US20130229748A1 - Multilayer ceramic electronic component and method of manufacturing the same - Google Patents

Multilayer ceramic electronic component and method of manufacturing the same Download PDF

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Publication number
US20130229748A1
US20130229748A1 US13/768,961 US201313768961A US2013229748A1 US 20130229748 A1 US20130229748 A1 US 20130229748A1 US 201313768961 A US201313768961 A US 201313768961A US 2013229748 A1 US2013229748 A1 US 2013229748A1
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thickness
ceramic body
ceramic
electronic component
internal electrodes
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English (en)
Inventor
Hae Suk Chung
Byoung HWA Lee
Min Cheol Park
Eun Hyuk Chae
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHAE, EUN HYUK, CHUNG, HAE SUK, LEE, BYOUNG HWA, PARK, MIN CHEOL
Publication of US20130229748A1 publication Critical patent/US20130229748A1/en
Priority to US15/790,963 priority Critical patent/US10347421B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics

Definitions

  • the present invention relates to a multilayer ceramic electronic component and a method of manufacturing the same, and more particularly, to a multilayer ceramic electronic component having low equivalent series inductance (ESL).
  • ESL equivalent series inductance
  • ESL equivalent series inductance
  • a so-called “low inductance chip capacitor (LICC),” decreases a distance between external terminals, and thus a current flow path, thereby reducing inductance of capacitance.
  • the internal electrode when a lead-out portion of an internal electrode is compressed, in order to reduce a difference in electrode density between a capacitance part and the lead-out portion of the internal electrode, the internal electrode may be broken or bent, and thus, a current flow path therein may be significantly increased, resulting in increased ESL.
  • An aspect of the present invention provides a multilayer ceramic electronic component having relatively low equivalent series inductance (ESL) and a method of manufacturing the same.
  • ESL equivalent series inductance
  • a multilayer ceramic electronic component including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, wherein, when a direction in which the external electrodes are connected and extended is denoted as a width direction ; a direction in which the internal electrodes are laminated is denoted as a ⁇ thickness direction ⁇ ; and a direction perpendicular to the width direction and the thickness direction is denoted as a ⁇ length direction ⁇ , the ceramic body has a width smaller than a length thereof, the number of the internal electrodes laminated is 250 or more, when the thickness of the ceramic layer is denoted by T d and the thickness of the internal electrode is denoted by T e , 0.5 ⁇ T e /T d ⁇ 2.0, and when the thickness of a central portion in a width direction of the ceramic body is denoted by T m and the thickness of each of side portions of the ceramic body is denoted by T a , in a
  • the central portion in the width direction of the ceramic body may be within sections inside 15% of the width of the ceramic body on both sides of a center of the ceramic body in the width direction.
  • the side portion of the ceramic body may be a section within 10% of the width of the ceramic body from each side of the ceramic body in the width direction.
  • the internal electrode may include a capacitance formation portion forming capacitance by overlapping the internal electrode and an adjacent internal electrode, and a lead-out portion extended from the capacitance formation portion and led out to an outside of the ceramic body, the lead out portion being thicker than the capacitance formation portion.
  • the external electrodes may be extended onto side surfaces opposing each other in the width direction of the ceramic body and onto portions of the other surfaces adjacent to the side surfaces.
  • the thickness of the ceramic layer may be a thickness of the ceramic layer disposed between capacitance formation portions of adjacent internal electrodes.
  • the thickness of the internal electrode may be a thickness of the capacitance formation portion of the internal electrode.
  • the cross section in the width-thickness direction may be located within sections inside 40% of the length of the ceramic body on both sides of the center of the ceramic body in the length direction.
  • a method of manufacturing a multilayer ceramic electronic component including: preparing a cuboid green chip by laminating 250 or more layers of internal electrodes each interposed between ceramic layers, the cuboid green chip having a smaller width than a length thereof; compressing side portions in a width direction of the green chip such that a ratio of a thickness of a compressed portion to a thickness of an uncompressed portion is 0.9-0.97; sintering the green chip; and forming external electrodes on side surfaces in a width direction of the sintered chip.
  • adjacent internal electrodes may be exposed to opposing surfaces of the green chip, respectively.
  • the internal electrode may be formed such that a lead-out portion thereof is thicker than a capacitance formation portion thereof.
