CN103031588B - 连续电镀装置 - Google Patents

连续电镀装置 Download PDF

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Publication number
CN103031588B
CN103031588B CN201210367382.2A CN201210367382A CN103031588B CN 103031588 B CN103031588 B CN 103031588B CN 201210367382 A CN201210367382 A CN 201210367382A CN 103031588 B CN103031588 B CN 103031588B
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CN
China
Prior art keywords
workpiece
anode electrode
described multiple
segmentation anode
electrode
Prior art date
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CN201210367382.2A
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English (en)
Chinese (zh)
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CN103031588A (zh
Inventor
野田朝裕
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Almex Technologies Inc
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Almex PE Inc
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Publication of CN103031588A publication Critical patent/CN103031588A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201210367382.2A 2011-09-29 2012-09-28 连续电镀装置 Active CN103031588B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-214301 2011-09-29
JP2011214301A JP5795514B2 (ja) 2011-09-29 2011-09-29 連続メッキ装置

Publications (2)

Publication Number Publication Date
CN103031588A CN103031588A (zh) 2013-04-10
CN103031588B true CN103031588B (zh) 2015-11-11

Family

ID=47878724

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210367382.2A Active CN103031588B (zh) 2011-09-29 2012-09-28 连续电镀装置

Country Status (6)

Country Link
US (1) US20130081939A1 (enExample)
JP (1) JP5795514B2 (enExample)
KR (1) KR101475396B1 (enExample)
CN (1) CN103031588B (enExample)
DE (1) DE102012018393B4 (enExample)
TW (1) TWI564431B (enExample)

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JP6115309B2 (ja) * 2013-05-22 2017-04-19 住友金属鉱山株式会社 化学処理装置
EP2907900A1 (en) * 2014-02-18 2015-08-19 Italfimet S.R.L. Electroplating process and apparatus, particularly for plating or forming parts made of electrically conducting materials by electrodeposition
TWI530593B (zh) * 2014-08-11 2016-04-21 亞智科技股份有限公司 多陽極控制裝置及具有該裝置的電鍍設備
CN104313657A (zh) * 2014-11-10 2015-01-28 临安振有电子有限公司 Hdi印制线路板通孔的电沉积装置
CN106149039B (zh) * 2015-04-08 2017-11-24 亚硕企业股份有限公司 电镀设备
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
TWI698554B (zh) * 2015-10-20 2020-07-11 香港商亞洲電鍍器材有限公司 電鍍機器及電鍍方法
CN105350062B (zh) * 2015-12-07 2018-01-19 依力柏电能有限公司 一种电镀装置
DE102016205417A1 (de) 2016-04-01 2017-10-05 Schaeffler Technologies AG & Co. KG Oberflächenbehandlungsanlage zur elektrochemischen Oberflächenbehandlung von Wälzkörpern
KR101880601B1 (ko) * 2016-12-16 2018-08-17 (주)포인텍 양극 이동형 전해도금 장치
JP6875758B2 (ja) * 2017-10-20 2021-05-26 株式会社アルメックステクノロジーズ 表面処理装置
CN111247272A (zh) * 2017-10-20 2020-06-05 Almex Pe 株式会社 表面处理装置
CN111247273B (zh) * 2017-10-20 2022-12-20 Almex 科技株式会社 表面处理装置和工件保持夹具
JP7293765B2 (ja) * 2018-07-24 2023-06-20 富士フイルムビジネスイノベーション株式会社 めっき装置
CN110699738A (zh) * 2019-11-07 2020-01-17 俊杰机械(深圳)有限公司 一种五金工件独立电镀装置及工艺
KR102343926B1 (ko) * 2020-04-03 2021-12-24 (주)포인텍 분사압 조절형 노즐이 장착된 도금장치
KR102164884B1 (ko) * 2020-06-30 2020-10-14 (주)네오피엠씨 개별 지그의 전류를 제어하는 도금장치
KR102206395B1 (ko) * 2020-06-30 2021-01-25 (주)네오피엠씨 개별파티션을 구비한 도금장치
CN112760701B (zh) * 2020-12-16 2022-04-12 景旺电子科技(珠海)有限公司 垂直连续电镀设备
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
KR102306782B1 (ko) * 2021-03-04 2021-09-30 (주)네오피엠씨 기판 개별 전류량 제어 시스템
US20250003105A1 (en) * 2023-06-27 2025-01-02 Semiconductor Components Industries, Llc Electroplating systems and methods

