TWI874929B - 矯正裝置、曝光裝置、塗佈顯影裝置、曝光系統、曝光方法、及元件製造方法 - Google Patents

矯正裝置、曝光裝置、塗佈顯影裝置、曝光系統、曝光方法、及元件製造方法 Download PDF

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Publication number
TWI874929B
TWI874929B TW112110017A TW112110017A TWI874929B TW I874929 B TWI874929 B TW I874929B TW 112110017 A TW112110017 A TW 112110017A TW 112110017 A TW112110017 A TW 112110017A TW I874929 B TWI874929 B TW I874929B
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TW
Taiwan
Prior art keywords
wafer
force
unit
shape
heating
Prior art date
Application number
TW112110017A
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English (en)
Chinese (zh)
Other versions
TW202401143A (zh
Inventor
一之瀬剛
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日商尼康股份有限公司
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Publication of TW202401143A publication Critical patent/TW202401143A/zh
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Publication of TWI874929B publication Critical patent/TWI874929B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
TW112110017A 2022-03-25 2023-03-17 矯正裝置、曝光裝置、塗佈顯影裝置、曝光系統、曝光方法、及元件製造方法 TWI874929B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2022/014471 WO2023181367A1 (ja) 2022-03-25 2022-03-25 矯正装置、露光装置、コータ・デベロッパ装置、露光システム、露光方法、及びデバイス製造方法
WOPCT/JP2022/014471 2022-03-25

Publications (2)

Publication Number Publication Date
TW202401143A TW202401143A (zh) 2024-01-01
TWI874929B true TWI874929B (zh) 2025-03-01

Family

ID=88100257

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112110017A TWI874929B (zh) 2022-03-25 2023-03-17 矯正裝置、曝光裝置、塗佈顯影裝置、曝光系統、曝光方法、及元件製造方法

Country Status (7)

Country Link
US (1) US20250014918A1 (https=)
EP (1) EP4503108A1 (https=)
JP (1) JPWO2023181367A1 (https=)
KR (1) KR20240154044A (https=)
CN (1) CN118901128A (https=)
TW (1) TWI874929B (https=)
WO (1) WO2023181367A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116842A (ja) * 2003-10-09 2005-04-28 Shinko Electric Ind Co Ltd ウェーハ吸着ステージ及びウェーハの吸着方法
TW200947595A (en) * 2007-12-28 2009-11-16 Tokyo Electron Ltd Vacuum processing apparatus, vacuum processing method, and computer-readable medium
TW201332714A (zh) * 2012-02-14 2013-08-16 台灣積體電路製造股份有限公司 化學機械研磨系統及方法
TW201448013A (zh) * 2013-02-08 2014-12-16 蘭姆研究股份公司 用以處理晶圓狀物件之表面的程序及設備
US20190198299A1 (en) * 2017-12-27 2019-06-27 Hitachi High-Technologies Corporation Wafer processing method and wafer processing apparatus
JP2019192775A (ja) * 2018-04-25 2019-10-31 日東電工株式会社 ワーク矯正方法およびワーク矯正装置
CN210182343U (zh) * 2019-09-18 2020-03-24 中芯长电半导体（江阴）有限公司 降低晶圆翘曲度的装置及半导体设备
JP2021089948A (ja) * 2019-12-03 2021-06-10 筑波精工株式会社 吸着保持装置及び対象物表面加工方法
CN113224220A (zh) * 2021-05-12 2021-08-06 东莞市凯格精机股份有限公司 一种芯片转移方法和芯片转移设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07256774A (ja) * 1994-03-24 1995-10-09 Toppan Printing Co Ltd 反り矯正装置
CN204289408U (zh) * 2014-12-29 2015-04-22 昆山国显光电有限公司 产品翘曲矫正装置
KR102589733B1 (ko) 2015-04-29 2023-10-17 어플라이드 머티어리얼스, 인코포레이티드 기판 기형을 정정하기 위한 방법 및 장치
JP6934300B2 (ja) * 2017-01-18 2021-09-15 株式会社ディスコ 板状ワークの加工方法及びそれを用いる加工装置
KR101930742B1 (ko) * 2017-05-29 2019-03-11 주식회사 이오테크닉스 휨 감소 장치 및 휨 감소 방법
JP7329996B2 (ja) * 2019-07-09 2023-08-21 日本特殊陶業株式会社 基板保持装置
US20210035795A1 (en) * 2019-07-30 2021-02-04 Applied Materials, Inc. Methods and apparatus for substrate warpage correction

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116842A (ja) * 2003-10-09 2005-04-28 Shinko Electric Ind Co Ltd ウェーハ吸着ステージ及びウェーハの吸着方法
TW200947595A (en) * 2007-12-28 2009-11-16 Tokyo Electron Ltd Vacuum processing apparatus, vacuum processing method, and computer-readable medium
TW201332714A (zh) * 2012-02-14 2013-08-16 台灣積體電路製造股份有限公司 化學機械研磨系統及方法
TW201448013A (zh) * 2013-02-08 2014-12-16 蘭姆研究股份公司 用以處理晶圓狀物件之表面的程序及設備
US20190198299A1 (en) * 2017-12-27 2019-06-27 Hitachi High-Technologies Corporation Wafer processing method and wafer processing apparatus
JP2019192775A (ja) * 2018-04-25 2019-10-31 日東電工株式会社 ワーク矯正方法およびワーク矯正装置
CN210182343U (zh) * 2019-09-18 2020-03-24 中芯长电半导体（江阴）有限公司 降低晶圆翘曲度的装置及半导体设备
JP2021089948A (ja) * 2019-12-03 2021-06-10 筑波精工株式会社 吸着保持装置及び対象物表面加工方法
CN113224220A (zh) * 2021-05-12 2021-08-06 东莞市凯格精机股份有限公司 一种芯片转移方法和芯片转移设备

Also Published As

Publication number Publication date
JPWO2023181367A1 (https=) 2023-09-28
CN118901128A (zh) 2024-11-05
US20250014918A1 (en) 2025-01-09
TW202401143A (zh) 2024-01-01
KR20240154044A (ko) 2024-10-24
EP4503108A1 (en) 2025-02-05
WO2023181367A1 (ja) 2023-09-28

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