  • the compression may be performed in a lamination direction of the internal electrodes.
  • the external electrodes may be extended to portions of the other surfaces adjacent to the side surfaces in the width direction.
  • FIG. 1 is a perspective view of a multilayer ceramic electronic component according to an embodiment of the present invention
  • FIG. 2 is a schematic view of a ceramic body according to an embodiment of the present invention.
  • FIG. 3 is an exploded perspective view of FIG. 2 ;
  • FIG. 4 is a cross-sectional view taken along the line X-X′ of FIG. 1 ;
  • FIGS. 5A , 5 B, 6 A, 6 B, 7 A, and 7 B are schematic views showing modifications of internal electrodes according to embodiments of the present invention.
  • FIG. 8 is a schematic view showing measurement of thicknesses of a ceramic layer and an internal electrode.
  • multilayer ceramic electronic components there may be provided, as multilayer ceramic capacitors, multilayer chip inductors, chip beads, chip varistors, and the like.
  • FIG. 1 is a perspective view of a multilayer ceramic electronic component according to an embodiment of the present invention
  • FIG. 2 is a schematic view of a ceramic body according to an embodiment of the present invention
  • FIG. 3 is an exploded perspective view of FIG. 2
  • FIG. 4 is a cross-sectional view taken along line X-X′ of FIG. 1
  • FIGS. 5 to 7 are schematic views showing modifications of internal electrodes according to an embodiment of the present invention
  • FIG. 8 is a schematic view showing measurement of thicknesses of a ceramic layer and an internal electrode.
  • a multilayer ceramic electronic component may include a ceramic body 10 and external electrodes 21 and 22 .
  • a ⁇ width direction ⁇ may denote a direction in which the external electrodes 21 and 22 are connected and extended (“W direction”); a ⁇ lamination direction ⁇ or ⁇ thickness direction ⁇ may denote a direction in which the internal electrodes are laminated (“T direction”); and a ⁇ length direction ⁇ may denote a direction perpendicular to the width direction and the lamination direction (“L” direction”).
  • the ceramic body 10 may be formed of a ceramic material having a relatively high dielectric constant, and without limitation thereto, a barium titanate- or strontium titanate-based material or the like may be used.
  • the ceramic body 10 may be formed by laminating and then sintering a plurality of ceramic layers, which may be integrated in a single body such that individual adjacent layers may not be readily differentiated from one another.
  • the ceramic body 10 may be a parallelepiped. Specifically, the ceramic body 10 may have a top surface S 1 and a bottom surface S 2 opposing each other in a thickness direction, end surfaces S 3 and S 4 opposing each other in a length direction, and side surfaces S 5 and S 6 opposing each other in a width direction. However, the ceramic body 10 may not actually have an entirely cuboid shape due to manufacturing process errors or the like.
  • the width of the ceramic body 10 that is, a distance between external electrodes 21 and 22 , is smaller than the length thereof.
  • external electrodes may be disposed on the end surfaces in the length direction of the ceramic body.
  • the larger current loop may be formed, and the magnitude of the induced magnetic field may be increased, resulting in an increase in inductance.
  • a distance between the external electrodes 21 and 22 , across the ceramic body 10 may be smaller than the length thereof in order to decrease the current path.
  • the distance between the external electrodes 21 and 22 are small, resulting in a decrease in the current path, and thus, the current loop may be reduced, thereby reducing inductance.
  • the multilayer ceramic electronic component of which the distance between the external electrodes 21 and 22 is smaller than the length thereof may be referred to as a reverse geometry capacitor (RGC) or a low inductance chip capacitor (LICC).
  • the number of laminated internal electrodes may be 250 or greater.
  • the defect of an increase in ESL may occur only when the number of laminated internal electrodes 31 and 32 is 250 or greater.
  • the present embodiment is provided to solve this defect, which will be described with reference to Table 1.
  • the ratio (T e /T d ) of a thickness (T e ) of the internal electrode 31 or 32 to a thickness (T d ) of the ceramic layer 11 may be 0.5-2.0 or less.
  • the ratio T e /T d is smaller than 0.5, a defect such as cracking or delamination may not occur.
  • the ratio T e /T d is 0.5 or greater, the defect of cracking or delamination may occur at first. The present embodiment is provided to solve these defects.
