriais para aumentar condutividade térmica em volume
KR101152040B1 (ko) * 2004-11-30 2012-07-23 스미토모 베이클라이트 가부시키가이샤 에폭시 수지 조성물 및 반도체장치
US7462656B2 (en) 2005-02-15 2008-12-09 Sabic Innovative Plastics Ip B.V. Electrically conductive compositions and method of manufacture thereof
US7528273B2 (en) 2005-04-14 2009-05-05 Momentive Performance Materials Inc. Aqueous catalytic process for the preparation of thiocarboxylate silane
US20060293427A1 (en) 2005-06-10 2006-12-28 Martens Marvin M Thermally conductive polyamide-based components used in light emitting diode reflector applications
US20070026221A1 (en) 2005-06-14 2007-02-01 Siemens Power Generation, Inc. Morphological forms of fillers for electrical insulation
JP4686274B2 (ja) 2005-06-30 2011-05-25 ポリマテック株式会社 放熱部品及びその製造方法
US7524560B2 (en) 2005-08-19 2009-04-28 Momentive Performance Materials Inc. Enhanced boron nitride composition and compositions made therewith
JP4747918B2 (ja) 2005-11-04 2011-08-17 東ソー株式会社 ポリアリーレンスルフィド組成物
US20070179232A1 (en) 2006-01-30 2007-08-02 National Starch And Chemical Investment Holding Corporation Thermal Interface Material
JP4386453B2 (ja) * 2006-05-31 2009-12-16 信越化学工業株式会社 樹脂封止された半導体装置
EP2064268A4 (en) 2006-09-12 2013-05-01 Henkel Ag & Co Kgaa METHOD FOR CHANGING THE RHEOLOGY IN FILLED RESIN SYSTEMS BY MEANS OF CAVITATION
TWI380325B (en) 2006-09-26 2012-12-21 Polytronics Technology Corp Heat-conductive dielectric polymer composition and heat dissipation substrate containing the same
WO2008043540A1 (en) 2006-10-12 2008-04-17 Dsm Ip Assets B.V. Lighting device
KR100706653B1 (ko) 2006-12-27 2007-04-13 제일모직주식회사 열전도성 수지 조성물 및 플라스틱 성형품
EP2118191A1 (en) 2007-01-10 2009-11-18 Momentive Performance Materials Inc. Thermal interface materials and methods for making thereof
WO2008088774A2 (en) 2007-01-12 2008-07-24 Momentive Performance Materials Inc. Improved process for making boron intride
JP5525682B2 (ja) 2007-05-15 2014-06-18 出光ライオンコンポジット株式会社 ポリアリーレンサルファイド樹脂組成物及びそれからなる成形品
US10023723B2 (en) 2007-06-05 2018-07-17 Momentive Performance Materials Inc. Process for preparing rubber compositions and articles made therefrom
WO2009035439A1 (en) 2007-09-14 2009-03-19 Henkel Ag & Co, Kgaa Thermally conductive composition
US8586650B2 (en) 2007-09-14 2013-11-19 Henkel US IP LLC Thermally conductive composition
US7723419B1 (en) 2007-09-17 2010-05-25 Ovation Polymer Technology & Engineered Materials, Inc. Composition providing through plane thermal conductivity
WO2009041300A1 (ja) * 2007-09-26 2009-04-02 Mitsubishi Electric Corporation 熱伝導性シート及びパワーモジュール
JP5226270B2 (ja) * 2007-10-05 2013-07-03 株式会社カネカ 高熱伝導性熱可塑性樹脂組成物
US8211341B2 (en) 2007-11-16 2012-07-03 Exxonmobil Research And Engineering Company Fiber pellets method of making, and use in making fiber reinforced polypropylene composites
JP5549061B2 (ja) 2007-12-27 2014-07-16 ダイソー株式会社 熱硬化性樹脂組成物
US8367760B1 (en) * 2008-02-19 2013-02-05 Firestone Building Products Company, Llc Non-black rubber membranes
US20110103021A1 (en) 2008-03-20 2011-05-05 Robert Hendrik Catharina Janssen Heatsinks of thermally conductive plastic materials
