US20130081939A1 - Serial plating system - Google Patents

Serial plating system Download PDF

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Publication number
US20130081939A1
US20130081939A1 US13/626,791 US201213626791A US2013081939A1 US 20130081939 A1 US20130081939 A1 US 20130081939A1 US 201213626791 A US201213626791 A US 201213626791A US 2013081939 A1 US2013081939 A1 US 2013081939A1
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United States
Prior art keywords
split
workpiece
workpieces
anode
plating
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Abandoned
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US13/626,791
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English (en)
Inventor
Tomohiro Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Almex PE Inc
Original Assignee
Almex PE Inc
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Filing date
Publication date
Application filed by Almex PE Inc filed Critical Almex PE Inc
Assigned to ALMEX PE INC. reassignment ALMEX PE INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NODA, TOMOHIRO
Publication of US20130081939A1 publication Critical patent/US20130081939A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Definitions

  • the present invention relates to a serial plating system that supplies current to workpieces that are serially transferred in a plating tank to plate the workpieces.
  • JP-A-2009-132999 applied for by the assignee of the present application discloses a current control method that utilizes a common anode and split cathode rails.
  • five power supply units supply current to up to five workpieces that are serially transferred in a plating tank via five corresponding split cathode rails (cathode relay members) so that the current density (A/dm2) is constant (see FIG. 1 of JP-A-2009-132999).
  • Each power supply unit performs constant-current control at a preset current value in a completely immersed state in which the entire workpiece faces the common anode.
  • the most upstream-side power supply unit gradually increases the amount of current based on the electrolysis area in which the workpiece in a partially immersed state that is being transferred to the plating tank faces the common anode.
  • the most downstream-side power supply unit gradually decreases the amount of current based on the electrolysis area in which the workpiece in a partially immersed state that is being transferred from the plating tank faces the common anode.
  • N the number of workpieces that are simultaneously set to a completely immersed state in the plating tank
  • N+1 the number of workpieces that are positioned in the plating tank when a partially immersed state occurs on the upstream side and the downstream side. Therefore, it is necessary to provide (N+1) split cathode rails and (N+1) power supply units.
  • Several aspects of the invention may provide a serial plating system that forms a coating on each workpiece at a thickness corresponding to the preset current value without using a plurality of split cathode rails.
  • Several aspects of the invention may provide a serial plating system that makes it possible to reduce the number of power supplies.
  • Several aspects of the invention may provide a serial plating system that gradually increases or decreases the current value corresponding to only the first workpiece and the final workpiece of one lot instead of gradually increasing or decreasing the current value corresponding to each workpiece transferred in lot units.
  • Several aspects of the invention may provide a serial plating system that makes it unnecessary to exchange the anode, and gradually increase or decrease the current value even if the size of the workpiece has been changed.
  • a serial plating system comprising:
  • a plating tank that receives a plating solution, a plurality of workpieces that are serially transferred along a transfer path being simultaneously plated in the plating tank;
  • a common cathode that is electrically connected to the plurality of workpieces via a plurality of transfer jigs that respectively hold the plurality of workpieces;
  • a plurality of power supplies that are respectively connected to a corresponding split anode among the plurality of split anodes and the common cathode, and independently control current supplied to the corresponding split anode among the plurality of split anodes.
  • the anode is split into the split anodes, differing from the related-art method, it is unnecessary to provide split cathode rails connected to the workpiece, and it suffices to connect the workpiece to the common cathode via the transfer jig.