  • the thickness of the internal electrode 31 or 32 is much greater than the thickness of the ceramic layer 11 , and thus, cracking or delamination may not be prevented, even when other factors are changed.
  • the coefficient of thermal expansion of the internal electrode may be larger than that of the ceramic layer due to the internal electrodes 31 and 32 containing a conductive metal. Stress may therefore be concentrated on an interface between the inner electrode 31 or 32 and the ceramic layer 11 due to repeated expansion and shrinkage through heat history, finally resulting in cracking or delamination.
  • the percentage of the internal electrodes in the ceramic body 10 is larger, and thus, thermal expansion and shrinkage of the internal electrodes may be larger. Therefore, cracking or delamination may occur.
  • the thickness (T d ) of the ceramic layer 11 may refer to an average thickness of the ceramic layer 11 disposed between the internal electrodes 31 and 32 .
  • the average thickness of the ceramic layer 11 may be measured from an image obtained by scanning a cross section in a width-thickness direction of the ceramic body 10 at a magnification of 10,000 times using a scanning electron microscope (SEM), as shown in FIG. 8 .
  • SEM scanning electron microscope
  • an average thickness value of the ceramic layer 11 may be obtained by measuring the thicknesses of 30 regions of the ceramic layer 11 that are equidistant in a width direction, on the scanned image, and then averaging the measured thicknesses.
  • the 30 regions that are equidistant may be extracted from the capacitance formation portion (P).
  • the average thickness (T d ) of the ceramic layer 11 may be further generalized.
  • the thickness (T e ) of the internal electrode 31 or 32 may be the thickness of a capacitance formation portion P of the internal electrode 31 or 32 .
  • the delamination between the internal electrode 31 or 32 and the ceramic layer 11 due to a difference in a coefficient of thermal expansion between the internal electrode 31 or 32 and the ceramic layer 11 may easily occur in the capacitance formation portion P having relatively high electrode density, and thus, the thickness of the capacitance formation portion P of the internal electrode needs to be controlled.
  • the thickness of a central portion (E) in the width direction of the ceramic body 10 is denoted by T m and the thickness of a side portion (B) of the ceramic body 10 is denoted by T a , 0.9 ⁇ T a /T m ⁇ 0.97 may be satisfied.
  • the area in which the capacitance formation portions (P) of the internal electrodes 31 and 32 overlap each other is different from the area in which the lead-out portions (Q) of the internal electrodes 31 or 32 in view of density of the internal electrode. That is to say, the area in which the capacitance formation portions (P) overlap each other is greater than the area in which the lead-out portions are formed, in view of electrode density.
  • electrode density may refer to the percentage of the area of the internal electrodes 31 and 32 in the overall area of the cross section in the width-thickness direction (W-T cross section).
  • the area (Q′) in which the lead-out portions (Q) overlap each other may be compressed.
  • the compression may be performed for an appropriate time period and at an appropriate pressure, considering the thickness of the internal electrodes 31 and 32 , the thickness of the ceramic layer 11 , the dimensions of the ceramic body 10 , and the like.
  • the internal electrodes 31 and 32 may be broken or bent at a boundary between the compressed portion (B) and the uncompressed portion A. In this case, a current path and the current loop may further increased, resulting in an increase in ESL.
  • This phenomenon may occur relatively more in the case of RGC or LICC in which a distance between the external electrodes 21 and 22 is relatively short.
  • the thickness (T m ) of the central portion (E) of the ceramic body 10 may be defined by a distance from the lowest point protruding downwardly to the highest point protruding upwardly in the central portion (E) in the width direction of the ceramic body 10 .
  • the central portion (E) in the width direction of the ceramic body 10 may be within sections inside 15% of the width of the ceramic body 10 on both sides of the center (C) of the ceramic body 10 in the width direction.
  • a middle portion A of the ceramic body 10 may protrude upwardly and downwardly since the side portions B thereof are compressed, and here, the highest point and the lowest point of the protruding portion may be formed within the above range.
  • Each of the side portions (B) of the ceramic body 10 may be a section within 10% of the width of the ceramic body 10 from each side of the ceramic body 10 in the width direction.
  • the thickness of the side portion (B) of the ceramic body 10 may be an average thickness.