TWI366421B (en) * 2008-08-22 2012-06-11 Nanya Plastics Corp High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards
US9101062B2 (en) 2008-09-08 2015-08-04 Nippon Steel & Sumikin Chemical Co., Ltd. Highly heat conductive polyimide film, highly heat conductive metal-clad laminate, and method for producing the same
JP2011256214A (ja) * 2008-10-08 2011-12-22 Denki Kagaku Kogyo Kk 熱伝導性湿気硬化型樹脂組成物
KR100908455B1 (ko) 2008-10-14 2009-07-20 김태웅 비점착성 도료의 조성물 및 그 제조방법
WO2010050202A1 (ja) 2008-10-30 2010-05-06 株式会社カネカ 高熱伝導性の熱可塑性樹脂組成物及び熱可塑性樹脂
FR2940302B1 (fr) * 2008-12-22 2012-07-27 Michelin Soc Tech Composition de caoutchouc comportant un agent de couplage mercaptosilane bloque
JP4848434B2 (ja) 2009-01-30 2011-12-28 日東電工株式会社 熱伝導性粘着剤組成物および熱伝導性粘着シート
WO2010097466A1 (en) 2009-02-27 2010-09-02 Dsm Ip Assets B.V. Polymer granulation process and polymer granulates
JP2010229368A (ja) * 2009-03-30 2010-10-14 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物並びにプリプレグ、積層板及び配線板
JP5330910B2 (ja) * 2009-07-03 2013-10-30 電気化学工業株式会社 樹脂組成物及びその用途
EP2456814A1 (en) 2009-07-24 2012-05-30 Ticona LLC Thermally conductive thermoplastic resin compositions and related applications
US8299159B2 (en) 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
US8303922B2 (en) 2009-08-24 2012-11-06 The United States Of America As Represeted By The Administrator Of The National Aeronautics And Space Administration Method for exfoliation of hexagonal boron nitride
JP2011084657A (ja) * 2009-10-15 2011-04-28 Daiso Co Ltd 熱硬化性樹脂組成物
JP2011132368A (ja) * 2009-12-24 2011-07-07 Sekisui Chem Co Ltd 樹脂組成物及び積層構造体
JP2011168672A (ja) * 2010-02-17 2011-09-01 Sekisui Chem Co Ltd 絶縁シート
CN102822279B (zh) 2010-04-07 2014-08-13 电气化学工业株式会社 Led照明箱体用的散热性树脂组合物及该led照明用散热性箱体
KR20110124127A (ko) 2010-05-10 2011-11-16 신코베덴키 가부시키가이샤 열가소성 수지 조성물 및 수지 성형품
JP2012107096A (ja) * 2010-11-16 2012-06-07 Kaneka Corp 熱伝導性硬化性樹脂組成物及び硬化性樹脂成形体
US20120157600A1 (en) * 2010-12-20 2012-06-21 E.I.Du Pont De Nemours And Company Molded thermoplastic articles comprising thermally conductive polymers
KR101236642B1 (ko) 2011-01-06 2013-02-22 주식회사 두산 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판
US8552101B2 (en) * 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
CN103429633A (zh) * 2011-03-07 2013-12-04 三菱瓦斯化学株式会社 树脂组合物以及使用其的预浸料和层叠板
CN102212273A (zh) 2011-04-29 2011-10-12 上海安美特铝业有限公司 用于太阳能光电-热转换设备的导热材料及其制备方法
CN102321364B (zh) 2011-09-20 2013-04-24 东莞市普强高分子材料有限公司 抗静电高散热石墨复合聚酰胺塑料及其制备方法
CN102504513B (zh) * 2011-10-24 2014-11-26 日照日纳功能材料科技有限公司 纳米复合导热高分子鞋材
TWI424014B (zh) * 2011-11-08 2014-01-21 Kenner Material & System Co Ltd 阻燃導熱塑膠組成物
US20140080951A1 (en) 2012-09-19 2014-03-20 Chandrashekar Raman Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US20140077125A1 (en) 2012-09-19 2014-03-20 Kang Yi Lin Composition comprising exfoliated boron nitride and method for forming such compositions
US20140080954A1 (en) 2012-09-19 2014-03-20 Chandrashekar Raman Methods for making thermally conductve compositions containing boron nitride