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2001073184A (ja) * 1999-09-06 2001-03-21 Dainippon Screen Mfg Co Ltd 基板メッキ装置
CN101423969A (zh) * 2007-11-01 2009-05-06 Almexpe株式会社 连续电镀处理装置

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JPS5243700Y2 (enExample) * 1971-06-30 1977-10-04
FR2396102A1 (fr) * 1977-06-29 1979-01-26 Trefimetaux Procede de depot electrolytique en continu, a grande vitesse, sur un substrat metallique en mouvement
US4378281A (en) 1981-06-25 1983-03-29 Napco, Inc. High speed plating of flat planar workpieces
DE3205969A1 (de) 1982-02-19 1983-09-01 Frisch Kabel- Und Verseilmaschinenbau Gmbh, 4030 Ratingen Stromversorgung fuer elektrolyseanlagen
US4492621A (en) * 1982-09-29 1985-01-08 Stubb Paul R Method and apparatus for electrodeposition of materials
JPS60128295A (ja) 1983-12-16 1985-07-09 Nippon Steel Corp メツキ電流自動補償制御装置
JPS61133400A (ja) 1984-12-03 1986-06-20 Kosaku:Kk 電気めつき装置
JPH01177400A (ja) * 1988-01-06 1989-07-13 Kosaku:Kk めっき電流を自動調節するめっき装置
DD273653A1 (de) 1988-07-04 1989-11-22 Mikroelektronik Bruno Baum Zeh Vorrichtung zum gleichmaessigen galvanischen beschichten mehrerer parallel in einem bad zu veredelnder bandfoermiger substrate
DE3939681A1 (de) * 1989-12-01 1991-06-06 Schering Ag Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung
JP3178164B2 (ja) * 1993-05-12 2001-06-18 ソニー株式会社 電解めっき装置
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
JP3299725B2 (ja) 1998-12-11 2002-07-08 株式会社ケミトロン メッキ方法とその装置
JP3285572B2 (ja) * 2000-06-09 2002-05-27 栄電子工業株式会社 分割電極部分を有する給電ローラを用いた連続めっき方法並びに装置
DE10153171B4 (de) * 2001-10-27 2004-09-16 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen
US7368043B2 (en) * 2003-04-10 2008-05-06 Applied Intellectual Capital Configurations and methods of electrochemical lead recovery from contaminated soil
KR100539239B1 (ko) * 2003-06-25 2005-12-27 삼성전자주식회사 도금 중단에 의해 불량이 발생되는 것을 방지하는 도금방법 및 이에 이용되는 도금 장비
CN100523309C (zh) * 2003-12-25 2009-08-05 亚洲电镀器材有限公司 电镀设备液体输送系统，有该系统的电镀设备及其操作方法
DE102005005095A1 (de) 2005-02-04 2006-08-10 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zur elektrochemischen Behandlung von Bauteilen in Durchlaufanlagen
US8177945B2 (en) * 2007-01-26 2012-05-15 International Business Machines Corporation Multi-anode system for uniform plating of alloys
JP2010020296A (ja) * 2008-07-14 2010-01-28 Toshiba Corp 画像形成装置及びクリーナ装置
KR20100115955A (ko) * 2009-04-21 2010-10-29 주식회사 티케이씨 수직연속도금 장치의 개별 급전장치 시스템
JP5650899B2 (ja) * 2009-09-08 2015-01-07 上村工業株式会社 電気めっき装置
TWM400483U (en) * 2010-04-06 2011-03-21 Foxconn Advanced Tech Inc Plating apparatus and method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001073184A (ja) * 1999-09-06 2001-03-21 Dainippon Screen Mfg Co Ltd 基板メッキ装置
CN101423969A (zh) * 2007-11-01 2009-05-06 Almexpe株式会社 连续电镀处理装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
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线材连续电镀锡设备及工艺;郝利峰等;《电镀与精饰》;20080430;第30 卷(第4期);第20-21页 *

Also Published As

Publication number Publication date
JP2013072131A (ja) 2013-04-22
DE102012018393A1 (de) 2013-04-04
JP5795514B2 (ja) 2015-10-14
US20130081939A1 (en) 2013-04-04
CN103031588A (zh) 2013-04-10
KR20130035201A (ko) 2013-04-08
TW201333262A (zh) 2013-08-16
DE102012018393B4 (de) 2018-05-24
TWI564431B (zh) 2017-01-01
KR101475396B1 (ko) 2014-12-22

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Japan's Tochigi County deer marshy City

Patentee after: Almex Technology Co.,Ltd.

Address before: Japan's Tochigi County deer marshy City

Patentee before: ALMEXPE Corp.

CP01 Change in the name or title of a patent holder