  • the compressed side portion (B) may be flat and the thickness from a bottom surface to a top surface of the compressed portion (B) may be denoted by a thickness (T a ) of the side portion (B) of the ceramic body 10 .
  • T a /T m When T a /T m is smaller than 0.9, the current path and the current loop may increase, resulting in an increase in ESL. When T a /T m is greater than 0.97, delamination may occur.
  • the cross section in the width-thickness direction may be located within sections inside 40% of the length of the ceramic body 10 on both sides of the center (C) of the ceramic body 10 in the length direction.
  • the thickness (T d ) of the ceramic body 10 may be stable within the above range, but not stable outside of the above range.
  • the thicknesses of the both portions (B) of the ceramic body 10 may be the same.
  • Tombstone defects may be prevented by forming the ceramic body 10 to have a symmetrical structure.
  • the ceramic body 10 may include barium titanate or strontium titanate.
  • a ceramic body 10 that can include a ceramic material having a relatively high dielectric constant may be used.
  • the internal electrodes 31 and 32 may be laminated within the ceramic body 10 such that each of the internal electrodes 31 and 32 may be interposed between the ceramic layers 11 .
  • the internal electrode 31 or 32 may include the capacitance formation portion (P) that contributes to capacitance formation by overlapping with the adjacent internal electrode 31 or 32 and the lead-out portion (Q) that is extended from a portion of the capacitance formation portion (P) and led out to the outside of the ceramic body 10 .
  • the lead-out portion (Q) may be thicker than the capacitance formation portion (P).
  • a region (P′) in which the capacitance formation portions (P) overlap each other is higher than a region (Q′) in which the lead-out portions (Q) overlap each other in view of electrode density. Compression may be performed on the region (Q′) where the lead-out portions (Q) overlap each other in order to reduce the difference in electrode density.
  • the lead-out portions (Q) of the internal electrodes 31 and 32 may be thicker than the capacitance formation portions (P) thereof in order to reduce the difference in electrode density.
  • the internal electrodes 31 and 32 may be formed by a method such as screen-printing a conductive paste or the like.
  • the screen printing may be performed several times for the lead-out portions (Q) of the internal electrodes 31 and 32 , thereby forming the lead-out portions (P) to be thicker than the capacitance formation portions (Q).
  • FIGS. 5 to 7 show modifications of the internal electrodes 31 and 32 .
  • FIGS. 5A and 5B show cases in which the capacitance formation portions (P) of the internal electrodes 31 and 32 are extended to form the lead-out portions (Q) thereof
  • FIGS. 6A and 6B show cases in which the lead-out portions (Q) are smaller than the capacitance formation portions (P).
  • FIGS. 7A and 7B show cases in which each of the lead-out portions (Q) is divided into two.
  • the shapes of the internal electrodes 31 and 32 are not limited to the cases of FIGS. 5 to 7 , and may be varied as necessary.
  • the thickness (T e ) of each of the internal electrodes 31 and 32 may be measured from an image obtained by scanning a cross section in a width-thickness direction (W-T cross section) of the ceramic body 10 using a scanning electron microscope (SEM).
  • the average thickness of the internal electrode 31 or 32 may be obtained by measuring the thicknesses of 30 regions that are equidistant in a width direction, on an image of any internal electrode 31 or 32 extracted from the image obtained by scanning a cross section in a width-thickness direction (W-T cross section), which is cut in the central portion (H) in a length direction of the ceramic body 10 , at a magnification of 10,000 times using a scanning electron microscope (SEM), and then averaging the measured thicknesses.
  • W-T cross section width-thickness direction
  • SEM scanning electron microscope
  • the central portion (H) in the length direction of the ceramic body 10 may be within sections inside 40% of the length of the ceramic body 10 on both sides of the center (C) of the ceramic body 10 in the length direction.
  • the reason is that each thickness (T e ) of the internal electrodes 31 and 32 has a stable value within the above-described range.
  • the 30 regions that are equidistant may be extracted from the capacitance formation portion (P) of the internal electrode 31 or 32 .
  • the average thickness (T e ) of the internal electrode 31 or 32 maybe further generalized.
  • the internal electrodes 31 and 32 may include at least one selected from the group consisting of gold, silver, copper, nickel, palladium, and an alloy thereof. However, without being limited thereto, any metal that can confer conductivity to the internal electrodes 31 and 32 may be used.