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3608868A (en) * 1967-12-16 1971-09-28 Werner & Pfleiderer Continually mixing and kneading device with two or more screws for a plasticizable material
US5318358A (en) * 1991-10-15 1994-06-07 Werner & Pfleiderer Gmbh Screw kneader for plastic material having a controlling mixing section
US20040068037A1 (en) * 2002-10-03 2004-04-08 Jun Mitadera Process for production of polyamide composite material
US20040252502A1 (en) * 2003-06-11 2004-12-16 Mccullough Kevin Light-Emitting diode reflector assembly having a heat pipe
US7897083B2 (en) * 2004-07-28 2011-03-01 Polyplastics Co., Ltd. Method for manufacturing liquid crystalline resin composition of reduced density
US20070259993A1 (en) * 2005-03-29 2007-11-08 Asahi Kasei Chemicals Corporation Process for producing polyphenylene ether composition
US20100279091A1 (en) * 2005-12-22 2010-11-04 Mitsubishi Plastics, Inc. Reflective film
US20100020559A1 (en) * 2006-07-11 2010-01-28 Janssen Robert H C Lamp sockets
US20080153960A1 (en) * 2006-10-07 2008-06-26 Paulo Meneghetti Mixed boron nitride composition and method for making thereof
US20080153959A1 (en) * 2006-12-20 2008-06-26 General Electric Company Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof
US20090023851A1 (en) * 2007-06-23 2009-01-22 Bayer Materialscience Ag Process for the production of an electrically conducting polymer composite material
US20100305253A1 (en) * 2007-09-28 2010-12-02 Basf Se Methods For Producing Flameproofed Thermoplastic Moulding Compounds
US20090226711A1 (en) * 2008-03-06 2009-09-10 General Electric Company Biaxially Oriented Nanocomposite Film, Method of Manufacture, and Articles Thereof
US20100060134A1 (en) * 2008-09-11 2010-03-11 Sumitomo Chemical Company, Limited Method for producing liquid-crystalline polyester resin composition
US20100159213A1 (en) * 2008-12-19 2010-06-24 Przybylinski James P Wood-Plastic Composites Utilizing Ionomer Capstocks and Methods of Manufacture
US20110063940A1 (en) * 2009-09-14 2011-03-17 Steer Engineering Private Limited Method of extruder operation
US20120292578A1 (en) * 2009-11-18 2012-11-22 Alexander Bacher METHOD FOR PRODUCING COMPOSITE MATERIALS BASED ON POLYMERS AND CARBON NANOTUBES (CNTs), COMPOSITE MATERIALS PRODUCED IN THIS WAY AND USE THEREOF
US20130018137A1 (en) * 2010-12-23 2013-01-17 Bayer Materialscience Ag Process for improving carbon black dispersion
US20120217434A1 (en) * 2011-02-25 2012-08-30 L Abee Roy Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
US20120319031A1 (en) * 2011-06-15 2012-12-20 Thermal Solution Resources, Llc Thermally conductive thermoplastic compositions
US20130099424A1 (en) * 2011-10-25 2013-04-25 Chevron Phillips Chemical Company Lp System and method for blending polymers

