CN118901128A - 矫正装置、曝光装置、涂布显影装置、曝光系统、曝光方法、及元件制造方法 - Google Patents

矫正装置、曝光装置、涂布显影装置、曝光系统、曝光方法、及元件制造方法 Download PDF

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Publication number
CN118901128A
CN118901128A CN202280093911.6A CN202280093911A CN118901128A CN 118901128 A CN118901128 A CN 118901128A CN 202280093911 A CN202280093911 A CN 202280093911A CN 118901128 A CN118901128 A CN 118901128A
Authority
CN
China
Prior art keywords
wafer
force
unit
shape
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280093911.6A
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English (en)
Chinese (zh)
Inventor
一之濑刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN118901128A publication Critical patent/CN118901128A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
CN202280093911.6A 2022-03-25 2022-03-25 矫正装置、曝光装置、涂布显影装置、曝光系统、曝光方法、及元件制造方法 Pending CN118901128A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/014471 WO2023181367A1 (ja) 2022-03-25 2022-03-25 矯正装置、露光装置、コータ・デベロッパ装置、露光システム、露光方法、及びデバイス製造方法

Publications (1)

Publication Number Publication Date
CN118901128A true CN118901128A (zh) 2024-11-05

Family

ID=88100257

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280093911.6A Pending CN118901128A (zh) 2022-03-25 2022-03-25 矫正装置、曝光装置、涂布显影装置、曝光系统、曝光方法、及元件制造方法

Country Status (7)

Country Link
US (1) US20250014918A1 (https=)
EP (1) EP4503108A1 (https=)
JP (1) JPWO2023181367A1 (https=)
KR (1) KR20240154044A (https=)
CN (1) CN118901128A (https=)
TW (1) TWI874929B (https=)
WO (1) WO2023181367A1 (https=)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07256774A (ja) * 1994-03-24 1995-10-09 Toppan Printing Co Ltd 反り矯正装置
JP4288133B2 (ja) * 2003-10-09 2009-07-01 新光電気工業株式会社 ウェーハ吸着ステージ及びウェーハの吸着方法
JP4784599B2 (ja) * 2007-12-28 2011-10-05 東京エレクトロン株式会社 真空処理装置及び真空処理方法並びに記憶媒体
US20130210173A1 (en) * 2012-02-14 2013-08-15 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple Zone Temperature Control for CMP
US9870933B2 (en) * 2013-02-08 2018-01-16 Lam Research Ag Process and apparatus for treating surfaces of wafer-shaped articles
CN204289408U (zh) * 2014-12-29 2015-04-22 昆山国显光电有限公司 产品翘曲矫正装置
KR102589733B1 (ko) 2015-04-29 2023-10-17 어플라이드 머티어리얼스, 인코포레이티드 기판 기형을 정정하기 위한 방법 및 장치
JP6934300B2 (ja) * 2017-01-18 2021-09-15 株式会社ディスコ 板状ワークの加工方法及びそれを用いる加工装置
KR101930742B1 (ko) * 2017-05-29 2019-03-11 주식회사 이오테크닉스 휨 감소 장치 및 휨 감소 방법
JP7073098B2 (ja) * 2017-12-27 2022-05-23 株式会社日立ハイテク ウエハ処理方法およびウエハ処理装置
JP2019192775A (ja) * 2018-04-25 2019-10-31 日東電工株式会社 ワーク矯正方法およびワーク矯正装置
JP7329996B2 (ja) * 2019-07-09 2023-08-21 日本特殊陶業株式会社 基板保持装置
US20210035795A1 (en) * 2019-07-30 2021-02-04 Applied Materials, Inc. Methods and apparatus for substrate warpage correction
CN210182343U (zh) * 2019-09-18 2020-03-24 中芯长电半导体（江阴）有限公司 降低晶圆翘曲度的装置及半导体设备
JP7453660B2 (ja) * 2019-12-03 2024-03-21 筑波精工株式会社 吸着保持装置及び対象物表面加工方法
CN113224220A (zh) * 2021-05-12 2021-08-06 东莞市凯格精机股份有限公司 一种芯片转移方法和芯片转移设备

Also Published As

Publication number Publication date
JPWO2023181367A1 (https=) 2023-09-28
US20250014918A1 (en) 2025-01-09
TW202401143A (zh) 2024-01-01
KR20240154044A (ko) 2024-10-24
EP4503108A1 (en) 2025-02-05
TWI874929B (zh) 2025-03-01
WO2023181367A1 (ja) 2023-09-28

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