  • Noble metals such as gold, silver, palladium and the like are expensive, but oxidation defects present do not need to be considered at the time of sintering.
  • Base metals such as nickel and the like are relatively cheap, and thus, may have strength in costs, but the sintering state needs to be maintained in a reduction atmosphere in order to prevent oxidation of the metals.
  • the external electrodes 21 and 22 may be extended onto the side surfaces (S 5 and S 6 ) opposing each other in the width direction of the ceramic body 10 and onto portions of the surfaces (S 1 to S 4 ) adjacent to the side surfaces (S 5 and S 6 ).
  • the external electrodes 21 and 22 may cover the compressed side portions of the ceramic body 10 .
  • the external electrodes 21 and 22 are not limited thereto, but may include conductive metals such as copper and the like, and a glass component may be further added thereinto in order to improve compactness thereof.
  • a method of manufacturing a multilayer ceramic electronic component including: preparing a cuboid green chip by laminating 250 or more layers of internal electrodes each interposed between ceramic layers, the cuboid green chip having a smaller width than a length thereof; compressing side portions in a width direction of the green chip such that a ratio of thickness of a compressed portion to thickness of an uncompressed portion is 0.9-0.97; sintering the green chip; and forming the external electrodes on side surfaces in a width direction of the sintered chip.
  • a cuboid green chip having a smaller width than a length thereof may be prepared by laminating 250 or more layers of internal electrodes each interposed between green ceramic layers.
  • a ceramic slurry may be prepared by mixing a ceramic powder, an organic solvent, a binder, and the like and conducting ball milling, and then a doctor blade method or the like using the ceramic slurry may be preformed to form thin green sheets.
  • a conductive paste including a conductive metal may be prepared in the same manner as the ceramic slurry, and a screen printing method or the like using the conductive paste may be performed to form the internal electrodes on the green sheets, respectively.
  • 250 or more layers of green sheets on which the internal electrodes have been formed may be laminated and compressed to form a green sheet laminate, which may be then cut to manufacture the green chip.
  • the internal electrodes may be exposed to opposing surfaces of the green chip, and a direction in which the surfaces to which the internal electrodes are exposed are extended may be denoted by a width direction.
  • the green chip may have a cuboid of which the width, that is, a distance between the external electrodes, is smaller than the length.
  • the reason for this is that a distance between external terminals is decreased to reduce the current path, and thus, ESL may be reduced in the capacitor. That is to say, the reason for the above-detailed conditions is for manufacturing an RGC or LICC.
  • the internal electrode may include a capacitance formation portion contributing to capacitance formation and a lead-out portion extended from the capacitance formation portion and led out to the outside of the green chip, and here, the lead out portion may be thicker than the capacitance formation portion.
  • the reason is for reducing a difference in electrode density between a region in which the capacitance formation portions overlap each other and a region in which the lead out portions overlap each other.
  • side portions in a width direction of the green chip may be compressed, and the compression may be performed in a lamination direction of the internal electrodes.
  • the number of laminated internal electrodes in the region in which the capacitance formation portions overlap each other is 2 times the number of laminated internal electrodes in the region in which the lead out portions overlap each other, and thus the electrode density may be larger in the region in which the capacitance formation portions overlap each other than in the region in which the lead out portions overlap each other.
  • the region in which the lead out portions overlap each other may be compressed in a thickness direction in order to reduce a difference in electrode density.
  • the internal electrodes may be excessively broken or bent proportionally, and thus the current path may be increased, resulting in an increase in ESL.
  • binding strength between the green ceramic layer and the internal electrode may not be sufficient, resulting in delamination.
  • the above defects may not occur when the ratio of thickness of the compressed portion to thickness of the uncompressed portion in the green chip is 0.9-0.97.
  • the green chip may be sintered.
  • a calcining process may be performed at a temperature lower than the sintering temperature.
  • the organic materials present in the green chip may be removed by the calcining process.
  • the internal electrode may be oxidized to reduce conductivity thereof, and thus, sintering may need to be performed at the reduction atmosphere.
  • external electrodes may be formed on side surfaces in a width direction of the sintered chip.
  • the external electrodes may be extended to portions of the other surfaces adjacent to the side surfaces in the width direction of the sintered chip.