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9434870B2 (en) 2012-09-19 2016-09-06 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US8946333B2 (en) 2012-09-19 2015-02-03 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US9862870B2 (en) * 2013-08-23 2018-01-09 Lotte Advanced Materials Co., Ltd. Thermally-conductive polycarbonate resin composition and molded product formed therefrom
US20160200957A1 (en) * 2013-08-23 2016-07-14 Samsung Sdi Co., Ltd. Thermally-Conductive Polycarbonate Resin Composition and Molded Product Formed Therefrom
US20150111796A1 (en) * 2013-10-21 2015-04-23 Ticona Gmbh Intrinsic Low Friction Polyoxymethylene
US10479954B2 (en) 2013-10-21 2019-11-19 Celanese Sales Germany Gmbh Intrinsic low friction polyoxymethylene
US10030208B2 (en) * 2013-10-21 2018-07-24 Celanese Sales Germany Gmbh Intrinsic low friction polyoxymethylene
JP2015183100A (ja) * 2014-03-25 2015-10-22 トヨタ自動車株式会社 熱伝導材の製造方法
CN106459405A (zh) * 2014-06-19 2017-02-22 普立万公司 导热和导电尼龙混配物
WO2016011391A1 (en) * 2014-07-18 2016-01-21 Elverud Kim Edward Resistive heater
US20160021704A1 (en) * 2014-07-18 2016-01-21 Kim Edward Elverud Resistive heater
US10134502B2 (en) * 2014-07-18 2018-11-20 Kim Edward Elverud Resistive heater
CN107077917A (zh) * 2014-09-26 2017-08-18 莫门蒂夫性能材料股份有限公司 用于变压器绝缘的纸张中的氮化硼的层压复合材料
EP3059068A1 (en) * 2015-02-20 2016-08-24 Steer Engineering Private Limited Process and apparatus for producing a blend of styrene resin and polyphenylene ether
US10675598B2 (en) * 2015-03-24 2020-06-09 South Dakota Board Of Regents High shear thin film machine for dispersion and simultaneous orientation-distribution of nanoparticles within polymer matrix
US20180056253A1 (en) * 2015-03-24 2018-03-01 South Dakota Board Of Regents High Shear Thin Film Machine For Dispersion and Simultaneous Orientation-Distribution Of Nanoparticles Within Polymer Matrix
CN107735378A (zh) * 2015-07-31 2018-02-23 日本板硝子株式会社 薄片状玻璃及树脂组合物
US10590023B2 (en) 2015-07-31 2020-03-17 Nippon Sheet Glass Company, Limited Glass flakes and resin composition
WO2017022181A1 (ja) * 2015-07-31 2017-02-09 日本板硝子株式会社 フレーク状ガラス及び樹脂組成物
JP2017052915A (ja) * 2015-09-11 2017-03-16 株式会社豊田中央研究所 樹脂複合材料及びその製造方法
US10196577B2 (en) 2015-09-30 2019-02-05 Celanese Sales Germany Gmbh Low friction squeak free assembly
CN108463319A (zh) * 2015-10-01 2018-08-28 特尼吉玛有限责任公司 利用一种或多种添加剂连续改性由未萃取的聚酰胺6形成的聚合物熔体的方法和装置
WO2017054957A1 (de) * 2015-10-01 2017-04-06 Technip Zimmer Gmbh Verfahren und vorrichtung zur kontinuierlichen modifikation einer polymerschmelze aus unextrahiertem polyamid 6 mit einem oder mehreren additiven
EA038444B1 (ru) * 2015-10-01 2021-08-30 Технип Зиммер Гмбх Способ и устройство для непрерывного модифицирования полимерного расплава неэтилированного полиамида 6 с одной или несколькими добавками
TWI617598B (zh) * 2015-10-01 2018-03-11 德希尼布吉瑪公司 以一或多種添加劑連續性改質未經萃取的聚醯胺6之聚合物熔融物之方法及裝置
US10899060B2 (en) 2015-10-01 2021-01-26 Technip Zimmer Gmbh Method and device for continuously modifying a polymer melt made of non-extracted polyamide 6 with one or more additives
US11077597B2 (en) 2016-02-23 2021-08-03 Moistureshield, Inc. Compositions and methods for reducing the surface temperature of composite articles
EP3420024A4 (en) * 2016-02-23 2020-02-19 Advanced Environmental Recycling Technologies, Inc COMPOSITIONS AND METHODS FOR REDUCING THE SURFACE TEMPERATURE OF COMPOSITE ARTICLES
EP3954520A3 (en) * 2016-04-22 2022-03-16 Steerlife India Private Limited Fractional lobe processor, and related method of hot melt fragmentation
WO2017183007A1 (en) 2016-04-22 2017-10-26 Steerlife India Private Limited A fractional lobe processor
EP3445558A4 (en) * 2016-04-22 2019-12-11 Steerlife India Private Limited A fractional lobe processor
US11465327B1 (en) 2016-04-22 2022-10-11 Steerlife India Private Limited Fractional lobe processor
WO2018148116A1 (en) * 2017-02-09 2018-08-16 Polyone Corporation Thermally conductive polyvinyl halide
US11535737B2 (en) 2017-02-09 2022-12-27 Geon Performance Solutions, Llc Thermally conductive polyvinyl halide
US11827760B2 (en) 2017-03-10 2023-11-28 Celanese Sales Germany Gmbh Polyester polymer compositions
EP3642279A4 (en) * 2017-06-22 2020-08-05 Steer Engineering Private Limited PROCESS FOR THE PRODUCTION OF UNPLASTICIZED MOLTEN ARTICLES IN POLY (VINYL CHLORIDE)
WO2018235009A1 (en) 2017-06-22 2018-12-27 Steer Engineering Private Limited PROCESS FOR THE PRODUCTION OF POLY (VINYL CHLORIDE) NON-PLASTICATED FELT ARTICLES
WO2019051382A1 (en) * 2017-09-11 2019-03-14 Rogers Corporation NANOFEUILLE AND METHOD OF MANUFACTURING
US11725105B2 (en) 2018-02-20 2023-08-15 Ticona Llc Thermally conductive polymer composition
US20250033262A1 (en) * 2023-07-28 2025-01-30 Richard Sofia Systems and methods for reprocessing polymeric material during a molding process