  • This makes it possible to reduce the width of the serial plating system. Since the plurality of workpieces connected to the common cathode are serially transferred so that a small gap is formed between the adjacent workpieces, the total electrolysis area of the workpiece(s) that faces one split anode when the split anode faces one workpiece is almost equal to that when the split anode faces two workpieces. Therefore, it suffices to control the split anode at a constant current during serial transfer.
  • each of the plurality of split anodes may include a first electrode that faces a first side of each of the plurality of workpieces, and may include a second electrode that faces a second side of each of the plurality of workpieces.
  • each of the plurality of power supplies may include a first power supply that supplies current to the first electrode, and a second power supply that supplies current to the second electrode, the first power supply and the second power supply may independently control the current value.
  • N split anodes and N power supplies even when the number of workpieces that are simultaneously set to a completely immersed state in the plating tank is N, and the number of workpieces that are positioned in the plating tank when a partially immersed state occurs on the upstream side and the downstream side is (N+1).
  • the number of expensive power supplies can be reduced as compared with the method disclosed in JP-A-2009-132999 that requires (N+1) power supplies.
  • the plurality of workpieces may be supplied to the plating tank in lot units, the plurality of power supplies may respectively gradually increase the current value of the corresponding split anode among the plurality of split anodes when a first workpiece of one lot faces the corresponding split anode based on an electrolysis area in which the first workpiece faces the corresponding split anode, and the plurality of power supplies may respectively gradually decrease the current value of the corresponding split anode among the plurality of split anodes when a final workpiece of one lot faces the corresponding split anode based on an electrolysis area in which the final workpiece faces the corresponding split anode.
  • L 2 being a length of each of the plurality of workpieces along a transfer direction
  • L 2 being a length of each of the plurality of split anodes along the transfer direction
  • n being an integer equal to or larger than 2.
  • the plurality of workpieces may be supplied to the plating tank in lot units, and
  • each of the plurality of power supplies may control the corresponding split anode among the plurality of split anodes at a constant current from a first workpiece to a final workpiece of each lot.
  • a plurality of nozzles that discharge the plating solution to the plurality of workpieces may be provided in the plating tank along a transfer direction at positions opposite to each of the plurality of workpieces, and
  • At least one split anode among the plurality of split anodes may be respectively disposed between two adjacent nozzles among the plurality of nozzles.
  • the length L 2 of the split anode can be set to be less than the distance between two adjacent nozzles. Therefore, at least one split anode among the plurality of split anodes can be disposed between two adjacent nozzles. This makes it possible to reduce the distance between the split anode and the workpiece, and reduce the electrical resistance of the plating solution that is present between the split anode and the workpiece, so that the density of current supplied from the split anode to the workpiece can be increased to implement high-speed plating.
  • each of the plurality of split anodes may have a circular horizontal cross-sectional shape.
  • the split anode is rectangular when viewed from above (in a plan view), since the distance between the plating target surface of the workpiece and the split anode is constant, the plating solution discharged from the nozzle is concentrated (trapped) in a narrow range corresponding to the constant distance.
  • the split anode has a circular horizontal cross-sectional shape, the distance between the plating target surface of the workpiece and the split anode increases as the distance from the centerline of the split anode increases, so that the plating solution can escape from the space between the workpiece and the split anode.
  • FIG. 1 is a schematic plan view illustrating a serial plating system according to a first embodiment of the invention.
  • FIG. 2 is a schematic cross-sectional view illustrating a serial plating system.
  • FIGS. 3A and 3B are views illustrating that the electrolysis area when the split anode faces one workpiece is substantially equal to that when the split anode faces two workpieces.
  • FIG. 4 is a view illustrating a transfer state in which one workpiece faces one split anode.
  • FIGS. 5A and 5B are views illustrating a control process that gradually increases the current value when the first workpiece of one lot is carried in.