  • the external electrodes may be formed by a printing or dipping method using a paste including a conductive metal.
  • a glass component may be further added into the paste, thereby to improve compactness of the external electrode, and prevent infiltration of a plating liquid during a plating process which will be performed later.
  • plating layers may be formed on the external electrodes for easy soldering.
  • the plating layers may be nickel or tin plating layers.
  • the ceramic body may include barium titanate.
  • the internal electrodes may include at least one selected from the group consisting of gold, silver, copper, nickel, palladium, and an alloy thereof.
  • the external electrodes may include copper.
  • a ceramic slurry was prepared by mixing ethanol as an organic solvent, and ethyl cellulose as a binder, with a barium titanate powder, followed by ball milling using zirconia balls.
  • the ceramic slurry was coated on a polyethylene film by a doctor blade method, and then dried, thereby forming ceramic green sheets.
  • a conductive paste was prepared by mixing ethanol as an organic solvent, and ethyl cellulose as a binder, with a nickel powder, followed by ball milling.
  • Internal electrodes were, respectively, formed on the ceramic green sheets by using the conductive paste.
  • a ceramic green sheet laminate was manufactured by laminating the ceramic green sheets on which the internal electrodes were formed, and then the ceramic green sheet laminate was cut to provide a green chip.
  • the number of laminated internal electrodes was 240, 250, and 260.
  • the green chip was sintered in a reduction atmosphere at a temperature of 1000° C., thereby obtaining a sintered chip.
  • External electrodes were formed on the sintered chip by using a conductive paste containing copper as a main component, and thus, the multilayer ceramic capacitor was finally manufactured.
  • the ESL values of the multilayer ceramic capacitors were measured while the number of laminated internal electrodes 31 or 32 was varied to 240, 250, and 260, and T e /T d was varied to 0.4, 0.6, 1.0, and 1.4.
  • the ESL value was measured by using a vector network analyzer (VNA), after a chip was mounted on a substrate.
  • VNA vector network analyzer
  • ESL values thereof were 90 pH, 91 pH, 93 pH, and 94 pH, respectively.
  • the ESL values were relatively small regardless of the T e /T d values.
  • the unit of ESL is picohenry “pH”.
  • Sample 5 in which the number of laminated internal electrodes was 250 and the T e /T d value was 0.4, exhibited an ESL value of 94 pH; Sample 6, in which the number of laminated internal electrodes was 250 and the T e /T d value was 0.5, exhibited an ESL value of 102 pH; Sample 7, in which the number of laminated internal electrodes was 250 and the T e /T d value was 1.0, exhibited an ESL value of 104 pH; and Sample 8, in which the number of laminated internal electrodes was 250 and the T e /T d value was 1.4, exhibited an ESL value of 102 pH.
  • Samples 9 to 12 in which the number of laminated internal electrodes was 260, had the same results as the cases in which the number of laminated internal electrodes was 250.
  • Embodiments of the present invention may be provided to solve the defects occurring in the cases in which the number of laminated internal electrodes 31 and 32 was 250 or more and the T e /T d value was 0.5 or greater.
  • the ESL values of the multilayer ceramic capacitors were measured while the number of laminated internal electrodes was 270 and the T e /T d value was varied to 0.5, 1.0, 2.0, and 2.2 while the T a /T m value was varied to 0.88, 0.90, 0.93, 0.96, and 0.98 for each of the T e /T d values.
  • the thickness (T d ) of the ceramic layer and the thickness (T e ) of the internal electrode were measured in the manner as described above.
  • comparative example 1 having a T e /T d value of 0.5 and a T a /T m value of 0.88 exhibited an ESL value of 113 pH and no delamination. This is likely that the thickness of the side portion in the width direction of the ceramic body was remarkably decreased due to strong compression, resulting in an increased current path and an increased ESL value, but delamination did not occur due to strong compression.
  • Comparative example 2 having a T e /T d value of 0.5 and a T a /T m value of 0.98 exhibited an ESL value of 90 pH and delamination. This is likely that weak compression leaded a small increase in current path and a small increase in ESL, but binding strength between the internal electrode and the ceramic layer, which are formed of different kinds of materials, is reduced, resulting in delamination.