Also Published As

Publication number Publication date
US8946333B2 (en) 2015-02-03
JP6406549B2 (ja) 2018-10-17
EP2898003A1 (en) 2015-07-29
CN104981503B (zh) 2017-11-07
CN104981503A (zh) 2015-10-14
US20140080952A1 (en) 2014-03-20
WO2014047297A1 (en) 2014-03-27
JP2015534596A (ja) 2015-12-03
EP2898003B8 (en) 2021-05-12
EP2898003B1 (en) 2021-03-31
WO2014047298A1 (en) 2014-03-27

Similar Documents

Publication Publication Date Title
US8946333B2 (en) Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US9434870B2 (en) Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
EP3237166B1 (en) Thermally conductive plastic compositions
US20150275063A1 (en) Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
WO2014047249A1 (en) Methods for making thermally conductive compositions containing boron nitride
KR101457016B1 (ko) 내습성 및 열전도성이 우수한 열가소성 수지 조성물 및 성형품
US20140077125A1 (en) Composition comprising exfoliated boron nitride and method for forming such compositions
CN102213400A (zh) Led照明装置用框体以及led照明装置
JP2008260830A (ja) 伝熱性樹脂組成物
KR101355026B1 (ko) 성형성 및 열전도성이 우수한 열가소성 수지 조성물
JP6168851B2 (ja) 放熱樹脂成形体
KR20140126907A (ko) 고분자 수지용 방열재, 방열 수지 조성물, 플라스틱 방열재료 및 그 제조방법
KR101657338B1 (ko) 고분자 수지 조성물과 제조 방법, 및 플라스틱 사출 성형품
KR20140080115A (ko) 열전도성이 우수하고, 열전도도의 이방성이 감소된 전기 전도성 열가소성 수지 조성물
CN115803368B (zh) 聚芳硫醚树脂组合物的毛边抑制方法
KR101688278B1 (ko) 비카본계 필러 함유 열전도성 수지 조성물 및 압출성형품의 제조방법
WO2013161844A1 (ja) 高熱伝導性樹脂組成物
KR101405264B1 (ko) 열전도성 및 휨 특성이 우수한 전기 전도성 열가소성 수지 조성물
EP4556518A1 (en) Thermally conductive and electrically insulating high temperature polymers
KR101405258B1 (ko) 열전도성 및 휨 특성이 우수한 전기 절연성 열가소성 수지 조성물
KR20170100469A (ko) 열전도성이 우수하고, 열전도도의 이방성이 감소된 전기 전도성 열가소성 수지 조성물
CN108291046A (zh) 通过塑料上涂料导热的组合物