  • FIGS. 6A and 6B are views illustrating a control process that gradually decreases the current value when the final workpiece of one lot is carried out.
  • FIGS. 7A to 7C are views illustrating a second embodiment of the invention.
  • FIG. 8 is a view illustrating related-art method in which a nozzle is provided between a workpiece and an anode.
  • FIG. 9 is a view illustrating a third embodiment of the invention.
  • FIG. 10 is a view illustrating an example in which a split anode has a circular horizontal cross-sectional shape.
  • a serial plating system includes at least one plating tank 10 .
  • a plurality of plating tanks 10 - 1 to 10 - 3 may preferably be connected along a workpiece transfer direction A.
  • the plating tank 10 receives a plating solution 11 , and a plurality of workpieces W that are serially transferred along the transfer direction A (see FIG. 1 ) are simultaneously plated in the plating tank 10 .
  • a common cathode 30 that is electrically connected to each workpiece W via a transfer jig 20 that holds the workpiece W is provided over the plating tank 10 .
  • the common cathode 30 may be disposed at a position offset from the position over the plating tank 10 .
  • a plurality of split anodes 40 are disposed in the plating tank 10 so as to face the transfer path of the workpiece W.
  • Each split anode 40 ( 40 - 1 to 40 - 4 ) may include a first electrode 40 A ( 40 A- 1 to 40 A- 4 ) that is disposed on one side of the transfer path, and may include a second electrode 40 B ( 40 B- 1 to 40 B- 4 ) that is disposed on the other side of the transfer path.
  • the split anodes 40 40 - 1 to 40 - 4
  • a plurality of power supplies 50 ( 50 - 1 to 50 - 4 ) are provided, the plurality of power supplies 50 ( 50 - 1 to 50 - 4 ) being respectively connected to the corresponding split anode among the split anodes 40 ( 40 - 1 to 40 - 4 ) and the common cathode 30 , and independently controlling current supplied to the corresponding split anode among the split anodes 40 ( 40 - 1 to 40 - 4 ).
  • a power supply that is connected to the first electrode 40 A ( 40 A- 1 to 40 A- 4 ) is referred to as a first power supply 50 A ( 50 A- 1 to 50 A- 4 ), and a power supply that is connected to the second electrode 40 B ( 40 B- 1 to 40 B- 4 ) is referred to as a second power supply 50 B ( 50 B- 1 to 50 B- 4 ).
  • the first power supply 50 A ( 50 A- 1 to 50 A- 4 ) and the second power supply 50 B ( 50 B- 1 to 50 B- 4 ) independently control the current value.
  • each anode is split into split anodes, differing from the related-art method, it is unnecessary to provide split cathode rails that are connected to the workpiece W.
  • the workpiece W is connected to the common cathode 30 via the transfer jig 20 . This makes it possible to reduce the width of the serial plating system.
  • a plurality of workpieces W that are connected to the common cathode 30 are serially transferred so that a small gap G is formed between adjacent workpieces W among the plurality of workpieces W. If the gap G formed between the adjacent workpieces W is large, electric field concentration occurs at each edge of the workpiece W in the transfer direction A, so that a dog-bone phenomenon occurs (i.e., the plating thickness increases at each edge of the workpiece W). The gap G is set so that electric field concentration does not occur.
  • the split anodes 40 can be subjected to constant-current control at a preset current value (A/dm2) when a plurality of workpieces W are serially transferred in a state in which the gap G is formed between adjacent workpieces W. More specifically, a plurality of workpieces W that are transferred in the plating tank 10 can be regarded as a single workpiece, and the electrolysis area substantially does not change even if the workpiece W moves relative to each split anode 40 .
  • the control process becomes complex.
  • the workpiece W that is simultaneously positioned in two plating tanks 10 comes in contact with the split cathode rails of the two plating tanks 10 . Therefore, it is necessary to gradually decrease the current value in the plating tank 10 from which the workpiece W is being transferred, and gradually increase the current value in the plating tank 10 to which the workpiece W is being transferred.
  • the workpiece W that is simultaneously positioned in two plating tanks 10 is connected to the common cathode, it is unnecessary to perform such a complex control process.
  • a plurality of workpieces W 1 to WN are supplied to the plating tank 10 in lot units.
  • FIG. 5A when the first workpiece W 1 of one lot faces each of the split anodes 40 A- 1 to 40 A- 4 , another plating target workpiece is not present on the downstream side of the workpiece W 1 .
  • a dummy workpiece that prevents electric field concentration at the edge of the workpiece may be provided on the upstream side of the workpiece W 1 so that the gap G is formed between the dummy workpiece and the workpiece W 1 .