  • Comparative example 3 inventive examples 4 to 6, and comparative example 4, which had the T e /T d values of all 1.0, exhibited the same results as the cases in which the T e /T d value was 0.5.
  • comparative example 5 inventive examples 7 to 9, and comparative example 6, which had the T e /T d values of all 2.0, exhibited the same results as the cases in which the T e /T d value was 0.5.
  • a multilayer ceramic electronic component having relatively low equivalent series inductance (ESL) may be obtained.
US13/768,961 2012-02-17 2013-02-15 Multilayer ceramic electronic component and method of manufacturing the same Abandoned US20130229748A1 (en)

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US10707011B2 (en) * 2013-02-01 2020-07-07 The Trustees Of Dartmouth College Multilayer conductors with integrated capacitors and associated systems and methods
US20190057806A1 (en) * 2013-02-01 2019-02-21 The Trustees Of Dartmouth College Multilayer conductors with integrated capacitors and associated systems and methods
US20150016013A1 (en) * 2013-07-11 2015-01-15 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor
US9362054B2 (en) * 2013-07-11 2016-06-07 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor
US20150022942A1 (en) * 2013-07-17 2015-01-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and method of manufacturing the same
US9105411B2 (en) * 2013-07-17 2015-08-11 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and method of manufacturing the same
CN104575936A (zh) * 2013-10-11 2015-04-29 三星电机株式会社 叠层电感器及其制造方法
US8995109B1 (en) * 2013-10-30 2015-03-31 Murata Manufacturing Co., Ltd. Monolithic ceramic electronic component
US20150179343A1 (en) * 2013-10-30 2015-06-25 Murata Manufacturing Co., Ltd. Monolithic ceramic electronic component
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CN104766690A (zh) * 2014-01-02 2015-07-08 三星电机株式会社 多层电子组件及其制造方法
US9728336B2 (en) * 2014-08-13 2017-08-08 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor, multilayer ceramic capacitor series including the same, and multilayer ceramic capacitor mount body including the same
US9947476B2 (en) * 2014-08-13 2018-04-17 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor, multilayer ceramic capacitor series including the same, and multilayer ceramic capacitor mount body including the same
US20160049256A1 (en) * 2014-08-13 2016-02-18 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor, multilayer ceramic capacitor series including the same, and multilayer ceramic capacitor mount body including the same
US9099246B1 (en) * 2014-09-18 2015-08-04 Murata Manufacturing Co. Ltd. Multilayer ceramic capacitor
US20160233027A1 (en) * 2014-12-05 2016-08-11 Taiyo Yuden Co., Ltd. Laminated ceramic electronic component
US10541086B2 (en) * 2014-12-05 2020-01-21 Taiyo Yuden Co., Ltd. Laminated ceramic electronic component
US10008329B2 (en) * 2015-01-23 2018-06-26 Tdk Corporation Multilayer capacitor having first internal electrodes and second internal electrodes alternately disposed
US20160217927A1 (en) * 2015-01-23 2016-07-28 Tdk Corporation Multilayer capacitor
US10304631B2 (en) * 2015-11-26 2019-05-28 Taiyo Yuden Co., Ltd. Ceramic electronic component and method of producing the same
CN106876089A (zh) * 2015-12-14 2017-06-20 株式会社村田制作所 电子部件及其制造方法
US10734160B2 (en) * 2016-02-26 2020-08-04 Taiyo Yuden Co., Ltd. Multilayer ceramic capacitor
US20170250026A1 (en) * 2016-02-26 2017-08-31 Taiyo Yuden Co., Ltd. Multilayer ceramic capacitor
US10529472B2 (en) 2017-12-01 2020-01-07 Avx Corporation Low aspect ratio varistor
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US11817259B2 (en) 2018-12-12 2023-11-14 Samsung Electro-Mechanics Co., Ltd. Multi-layered ceramic electronic component
US20220189695A1 (en) * 2020-12-14 2022-06-16 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same mounted thereon
US11562858B2 (en) * 2020-12-14 2023-01-24 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same mounted thereon

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JP2013172148A (ja) 2013-09-02
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US10347421B2 (en) 2019-07-09
CN103258644A (zh) 2013-08-21
CN103258644B (zh) 2017-09-29
KR20130094979A (ko) 2013-08-27
US20180061571A1 (en) 2018-03-01

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