TWI864316B - 積層體之製造方法 - Google Patents

積層體之製造方法 Download PDF

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Publication number
TWI864316B
TWI864316B TW110127473A TW110127473A TWI864316B TW I864316 B TWI864316 B TW I864316B TW 110127473 A TW110127473 A TW 110127473A TW 110127473 A TW110127473 A TW 110127473A TW I864316 B TWI864316 B TW I864316B
Authority
TW
Taiwan
Prior art keywords
resin film
support material
laminate
substrate
laminated body
Prior art date
Application number
TW110127473A
Other languages
English (en)
Chinese (zh)
Other versions
TW202214446A (zh
Inventor
兒玉年矢
池田龍太郎
Original Assignee
日商東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW202214446A publication Critical patent/TW202214446A/zh
Application granted granted Critical
Publication of TWI864316B publication Critical patent/TWI864316B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW110127473A 2020-07-31 2021-07-27 積層體之製造方法 TWI864316B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-129967 2020-07-31
JP2020129967 2020-07-31

Publications (2)

Publication Number Publication Date
TW202214446A TW202214446A (zh) 2022-04-16
TWI864316B true TWI864316B (zh) 2024-12-01

Family

ID=80037328

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110127473A TWI864316B (zh) 2020-07-31 2021-07-27 積層體之製造方法

Country Status (5)

Country Link
JP (2) JP7517341B2 (https=)
KR (1) KR102737275B1 (https=)
CN (1) CN115803122B (https=)
TW (1) TWI864316B (https=)
WO (1) WO2022024655A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003113356A (ja) * 2001-10-01 2003-04-18 Lintec Corp 紙類接着用粘着テープ
JP2003292916A (ja) * 2002-04-08 2003-10-15 Nitto Denko Corp 粘着シートを用いた被着体加工方法
JP2012177084A (ja) * 2011-01-31 2012-09-13 Dainippon Printing Co Ltd 耐熱仮着用の粘着剤組成物及び粘着テープ
TW201545870A (zh) * 2014-06-06 2015-12-16 Fujifilm Corp 積層體、轉印膜、積層體的製造方法、導電膜積層體、靜電電容型輸入裝置及圖像顯示裝置
JP2016069474A (ja) * 2014-09-29 2016-05-09 リンテック株式会社 仮固定方法および粘着シート

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047975A (ja) * 2002-05-17 2004-02-12 Semiconductor Energy Lab Co Ltd 積層体の転写方法及び半導体装置の作製方法
JP5171332B2 (ja) * 2008-03-18 2013-03-27 リンテック株式会社 剥離シート、剥離シート付き偏光板、及び基材レス両面粘着シート
JP5874159B2 (ja) 2010-08-31 2016-03-02 日本電気硝子株式会社 ガラス−樹脂積層体、およびそれを巻き取ったガラスロール、並びにガラスロールの製造方法
KR101740763B1 (ko) * 2010-11-10 2017-05-26 스미또모 가가꾸 가부시키가이샤 편광성 적층 필름 및 편광판의 제조 방법
JP2013063606A (ja) 2011-09-20 2013-04-11 Fujimori Kogyo Co Ltd 接着シート積層体
JP5921927B2 (ja) 2012-03-27 2016-05-24 日東電工株式会社 加熱剥離型粘着シート
JP6580808B2 (ja) 2012-06-19 2019-09-25 日鉄ケミカル＆マテリアル株式会社 表示装置及びその製造方法
JP6039297B2 (ja) 2012-08-07 2016-12-07 三井化学株式会社 ポリイミドフィルム及びその製造方法
JP2018116859A (ja) 2017-01-19 2018-07-26 株式会社ジャパンディスプレイ 表示装置の製造方法及び表示装置
JP7139141B2 (ja) 2017-06-13 2022-09-20 マクセル株式会社 両面粘着テープ、及び薄膜部材と支持部材との積層体
JP2019062088A (ja) * 2017-09-27 2019-04-18 パナソニックＩｐマネジメント株式会社 太陽電池モジュール
KR102576310B1 (ko) 2018-03-30 2023-09-07 린텍 가부시키가이샤 경화 봉지체의 휨 방지용 적층체, 및 경화 봉지체의 제조 방법
JP7273472B2 (ja) 2018-08-27 2023-05-15 日東電工株式会社 積層体
JP2020093534A (ja) * 2018-12-03 2020-06-18 住友化学株式会社 積層体およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003113356A (ja) * 2001-10-01 2003-04-18 Lintec Corp 紙類接着用粘着テープ
JP2003292916A (ja) * 2002-04-08 2003-10-15 Nitto Denko Corp 粘着シートを用いた被着体加工方法
JP2012177084A (ja) * 2011-01-31 2012-09-13 Dainippon Printing Co Ltd 耐熱仮着用の粘着剤組成物及び粘着テープ
TW201545870A (zh) * 2014-06-06 2015-12-16 Fujifilm Corp 積層體、轉印膜、積層體的製造方法、導電膜積層體、靜電電容型輸入裝置及圖像顯示裝置
JP2016069474A (ja) * 2014-09-29 2016-05-09 リンテック株式会社 仮固定方法および粘着シート

Also Published As

Publication number Publication date
CN115803122A (zh) 2023-03-14
WO2022024655A1 (ja) 2022-02-03
KR20230042210A (ko) 2023-03-28
JP7517341B2 (ja) 2024-07-17
TW202214446A (zh) 2022-04-16
JP2024102166A (ja) 2024-07-30
KR102737275B1 (ko) 2024-12-03
CN115803122B (zh) 2023-12-01
JP7798129B2 (ja) 2026-01-14
JPWO2022024655A1 (https=) 2022-02-03

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