  • the power supplies 50 A- 1 to 50 A- 4 respectively gradually increase the current value of the corresponding split anode among the split anodes 40 A- 1 to 40 A- 4 based on the electrolysis area (L 3 (see FIG. 5 A) ⁇ workpiece height) in which the first workpiece W 1 faces the split anode 40 A (see FIG. 5B ). This makes it possible to set the current density of the workpiece W 1 to be constant.
  • the power supplies 50 A- 1 to 50 A- 4 respectively gradually decrease the current value of the corresponding split anode among the split anodes 40 A- 1 to 40 A- 4 based on the electrolysis area (L 4 (see FIG. 6 A) ⁇ workpiece height) in which the final workpiece WN faces the split anode 40 A (see FIG. 6B ). This makes it possible to set the current density of the workpiece WN to be constant.
  • L 1 being the length of each workpiece W along the transfer direction A
  • L 2 being the length of each split anode 40 along the transfer direction A
  • n being an integer equal to or larger than 2.
  • FIGS. 7A to 7C illustrate a state in which a workpiece WA having a length L 1 A, a workpiece WB having a length L 1 B, or a workpiece WC having a length L 1 C is transferred in the plating tank 10 in which the split anodes 40 - 1 , 40 - 2 , 40 - 3 , and 40 - 4 having the length L 2 are disposed.
  • a plurality of workpieces W are supplied to the plating tank 10 in lot units, and each power supply 50 can control the corresponding split anode 40 at a constant current from the first workpiece to the final workpiece of each lot.
  • the length L 1 A of the workpiece WA, the length L 1 B of the workpiece WB, and the length L 1 C of the workpiece WC need not necessarily correspond to an integral multiple of one cycle of the split anodes that are arranged cyclically, but may be an arbitrary length.
  • a nozzle that discharges the plating solution to the workpiece may be provided between the workpiece and the electrode (anode).
  • a nozzle is disclosed in JP-A-2000-178784 ( FIGS. 1 and 3 ), JP-A-2006-214006 ( FIG. 1 ), or JP-A-58-6998 ( FIG. 4 ), for example.
  • JP-A-58-6998 discloses that the distance S 1 between the workpiece W and the anode 200 is 100 mm or more.
  • a plurality of nozzles 100 that discharge the plating solution to the workpiece W may be provided along the transfer direction A at positions opposite to one workpiece W, and at least one split anode 40 among the plurality of split anodes 40 may be disposed between two adjacent nozzles among the plurality of nozzles 100 so that at least part of one split anode 40 may be positioned between two adjacent nozzles 100 .
  • the length L 2 of the split anode 40 can be set to a value less than the distance L 5 between two adjacent nozzles 100 . Therefore, at least one split anode 40 among the plurality of split anodes 40 can be disposed between two adjacent nozzles 100 among the plurality of nozzles 100 . This makes it possible to reduce the distance S 2 between the split anode 40 and the workpiece W, and reduce the electrical resistance of the plating solution that is present between the split anode 40 and the workpiece W, so that the density of current supplied from the split anode 40 to the workpiece W can be increased to implement high-speed plating.
  • Each split anode 40 may have a circular horizontal cross-sectional shape (outline) as shown in FIG. 10 . If the split anode has a rectangular shape when viewed from above (in a plan view), the distance between the plating target surface of the workpiece and the split anode 40 is constant. Therefore, the plating solution 11 discharged from the nozzle 100 is trapped in a narrow range.
  • the split anode 40 has a circular horizontal cross-sectional shape, the distance between the plating target surface of the workpiece W and the split anode 40 increases as the distance from a centerline B of the split anode 40 increases, so that the plating solution 11 can escape from the space between the workpiece W and the split anode 40 .
  • the plating solution 11 When the plating solution 11 can escape from the space between the workpiece W and the split anode 40 , the workpiece 1 always comes in contact with fresh plating solution. If the flow of the plating solution between the workpiece W and the nozzle 100 (anode 40 ) is insufficient, the plating solution may not enter a negative-pressure area that occurs around a high-speed nozzle flow. In particular, a flexible workpiece W may be drawn toward the nozzle 100 . Therefore, it is important to ensure that the plating solution discharged from the nozzle 100 can escape from the space between the workpiece W and the split anode 40 in order to prevent a phenomenon in which the workpiece W is drawn toward the negative-pressure area.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
US13/626,791 2011-09-29 2012-09-25 Serial plating system Abandoned US20130081939A1 (en)

