TWI564431B - 連續電鍍裝置 - Google Patents

連續電鍍裝置 Download PDF

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Publication number
TWI564431B
TWI564431B TW101134938A TW101134938A TWI564431B TW I564431 B TWI564431 B TW I564431B TW 101134938 A TW101134938 A TW 101134938A TW 101134938 A TW101134938 A TW 101134938A TW I564431 B TWI564431 B TW I564431B
Authority
TW
Taiwan
Prior art keywords
workpiece
anode electrodes
divided
workpieces
divided anode
Prior art date
Application number
TW101134938A
Other languages
English (en)
Chinese (zh)
Other versions
TW201333262A (zh
Inventor
野田朝裕
Original Assignee
Ａｌｍｅｘ Ｐｅ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ａｌｍｅｘ Ｐｅ股份有限公司 filed Critical Ａｌｍｅｘ Ｐｅ股份有限公司
Publication of TW201333262A publication Critical patent/TW201333262A/zh
Application granted granted Critical
Publication of TWI564431B publication Critical patent/TWI564431B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
TW101134938A 2011-09-29 2012-09-24 連續電鍍裝置 TWI564431B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011214301A JP5795514B2 (ja) 2011-09-29 2011-09-29 連続メッキ装置

Publications (2)

Publication Number Publication Date
TW201333262A TW201333262A (zh) 2013-08-16
TWI564431B true TWI564431B (zh) 2017-01-01

Family

ID=47878724

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101134938A TWI564431B (zh) 2011-09-29 2012-09-24 連續電鍍裝置

Country Status (6)

Country Link
US (1) US20130081939A1 (enExample)
JP (1) JP5795514B2 (enExample)
KR (1) KR101475396B1 (enExample)
CN (1) CN103031588B (enExample)
DE (1) DE102012018393B4 (enExample)
TW (1) TWI564431B (enExample)

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JP6115309B2 (ja) * 2013-05-22 2017-04-19 住友金属鉱山株式会社 化学処理装置
EP2907900A1 (en) * 2014-02-18 2015-08-19 Italfimet S.R.L. Electroplating process and apparatus, particularly for plating or forming parts made of electrically conducting materials by electrodeposition
TWI530593B (zh) * 2014-08-11 2016-04-21 亞智科技股份有限公司 多陽極控制裝置及具有該裝置的電鍍設備
CN104313657A (zh) * 2014-11-10 2015-01-28 临安振有电子有限公司 Hdi印制线路板通孔的电沉积装置
CN106149039B (zh) * 2015-04-08 2017-11-24 亚硕企业股份有限公司 电镀设备
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
TWI698554B (zh) * 2015-10-20 2020-07-11 香港商亞洲電鍍器材有限公司 電鍍機器及電鍍方法
CN105350062B (zh) * 2015-12-07 2018-01-19 依力柏电能有限公司 一种电镀装置
DE102016205417A1 (de) 2016-04-01 2017-10-05 Schaeffler Technologies AG & Co. KG Oberflächenbehandlungsanlage zur elektrochemischen Oberflächenbehandlung von Wälzkörpern
KR101880601B1 (ko) * 2016-12-16 2018-08-17 (주)포인텍 양극 이동형 전해도금 장치
JP6875758B2 (ja) * 2017-10-20 2021-05-26 株式会社アルメックステクノロジーズ 表面処理装置
CN111247272A (zh) * 2017-10-20 2020-06-05 Almex Pe 株式会社 表面处理装置
CN111247273B (zh) * 2017-10-20 2022-12-20 Almex 科技株式会社 表面处理装置和工件保持夹具
JP7293765B2 (ja) * 2018-07-24 2023-06-20 富士フイルムビジネスイノベーション株式会社 めっき装置
CN110699738A (zh) * 2019-11-07 2020-01-17 俊杰机械(深圳)有限公司 一种五金工件独立电镀装置及工艺
KR102343926B1 (ko) * 2020-04-03 2021-12-24 (주)포인텍 분사압 조절형 노즐이 장착된 도금장치
KR102164884B1 (ko) * 2020-06-30 2020-10-14 (주)네오피엠씨 개별 지그의 전류를 제어하는 도금장치
KR102206395B1 (ko) * 2020-06-30 2021-01-25 (주)네오피엠씨 개별파티션을 구비한 도금장치
CN112760701B (zh) * 2020-12-16 2022-04-12 景旺电子科技(珠海)有限公司 垂直连续电镀设备
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
KR102306782B1 (ko) * 2021-03-04 2021-09-30 (주)네오피엠씨 기판 개별 전류량 제어 시스템
US20250003105A1 (en) * 2023-06-27 2025-01-02 Semiconductor Components Industries, Llc Electroplating systems and methods

Citations (1)

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Publication number Priority date Publication date Assignee Title
TWM400483U (en) * 2010-04-06 2011-03-21 Foxconn Advanced Tech Inc Plating apparatus and method

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JP3715846B2 (ja) * 1999-09-06 2005-11-16 大日本スクリーン製造株式会社 基板メッキ装置
JP3285572B2 (ja) * 2000-06-09 2002-05-27 栄電子工業株式会社 分割電極部分を有する給電ローラを用いた連続めっき方法並びに装置
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CN100523309C (zh) * 2003-12-25 2009-08-05 亚洲电镀器材有限公司 电镀设备液体输送系统，有该系统的电镀设备及其操作方法
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US8177945B2 (en) * 2007-01-26 2012-05-15 International Business Machines Corporation Multi-anode system for uniform plating of alloys
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JP2010020296A (ja) * 2008-07-14 2010-01-28 Toshiba Corp 画像形成装置及びクリーナ装置
KR20100115955A (ko) * 2009-04-21 2010-10-29 주식회사 티케이씨 수직연속도금 장치의 개별 급전장치 시스템
JP5650899B2 (ja) * 2009-09-08 2015-01-07 上村工業株式会社 電気めっき装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM400483U (en) * 2010-04-06 2011-03-21 Foxconn Advanced Tech Inc Plating apparatus and method

Also Published As

Publication number Publication date
CN103031588B (zh) 2015-11-11
JP2013072131A (ja) 2013-04-22
DE102012018393A1 (de) 2013-04-04
JP5795514B2 (ja) 2015-10-14
US20130081939A1 (en) 2013-04-04
CN103031588A (zh) 2013-04-10
KR20130035201A (ko) 2013-04-08
TW201333262A (zh) 2013-08-16
DE102012018393B4 (de) 2018-05-24
KR101475396B1 (ko) 2014-12-22

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