JPWO2023181367A1 - - Google Patents
Info
- Publication number
- JPWO2023181367A1 JPWO2023181367A1 JP2024509667A JP2024509667A JPWO2023181367A1 JP WO2023181367 A1 JPWO2023181367 A1 JP WO2023181367A1 JP 2024509667 A JP2024509667 A JP 2024509667A JP 2024509667 A JP2024509667 A JP 2024509667A JP WO2023181367 A1 JPWO2023181367 A1 JP WO2023181367A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Engineering & Computer Science (AREA)
- Robotics (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/014471 WO2023181367A1 (ja) | 2022-03-25 | 2022-03-25 | 矯正装置、露光装置、コータ・デベロッパ装置、露光システム、露光方法、及びデバイス製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181367A1 true JPWO2023181367A1 (https=) | 2023-09-28 |
Family
ID=88100257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509667A Ceased JPWO2023181367A1 (https=) | 2022-03-25 | 2022-03-25 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250014918A1 (https=) |
| EP (1) | EP4503108A1 (https=) |
| JP (1) | JPWO2023181367A1 (https=) |
| KR (1) | KR20240154044A (https=) |
| CN (1) | CN118901128A (https=) |
| TW (1) | TWI874929B (https=) |
| WO (1) | WO2023181367A1 (https=) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07256774A (ja) * | 1994-03-24 | 1995-10-09 | Toppan Printing Co Ltd | 反り矯正装置 |
| JP2005116842A (ja) * | 2003-10-09 | 2005-04-28 | Shinko Electric Ind Co Ltd | ウェーハ吸着ステージ及びウェーハの吸着方法 |
| CN204289408U (zh) * | 2014-12-29 | 2015-04-22 | 昆山国显光电有限公司 | 产品翘曲矫正装置 |
| JP2018117041A (ja) * | 2017-01-18 | 2018-07-26 | 株式会社ディスコ | 板状ワークの反り低減方法及びそれを用いる加工装置 |
| JP2019192775A (ja) * | 2018-04-25 | 2019-10-31 | 日東電工株式会社 | ワーク矯正方法およびワーク矯正装置 |
| CN210182343U (zh) * | 2019-09-18 | 2020-03-24 | 中芯长电半导体（江阴）有限公司 | 降低晶圆翘曲度的装置及半导体设备 |
| US20200171738A1 (en) * | 2017-05-29 | 2020-06-04 | Eo Technics Co., Ltd. | Warpage reduction device and warpage reduction method |
| US20210035795A1 (en) * | 2019-07-30 | 2021-02-04 | Applied Materials, Inc. | Methods and apparatus for substrate warpage correction |
| JP2021012981A (ja) * | 2019-07-09 | 2021-02-04 | 日本特殊陶業株式会社 | 基板保持装置 |
| JP2021089948A (ja) * | 2019-12-03 | 2021-06-10 | 筑波精工株式会社 | 吸着保持装置及び対象物表面加工方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4784599B2 (ja) * | 2007-12-28 | 2011-10-05 | 東京エレクトロン株式会社 | 真空処理装置及び真空処理方法並びに記憶媒体 |
| US20130210173A1 (en) * | 2012-02-14 | 2013-08-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multiple Zone Temperature Control for CMP |
| US9870933B2 (en) * | 2013-02-08 | 2018-01-16 | Lam Research Ag | Process and apparatus for treating surfaces of wafer-shaped articles |
| KR102589733B1 (ko) | 2015-04-29 | 2023-10-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 기형을 정정하기 위한 방법 및 장치 |
| JP7073098B2 (ja) * | 2017-12-27 | 2022-05-23 | 株式会社日立ハイテク | ウエハ処理方法およびウエハ処理装置 |
| CN113224220A (zh) * | 2021-05-12 | 2021-08-06 | 东莞市凯格精机股份有限公司 | 一种芯片转移方法和芯片转移设备 |
-
2022
- 2022-03-25 JP JP2024509667A patent/JPWO2023181367A1/ja not_active Ceased
- 2022-03-25 CN CN202280093911.6A patent/CN118901128A/zh active Pending
- 2022-03-25 EP EP22933506.2A patent/EP4503108A1/en not_active Withdrawn
- 2022-03-25 KR KR1020247031704A patent/KR20240154044A/ko not_active Ceased
- 2022-03-25 WO PCT/JP2022/014471 patent/WO2023181367A1/ja not_active Ceased
-
2023
- 2023-03-17 TW TW112110017A patent/TWI874929B/zh active
-
2024
- 2024-09-19 US US18/889,608 patent/US20250014918A1/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07256774A (ja) * | 1994-03-24 | 1995-10-09 | Toppan Printing Co Ltd | 反り矯正装置 |
| JP2005116842A (ja) * | 2003-10-09 | 2005-04-28 | Shinko Electric Ind Co Ltd | ウェーハ吸着ステージ及びウェーハの吸着方法 |
| CN204289408U (zh) * | 2014-12-29 | 2015-04-22 | 昆山国显光电有限公司 | 产品翘曲矫正装置 |
| JP2018117041A (ja) * | 2017-01-18 | 2018-07-26 | 株式会社ディスコ | 板状ワークの反り低減方法及びそれを用いる加工装置 |
| US20200171738A1 (en) * | 2017-05-29 | 2020-06-04 | Eo Technics Co., Ltd. | Warpage reduction device and warpage reduction method |
| JP2019192775A (ja) * | 2018-04-25 | 2019-10-31 | 日東電工株式会社 | ワーク矯正方法およびワーク矯正装置 |
| JP2021012981A (ja) * | 2019-07-09 | 2021-02-04 | 日本特殊陶業株式会社 | 基板保持装置 |
| US20210035795A1 (en) * | 2019-07-30 | 2021-02-04 | Applied Materials, Inc. | Methods and apparatus for substrate warpage correction |
| CN210182343U (zh) * | 2019-09-18 | 2020-03-24 | 中芯长电半导体（江阴）有限公司 | 降低晶圆翘曲度的装置及半导体设备 |
| JP2021089948A (ja) * | 2019-12-03 | 2021-06-10 | 筑波精工株式会社 | 吸着保持装置及び対象物表面加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118901128A (zh) | 2024-11-05 |
| US20250014918A1 (en) | 2025-01-09 |
| TW202401143A (zh) | 2024-01-01 |
| KR20240154044A (ko) | 2024-10-24 |
| EP4503108A1 (en) | 2025-02-05 |
| TWI874929B (zh) | 2025-03-01 |
| WO2023181367A1 (ja) | 2023-09-28 |
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