Legal Events

Date Code Title Description
AS Assignment

Owner name: JPMORGAN CHASE BANK, N.A., NEW YORK

Free format text: SECURITY AGREEMENT;ASSIGNOR:MOMENTIVE PERFORMANCE MATERIALS INC.;REEL/FRAME:030311/0343

Effective date: 20130424

AS Assignment

Owner name: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS CO

Free format text: SECURITY INTEREST;ASSIGNOR:MOMENTIVE PERFORMANCE MATERIALS INC.;REEL/FRAME:032736/0471

Effective date: 20140411

Owner name: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT, NE

Free format text: SECURITY INTEREST;ASSIGNOR:MOMENTIVE PERFORMANCE MATERIALS INC.;REEL/FRAME:032736/0552

Effective date: 20140411

Owner name: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS CO

Free format text: SECURITY INTEREST;ASSIGNOR:MOMENTIVE PERFORMANCE MATERIALS INC.;REEL/FRAME:032736/0457

Effective date: 20140411

Owner name: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT, NE

Free format text: SECURITY INTEREST;ASSIGNOR:MOMENTIVE PERFORMANCE MATERIALS INC.;REEL/FRAME:032754/0774

Effective date: 20140411

AS Assignment

Owner name: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT, PENNSYLVANIA

Free format text: SECURITY INTEREST;ASSIGNOR:MOMENTIVE PERFORMANCE MATERIALS INC.;REEL/FRAME:034066/0570

Effective date: 20141024

Owner name: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT, PENNSYLVANIA

Free format text: SECURITY INTEREST;ASSIGNOR:MOMENTIVE PERFORMANCE MATERIALS INC.;REEL/FRAME:034066/0662

Effective date: 20141024

Owner name: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., A

Free format text: SECURITY INTEREST;ASSIGNOR:MOMENTIVE PERFORMANCE MATERIALS INC.;REEL/FRAME:034066/0570

Effective date: 20141024

Owner name: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., A

Free format text: SECURITY INTEREST;ASSIGNOR:MOMENTIVE PERFORMANCE MATERIALS INC.;REEL/FRAME:034066/0662

Effective date: 20141024

AS Assignment

Owner name: MOMENTIVE PERFORMANCE MATERIALS INC., NEW YORK

Free format text: TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS;ASSIGNOR:JPMORGAN CHASE BANK, N.A.;REEL/FRAME:034410/0607

Effective date: 20141024

AS Assignment

Owner name: BOKF, NA, AS SUCCESSOR COLLATERAL AGENT, OKLAHOMA

Free format text: NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY;ASSIGNOR:THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT;REEL/FRAME:035136/0457

Effective date: 20150302

Owner name: BOKF, NA, AS SUCCESSOR COLLATERAL AGENT, OKLAHOMA

Free format text: NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY - SECOND LIEN;ASSIGNOR:THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT;REEL/FRAME:035137/0263

Effective date: 20150302

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: MOMENTIVE PERFORMANCE MATERIALS INC., NEW YORK

Free format text: BANKRUPTCY ORDER TO RELEASE SECURITY INTEREST AT REEL/FRAME NO. 032736/471;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:043608/0018

Effective date: 20140911

AS Assignment

Owner name: MOMENTIVE PERFORMANCE MATERIALS INC., NEW YORK

Free format text: BANKRUPTCY ORDER TO RELEASE SECURITY INTEREST AT REEL/FRAME NO. 032736/0457;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:044203/0513

Effective date: 20140911

AS Assignment

Owner name: MOMENTIVE PERFORMANCE MATERIALS INC., NEW YORK

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BOKF, NA;REEL/FRAME:049194/0085

Effective date: 20190515

Owner name: MOMENTIVE PERFORMANCE MATERIALS INC., NEW YORK

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BOKF, NA;REEL/FRAME:049249/0271

Effective date: 20190515

AS Assignment

Owner name: MOMENTIVE PERFORMANCE MATERIALS INC., NEW YORK

Free format text: TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS;ASSIGNOR:JPMORGAN CHASE BANK, N.A.;REEL/FRAME:050304/0555

Effective date: 20190515

AS Assignment

Owner name: MOMENTIVE PERFORMANCE MATERIALS INC., NEW YORK

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:054336/0023

Effective date: 20201102