Applications Claiming Priority (2)

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JP2011-214301 2011-09-29
JP2011214301A JP5795514B2 (ja) 2011-09-29 2011-09-29 連続メッキ装置

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JP (1) JP5795514B2 (enExample)
KR (1) KR101475396B1 (enExample)
CN (1) CN103031588B (enExample)
DE (1) DE102012018393B4 (enExample)
TW (1) TWI564431B (enExample)

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EP2907900A1 (en) * 2014-02-18 2015-08-19 Italfimet S.R.L. Electroplating process and apparatus, particularly for plating or forming parts made of electrically conducting materials by electrodeposition
CN112760701A (zh) * 2020-12-16 2021-05-07 景旺电子科技(珠海)有限公司 垂直连续电镀设备
US20220243355A1 (en) * 2021-01-29 2022-08-04 Tyco Electronics (Shanghai) Co., Ltd. Contact device and method for producing the contact device
WO2025006057A1 (en) * 2023-06-27 2025-01-02 Semiconductor Components Industries, Llc Electroplating systems and methods

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TWI530593B (zh) * 2014-08-11 2016-04-21 亞智科技股份有限公司 多陽極控制裝置及具有該裝置的電鍍設備
CN104313657A (zh) * 2014-11-10 2015-01-28 临安振有电子有限公司 Hdi印制线路板通孔的电沉积装置
CN106149039B (zh) * 2015-04-08 2017-11-24 亚硕企业股份有限公司 电镀设备
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
TWI698554B (zh) * 2015-10-20 2020-07-11 香港商亞洲電鍍器材有限公司 電鍍機器及電鍍方法
CN105350062B (zh) * 2015-12-07 2018-01-19 依力柏电能有限公司 一种电镀装置
DE102016205417A1 (de) 2016-04-01 2017-10-05 Schaeffler Technologies AG & Co. KG Oberflächenbehandlungsanlage zur elektrochemischen Oberflächenbehandlung von Wälzkörpern
KR101880601B1 (ko) * 2016-12-16 2018-08-17 (주)포인텍 양극 이동형 전해도금 장치
JP6875758B2 (ja) * 2017-10-20 2021-05-26 株式会社アルメックステクノロジーズ 表面処理装置
CN111247272A (zh) * 2017-10-20 2020-06-05 Almex Pe 株式会社 表面处理装置
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KR102206395B1 (ko) * 2020-06-30 2021-01-25 (주)네오피엠씨 개별파티션을 구비한 도금장치
KR102306782B1 (ko) * 2021-03-04 2021-09-30 (주)네오피엠씨 기판 개별 전류량 제어 시스템

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CN112760701A (zh) * 2020-12-16 2021-05-07 景旺电子科技(珠海)有限公司 垂直连续电镀设备
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WO2025006057A1 (en) * 2023-06-27 2025-01-02 Semiconductor Components Industries, Llc Electroplating systems and methods

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JP2013072131A (ja) 2013-04-22
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JP5795514B2 (ja) 2015-10-14
CN103031588A (zh) 2013-04-10
KR20130035201A (ko) 2013-04-08
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TWI564431B (zh) 2017-01-01
KR101475396B1 (ko) 2014-12-22

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